Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
Features
Low Voltage Operation
VCC = 1.7V to 3.6V
Internally Organized as 4,096 x 8 (32K)
I2C-compatible (2-wire) Serial Interface
100kHz Standard Mode, 1.7V to 3.6V
400kHz Fast Mode, 1.7V to 3.6V
1MHz Fast Mode Plus (FM+), 2.5V to 3.6V
Schmitt Trigger Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
Write Protect Pin for Full Array Hardware Data Protection
Ultra Low Active Current (1mA max) and Standby Current (0.8μA Max)
32-byte Page Write Mode
Partial Page Writes Allowed
Random and Sequential Read Modes
Self-timed Write Cycle Within 5ms Max
High Reliability
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Green Package Options (Lead-free/Halide-free/RoHS Compliant)
8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-lead PDIP(1), 5-lead SOT23,
8-ball VFBGA, and 4-ball/5-ball WLCSP
Die Sale Options: Wafer Form and Tape and Reel Available
Description
The Atmel® AT24C32E provides 32,768 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 4,096 words of 8 bits
each. The device’s cascadable feature allows up to eight devices to share a
common 2-wire bus. This device is optimized for use in many industrial and
commercial applications where low-power and low voltage operation are
essential. The device is available in space-saving 8-lead SOIC, 8-lead TSSOP,
8-pad UDFN, 8-lead PDIP(1), 5-lead SOT23, 8-ball VFBGA, and 4- or 5-ball
WLCSP packages. The entire family of packages operates from 1.7V to 3.6V.
Note: 1. Contact Atmel Sales for the availability of this package.
AT24C32E
I2C-Compatible (2-wire) Serial EEPROM
32-Kbit (4,096 x 8)
DATASHEET
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
2
1. Pin Descriptions and Pinouts
Table 1-1. Pin Descriptions
Note: 1. If the A0, A1, A2, or WP pins are not driven, they are internally pulled down to GND. In order to operate in a wide
variety of application environments, the pull-down mechanism is intentionally designed to be somewhat strong.
Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull-down mechanism
disengages. Atmel recommends connecting these pins to a known state whenever possible.
Note: 1. Refer to “Device Addressing” for details about addressing the SOT23 and WLCSP versions of the device.
Pin
Number
Pin
Symbol Pin Name and Functional Description
Asserted
State
Pin
Type
1, 2, 3 A0, A1, A2
Device Address Inputs: The A0, A1, and A2 pins are used to select the
hardware device address and correspond to the fifth, sixth, and seventh
bit of the I2C seven bit slave address. These pins can be directly
connected to VCC or GND, allowing up to eight devices on the same bus.
Refer to Note 1 for behavior of the pin when not connected.
— Input
4 GND Ground: The ground reference for the power supply. GND should be
connected to the system ground. — Power
5 SDA
Serial Data: The SDA pin is an open-drain bidirectional input/output pin
used to serially transfer data to and from the device.
The SDA pin must be pulled-high using an external pull-up resistor (not to
exceed 10K in value) and may be wire-ORed with any number of other
open-drain or open-collector pins from other devices on the same bus.
—Input/
Output
6 SCL
Serial Clock: The SCL pin is used to provide a clock to the device and to
control the flow of data to and from the device. Command and input data
present on the SDA pin is always latched in on the rising edge of SCL,
while output data on the SDA pin is clocked out on the falling edge of SCL.
The SCL pin must either be forced high when the serial bus is idle or
pulled-high using an external pull-up resistor.
— Input
7 WP
Write Protect: Connecting the WP pin to GND will ensure normal write
operations. When the WP pin is connected to VCC, all write operations to
the memory are inhibited.
Refer to Note 1 for behavior of the pin when not connected.
High Input
8 VCC
Device Power Supply: The VCC pin is used to supply the source voltage
to the device. Operations at invalid VCC voltages may produce spurious
results and should not be attempted.
