MKS2PAC220BYOMZ - OMRON - Datasheet.Directory

 2014 Microchip Technology Inc. DS40001750A-page 1

Description:

Microchip’s MTCH6102 is a turnkey projected

capacitive touch controller that simplifies adding

gestures to touch interface designs with

industry-leading low-power performance. It utilizes up

to 15 channels to support taps, swipes, and scrolling on

XY touch pads and touch screens. MTCH6102 allows

designers to quickly and easily integrate projected

capacitive touch into their cost-sensitive, low-power

application. MTCH6102 provides developers with a

flexible touch-sensing solution to optimize common

constraints of size, power and cost that are critical to

applications such as wearable devices, remote

controls, gaming devices and track pads.

Applications:

• Wearable Devices such as Headphones,

Watches, Fitness Wristbands

• Track Pads and Computer Peripherals

• Input Devices with Configurable Button, Keypad

or Scrolling Functions

• Any Interface with Single-Finger Gestures to

Swipe, Scroll, or Doubletap Controls

• Home Automation Control Panels

• Security Control Keypads

• Automotive Center Stack Controls

• Gaming Devices

• Remote Control Touch Pads

Touch Sensor Support:

• Up to 15 Channels

• Sensor Sizes up to 120 mm (4.7”)

• Individual Channel Tuning for Optimal Sensitivity

• Works with Printed Circuit Board (PCB) Sensors,

Film, Glass and Flexible Printed Circuit (FPC)

Sensors

Cover Layer Support:

• Plastic: up to 3 mm

• Glass: up to 5 mm

Touch Performance:

• >200 Reports per Second (configurable)

• 12-Bit Resolution Coordinate Reporting

Touch Features:

• Gesture Detection and Reporting

• Self-Capacitance Signal Acquisition

• Multiple Built-in Filtering Options

Power Management:

• Configurable Sleep/Idle Frame Rates

• Standby mode <500 nA (typical)

• Active mode <12 uA possible

Communication Interface:

•I

2C™ (up to 400 kbps)

• Both Polling and Interrupt Schemes Supported

• Sync Signal Allows for Host Frame Detection

• Field Upgradeable over I2C

Operating Conditions:

• 1.8V to 3.6V, -40°C to +85°C

Package Types:

• 28-Pin SSOP

• 28-Pin UQFN

MTCH6102

MTCH6102 Low-Power Projected Capacitive Touch Controller

MTCH6102

DS40001750A-page 2  2014 Microchip Technology Inc.

Table of Contents

1.0 MTCH6102 Block Diagram........................................................................................................................................................... 3

2.0 Pin Diagrams................................................................................................................................................................................ 4

3.0 MTCH6102 Pinout Description..................................................................................................................................................... 5

4.0 Layout........................................................................................................................................................................................... 6

5.0 Communication ............................................................................................................................................................................ 8

6.0 Sensor Design Considerations................................................................................................................................................... 10

7.0 Operating Modes........................................................................................................................................................................ 13

8.0 Controller Commands ................................................................................................................................................................ 15

9.0 Touch Frame Control ................................................................................................................................................................. 16

10.0 Touch Data Registers................................................................................................................................................................. 17

11.0 Acquisition and Touch Parameters ............................................................................................................................................ 18

12.0 Compensation RAM ................................................................................................................................................................... 20

13.0 Baseline...................................................................................................................................................................................... 21

14.0 Gesture Features and Parameters............................................................................................................................................. 22

15.0 Configuring a Non-Default Application ....................................................................................................................................... 26

16.0 Manufacturing Testing ................................................................................................................................................................ 27

17.0 Memory Map .............................................................................................................................................................................. 28

18.0 Electrical Characteristics ............................................................................................................................................................ 31

19.0 Ordering Information .................................................................................................................................................................. 35

20.0 Packaging Information................................................................................................................................................................ 36

The Microchip Web Site........................................................................................................................................................................ 43

Customer Change Notification Service................................................................................................................................................. 43

Customer Support ............................................................................................................................................................................... 43

Worldwide Sales and Service............................................................................................................................................................... 45

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 2014 Microchip Technology Inc. DS40001750A-page 3

MTCH6102

1.0 MTCH6102 BLOCK DIAGRAM

FIGURE 1-1: MTCH6102 BLOCK DIAGRAM

CONFIGURATION

RAM

TOUCH

RAM

ACQUISITION

RAM

CVD ACQUISITION

ENGINE

TOUCH

DECODING

GESTURE

ENGINE

CORE RAM

TIMING ENGINE

RX Sensor

Channels

Host

Controller

SYNC

INT

Host

Controller

Host

Controller

MTCH6102

DS40001750A-page 4  2014 Microchip Technology Inc.

2.0 PIN DIAGRAMS

FIGURE 2-1: 28-PIN UQFN (4X4)

FIGURE 2-2: 28-PIN SSOP

MTCH6102

RX11

RX12

RX13

VSS

RX10

RX9

RESET

RX8

RX7

RX6

RX5

RX4

RX3

VDD

VSS

RX2

INT

SYNC

RX14

SCL

SDA

RX0

RX1

MTCH6102

RESET

RX9

RX10

RX11

RX12

RX13

VSS

INT

SYNC

RX14

SCL

RX8

RX7

RX6

RX5

RX4

RX3

VDD

VSS

RX2

RX1

RX0

SDA

 2014 Microchip Technology Inc. DS40001750A-page 5

MTCH6102

3.0 MTCH6102 PINOUT

DESCRIPTION

TABLE 3-1: MTCH6102 PINOUT DESCRIPTION

Pin Name UQFN Pin SSOP Pin Pin Type Description

RESET 26 1 I Master Reset with Internal Pull-up

SCL 11 14 I/O I2C™ Clock

SDA 12 15 I/O I2C Data Input/Output

INT 8 11 O Interrupt Request Output

SYNC 9 12 O Synchronous Frame Output

RX0 13 16 I/O Touch Sensor Channel Input

RX1 14 17 I/O

RX2 15 18 I/O

RX3 18 21 I/O

RX4 19 22 I/O

RX5 20 23 I/O

RX6 21 24 I/O

RX7 22 25 I/O

RX8 23 26 I/O

RX9 27 2 I/O

RX10 28 3 I/O

RX11 1 4 I/O

RX12 2 5 I/O

RX13 4 7 I/O

RX14 10 13 I/O

VDD 17 20 Power Positive Supply

VSS 5,16 8,19 Power Ground Reference

N/C 3, 6, 7, 24, 25 6, 9, 10, 27, 28 N/C No Connect

MTCH6102

DS40001750A-page 6  2014 Microchip Technology Inc.

