May 2015
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This is information on a product in full production.
www.st.com
MP34DT04
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Features
Single supply voltage
Low power consumption
120 dBSPL acoustic overload point
64 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS sensitivity
PDM output
HCLGA package
Top-port design
SMD-compliant
EMI-shielded
ECOPACK®, RoHS, and “Green”
compliant
Applications
Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
Description
The MP34DT04 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT04 has an acoustic overload point of
120 dBSPL with a 64 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT04 is available in a top-port, SMD-
compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp.
range [°C]
Package
Packing
MP34DT04
-40 to +85
HCLGA
(3x4 x1.095 mm)
4LD
Tray
MP34DT04TR
-40 to +85
HCLGA
(3x4x1.095 mm)
4LD
Tape and
reel
Contents
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Contents
1 Pin description ................................................................................ 5
2 Acoustic and electrical specifications ........................................... 6
2.1 Acoustic and electrical characteristics ............................................... 6
2.2 Timing characteristics ....................................................................... 7
2.3 Frequency response ......................................................................... 8
3 Application recommendations ....................................................... 9
4 Carrier tape mechanical specifications ....................................... 11
5 Process recommendations ........................................................... 12
6 Sensing element ............................................................................ 14
7 Absolute maximum ratings ........................................................... 15
8 Functionality .................................................................................. 16
8.1 L/R channel selection ...................................................................... 16
9 Package information ..................................................................... 17
9.1 Soldering information ...................................................................... 17
9.2 HCLGA package information........................................................... 18
10 Revision history ............................................................................ 20
MP34DT04
List of tables
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List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications ................................................................................................................ 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Frequency response mask for digital microphones ...................................................................... 8
Table 7: Absolute maximum ratings ......................................................................................................... 15
Table 8: L/R channel selection ................................................................................................................. 16
Table 9: Recommended soldering profile limits ........................................................................................ 17
Table 10: Document revision history ........................................................................................................ 20
List of figures
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List of figures
Figure 1: Pin connections ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Frequency response and mask ................................................................................................... 8
Figure 4: MP34DT04 electrical connections (top view) .............................................................................. 9
Figure 5: MP34DT04 electrical connections for stereo configuration (top view) ...................................... 10
Figure 6: Carrier tape without microphone (top view) ............................................................................... 11
Figure 7: Carrier tape with microphone (top view) .................................................................................... 11
Figure 8: Recommended picking area ...................................................................................................... 12
Figure 9: Recommended picker design .................................................................................................... 13
Figure 10: Recommended soldering profile limits .................................................................................... 17
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data ........................................ 18
Figure 12: Land pattern............................................................................................................................. 19
MP34DT04
Pin description
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1 Pin description
Figure 1: Pin connections
Table 2: Pin description
Pin #
Pin name
Function
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
0 V supply
Acoustic and electrical specifications
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2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25
°C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Min.
Typ.
(1)
Max.
Unit
Vdd
Supply voltage
1.6
1.8
3.6
V
Idd
Current consumption in normal
mode
Mean value
600
700
μA
IddPdn
Current consumption in power-
down mode
(2)
10
µA
Scc
Short-circuit current
1
10
mA
AOP
Acoustic overload point
120
dBSPL
So
Sensitivity
-29
-26
-23
dBFS
SNR
Signal-to-noise ratio
A-weighted at 1 kHz, 94
dB SPL
64
dB (A)
PSR
Power supply rejection
100 mVpp sine 1 kHz
-70
dBFS
Clock
Input clock frequency
(3)
1
2.4
3.25
MHz
Ton
Turn-on time
(4)
Guaranteed by design
10
ms
Top
Operating temperature range
-40
+85
°C
V
IOL
Low-level logic input/output
voltage
I
out
= 1 mA
-0.3
0.35xVdd
V
V
IOH
High-level logic input/output
voltage
I
out
= 1 mA
0.65xVdd
Vdd+0.3
V
Notes:
(1)
Typical specifications are not guaranteed.
(2)
Input clock in static mode.
(3)
Duty cycle: min = 40% max = 60%.