— Power
A0
A1
A2
GND
VCC
WP
SCL
SDA
8-lead SOIC
Top View
Note: Package drawings are not to scale
8
7
6
5
8-lead TSSOP
Top View
1
2
3
4
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SDA
Top View
8
7
6
5
1
2
3
4
8-pad UDFN
A0
A1
A2
GND
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
A0
A1
A2
GND
1
2
3
4
8
7
6
5
8-ball VFBGA
Top ViewTop View
SCL
GND
SDA
WP
VCC
5-lead SOT23
(1)
1
2
3
5
4
1
2
3
4
Top View
8-lead PDIP
A0
A1
A2
GND
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
V
CC
GND
SCL SDA
4-ball WLCSP
(1)
Top View
5-ball WLCSP
Top View
GND
SDA
SCL
V
CC
WP
(1)
3
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
2. Device Block Diagram and System Configuration
Figure 2-1. Block Diagram
Figure 2-2. System Configuration Using 2-Wire Serial EEPROMs
1 page
Start
Stop
Detector
GND
A
2
Memory
System Control
Module
High Voltage
Generation Circuit
Data & ACK
Input/Output Control
Address Register
and Counter
Write
Protection
Control
DOUT
DIN
Hardware
Address
Comparator
V
CC
WP
SCL
SDA
Power
On Reset
Generator
EEPROM Array
Column Decoder
Row Decoder
Data Register
A
1
A
0
I2C Bus Master:
Microcontroller
Slave 0
AT24Cxxx
V
CC
WP
SDA
SCL
A
0
A
1
A
2
GND
VCC
GND
SCL
SDA
WP
RPUP(max) = tR(max)
0.8473 x CL
RPUP(min) = VCC - VOL(max)
IOL
Slave 1
AT24Cxxx
V
CC
WP
SDA
SCL
A
0
A
1
A
2
GND
Slave 7
AT24Cxxx
V
CC
WP
SDA
SCL
A
0
A
1
A
2
GND
V
CC
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
4
3. Device Operation and Communication
The AT24C32E operates as a slave device and utilizes a simple I2C-compatible 2-wire digital serial interface to
communicate with a host controller, commonly referred to as the bus Master. The Master initiates and controls
all read and write operations to the slave devices on the serial bus, and both the Master and the slave devices
can transmit and receive data on the bus.
The serial interface is comprised of just two signal lines: Serial Clock (SCL) and Serial Data (SDA). The SCL pin
is used to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive command
and data information from the Master, as well as, to send data back to the Master. Data is always latched into
the AT24C32E on the rising edge of SCL and always output from the device on the falling edge of SCL. Both the
SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to minimize the effects
of input spikes and bus noise.
All command and data information is transferred with the Most-Significant Bit (MSB) first. During bus
communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data have been
transferred, the receiving device must respond with either an Acknowledge (ACK) or a No-Acknowledge
(NACK) response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the Master. Therefore,
nine clock cycles are required for every one byte of data transferred. There are no unused clock cycles during
any read or write operation, so there must not be any interruptions or breaks in the data stream during each data
byte transfer and ACK or NACK clock cycle.
During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable
while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will
occur. Start and Stop conditions are used to initiate and end all serial bus communication between the Master
and the slave devices. The number of data bytes transferred between a Start and a Stop condition is not limited
and is determined by the Master. In order for the serial bus to be idle, both the SCL and SDA pins must be in the
logic-high state at the same time.
3.1 Clock and Data Transition Requirements
The SDA pin is an open drain terminal and therefore must be pulled high with an external pull-up resistor. Data
on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will
indicate a Start or Stop condition as defined below.
3.2 Start and Stop Conditions
3.2.1 Start Condition
A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is at a stable
Logic 1 state and will bring the device out of standby mode. The Master uses a Start condition to initiate any
data transfer sequence, therefore every command must begin with a Start condition. The device will
continuously monitor the SDA and SCL pins for a Start condition but will not respond unless one is detected.
Please refer to Figure 3-1 for more details.