4.0 LAYOUT

FIGURE 4-1: TYPICAL APPLICATION CIRCUIT

MTCH6102

RX11

RX12

RX13

RX10

RX9

RESET

RX8

RX7

RX6

RX5

RX4

RX3

RX2

INT

SYNC

RX14

SCL

SDA

RX0

RX1

0.1ʅF10ʅF



20k

4.7k1.8k



Host Controller



 2014 Microchip Technology Inc. DS40001750A-page 7

MTCH6102

4.1 Decoupling Capacitors

The use of decoupling capacitors on power-supply

pins, such as VDD and VSS, is required. Consider the

following criteria when using decoupling capacitors:

1. Value and type of capacitor:

A value of 0.1 µF (100 nF), 10-20V is recommended.

The capacitor should be a low Equivalent Series

Resistance (low ESR) capacitor and have resonance

frequency in the range of 20 MHz and higher. It is

further recommended that ceramic capacitors be used.

2. Placement on the Printed Circuit Board:

The decoupling capacitors should be placed as close to

the pins as possible. It is recommended that the

capacitors be placed on the same side of the board as

the device. If space is constricted, the capacitor can be

placed on another layer on the PCB using a via;

however, ensure that the trace length from the pin to

the capacitor is within one-quarter inch (6 mm) in

length.

3. Handling high-frequency noise:

If the board is experiencing high-frequency noise,

upward of tens of MHz, add a second ceramic-type

capacitor in parallel to the above-described decoupling

capacitor. The value of the second capacitor can be in

the range of 0.01 µF to 0.001 µF. Place this second

capacitor next to the primary decoupling capacitor. In

high-speed circuit designs, consider implementing a

decade pair of capacitances as close to the power and

ground pins as possible (for example, 0.1 µF in parallel

with 0.001 µF).

4. Maximizing performance:

On the board layout from the power supply circuit, run

the power and return traces to the decoupling

capacitors first, and then to the device pins. This

ensures that the decoupling capacitors are first in the

power chain. It is equally important to keep the trace

length between the capacitor and the power pins to a

minimum, thereby reducing PCB track inductance.

4.2 Bulk Capacitors

The use of a bulk capacitor is recommended to improve

power-supply stability. Typical values range from

4.7 µF to 47 µF. This capacitor should be located as

close to the device as possible.

MTCH6102

DS40001750A-page 8  2014 Microchip Technology Inc.

5.0 COMMUNICATION

5.1 I2C Pin Specification

5.1.1 DESCRIPTION

The MTCH6102 low-power projected capacitive touch

controller uses a standard register-based read/write

I2C protocol based upon the memory map. This

protocol is similar to many other devices such as

temperature sensors and serial EEPROMs. Although

data can be read at any time (polling), an interrupt pin

(INT) is provided for flexible integration options.

5.1.2 READING/WRITING REGISTERS

To access memory (both to read or write), the I2C

transaction must start by addressing the chip with the

Write bit set, then writing out a single byte of data

representing the memory address to be operated on.

After that, the host can choose to do either of the

following (see Figure 5-1):

1. To write memory, continue writing [n] data bytes

(see Figure 5-2).

2. To read memory, restart the I2C transaction (via

either a Stop-Start or Restart), then address the

chip with the Read bit set. Continue to read in [n]

data bytes (see Figure 5-3).

During either of these transactions, multiple bytes

within the same block may be read or written due to the

device’s address auto-increment feature. See

Section 17.0 “Memory Map” for block separation.

FIGURE 5-1: I2C™ TRANSACTION DIAGRAM

FIGURE 5-2: EXAMPLE I2C™ WRITE TRANSACTION

FIGURE 5-3: EXAMPLE I2C™ READ TRANSACTION

DATAIN DATAIN

... P

SR I2CADDR R

DATAOUT ... PDATAOUT

S I2CADDR W REGADDR

Write

Read

S W

P I2CADDR

REGADDR

Start Condition Write Bit

Read Bit

Stop Condition

SR Restart Condition

Device Address (ďŝƚ7)

S0x25 W

ACK

0x04 0x80 P

/ϮCdD

ACK ACK

Address Data

S0x25 W

ACK SR

0x10 0x25 R

ACK

0x01

NK P

INT

ϮCdD

ACK

Address Data

 2014 Microchip Technology Inc. DS40001750A-page 9

MTCH6102

5.1.3 DEVICE ADDRESSING

The MTCH6102 default 7-bit base address is 0x25.

Every transmission must be prefixed with this address,

as well as a bit signifying whether the transmission is a

master write (‘0’) or master read (‘1’). After appending

this Read/Write bit to the base address, this first byte

becomes either 0x4A (write) or 0x4B (read).

This address can be modified (see I2CADDR), but this

requires initially communicating with the device under

the default address. If this is not feasible in the user’s

application, contact Microchip support for additional

options.

5.2 Interrupt Pin

MTCH6102 provides an open-collector active-low

Interrupt pin (INT) that will be asserted any time new

data is available. INT is automatically released under

two conditions:

1. A read is performed of any register within the

device.

2. The next frame of decoding has started.

5.3 SYNC Output Pin

MTCH6102 provides an active-high sync signal that

correlates with the current touch frame status. The

SYNC pin is low while the device is sleeping (between

frames) and high while touch sensing/decoding is

occurring. A common use of this pin includes a host

that makes use of data on every frame (such as

raw-acquisition data), for host-side decoding (see

Figure 5-4).

FIGURE 5-4: EXAMPLE INT/SYNC LOGIC

CdD

INT

SYNC

efg

a Controller sleeping f INT is released as controller goes to Sleep

b Controller decoding g INT is asserted due to (d)

c Touch frame h INT is released due to I2C™ read

d Finger is present i INT is released due to I2C™ read

e INT asserted due to (d) j Finger is not present

MTCH6102

DS40001750A-page 10  2014 Microchip Technology Inc.

