Semiconductor MSM7512B
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GENERAL DESCRIPTION
The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems,
telecontrol systems, home security systems, etc.
The family version, MSM7510 for ITU-T V.21, will be available following this device.
Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these
devices need two power supplies, +5 V for digital and +12 V for analog.
New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power
consumption.
FEATURES
• Conforms to ITU-T V.23, 1200 bps Half Duplex
• Conforms to ITU-T V.23, 75 bps transmitter
• Single Power Supply: +3 V to +5 V
• Low Power Consumption
Operating Mode: 25 mW Typ.
Power Down Mode: 0.1 mW Max.
• Line Hybrid Circuit on Chip
• Line Direct Drive Capability of Analog Output
• 3.579545 MHz Crystal Oscillator
• Digital Interface: TTL
• Package options:
16-pin plastic DIP (DIP16-P-300–2.54) (Product name: MSM7512BRS)
24-pin plastic SOP (SOP24-P-430-1.27–K) (Product name: MSM7512BGS-K)
¡ Semiconductor
MSM7512B
1200 bps Half Duplex FSK Modem – ITU-T V.23
E2A0014-16-X0
This version: Jan. 1998
Previous version: Nov. 1996
Semiconductor MSM7512B
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BLOCK DIAGRAM
AI
(2)
X1
(6)
X2
(7)
V
DD
(1)
CLK
(8)
RD
(9)
CD
(10)
XD
(11)
RS
(12)
CONT.
Demodulator
Modulator
–
+
*R1
*R2
AO
(3)
*R3
*R2
AOG
*R2
EAI
(4) TEST
(13)
MOD1
(14)
MOD2
(15)
AOG
(16)
CLK GEN.
OSC
SG GEN.
GND
(5)
* R1 to R3 ≥ 50 kW
( ) : for MSM7512BRS
*R1
FSK & ANS
Bandpass
Filter
–
+
Semiconductor MSM7512B
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PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
V
DD
AI
AO
EAI
GND
X1
X2
CLK
AOG
MOD2
MOD1
TEST
RS
XD
CD
RD
16-Pin Plastic DIP
1
2
3
4
5
6
7
8
9
10
11
12 13
14
15
16
17
18
19
20
21
22
23
24
V
DD
NC
AI
AO
EAI
X1
NC
X2
AOG
NC
MOD2
NC
NC
CD
NC
CLK
NC
RD
24-Pin Plastic SOP
NC : No connect pin
NC
GND
MOD1
TEST
RS
XD
Semiconductor MSM7512B
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PIN DESCRIPTION
Note : I* : Internally pulled-up input pin.
11 V
DD
— +3 V to +5 V Power Supply
2 3 AI I Analog receive signal input.
3 5 AO O Analog transmit signal output.
4 6 EAI I
External analog signal input.
The signal applied to this pin is transmitted from AO via transmit output
amplifier. When not using this pin, it should be left open.
5 7 GND — Ground, 0 V.
6 8 X1 I 3.579545 MHz crystal resonator should be connected to X1 and X2.
When applying external clock 3.579545 MHz to the device, it should be
applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1
has to be opened.
710 X2 O
8 12 CLK O 3.579545 MHz clock signal output.
913 RD O
Modem receive serial data output.
Digital "1" and "0" correspond to "Mark" and "Space", respectively. When
CD (Carrier Detect) is off, RD is held at "Mark" state.
10 15 CD OFSK Receive signal and answer tone detect.
Digital "0" and "1" represent "Detect" and "Non-detect", respectively.
11 17 XD I* Modem transmit serial data input.
Digital "1" and "0" correspond to "Mark" and "Space", respectively.
12 18 RS I* FSK signal and answer tone transmit enable.
When digital "0" is applied to RS, transmitting becomes enable.
13 19 TEST I* Chip test input.
TEST should be open or digital "1".
14 20 MOD1 I* Operation mode select.
Refer to Table 1.
15 22 MOD2 I*
16 24 AOG I*
Analog transmit signal amplitude select.
Digital "1" Æ –10 dBm Typ. at AO
Digital "0" Æ –4 dBm Typ. at AO
DescriptionName I/O
RS GS-VK
No.
