SN74LVC4245APWR - Texas Instruments

www.ti.com

FEATURES

DESCRIPTION/ORDERING INFORMATION

DB, DW, OR PW PACKAGE

(TOP VIEW)

(5 V) VCCA

DIR

GND

VCCB (3.3 V)

GND

SN74LVC4245AOCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

•Bidirectional Voltage Translator•5.5 V on A Port and 2.7 V to 3.6 V on B Port•Control Inputs V

Levels Are Referencedto V

CCA

Voltage•Latch-Up Performance Exceeds 250 mA PerJESD 17•ESD Protection Exceeds JESD 22– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)

This 8-bit (octal) noninverting bus transceivercontains two separate supply rails; B port has V

CCB

,which is set at 3.3 V, and A port has V

CCA

, which isset at 5 V. This allows for translation from a 3.3-V toa 5-V environment, and vice versa.<br/>

The SN74LVC4245A is designed for asynchronous communication between data buses. The device transmitsdata from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at thedirection-control (DIR) input. The output-enable ( OE) input can be used to disable the device so the buses areeffectively isolated. The control circuitry (DIR, OE) is powered by V

CCA

The SN74LVC4245A pinout allows the designer to switch to a normal all-3.3-V or all-5-V 20-pin '245 devicewithout board re-layout. The designer uses the data paths for pins 2–11 and 14–23 of the SN74LVC4245A toalign with the conventional '245 pinout.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

Tube of 25 SN74LVC4245ADWSOIC – DW LVC4245AReel of 2000 SN74LVC4245ADWRSSOP – DB Reel of 2000 SN74LVC4245ADBR LJ245A–40 °C to 85 °C

Tube of 60 SN74LVC4245APWTSSOP – PW Reel of 2000 SN74LVC4245APWR LJ245AReel of 250 SN74LVC4245APWT

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.

FUNCTION TABLE

INPUTS

OPERATIONOE DIR

L L B data to A busL H A data to B busH X Isolation

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 1994–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

www.ti.com

DIR

To Seven Other Channels

Absolute Maximum Ratings

(1)

SN74LVC4245A

OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

LOGIC DIAGRAM (POSITIVE LOGIC)

over operating free-air temperature range for V

CCA

= 4.5 V to 5.5 V (unless otherwise noted)

MIN MAX UNIT

CCA

Supply voltage range –0.5 6.5 VA port

(2)

–0.5 V

CCA

+ 0.5V

Input voltage range VControl inputs –0.5 6V

Output voltage range A port

(2)

–0.5 V

CCA

+ 0.5 VI

Input clamp current V

< 0 –50 mAI

Output clamp current V

< 0 –50 mAI

Continuous output current ±50 mAContinuous current through each V

CCA

or GND ±100 mADB package 63θ

Package thermal impedance

(3)

DW package 46 °C/WPW package 88T

stg

Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) This value is limited to 6 V maximum.(3) The package thermal impedance is calculated in accordance with JESD 51-7.

www.ti.com

Absolute Maximum Ratings

(1)

Recommended Operating Conditions

(1)

Recommended Operating Conditions

(1)

SN74LVC4245AOCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

over operating free-air temperature range for V

CCB

= 2.7 V to 3.6 V (unless otherwise noted)

MIN MAX UNIT

CCB

Supply voltage range –0.5 4.6 VV

Input voltage range B port

(2)

–0.5 V

CCB

+ 0.5 VV

Output voltage range B port

(2)

–0.5 V

CCB

+ 0.5 VI

Input clamp current V

< 0 –50 mAI

Output clamp current V

< 0 –50 mAI

Continuous output current ±50 mAContinuous current through V

CCB

or GND ±100 mADB package 63θ

Package thermal impedance

(3)

DW package 46 °C/WPW package 88T

stg

Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) This value is limited to 4.6 V maximum.(3) The package thermal impedance is calculated in accordance with JESD 51-7.