6.0 SENSOR DESIGN

CONSIDERATIONS

6.1 General Guidelines

FIGURE 6-1: DIAMOND DIMENSION

GUIDELINES

6.1.1 PROTOTYPING DESIGNS

Touch sensor designs typically require a thorough

debugging phase to ensure a reliable product. If

possible, it is suggested that flexible prototyping

hardware be created with this in mind. A common

example is providing external access to the

communication lines for quick test and tuning while

in-circuit.

6.1.2 SENSOR OVERLAY MATERIAL

To prevent saturation of sensor levels, a minimum

overlay of 0.5 mm plastic or glass is required for proper

operation of the device, even during a prototyping

phase, even if this value is different than the final

design.

6.1.3 OPERATION WITH AN LCD

MTCH6102 has integrated algorithms to detect and

minimize the effects of noise, but proper care should

always be taken in selecting an LCD and support

components with a focus on reducing noise as much as

possible. Since the interaction between the touch

sensor and display is highly dependent upon the

physical arrangement of the components, proper

testing should always be executed with a fully

integrated device. Please reference the appropriate

projected capacitive touch screen manufacturer’s

integration guide for additional design considerations.

Note: At no time should the device be expected

to respond correctly to a user touching a

bare PCB sensor.

Dim. Typ. Min. Max.

a 6 mm 4 mm 10 mm

b 0.2 mm — 0.5 mm

 2014 Microchip Technology Inc. DS40001750A-page 11

MTCH6102

6.2 Sensor Layout Configuration

MTCH6102 is designed to work with sensors with a

minimum of 3x3 sensor channels, and a total maximum

of 15 channels. The number of channels on each axis

is governed by the registers in Table 6 -1. For all sensor

configurations, the following conditions must be met:

1. Channel layout must start at RX0.

2. Each axis must have the associated channels in

either ascending or descending order.

3. No unconnected channel pins are allowed in the

middle of a layout.

Table 6-2 shows an example of each rule being broken

by a 6x5 sensor layout, followed by the correct layout

in the last column.

6.3 Sensor Output Resolution

MTCH6102 interpolates 64 discrete points between

each channel and 32 points past the centerline of each

edge. As a result, the maximum value in the TOUCHX

and TOUCHY registers will be

(64xNUMBEROFCHANNELS) on each axis. For the

default 9x6 sensor, this results in a maximum resolution

of 576x384.

TABLE 6-1: REGISTERS ASSOCIATED WITH SENSOR LAYOUT CONFIGURATION

Address Name Description

0x20 NUMBEROFXCHANNELS Number of channels used for X axis

0x21 NUMBEROFYCHANNELS Number of channels used for Y axis

TABLE 6-2: EXAMPLE OF INCORRECT

6X5 SENSOR CONNECTIONS

(1) (2) (3) Correct

RX0 X0 X0 X0

RX1 X1 X1 X1

RX2 X2 X2 X2

RX3 X4 X3 X3

RX4 X0 X3 X4 X4

RX5 X1 X5 X5 X5

RX6 X2 Y0 Y0

RX7 X3 Y2 Y1

RX8 X4 Y1 Y0 Y2

RX9 X5 Y3 Y1 Y3

RX10 Y0 Y4 Y2 Y4

RX11 Y1 Y3

RX12 Y2

RX13 Y3 Y4

RX14 Y4

MTCH6102

DS40001750A-page 12  2014 Microchip Technology Inc.

6.4 Sensor Orientation

To aid in PCB layout, the sensor can be oriented in any

direction, have either axis reversed, or even have the

axes swapped. The host controller must take into

account the X/Y output and gesture orientation based

on Figure 6-2.

FIGURE 6-2: SENSOR ORIENTATION EXAMPLES

RX0 RX8

RX9

RX14

(0,0)

(0,384)

(576,0)

(576,384)

RX0 RX8

RX14

RX9 (0,0)

(0,384)

(576,0)

(576,384)

RX8 RX0

RX9

RX14

(0,0)

(0,384)

(576,0)

(576,384)

RX8 RX0

RX14

RX9 (0,0)

(0,384)

(576,0)

(576,384)

 2014 Microchip Technology Inc. DS40001750A-page 13

MTCH6102

7.0 OPERATING MODES

MTCH6102 operates in multiple modes (see Table 7-1)

governed by the MODE register (see Register 7-1).

TABLE 7-1: OPERATING MODE DESCRIPTIONS

Mode

Name Description INT Behavior

Full Full X/Y and gesture decoding occurs (Default mode) Asserted if touch is present or if a change in

touch status or a gesture have occurred

Touch Full X/Y decoding only Asserted if touch is present or if a change in

touch status occurs

Gesture Full X/Y and gesture decoding occurs, but INT is no

longer asserted for touch data

Asserted for gestures only(1)

Raw Raw-capacitance signals are stored in RAWADC

registers, no decoding done. Channel selection and

type of measurement is governed by the MODECON

None

Standby Device is no longer sensing or performing baseline

tasks

None

Note 1: Data in TOUCH registers is still valid.

U-x U-x U-x U-x R/W-0 R/W-0 R/W-1 R/W-1

— — — — MODE<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 MODE<3:0>: Touch Decoding mode bits

0000 = Standby

0001 = Gesture

0010 = Touch only

0011 = Full (touch and gesture)

01XX =Raw ADC

MTCH6102

DS40001750A-page 14  2014 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

TYPE<3:0> CH<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 TYPE<3:0>: CVD Result Arithmetic bits

0000 = (1023 – Result1) + Result 2

0001 = Result 1 only

0010 = Result 2 only

bit 3-0 CH<3:0>: RX Sense Channel bits

0000 =RX0

1110 =RX14

1111 = Reserved, do not use

 2014 Microchip Technology Inc. DS40001750A-page 15

MTCH6102

8.0 CONTROLLER COMMANDS

Various controller commands can be initiated by writing

a ‘1’ to the appropriate bit in the CMD register

(Register 8-1). This bit will automatically be cleared

after the command has been completed.