3.2.2 Stop Condition
A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the
Logic 1 state. The Master can use the Stop condition to end a data transfer sequence with the AT24C32E which
will subsequently return to standby mode. The Master can also utilize a repeated Start condition instead of a
Stop condition to end the current data transfer if the Master will perform another operation. Please refer to
Figure 3-1 for more details.
5
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
3.3 Acknowledge and No-Acknowledge
After every byte of data is received, the receiving device must confirm to the Master that it has successfully
received the data byte by responding with what is known as an acknowledge (ACK). An ACK is accomplished
by the transmitting device first releasing the SDA line at the falling edge of the eighth clock cycle followed by the
receiving device responding with a Logic 0 during the entire high period of the ninth clock cycle.
When the AT24C32E is transmitting data to the Master, the Master can indicate that it is done receiving data
and wants to end the operation by sending a Logic 1 response to the AT24C32E instead of an ACK response
during the ninth clock cycle. This is known as a no-acknowledge (NACK) and is accomplished by the Master
sending a Logic 1 during the ninth clock cycle, at which point the AT24C32E will release the SDA line so the
Master can then generate a Stop condition.
The transmitting device, which can be the bus Master or the Serial EEPROM, must release the SDA line at the
falling edge of the eighth clock cycle to allow the receiving device to drive the SDA line to a Logic 0 to ACK the
previous 8-bit word. The receiving device must release the SDA line at the end of the ninth clock cycle to allow
the transmitter to continue sending new data. A timing diagram has been provided in Figure 3-1 to better
illustrate these requirements.
Figure 3-1. Start Condition, Data Transitions, Stop Condition and Acknowledge
3.4 Standby Mode
The AT24C32E features a low-power standby mode which is enabled when any one of the following occurs:
A valid power-up sequence is performed (see Section 8.6, “Power-Up Requirements and Reset
Behavior”).
A Stop condition is received by the device unless it initiates an internal write cycle (see Section 5., “Write
Operations”).
At the completion of an internal write cycle (see Section 5.).
An unsuccessful match of the device type identifier or hardware address in the Device Address byte
occurs (see Section 4.1, “Device Addressing”).
The bus Master does not ACK the receipt of data read out from the device; instead it sends a NACK
response. (see Section 6., “Read Operations”).
SCL
SDA
SDA
Must Be
Stable
SDA
Change
Allowed
SDA
Change
Allowed
Acknowledge
Valid
Stop
Condition
Start
Condition
12 89
SDA
Must Be
Stable Acknowledge Window
The transmitting device (Master or Slave)
must release the SDA line at this point to allow
the receiving device (Master or Slave) to drive the
SDA line low to ACK the previous 8-bit word.
The receiver (Master or Slave)
must release the SDA line at
this point to allow the transmitter
to continue sending new data.
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
6
3.5 Software Reset
After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol reset by following
these steps:
1. Create a Start condition (if possible).
2. Clock nine cycles.
3. Create another Start condition followed by a Stop condition as seen in Figure 3-2.
The device will be ready for the next communication after the above steps have been completed. The device
should be ready for the next communication after above steps have been completed. In the event that the
device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device
(see Section 8.6.1, “Device Reset”).
Figure 3-2. Software Reset
SCL 9
Start
Condition Start
Condition
Stop
Condition
8321
SDA
Dummy Clock Cycles
7
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
4. Memory Organization
The AT24C32E is internally organized as 128 pages of 32 bytes each.
4.1 Device Addressing
Accessing the device requires an 8-bit Device Address word following a Start condition to enable the device for
a read or write operation. Since multiple slave devices can reside on the serial bus each slave device must have
its own unique address so the Master can access each device independently.
The most significant four bits of the Device Address word is referred to as the device type identifier. The device
type identifier ‘1010’ (Ah) is required in bits seven through four of the Device Address byte (Table 4-1).
Following the 4-bit device type identifier are the hardware slave address bits, A0, A1, and A2. These bits can be
used to expand the address space by allowing up to eight 32-Kbit Serial EEPROM devices on the same bus.