(4)
Time from the first clock edge to valid output data.
Table 4: Distortion specifications
Parameter
Test condition
Value
Distortion
100 dBSPL (50 Hz - 4 kHz)
< 1% THD + N
Distortion
115 dBSPL (1 kHz)
< 5% THD + N
MP34DT04
Acoustic and electrical specifications
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2.3 Timing characteristics
Table 5: Timing characteristics
Parameter
Description
Min.
Max.
Unit
fCLK
Clock frequency for normal mode
1
3.25
MHz
fPD
Clock frequency for power-down mode
0.23
MHz
TCLK
Clock period for normal mode
308
1000
ns
TR,EN
Data enabled on DATA line, L/R pin = 1
18 (1)
ns
TR,DIS
Data disabled on DATA line, L/R pin = 1
16(1)
ns
TL,EN
Data enabled on DATA line, L/R pin = 0
18(1)
ns
TL,DIS
Data disabled on DATA line, L/R pin = 0
16(1)
ns
Notes:
(1)From design simulations
Figure 2: Timing waveforms
Acoustic and electrical specifications
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2.4 Frequency response
Figure 3: Frequency response and mask
Table 6: Frequency response mask for digital microphones
Frequency / Hz (1)
Lower limit
Upper limit
Unit
100...4000
-2
+2
dBr 1 kHz
4000...10000
-2
+4
dBr 1 kHz
Notes:
(1)At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)
MP34DT04
Application recommendations
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3 Application recommendations
Figure 4: MP34DT04 electrical connections (top view)
Application recommendations
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Figure 5: MP34DT04 electrical connections for stereo configuration (top view)
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 8: "L/R channel selection").
MP34DT04
Carrier tape mechanical specifications
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4 Carrier tape mechanical specifications
Figure 6: Carrier tape without microphone (top view)
Figure 7: Carrier tape with microphone (top view)
Process recommendations
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5 Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with the
following recommendations:
The recommended pick-up area for the MP34DT04 package must be defined using
the worst case (ie. no device alignment during the picking process). This area has
been defined considering all the tolerances of the components involved (reel,
package, sound inlet). The picker tolerance shall be considered as well.
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area
For the package outline please refer to . Nozzle shape, size, and placement accuracy
are the other key factors to consider when deciding on the coordinates for picking.
Device alignment before picking is highly recommended.
A vacuum force greater than 7 psi must be avoided
1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
All recommended dimensions (device safe-picking area) do not include the pick-and-
place equipment tolerances
Figure 8: Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
MP34DT04
Process recommendations
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Figure 9: Recommended picker design
Sensing element
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6 Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
MP34DT04
Absolute maximum ratings
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7 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7: Absolute maximum ratings
Symbol
Ratings
Maximum value
Unit
Vdd
Supply voltage
-0.3 to 5
V
Vin
Input voltage on any control pin
-0.3 to Vdd +0.3
V
TSTG
Storage temperature range
-40 to +125
°C
ESD
Electrostatic discharge protection
±2000 (HBM)
V
±200 (MM)
±750 (CBM)
ESD
Product standard EN 55024:2010 - 3 air
discharge
±15000
V
Functionality
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8 Functionality
8.1 L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 8: L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
MP34DT04
Package information
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9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
9.1 Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits
Table 9: Recommended soldering profile limits
Description
Parameter
Pb free
Average ramp rate
TL to TP
3 °C/sec max
Preheat Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate
TSMAX to TL
Time maintained above liquids temperature
Liquids temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
Package information
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9.2 HCLGA package information
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data
1. The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes.
2. Ring plating can be subject to change not affecting acoustic and electrical
performance.
Dimensionsare in millimeterunless otherwise specified
General Tolerance is +/-0.15mmunless otherwise specified
OUTER DIMENSIONS
ITEM DIMENSION [mm] TOLERANCE [mm]
1.0±3]L[htgneL 1.0±4]W[htdiW 1.0±590.1]H[thgieH AP ɸ1.0±4.0
8579626_B
MP34DT04
Package information
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Figure 12: Land pattern
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