R/W-0 R/W-0 R/W-0 U-x R/W-0 U-x U-x R/W-0

NV DEF CFG —MFG ——BS

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7 NV: Nonvolatile Storage Write bit

bit 6 DEF: Restore Controller to Default Configuration Values bit

bit 5 CFG: Configure Controller bit (after parameters have been changed)

bit 4 Unimplemented: Read as ‘0’

bit 3 MFG: Execute Manufacturing Test bit

bit 2-1 Unimplemented: Read as ‘0’

bit 0 BS: Force Baseline bit (recalibration) to occur

MTCH6102

DS40001750A-page 16  2014 Microchip Technology Inc.

9.0 TOUCH FRAME CONTROL

Touch decoding is based around the concept of a touch

frame that begins with acquisition, followed by

decoding of the acquired values, and lastly a Sleep

phase for power savings. The duration of the touch

frame is governed by the current touch state, as well as

the timing registers outlined in this section (see

Table 9-1). Figure 9-1 shows the interaction between

these registers during a typical touch cycle.

Both active and idle period calculations are as shown

in Equation 9-1.

EQUATION 9-1:

Typical frame rates have been computed for the user’s

convenience and are shown in Table 9 -2 .

FIGURE 9-1: TOUCH FRAME TIMING

TABLE 9-1: REGISTERS ASSOCIATED

WITH TOUCH FRAME

CONTROL

Address Name Description

0x25 ACTIVEPERIODL Active Period

0x26 ACTIVEPERIODH

0x27 IDLEPERIODL Idle Period

0x28 IDLEPERIODH

0x29 IDLETIMEOUT Idle Timeout

0x2B DEBOUNCEUP Liftoff Debounce

0x2C DEBOUNCEDOWN Touch Down

Debounce

TABLE 9-2: EXAMPLE FRAME RATE

PERIOD CALCULATIONS

Desired Rate

(ms) Period

10 0x0142

20 0x0284

50 0x064C

100 0x0C99

Duration ms1000

-------------------------------------------------------





1PERIOD=+

Touch Present

SYNC

Up Timer (4)

Down Timer (2)

IdleTimer (5)

TCH bit

01012012 3 33012330100000

4554555554555545432100

0000000000055555 555432

105555555

INT

IDLETIMEOUT (5)DEBOUNCEUP (4)DEBOUNCEDOWN (2)

 2014 Microchip Technology Inc. DS40001750A-page 17

MTCH6102

10.0 TOUCH DATA REGISTERS

R/W-0 R/W-0 R/W-0 R/W-0 U-x R/W-0 R/W-0 R/W-0

FRAME<3:0> — LRG GES TCH

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 FRAME<3:0>: Increments on Every Touch Frame

bit 3 Unimplemented: Read as ‘0’

bit 2 LRG: Large Activation is Present

bit 1 GES: Gesture is Present

bit 0 TCH: Touch is Present

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

TOUCHX<3:0> TOUCHY<3:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-4 TOUCHX<3:0>: Current X Position (Least Significant bits)

bit 3-0 TOUCHY<3:0>: Current Y Position (Least Significant bits)

TABLE 10-1: SUMMARY OF REGISTERS ASSOCIATED WITH TOUCH DATA

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x10 TOUCHSTATE FRAME<3:0> —LRGGES TCH

0x11 TOUCHX TOUCHX<11:4>

0x12 TOUCHY TOUCHY<11:4>

0x13 TOUCHLSB TOUCHX<3:0> TOUCHY<3:0>

MTCH6102

DS40001750A-page 18  2014 Microchip Technology Inc.

11.0 ACQUISITION AND TOUCH

PARAMETERS

11.1 SCANCOUNT

Every time a channel is scanned, it is scanned multiple

times (SCANCOUNT) and summed. Increasing this

number will give an inherent averaging effect, but at the

cost of time and subsequently increased power

consumption.

11.2 TOUCHTHRESHX/

TOUCHTHRESHY and

HYSTERESIS

The presence of a touch is determined by the sensor

channel’s current value compared to the touch

thresholds set by TOUCHTHRESHX (or

TOUCHTHRESHY if the channel is on the Y axis).

The HYSTERESIS register contains a threshold

modifier that acts as a dynamic threshold modifier

depending on the state of the touch (higher without a

touch). A single channel of touch is shown in

Figure 11-1.

FIGURE 11-1: TOUCH THRESHOLD AND HYSTERESIS FUNCTIONALITY

TABLE 11-1: REGISTERS ASSOCIATED

WITH ACQUISITION AND

TOUCH PARAMETERS

Address Name Default

0x22 SCANCOUNT 6

0x23 TOUCHTHRESHX 55

0x24 TOUCHTHRESHY 40

0x2A HYSTERESIS 4

0x31 FILTERTYPE 2

0x32 FILTERSTRENGTH 1

0x35 LARGEACTIVATIONTHRESHL 0

0x36 LARGEACTIVATIONTHRESHH 0

Hysteresis

Touch Threshold

Sensor Amplitude

Touch Detected

 2014 Microchip Technology Inc. DS40001750A-page 19

MTCH6102

11.3 FILTERTYPE/FILTERSTRENGTH

As new sensor values are acquired, they are filtered

based on the settings of the FILTERTYPE/

FILTERSTRENGTH registers (see Table 11-2).

Examples of the effects of each filter type are shown in

Figure 11-2.

FIGURE 11-2: FILTER EXAMPLES

Choosing the correct filtering option for the user’s

application depends on the environment and sensor.

Note that while the median filter has good

characteristics, it is not the most efficient and will

consume more power than other filters.

11.4 Large Activation

The LARGEACTIVATIONTHRESH registers provide a

way to do simple rejection of signals that are too large

to interpret. The amplitude of all sensor channels are

added together and compared to this threshold. If

greater, the LRG bit of the TOUCHSTATE register

(Register 10-1) will be set.

Note that this does not affect touch decoding. In other

words, even if the large activation threshold is

breached, the controller will still decode the touch

position as normal. The LRG bit merely serves to

inform the host that the large activation threshold has

been reached.

If this functionality is not intended to be used, this

large activation routines from running.