These hardware slave address bits must correlate with the voltage level on the corresponding hardwired input
pins A0, A1, and A2.
The A0, A1, and A2 pins use an internal proprietary circuit that automatically biases the pin to a Logic 0 state if
the pin is allowed to float. In order to operate in a wide variety of application environments, the pull-down
mechanism is intentionally designed to be somewhat strong. Once the pin is biased above the CMOS input
buffer’s trip point (~0.5 x VCC), the pull-down mechanism disengages. Atmel recommends connecting the A0, A1,
and A2 pin to a known state whenever possible.
When using the SOT23 and WLCSP packages, the A0, A1, and A2 pins are not accessible and are left floating.
The previously mentioned automatic pull-down circuit will set this pin to a Logic 0 state. As a result, to properly
communicate with the device in the SOT23 and WLCSP packages, the A0, A1, and A2 software bits must always
be set to Logic 0 for any operation.
The eighth bit (bit 0) of the Device Address byte is the read/write operation select bit. A read operation is
initiated if this bit is high and a write operation is initiated if this bit is low.
Upon the successful comparison of the Device Address byte, the AT24C32E will return an ACK. If a valid
comparison is not made, the device will NACK and return to a standby state.
Table 4-1. Device Address Byte
Package
Device Type Identifier Hardware Slave Address Bits
Read/
Write
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SOIC, TSSOP, UDFN,
PDIP, VFBGA 1 0 1 0 A2A1A0R/W
SOT23, WLCSP 1 0 1 0 0 0 0 R/W
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
8
For all operations (except the Current Address Read), a two 8-bit Word Address byte must be transmitted to the
device immediately following the Device Address byte. The Word Address bytes consist of the 12-bit memory
array word address, and is used to specify which byte location in the EEPROM to start reading or writing.
The first Word Address byte contains the four most significant bits of the word address (A11 through A8) in bit
positions three through zero, as seen in Table 4-2. The remainder of the first Word Address byte are don’t care
bits and (in bit positions seven through four) as they all outside of the addressable 32-Kbit range. Upon
completion of the first Word Address byte, the AT24C32E will return an ACK.
Table 4-2. First Word Address Byte
Note: Bit 7 through Bit 4 are don’t care values as they fall outside the addressable 32-Kbit range.
Next, the second Word Address byte is sent to the device which provides the remaining eight bits of the word
address (A7 though A0). Upon completion of the second Word Address byte, the AT24C32E will return an ACK.
Please consult Table 4-3 to review these bit positions.
Table 4-3. Second Word Address Byte
The relationship of the AC timing parameters with respect to SCL and SDA for the AT24C32E are shown in the
timing waveform Figure 8-1 on page 15. The AC timing characteristics and specifications are outlined in
Section 8.4 “AC Characteristics” on page 15.
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
X X X X A11 A10 A9 A8
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
A7 A6 A5 A4 A3 A2 A1 A0
9
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
5. Write Operations
All write operations for the AT24C32E begin with the Master sending a Start condition, followed by a Device
Address byte with the R/W bit set to ‘0’, and then by the Word Address bytes. The data value(s) to be written
to the device immediately follow the Word Address bytes.
5.1 Byte Write
The AT24C32E supports the writing of single 8-bit bytes. Selecting a data word in the AT24C32E requires a 12-
bit word address.
Upon receipt of the proper Device Address and Word Address bytes, the EEPROM will send an Acknowledge.
The device will then be ready to receive the first 8-bit data word. Following receipt of the 8-bit data word, the
EEPROM will respond with an Acknowledge. The addressing device, such as a bus Master, must then terminate
the Write operation with a Stop condition. At that time the EEPROM will enter an internally self-timed write cycle,
which will be completed within tWR, while the data word is being programmed into the nonvolatile EEPROM. All
inputs are disabled during this write cycle, and the EEPROM will not respond until the Write is complete.
