General Specifications
Flanged Attenuators
25 Watts
Model RFP-25-XXAP
Resistive Element: Thick film
Substrate: Beryllium oxide ceramic
Cover: Alumina ceramic
Mounting Flange: Copper, nickel plated per
QQ-N-290
Lead(s): 99.99% pure silver (.005” thk)
Outline Drawing
.062
MAX.
.100
.130
.125
THRU
.116
.250
TYP.
.125
.125
.515
.050
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15” minimum.
Specifications subject to change without notice.
Electrical Specifications
Attenuation Value: 1, 2, 3, 4, 5, 6, 9, 10, 20 or
30 dB
Frequency Range: DC - 3.0 GHz
Power: 25 Watts
Flanged Attenuators
Features
•DC - 3.0 GHz
•25 Watts
•BeO Ceramic
•Welded Silver Leads
•Non-Nichrome Resistive
Element
•Low VSWR
•100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Note: XX denotes attenuation value.
RFP
25-XX
AP
VER. 12/5/01
CASE TEMPERATURE — °C
% OF RATED POWER
150125100755025
100
75
25
50
0
Flanged Attenuators
Model RFP-25-XXAP
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating Suggested Mounting Procedures
WITH LEAD.
BOARD EVEN
MIN..025
(2 PLACES)
BOARD LOWER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE:
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001” max. thickness).
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD. THAN LEAD.
BOARD HIGHER
SCALE:
Specifications
PART NUMBER ATTENUATION (dB) TOL. (+/-dB) POWER (WATTS) VSWR FREQ. (GHz)
RFP-25-1AP 1 0.50 25 1.20:1 3.0
RFP-25-2AP 2 0.50 25 1.20:1 3.0
RFP-25-3AP 3 0.50 25 1.20:1 3.0
RFP-25-4AP 4 0.50 25 1.20:1 3.0
RFP-25-5AP 5 0.50 25 1.20:1 3.0
RFP-25-6AP 6 0.50 25 1.20:1 3.0
RFP-25-9AP 9 0.75 25 1.35:1 3.0
RFP-25-10AP 10 0.75 25 1.35:1 3.0
RFP-25-20AP 20 0.50 25 1.20:1 3.0
RFP-25-30AP 30 1.00 25 1.20:1 3.0