TABLE 11-2: FILTERTYPE AND FILTERSTRENGTH DEFINITIONS

FILTERTYPE FILTERSTRENGTH Valid Values

0 – No Filter N/A —

1 – Median Size of median window 3, 5, 7, 9

2 – IIR Weighting of previous to current value 1, 2, 3 (1/2, 1/4 and 1/8 weighting accordingly)

3 – Average Size of average window 1, 2, 3 (2, 4 and 8 accordingly)

Unfiltered (raw) data:

Median - Strength 5 (Window size 5)

IIR - Strength 1 (50/50)

Average – Strength 2 (Window size 4)

MTCH6102

DS40001750A-page 20  2014 Microchip Technology Inc.

12.0 COMPENSATION RAM

It is very common for a typical touch sensor to have

non-uniform capacitive properties. To equalize the

sensor, a series of coefficients can be written to the

compensation RAM block. These coefficients

represent a ratio that is applied to the individual

channel in post-acquisition, before touch decoding

occurs.

EQUATION 12-1: COMPENSATION RAM CALCULATION

To obtain the correct compensation RAM values, the

following procedure should be used:

1. Set all SENSORVALUES registers to zero (if

necessary).

2. Record the peak values that occur in the

SENSORVALUES registers when using the

sensor under normal conditions (column A of

Table 12-1).

3. Pick a commonly occurring value to represent

the median of the set (‘125’).

4. Calculate the ratio of the peak value by dividing

the median value by the peak (column B).

5. Multiply this value by 64 and truncate (column

C). These are the compensation values that

should be written to the SENSORCOMP

registers. Please note that, if no compensation

is required (value of ‘64’, ratio of ‘1’), the register

should be set to ‘0’, to save time running

compensation routines for that channel.

6. To see the expected output from the

compensation values, follow Equation 12-1

(result in column D).

RAW VALUESENSORCOMP

----------------------------------------------------------------------------------------FINAL VALUE=

TABLE 12-1: COMPENSATION RAM

EXAMPLE CALCULATION

CH A B C D

0 102 1.225 78 124

1 113 1.106 71 125

2 118 1.059 68 125

3 125 1 64 (0) 125

4 125 1 64 (0) 125

5 128 0.977 63 126

6 132 0.947 61 126

7 160 0.781 50 125

 2014 Microchip Technology Inc. DS40001750A-page 21

MTCH6102

13.0 BASELINE

Capacitive touch principles rely on analyzing a change

in capacitance from a previously-stored baseline value

(sometimes referred to as a calibration value). Baseline

routines and behavior can be tweaked using the

registers listed in Table 13-1.

13.1 BS Bit (CMD Register)

The BS bit forces the current sensor values to be

stored as the baseline values, disregarding the

constraints of BASEPOSFILTER and

BASENEGFILTER.

13.2 BASEINTERVAL

It represents the number of touch frames between

baseline sampling. Data that is sampled will be applied

at the next baseline interval, provided that a touch has

not occurred between the two.

If at any point, the touch threshold is breached, the

baseline counter is reset, and a full interval without a

touch must occur before baselining resumes.

Note that this value is specified in terms of the number

of touch frames, so any changes in frame rate should

take this into consideration by raising or lowering this

interval accordingly.

13.3 BASEPOSFILTER/BASENEGFILTER

The positive and negative filters act as slew-rate

limiters for a new baseline being applied. For example,

if the new baseline value is larger than the previous by

a value of 35, and the BASEPOSFILTER is set to 20

(default), the new baseline will only be increased by 20.

Use of these registers helps prevent unwanted spikes

in the baseline value.

13.4 BASEFILTERTYPE/

BASEFILTERSTRENGTH

Baseline acquisition frames follow the same filter type

and strength parameters as normal acquisition filters,

defined in Section 11.3 “FILTERTYPE/FILTER-

STRENGTH”.

TABLE 13-1: REGISTERS ASSOCIATED WITH BASELINE

Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x04 NV DEF CFG -MFG --BS 0

0x2D BASEINTERVALL 10

0x2E BASEINTERVALH 0

0x2F BASEPOSFILTER 20

0x30 BASENEGFILTER 20

0x33 BASEFILTERTYPE 2

0x34 BASEFILTERSTRENGTH 1

MTCH6102

DS40001750A-page 22  2014 Microchip Technology Inc.

14.0 GESTURE FEATURES AND

PARAMETERS

Gesture detection and reporting is governed by the

registers outlined in Table 14-1.

When a gesture is performed, the gesture ID will be

placed in GESTURESTATE, and the GES bit of the

TOUCHSTATE register will be set. Both of these items

are cleared after reading the GESTURESTATE

explaining the logic behind the last operation of the

gesture engine, primarily to help with debugging of the

gesture parameters. These diagnostic codes are

shown in Register 14-2.

TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH GESTURES

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x10 TOUCHSTATE FRAME<3:0> -LRG GES TCH N/A

0x14 GESTURESTATE GESTURESTATE 0

0x15 GESTUREDIAG GESTUREDIAG 0

0x37 HORIZONTALSWIPEDISTANCE HORIZONTALSWIPEDISTANCE 64

0x38 VERTICALSWIPEDISTANCE VERTICALSWIPEDISTANCE 64

0x39 SWIPEHOLDBOUNDARY SWIPEHOLDBOUNDARY 25

0x3A TAPDISTANCE TAPDISTANCE 25

0x3B DISTANCEBETWEENTAPS DISTANCEBETWEENTAPS 64

0x3C TAPHOLDTIME TAPHOLDTIMEL 50

0x3D TAPHOLDTIMEH 0

0x3E GESTURECLICKTIME GESTURECLICKTIME 12

0x3F SWIPEHOLDTHRESH SWIPEHOLDTHRESH 32

0x40 MINSWIPEVELOCITY MINSWIPEVELOCITY 4

0x41 HORIZONTALGESTUREANGLE HORIZONTALGESTUREANGLE 45

0x42 VERTICALGESTUREANGLE VERTICALGESTUREANGLE 45

 2014 Microchip Technology Inc. DS40001750A-page 23

MTCH6102

Please note that the gesture orientations listed in

moving on increasing X-axis channels, and down

moving on increasing Y-axis channels. These default

orientations are shown in Figure 14-1. Depending on

the application, the host may need to associate the

gesture IDs differently.