Figure 5-1. Byte Write
5.2 Page Write
A Page Write operation allows up to 32 bytes to be written in the same write cycle, provided all bytes are in the
same row of the memory array (where address bits A11 through A5 are the same). Partial Page Writes of less
than 32 bytes are also allowed.
A Page Write is initiated the same way as a Byte Write, but the bus Master does not send a Stop condition after
the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the bus
Master can transmit up to thirty one additional data words. The EEPROM will respond with an ACK after each
data word is received. Once all data to be written has been sent to the device, the bus Master must issue a Stop
condition (Figure 5-2) at which time the internally self-timed write cycle will begin.
The lower five bits of the word address are internally incremented following the receipt of each data word. The
higher order address bits are not incremented and retain the memory page row location. Page Write operations
are limited to writing bytes within a single physical page, regardless of the number of bytes actually being
written. When the incremented word address reaches the page boundary, the address counter will “roll over” to
the beginning of the same page. Nevertheless, creating a roll over event should be avoided as previously
loaded data in the page could become unintentionally altered.
SCL
SDA
Start Condition
by Master
Device Address Byte First Word Address Byte
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
1 0 1 0 A2 A
1 A
0 0 0
Second Word Address Byte Data Word
Stop Condition
by Master
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
D7 D6 D5 D4 D3 D2 D1 D0 0
X X X X A11 A10 A9 A8 0
ACK
from Slave
ACK
from Slave
ACK
from Slave
ACK
from Slave
A7 A6 A5 A4 A3 A2 A1 A0 0
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
10
Figure 5-2. Page Write
5.3 Acknowledge Polling
An Acknowledge Polling routine can be implemented to optimize time sensitive applications that would prefer
not to wait the fixed maximum write cycle time (tWR). This method allows the application to know immediately
when the Serial EEPROM write cycle has completed, so a subsequent operation can be started.
Once the internally self-timed write cycle has started, an Acknowledge Polling routine can be initiated. This
involves repeatedly sending a Start condition followed by a valid Device Address byte with the R/W bit set at
Logic 0. The device will not respond with an ACK while the write cycle is ongoing. Once the internal write cycle
has completed, the EEPROM will respond with an ACK, allowing a new Read or Write operation to be
immediately initiated. A flow chart has been included below in Figure 5-3 to better illustrate this technique.
Figure 5-3. Acknowledge Polling Flow Chart
5.4 Write Cycle Timing
The length of the self-timed write cycle, or tWR, is defined as the amount of time from the Stop condition that
begins the internal Write operation, to the Start condition of the first Device Address byte sent to the AT24C32E
that it subsequently responds to with an ACK. Figure 5-4 has been included to show this measurement. During
the internally self-timed write cycle, any attempts to read from or write to the memory array will not be
processed.
SCL
SDA
Start Condition
by Master ACK
from Slave
ACK
from Slave
Device Address Byte First Word Address Byte
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
1 0 1 0 A2 A
1 A0 0 0 X X X X A11 A10 A9 A8 0
ACK
from Slave
ACK
from Slave
Stop Condition
by Master
ACK
from Slave
Second Word Address Byte Data Word (n) Data Word (n+x), max of 32 without rollover
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
A7 A6 A5 A4 A3 A2 A1 A0 0 D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 0
MSB MSB MSB
Did
the device
ACK?
Send any
Write
protocol
Send
Stop
condition
to initiate the
write cycle
Send Start
condition followed
by a valid
Device Address
byte with R/W = 0
Proceed to
next Read or
Write operation
NO
YES
11
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
Figure 5-4. Write Cycle Timing
5.5 Write Protection
The AT24C32E utilizes a hardware data protection scheme that allows the user to write protect the entire
memory contents when the WP pin is at VCC (or a valid VIH). No write protection will be set if the WP pin is at
GND or left floating. The 4-ball WLCSP version of the device does not include any write protection features.