for V

CCA

= 4.5 V to 5.5 V

MIN MAX UNIT

CCA

Supply voltage 4.5 5.5 VV

High-level input voltage 2 VV

Low-level input voltage 0.8 VV

Input voltage 0 V

CCA

Output voltage 0 V

CCA

High-level output current –24 mAI

Low-level output current 24 mAT

Operating free-air temperature –40 85 °C

(1) All unused inputs of the device must be held at the associated V

or GND to ensure proper device operation. Refer to the TIapplication report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

for V

CCB

= 2.7 V to 3.6 V

MIN MAX UNIT

CCB

Supply voltage 2.7 3.6 VV

High-level input voltage V

CCB

= 2.7 V to 3.6 V 2 VV

Low-level input voltage V

CCB

= 2.7 V to 3.6 V 0.8 VV

Input voltage 0 V

CCB

Output voltage 0 V

CCB

= 2.7 V –12I

High-level output current mAV

CCB

= 3 V –24V

CCB

= 2.7 V 12I

Low-level output current mAV

CCB

= 3 V 24T

Operating free-air temperature –40 85 °C

(1) All unused inputs of the device must be held at the associated V

or GND to ensure proper device operation. Refer to the TIapplication report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

www.ti.com

Electrical Characteristics

(1)

Electrical Characteristics

(1)

SN74LVC4245A

OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

over recommended operating free-air temperature range for V

CCA

= 4.5 V to 5.5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS V

CCA

MIN TYP

(2)

MAX UNIT

4.5 V 4.3I

= –100 µA

5.5 V 5.3V

V4.5 V 3.7I

= –24 mA

5.5 V 4.74.5 V 0.2I

= 100 µA

5.5 V 0.2V

V4.5 V 0.55I

= 24 mA

5.5 V 0.55I

Control inputs V

= V

CCA

or GND 5.5 V ±1µAI

(3)

A port V

= V

CCA

or GND 5.5 V ±5µAI

CCA

= V

CCA

or GND, I

= 0 5.5 V 80 µA∆I

CCA

(4)

One input at 3.4 V, Other inputs at V

CCA

or GND 5.5 V 1.5 mAC

Control inputs V

= V

CCA

or GND Open 5 pFC

A port V

= V

CCA

or GND 5 V 11 pF

(1) V

CCB

= 2.7 V to 3.6 V(2) All typical values are measured at V

= 5 V, T

= 25 °C.(3) For I/O ports, the parameter I

includes the input leakage current.(4) This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or the associatedV

over recommended operating free-air temperature range for V

CCB

= 2.7 V to 3.6 V (unless otherwise noted)

PARAMETER TEST CONDITIONS V

CCB

MIN TYP

(2)

MAX UNIT

= –100 µA 2.7 V to 3.6 V V

– 0.22.7 V 2.2V

= –12 mA V3 V 2.4I

= –24 mA 3 V 2I

= 100 µA 2.7 V to 3.6 V 0.2V

= 12 mA 2.7 V 0.4 VI

= 24 mA 3 V 0.55I

(3)

B port V

= V

CCB

or GND 3.6 V ±5µAI

CCB

= V

CCB

or GND, I

= 0 3.6 V 50 µA∆I

CCB

(4)

One input at V

CCB

– 0.6 V, Other inputs at V

CCB

or GND 2.7 V to 3.6 V 0.5 mAC

B port V

= V

CCB

or GND 3.3 V 11 pF

(1) V

CCA

= 5 V ±0.5 V(2) All typical values are measured at V

= 3.3 V, T

= 25 °C.(3) For I/O ports, the parameter I

includes the input leakage current.(4) This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or the associatedV

www.ti.com

Switching Characteristics

Operating Characteristics

Power-Up Considerations

(1)

SN74LVC4245AOCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

over recommended operating free-air temperature range, C

= 50 pF (unless otherwise noted) (see Figure 1 and Figure 2 )

CCA

= 5 V ±0.5 V,FROM TO

CCB

= 2.7 V to 3.6 VPARAMETER UNIT(INPUT) (OUTPUT)

MIN MAX

PHL

1 6.3A B nst

PLH

1 6.7t

PHL

1 6.1B A nst

PLH

1 5t

PZL

1 9OE A nst

PZH

1 8.1t

PZL

1 8.8OE B nst

PZH

1 9.8t

PLZ

1 7OE A nst

PHZ

1 5.8t

PLZ

1 7.7OE B nst

PHZ

1 7.8

CCA

= 4.5 V to 5.5 V, V

CCB

= 2.7 V to 3.6 V, T

= 25 °C

PARAMETER TEST CONDITIONS TYP UNIT

Outputs enabled 39.5C

Power dissipation capacitance per transceiver C

= 0, f = 10 MHz pFOutputs disabled 5

TI level-translation devices offer an opportunity for successful mixed-voltage signal design. A proper power-upsequence always should be followed to avoid excessive supply current, bus contention, oscillations, or otheranomalies caused by improperly biased device pins. Take these precautions to guard against such power-upproblems:

1. Connect ground before any supply voltage is applied.2. Power up the control side of the device (V

CCA

for all four of these devices).3. Tie OE to V

CCA

with a pullup resistor so that it ramps with V

CCA

.4. Depending on the direction of the data path, DIR can be high or low. If DIR high is needed (A data to B bus),ramp it with V

CCA

. Otherwise, keep DIR low.

(1) Refer to the TI application report, Texas Instruments Voltage-Level-Translation Devices, literature number SCEA021.

www.ti.com

PARAMETER MEASUREMENT INFORMATION

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

S1 2 × VCC

Open

GND

500 Ω

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

NONINVERTING OUTPUTS

tPLH tPHL VOH

VOL

Output

Control

Output

Waveform 1

S1 at 2 × VCC

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

tPZL

tPZH

tPLZ

tPHZ

1.5 V

VCC

0 V

VOL + 0.3 V

VOH - 0.3 V

≈0 V

3 V

VOLTAGE WA VEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

tPLH/tPHL

tPLZ/tPZL

tPHZ/tPZH

Open

2 × VCC

GND

TEST S1

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.

D. The outputs are measured one at a time, with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

VCC

0 V

1.5 V

Input

50% VCC

1.5 V

50% VCC

VCC

0 V

1.5 V 1.5 V

Input

VOLTAGE WA VEFORMS

PULSE DURATION

SN74LVC4245A

OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

A PORT

Figure 1. Load Circuit and Voltage Waveforms

www.ti.com

PARAMETER MEASUREMENT INFORMATION

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

S1 7 V

Open

GND

500 Ω

VOLTAGE WA VEFORMS

PROPAGATION DELAY TIMES

NONINVERTING OUTPUTS

tPLH tPHL VOH

VOL

Output

Control

Output

Waveform 1

S1 at 7 V

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

tPZL

tPZH

tPLZ

tPHZ

1.5 V

3.5 V

0 V

VOL + 0.3 V

VOH - 0.3 V

≈0 V

3 V

VOLTAGE WA VEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

tPLH/tPHL

tPLZ/tPZL

tPHZ/tPZH

Open

7 V

GND

TEST S1

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.

D. The outputs are measured one at a time, with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

3 V

0 V

1.5 V

Input 1.5 V

1.5 V 1.5 V

1.5 V

3 V

0 V

1.5 V 1.5 V

Input

VOLTAGE WA VEFORMS

PULSE DURATION

SN74LVC4245AOCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTERWITH 3-STATE OUTPUTS

SCAS375H – MARCH 1994 – REVISED MARCH 2005

B PORT

Figure 2. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com 14-Feb-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVC4245ADBR ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADW ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADWE4 ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADWG4 ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADWR ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245ADWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APW ACTIVE TSSOP PW 24 60 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWE4 ACTIVE TSSOP PW 24 60 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWG4 ACTIVE TSSOP PW 24 60 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWR ACTIVE TSSOP PW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWT ACTIVE TSSOP PW 24 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVC4245APWTE4 ACTIVE TSSOP PW 24 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 14-Feb-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVC4245APWTG4 ACTIVE TSSOP PW 24 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN74LVC4245A :

•Enhanced Product: SN74LVC4245A-EP

NOTE: Qualified Version Definitions:

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LVC4245ADBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1

SN74LVC4245ADWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1

SN74LVC4245APWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

SN74LVC4245APWT TSSOP PW 24 250 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LVC4245ADBR SSOP DB 24 2000 367.0 367.0 38.0

SN74LVC4245ADWR SOIC DW 24 2000 367.0 367.0 45.0

SN74LVC4245APWR TSSOP PW 24 2000 367.0 367.0 38.0

SN74LVC4245APWT TSSOP PW 24 250 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time

of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265