FIGURE 14-1: GESTURE ORIENTATION

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GESTURESTATE<7:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-0 GESTURESTATE<7:0>:

0x00 No Gesture Present

0x10 Single Click

0x11 Click and Hold

0x20 Double Click

0x31 Down Swipe

0x32 Down Swipe and Hold

0x41 Right Swipe

0x42 Right Swipe and Hold

0x51 Up Swipe

0x52 Up Swipe and Hold

0x61 Left Swipe

0x62 Left Swipe and Hold

RX0 RX8

RX9

RX14 (0,384)

(0,0)

(576,384)

(576,0)

0x41

RIGHT

0x61

LEFT

0x51

0x31

DOWN

MTCH6102

DS40001750A-page 24  2014 Microchip Technology Inc.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GESTUREDIAG<7:0>

bit 7 bit 0

Legend:

R = Readable bit ‘1’ = Bit is set x = Bit is unknown -n = Value after initialization

(default)

W = Writable bit ‘0’ = Bit is cleared U = Unimplemented bit q = Conditional

bit 7-0 GESTUREDIAG<7:0>:

0x01 Click Timeout

0x02 Swipe Timeout

0x03 General Timeout

0x04 Click Threshold Exceeded

0x05 Swipe Threshold Exceeded

0x06 Swipe and Hold Threshold Exceeded

0x07 Swipe Opposite Direction Threshold Exceeded

0x08 Reserved

0x09 Swipe and Hold Value Exceeded

0x0A Outside Swipe Angle

 2014 Microchip Technology Inc. DS40001750A-page 25

MTCH6102

14.1 Gesture Tuning

FIGURE 14-2: GESTURE PARAMETER VISUALIZATION

Start

End

Legend:

1. HORIZONTALSWIPEDISTANCE/VERTICALSWIPEDISTANCE (a/b): Distance that a touch must move

from the initial touchdown to be considered a swipe.

2. SWIPEHOLDTHRESH (c): Allowed movement in the opposite direction before a swipe is canceled.

3. MINSWIPEVELOCITY (d): Once a movement is classified as a swipe, this distance must be kept frame to

frame before the swipe is classified as a hold (direction of travel is not important).

4. HORITZONTALGESTUREANGLE/VERTICALGESTUREANGLE (f/e): Angle in degrees allowed on

horizontal (X-axis) and vertical (Y-axis) swipe movements. Swipes outside this parameter are detected, but

not reported.

5. SWIPEHOLDBOUNDARY (g): Once a swipe is classified as a hold, movement must not exceed this

parameter in any direction.

6. DISTANCEBETWEENTAPS (h): Distance allowed between two taps to be considered a double click.

7. TAPDISTANCE (i): Even when a sensor is pressed for a very short time (click), multiple frames of touch

data occur. This parameter governs how close those individual touch points must be for a click.

8. TAPHOLDTIME (not shown): Duration of time a click must be held for to be considered a click and hold.

9. GESTURECLICKTIME (not shown): Maximum time between two clicks to be considered a double click.

MTCH6102

DS40001750A-page 26  2014 Microchip Technology Inc.

15.0 CONFIGURING A

NON-DEFAULT APPLICATION

When modifying sensor configuration parameters, the

CFG bit of the CMD register must be set for the

configuration to take effect. Setting this bit analyzes the

following registers for validity and coerces them if

necessary:

1. IDLEPERIOD/ACTIVEPERIOD

2. FILTERTYPE/FILTERSTRENGTH

3. BASELINEFILTERTYPE/FILTERSTRENGTH

4. NUMBEROFXCHANNELS/NUMBEROFYCHAN-

NELS

Afterwards, the values take effect, and the sensor is

base-lined and ready for use.

Most applications will require custom parameters to be

stored in the configuration RAM. The following

methods are recommended for achieving this:

1. For permanent configuration: Either during

manufacturing test or on first start-up, the host

controller writes all configuration values to the

controller, sets the CFG bit and stores them to

NVRAM by using the NV bit.

2. For configuration on every power-up: The host

writes all configuration data to the controller and

sets the CFG bit on start-up.

Note: If the controller is not in Standby mode

when changing configuration parameters,

unreliable touch data may be generated

until the CFG is set.

 2014 Microchip Technology Inc. DS40001750A-page 27

MTCH6102

16.0 MANUFACTURING TESTING

16.1 Automated Manufacturing Test

To start the automated manufacturing test, set the MFG

bit of the CMD register. This test re-purposes the same

RAM used for RAWADC commands to store the

results. When the test is complete, the MFG bit will be

cleared. The results of the manufacturing test are

stored in the registers shown in Table 16-1 .

16.2 Sensor Integrity Testing

To test the integrity of both the touch sensor and the

overlay for defects, the following test outline is advised:

1. For this test, a way to retrieve data from the

MTCH6102 will be required. This can be either

through a host controller, or the host controller

can conduct the test itself with pre-set test

values.

2. Collect the raw-capacitance values by reading

the RAWVALUES registers under normal

conditions on a set of at least 30 completely

assembled sensors.

3. Use the information collected in step 2 to

determine the variance and average value for

each sensor channel. These values will be used

as the standard by which manufactured sensors

will need to fall within.

4. For each new sensor produced, compare the

RAWVALUES to the range described in step 3.

If the sensor falls out of this range, inspect the

sensor assembly for defects.

5. To test for touch acquisition ability, repeat steps

1-4 with a known touch stimulus applied (e.g.,

simulated metal finger).

The above outline is intentionally generic, as

manufacturing test setup will need to be modified for

every application.

TABLE 16-1: MFG TEST RX LOOK-UP TABLE(1,2)

Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0XD0 ——RX13H— RX12H RX11H RX10H RX9H

0XD1 —— RX13L — RX12L RX11L RX10L RX9L

0XD2 —— RX8H RX7H RX6H RX5H RX4H RX3H

0XD3 —— RX8L RX7L RX6L RX5L RX4L RX3L

0XD4 RX2H RX1H RX0H — — RX14H — —

0XD5 RX2L RX1L RX0L — — RX14L — —

Note 1: RXnH: Pin was unable to set high and is likely shorted to VDD.

2: RXnL: Pin was unable to set low and is likely shorted to GND.

MTCH6102

DS40001750A-page 28  2014 Microchip Technology Inc.

