© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 8 1Publication Order Number:
SMS05T1/D
SMS05T1 Series
SC-74 Quad Transient
Voltage Suppressor
for ESD Protection
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems and
other applications. This quad device provides superior surge
protection over current quad Zener MMQA series by providing up to
350 watts peak power.
Features
•SC-74 Package Allows Four Separate Unidirectional Configurations
•Peak Power − 350 W, 8 x 20 mS
•ESD Rating of Class N (Exceeding 25 kV) per
the Human Body Model
•ESD Rating:
IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact)
IEC 61000−4−4 (EFT) 40 A (5/50 ns)
IEC 61000−4−5 (lightning) 23 A (8/20 ms)
•UL Flammability Rating of 94 V−0
•These Devices are Pb−Free and are RoHS Compliant
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Typical Applications
•Hand Held Portable Applications such as Cell Phones, Pagers,
Notebooks and Notebook Computers
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation
8 x 20 mS @ TA = 25°C (Note 1) Ppk 350 W
Total Power Dissipation on FR−5 Board
@ TA = 25°C (Note 2)
Derate Above 25°C
PD225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RqJA 556 °C/W
Junction and Storage
Temperature Range TJ, Tstg −55 to +150 °C
Lead Solder Temperature
Maximum 10 Seconds Duration TL260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be af fected.
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform
2. FR−5 = 1.0 x 0.75 x 0.62 in.
SC−74 QUAD TRANSIENT
VOLTAGE SUPPRESSOR
350 WATTS PEAK POWER
5 VOLTS
SC−74
CASE 318F
STYLE 1
1
2
3
6
5
4
MARKING DIAGRAM
PIN ASSIGNMENT
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 o
f
this data sheet.
DEVICE MARKING INFORMATION
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1
6
See detailed ordering, marking and shipping information in the
ordering information section on page 2 of this data sheet.
ORDERING INFORMATION
1
xxx M G
G
xxx = Specific Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SMS05T1 Series
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2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
QVBR Maximum Temperature Coefficient of VBR
IFForward Current
VFForward Voltage @ IF
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
Uni−Directional
IPP
IF
V
I
IR
IT
VRWM
VCVBR VF
ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL
Device* Device
Marking
Breakdown
Voltage
Max
Reverse
Leakage
Current
Max Reverse Voltage
(Clamping Voltage)
At Specified Reverse
Surge Current (IRSM)
Max Reverse Voltage
(Clamping Voltage)
At Specified Reverse
Surge Current (IRSM)
Capacitance
@ 0 Volt Bias,
1 MHz
VBR(V) ITIRVR
IRSM
(8x20 ms) VRSM
(8x20 ms) IRSM
(8x20 ms) VRSM
(8x20 ms) (pF)
Min Nom Max (mA) (mA) (V) (A) (V) (A) (V) Min Max
SMS05T1G 5V0 6.0 − 7.2 1.0 20 5.0 5.0 9.8 23 15.5 250 400
SMS12T1G 12V 13.3 − 15 1.0 1.0 12 5.0 19.0 15 23.0 80 150
SMS15T1G 15V 16.7 − 18.5 1.0 1.0 15 5.0 24.0 12 29.0 60 125
SMS24T1G 24V 26.7 − 32 1.0 1.0 24 5.0 40.0 8 44.0 40 75
*Includes SZ−prefix devices where applicable.
ORDERING INFORMATION
Device Package Shipping†
SMS05T1G,
SZSMS05T1G** SC−74
(Pb−Free) 3000 / Tape & Reel
SMS12T1G SC−74
(Pb−Free) 3000 / Tape & Reel
SMS15T1G,
SZSMS15T1G** SC−74
(Pb−Free) 3000 / Tape & Reel
SMS24T1G,
SZSMS24T1G** SC−74
(Pb−Free) 3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
**SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
SMS05T1 Series
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3
TYPICAL CHARACTERISTICS
SMS15
SMS12
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time Figure 2. Power Derating Curve
Figure 3. Pulse Waveform
t, TIME (ms)
30151050
Figure 4. Clamping Voltage versus
Peak Pulse Current
IPP, PEAK PULSE CURRENT (A)
2
5
20151050
15
10
5
0
25
PERCENT OF I
PP
VC, CLAMPING VOLTAGE (V)
Figure 5. 8 x 20 ms V
F
IF, FORWARD CURRENT (A)
5
3
1
1050
Figure 6. Typical Capacitance (SMS05 Series)
VR, REVERSE VOLTAGE (V)
2
5
20151050
150
100
50
0
0
200
250
V
F
, FORWARD VOLTAGE (V)
C, CAPACITANCE (pF)
2520
90
80
70
60
50
40
30
20
10
0
100
110 WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
td = IPP/2
4
2015
PULSE
WAVEFORM
tr = 8 ms
td = 20 ms
WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
20
SMS24
2
300
TJ = 25°C
c−t
8 X 20 ms SURGE
SMS05
SMS12
SMS05
tp, PULSE DURATION (ms)
10
1
0.1
10001001010.1
TA, AMBIENT TEMPERATURE (°C)
15
0
1251007550250
90
80
70
60
50
40
30
20
10
0
0.01
100
110
P
PP
, PEAK PULSE POWER (kW)
% OF RATED POWER OR IPP
SMS15 SMS24
40
35
30
50
45
SMS05T1 Series
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4
PACKAGE DIMENSIONS
SC−74 (SC−59ML)
CASE 318F−05
ISSUE N
23
456
D
1
eb
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
C
L
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.37 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE− −
L
0°10°0°10°
q
q
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
SMS05T1/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
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and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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