Semiconductor MSM7512B
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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
DC Characteristics
* Internally pulled-up pins
Power Supply Voltage V
DD
Ta = 25°C,
With respect to GND
–0.3 to +7 V
Input Voltage V
IN
–0.3 to V
DD
+ 0.3 V
Storage Temperature T
STG
–55 to +150 °C—
Symbol Condition Rating UnitParameter
( V
DD
= +2.7 V to +5.5 V, Top = –40°C to +85°C)
Power Supply Current I
DD
Operating Mode — 5.0 10.0 mA
I
SS
Power Down Mode — 5.0 20.0 mA
Digital Input Voltage V
IL
— 0 — 0.8 V
V
IH
— 2.2 — V
DD
V
Digital Input Leakage Current I
IL
V
I
= 0 V * –80 — 10 mA
I
IH
V
I
= 5 V –10 — 10 mA
Digital Output Voltage V
OL
I
OL
= 1.6 mA 0 0.2 0.4 V
V
OH
I
OH
= –0.4 mA 2.4 — V
DD
V
Symbol Condition Min. Typ. Max. UnitParameter
UnitMax.Typ.Min.ConditionSymbol
Power Supply Voltage V+5.5—+2.7—V
DD
Operating Temperature °C+85—–40—T
op
Input Clock Frequency %+0.1—–0.1To 3.579545 MHzf
CLK
V
DD
Bypass Capacitor mF——10V
DD
– GNDC
VDD
Oscillation Frequency MHz—3.579545———
Frequency Deviation ppm+100—–100+25°C ±5°C—
Temperature Characteristics ppm+50—–50–40°C to +85°C—
Equivalent Series Resistance W50————
Load Capacitance pF—16———
Crystal
Parameter
Semiconductor MSM7512B
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AC Characteristics
Modulator/analog output (AO) characteristics
* 0 dBm = 0.775 Vrms
(VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)
fDM
fDS
1200 bps Transmit Mode XD = "1"
XD = "0"
1296
2096
1300
2100
1304
2104
Hz
Hz
fBM
fBS
75 bps Transmit Mode XD = "1"
XD = "0"
386
446
390
450
394
454
Hz
Hz
FSK Transmit
Signal Frequency
FSK Transmit
Signal Amplitude
Ratio
VAO(MARK) – VAO(SPACE) –2 0 2 dBVAOD
VSPS P : In-band Signal
Energy
4 kHz to 8 kHz
8 kHz to 12 kHz
—
—
—
—
P–20
P–40
dB
dB
More than12 kHz — — P–60 dB
Out-of-band
Energy
To VDD/2 –150 — +150 mVVOFF
Output Offset Voltage
— 600 — — WRAO
Output Load Resistance
Symbol Condition Min. Typ. Max. UnitParameter
VAO1
VAO2
VO
AOG = "0"
AOG = "1"
–6
–12
–4
–10
–2
–8
dBm
dBm
FSK Transmit Signal
Answer Tone amplitude
VEA1
VEA2
VAO – VEAI
AOG = "0"
AOG = "1"
–2
–8
0
–6
2
–4
dB
dB
Analog External
Input Signal Gain
Semiconductor MSM7512B
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Demodulator analog input (Al, EAI) characteristics
* 0 dBm = 0.775 Vrms
t
CDD
AI
CD
t
CDH
Figure 1 Carrier Detect (CD) Timing
( V
DD
= +2.7 V to +5.5 V, Top = –40°C to +85°C)
V
ON
Æ V
OFF
—2—dBV
HYS
Hysteresis (CD)
AI — 10 — MWR
AI
Input Resistance
Symbol Condition Min. Typ. Max. UnitParameter
FSK Signal, at AI — — –6 dBmV
AI
Receive Signal
Amplitude
V
ON
V
OFF
FSK Signal, (1:1) at AI OFF Æ ON
OFF Æ OFF
—
–48
—
—
–42 dBm
dBm
Receive Signal
Detect Amplitude (CD)—
See Fig. 1 51520mst
CDD
CD Delay Time
20 40 60 mst
CDH
CD Hold Time
1200 bps, 1:1 Pattern –10 — 10 %D
BS
Receive Data (RD)
Bias Distortion
EAI 20 — — kWR
EAI
Semiconductor MSM7512B
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AI
AO
Phone
Line
Receive Filter RD
XD
DTE
Transmit Filter
Demodulator
Modulator
Phone
Line
AI
AO
RD
XD
DTE
SG
Receive Filter
Transmit Filter
Demodulator
Modulator
AI
AO
Phone
Line
Receive Filter RD
XD
DTE
Transmit Filter
Demodulator
Modulator
SG VDD
OPERATION MODE
Table 1 Operation Mode
Figure 4 Analog Loop Back Test Mode
Figure 2 FSK Transmit Mode
Figure 3 FSK Receive Mode
MOD2 MOD1
00
FSK Transmit Mode (Fig.2)
01
FSK Receive & 75 bps Transmit Mode (Fig.3)
10
Analog Loop Back Test Mode (Fig. 4)
11
Power Down Mode
Mode
Semiconductor MSM7512B
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APPLICATION CIRCUIT
➀
➁
MSM7512BRS
1
AO
AI
V
DD
EAI
GND
X1
X2
MOD
1
MOD
2
AOG
TEST
RS
XD
CD
CLK RD
16
CONT.
89
2.2 mF
600 W
Line
600 W : 600 W
2.2 mF
External Analog
Transmit Signal
100 pF
External Clock
3.58 MHz
10 mF
–
+
MSM7512BRS
1
AO
AI
VDD
10 mF
EAI
GND
X1
X2
MOD
1
MOD
2
AOG
TEST
RS
XD
CD
CLK RD
–
+
16
3.58 MHz
CONT.
89
2.2 mF
600 W
Line
600 W : 600 W
To other circuit
Semiconductor MSM7512B
10/12
An Example of the External Adjustment for a transmitting Level and detecting Level
If you desire to change the transmitting level or detecting level, adjust the external circuit
by referring to the following circuit.
Line transmitting level :
VAOL = VAO ¥ (R2/R1)
IC input level : VAI = VAIL ¥ (R4/R3)
Line
2.2 mF
51 kW
51 kW
600 W
R2
AI
600 W
R4
R3
R1
VAOL
VAO
VAI
AO
2.2 mF
51 kW
51 kW
VAIL
–
+
–
+
–
+
Semiconductor MSM7512B
11/12
(Unit : mm)
PACKAGE DIMENSIONS
DIP16-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.99 TYP.
Semiconductor MSM7512B
12/12
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Mirror finish