17.0 MEMORY MAP

TABLE 17-1: CORE RAM MEMORY MAP

Addr. Name

Core RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x00 FWMAJOR FW MAJOR 0x02

0x01 FWMINOR FW MINOR 0x00

0x02 APPID APPIDH <15:8> 0x00

0x03 APPIDL <7:0> 0x12

0x04 CMD NV DEF CFG —MFG——BS 0x00

0x05 MODE — — — — MODE<3:0> 0x03

0x06 MODECON TYPE<3:0> CH<3:0> 0x00

TABLE 17-2: TOUCH RAM MEMORY MAP

Addr. Name

Touch RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x10 TOUCHSTATE FRAME<3:0> — LRG GES TCH 0x00

0x11 TOUCHX TOUCHX<11:4> 0x00

0x12 TOUCHY TOUCHY<11:4> 0x00

0x13 TOUCHLSB TOUCHX<3:0> TOUCHY<3:0> 0x00

0x14 GESTURESTATE GESTURESTATE 0x00

0x15 GESTUREDIAG GESTUREDIAGNOSTIC 0x00

TABLE 17-3: COMPENSATION RAM MEMORY MAP

Addr.

Compensation RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x50 SENSORCOMP<RX0>

... ...

0x5F SENSORCOMP<RX14>

 2014 Microchip Technology Inc. DS40001750A-page 29

MTCH6102

TABLE 17-4: ACQUISITION RAM MEMORY MAP

Addr.

Acquisition RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x80 SENSORVALUES<RX0>

... ...

0x8E SENSORVALUES<RX14>

—

0x90 RAWVALUES<RX0>

... ...

0xAC RAWVALUES<RX14>

—

0xB0 BASEVALUES<RX0>

... ...

0xCC BASEVALUES<RX15>

—

0xD0 RAWADC<0>

... ...

0xEF SENSORVALUES<31>

MTCH6102

DS40001750A-page 30  2014 Microchip Technology Inc.

TABLE 17-5: CONFIGURATION RAM MEMORY MAP

Addr.

Configuration RAM

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default

0x20 NUMBEROFXCHANNELS 0x09

0x21 NUMBEROFYCHANNELS 0x06

0x22 SCANCOUNT 0x06

0x23 TOUCHTHRESHX 0x37

0x24 TOUCHTHRESHY 0x28

0x25 ACTIVEPERIODL 0x85

0x26 ACTIVEPERIODH 0x02

0x27 IDLEPERIODL 0x4C

0x28 IDLEPERIODH 0x06

0x29 IDLETIMEOUT 0x10

0x2A HYSTERESIS 0x04

0x2B DEBOUNCEUP 0x01

0x2C DEBOUNCEDOWN 0x01

0x2D BASEINTERVALL 0x0A

0x2E BASEINTERVALH 0x00

0x2F BASEPOSFILTER 0x14

0x30 BASENEGFILTER 0x14

0x31 FILTERTYPE 0x02

0x32 FILTERSTRENGTH 0x01

0x33 BASEFILTERTYPE 0x01

0x34 BASEFILTERSTRENGTH 0x05

0x35 LARGEACTIVATIONTHRESHL 0x00

0x36 LARGEACTIVATIONTHRESHH 0x00

0x37 HORIZONTALSWIPEDISTANCE 0x40

0x38 VERTICALSWIPEDISTANCE 0x40

0x39 SWIPEHOLDBOUNDARY 0x19

0x3A TAPDISTANCE 0x19

0x3B DISTANCEBETWEENTAPS 0x40

0x3C TAPHOLDTIMEL 0x32

0x3D TAPHOLDTIMEH 0x00

0x3E GESTURECLICKTIME 0x0C

0x3F SWIPEHOLDTHRESH 0x20

0x40 MINSWIPEVELOCITY 0x04

0x41 HORIZONTALGESTUREANGLE 0x2D

0x42 VERTICALGESTUREANGLE 0x2D

0x43 I2CADDR 0x25

 2014 Microchip Technology Inc. DS40001750A-page 31

MTCH6102

18.0 ELECTRICAL

CHARACTERISTICS

18.1 Absolute Maximum Ratings(†)

Ambient temperature under bias........................................................................................................ -40°C to +85°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on pins with respect to VSS

on VDD pin................................................................................................................................. -0.3V to +4.0V

on all other pins................................................................................................................0.3V to (VDD + 0.3V)

Maximum current

out of VSS pin ....................................................................................................................................... 340 mA

into VDD pin ......................................................................................................................................... 255 mA

Maximum output current

sunk by any I/O pin ............................................................................................................................... 25 mA

sourced by any I/O pin .......................................................................................................................... 25 mA

18.2 Standard Operating Conditions

The standard operating conditions for any device are defined as:

Operating Voltage: VDDMIN VDD VDDMAX

Operating Temperature: TA_MIN TA TA_MAX

VDD — Operating Supply Voltage

MTCH6102

VDDMIN ....................................................................................................................................... 1.8V

VDDMAX ...................................................................................................................................... 3.6V

TA — Operating Ambient Temperature Range

Industrial Temperature

TA_MIN ...................................................................................................................................... –40°C

A_MAX .................................................................................................................................... +85°C

Note: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and

protect the device in an application may cause partial to complete failure of the device.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

MTCH6102

DS40001750A-page 32  2014 Microchip Technology Inc.

18.3 DC Characteristics

TABLE 18-1: OPERATING CONDITIONS

Rating Min. Typ. Max. Units

Supply Voltage 1.8 — 3.6 V

Supply Current (Full Active, No Frame Rate) 0.7 — 1.17 mA

Supply Current (Sleep) <1 uA

TABLE 18-2: I/O PORTS

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Param.

No. Sym. Characteristic Min. Typ.† Max. Units Conditions

VIL Input Low Voltage

I/O PORT:

D030 with TTL buffer — — 0.15 VDD V1.8V  VDD  4.5V

D031 with Schmitt Trigger buffer — — 0.2 VDD V2.0V  VDD  5.5V

with I2C™ levels — — 0.3 VDD V

with SMBus levels — — 0.8 V 2.7V  VDD  5.5V

D032 RESET, OSC1 (RC mode) — — 0.2 VDD V

D033 OSC1 (HS mode) — — 0.3 VDD V

VIH Input High Voltage

I/O ports:

D040 with TTL buffer 0.25 VDD + 0.8 — — V 1.8V  VDD  4.5V

D041 with Schmitt Trigger buffer 0.8 VDD ——V2.0V  VDD  5.5V

with I2C levels 0.7 VDD ——V

with SMBus levels 2.1 — — V 2.7V  VDD  5.5V

D042 RESET 0.8 VDD ——V

D043A OSC1 (HS mode) 0.7 VDD ——V

D043B OSC1 (RC mode) 0.9 VDD ——VNote 1

IIL Input Leakage Current(2)

D060 I/O ports — ± 5 ± 125 nA VSS  VPIN  VDD, Pin at

high-impedance at 85°C

D061 RESET(2) —± 50± 200nAVSS  VPIN  VDD at 85°C

* These parameters are characterized but not tested.

† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: Negative current is defined as current sourced by the pin.

2: The leakage current on the RESET pin is strongly dependent on the applied voltage level. The specified levels

represent normal operating conditions. Higher leakage current may be measured at different input voltages.

 2014 Microchip Technology Inc. DS40001750A-page 33

MTCH6102

IPUR Weak Pull-up Current

D070* 25 100 200 AV

DD = 3.3V, VPIN = VSS

VOL Output Low Voltage

D080 I/O ports — — 0.6 V IOL = 6 mA, VDD = 3.3V

IOL = 1.8 mA, VDD = 1.8V

VOH Output High Voltage

D090 I/O ports VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V

IOH = 1 mA, VDD = 1.8V

CIO Capacitive Loading Specs on Output Pins

D101* All I/O pins — — 50 pF

TABLE 18-2: I/O PORTS (CONTINUED)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Param.

No. Sym. Characteristic Min. Typ.† Max. Units Conditions

* These parameters are characterized but not tested.

† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: Negative current is defined as current sourced by the pin.

2: The leakage current on the RESET pin is strongly dependent on the applied voltage level. The specified levels

represent normal operating conditions. Higher leakage current may be measured at different input voltages.

MTCH6102

DS40001750A-page 34  2014 Microchip Technology Inc.

18.4 AC Characteristics and Timing

Parameters

FIGURE 18-1: I2C™ BUS DATA TIMING

TABLE 18-3: I2C™ BUS DATA REQUIREMENTS

Param.

No. Symbol Characteristic Min. Max. Units Conditions

SP100* THIGH Clock high time 400 kHz mode 0.6 — s

SSP module 1.5TCY ——

SP101* TLOW Clock low time 400 kHz mode 1.3 — s

SSP module 1.5TCY ——

SP102* TRSDAx and SCLx rise

time

400 kHz mode 20 + 0.1CB300 ns

SP103* TFSDAx and SCLx fall time 400 kHz mode 20 + 0.1CB250 ns

SP106* THD:DAT Data input hold time 400 kHz mode 0 0.9 s

SP107* TSU:DAT Data input setup time 400 kHz mode 100 — ns

SP109* TAA Output valid from clock 400 kHz mode — — ns

SP110* TBUF Bus free time 400 kHz mode 1.3 — s

SP111 CBBus capacitive loading — 400 pF

* These parameters are characterized but not tested.

SP90

SP91 SP92

SP100

SP101

SP103

SP106 SP107

SP109 SP109

SP110

SP102

SCLx

SDAx

Out

 2014 Microchip Technology Inc. DS40001750A-page 35

MTCH6102

19.0 ORDERING INFORMATION

TABLE 19-1: ORDERING INFORMATION

Part Number Pin Package Packing

MTCH6102-I/SS 28-Lead SSOP (5.30 mm) Tube

MTCH6102-I/MV 28-Lead UQFN (4x4x0.5 mm) Tube

MTCH6102T-I/SS 28-Lead SSOP (5.30 mm) T/R

MTCH6102T-I/MV 28-Lead UQFN (4x4x0.5 mm) T/R

MTCH6102

DS40001750A-page 36  2014 Microchip Technology Inc.

20.0 PACKAGING INFORMATION

20.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

28-Lead SSOP (5.30 mm) Example

28-Lead UQFN (4x4x0.5 mm) Example

PIN 1 PIN 1

MTCH6102

1412017

-I/SS

MTCH

6102-I

/MV

412017

28-Lead Plastic Shrink Small Outline – 5.30 mm Body [SSOP]

28-Lead Plastic Ultra Thin Quad Flat, No Lead Package – 4x4x0.5 mm Body [UQFN]

 2014 Microchip Technology Inc. DS40001750A-page 37

MTCH6102

20.2 Package Details

The following sections give the technical details of the packages.

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MTCH6102

DS40001750A-page 38  2014 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2014 Microchip Technology Inc. DS40001750A-page 39

MTCH6102

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MTCH6102

DS40001750A-page 40  2014 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2014 Microchip Technology Inc. DS40001750A-page 41

MTCH6102

DS40001750A-page 42  2014 Microchip Technology Inc.

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A (03/2014)

Initial release of the document.

 2014 Microchip Technology Inc. DS40001750A-page 43

MTCH6102

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,

representative or Field Application Engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical support is available through the web site

at: http://microchip.com/support

DS40001750A-page 44  2014 Microchip Technology Inc.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & Co. KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-63276-043-2

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

 2014 Microchip Technology Inc. DS40001750A-page 45

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Austin, TX

Tel: 512-257-3370

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Novi, MI

Tel: 248-848-4000

Houston, TX

Tel: 281-894-5983

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Canada - Toronto

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2943-5100

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

China - Hangzhou

Tel: 86-571-8792-8115

Fax: 86-571-8792-8116

China - Hong Kong SAR

Tel: 852-2943-5100

Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8864-2200

Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-3019-1500

Japan - Osaka

Tel: 81-6-6152-7160

Fax: 81-6-6152-9310

Japan - Tokyo

Tel: 81-3-6880- 3770

Fax: 81-3-6880-3771

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Dusseldorf

Tel: 49-2129-3766400

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Pforzheim

Tel: 49-7231-424750

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Venice

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Poland - Warsaw

Tel: 48-22-3325737

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Worldwide Sales and Service

03/25/14