Table 5-1. AT24C32E Write Protect Behavior
The status of the WP pin is sampled at the Stop condition for every Byte Write or Page Write command prior to
the start of an internally self-timed Write operation. Changing the WP pin state after the Stop condition has been
sent will not alter or interrupt the execution of the write cycle. The WP pin state must be valid with respect to the
associated setup (tSU.WP) and hold (tHD.WP) timing as shown in the Figure 5-5 below. The WP setup time is the
amount of time that the WP state must be stable before the Stop condition is issued. The WP hold time is the
amount of time after the Stop condition that the WP state must remain stable.
If an attempt is made to write to the device while the WP pin has been asserted, the device will acknowledge the
Device Address, Word Address, and Data bytes but no write cycle will occur when the Stop condition is issued,
and the device will immediately be ready to accept a new Read or Write command.
Figure 5-5. Write Protect Setup and Hold Timing
tWR
Stop
Condition
Start
Condition
Data Word n
ACKD0
SDA
Stop
Conditio
n
SCL 89
ACK
First Acknowledge from the device
to a valid device address sequence after
write cycle is initiated. The minumum t
WR
can only be determined through
the use of an ACK Polling routine.
9
WP Pin Voltage Part of the Array Protected
VCC Full Array
GND None — Write Protection Not Enabled
SCL
SDA IN
1 2 7 8 9
D7 D6 D1 D0
WP
t
SU.WP
Stop Condition
by Master
Data Word Input Sequence Page/Byte Write Operation
ACK by Slave
t
HD.WP
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
12
6. Read Operations
Read operations are initiated the same way as Write operations with the exception that the Read/Write Select
bit in the Device Address word must be a Logic 1. There are three Read operations:
Current Address Read
Random Address Read
Sequential Read
6.1 Current Address Read
The internal data word address counter maintains the last address accessed during the last read or write
operation, incremented by one. This address stays valid between operations as long as the VCC is maintained to
the part. The address “roll over” during read is from the last byte of the last page to the first byte of the first page
of the memory.
A Current Address Read operation will output data according to the location of the internal data word address
counter. This is initiated with a Start condition, followed by a valid Device Address byte with the R/W bit set to
Logic 1. The device will ACK this sequence and the current address data word is serially clocked out on the
SDA line. All types of Read operations will be terminated if the bus Master does not respond with an ACK (it
NACKs) during the ninth clock cycle, which will force the device into standby mode. After the NACK response,
the Master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next
sequence.
Figure 6-1. Current Address Read
6.2 Random Read
A Random Read begins in the same way as a Byte Write operation does to load in a new data word address.
This is known as a “dummy write” sequence; however, the Data Byte and Stop condition of the Byte Write must
be omitted to prevent the part from entering an internal write cycle. Once the Device Address and Word Address
bytes are clocked in and acknowledged by the EEPROM, the bus Master must generate another Start condition.
The bus Master now initiates a Current Address Read by sending a Start condition, followed by a valid Device
Address byte with the R/W bit set to Logic 1. The EEPROM will ACK the Device Address and serially clock out
the data word on the SDA line. All types of Read operations will be terminated if the bus Master does not
respond with an ACK (it NACKs) during the ninth clock cycle, which will force the device into standby mode.
After the NACK response, the Master may send a Stop condition to complete the protocol, or it can send a Start
condition to begin the next sequence.
SCL
SDA
Device Address Byte Data Word (n)
Start Condition
by Master ACK
from Slave
NACK
from Master
Stop Condition
by Master
MSB MSB
1 0 1 0 A2 A
1 A
0 1 0 D7 D6 D5 D4 D3 D2 D1 D0 1
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
13
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
Figure 6-2. Random Read
6.3 Sequential Read
Sequential Reads are initiated by either a Current Address Read or a Random Read. After the bus Master
receives a data word, it responds with an acknowledge. As long as the EEPROM receives an ACK, it will
continue to increment the word address and serially clock out sequential data words. When the maximum
memory address is reached, the data word address will “roll over” and the sequential read will continue from the
beginning of the memory array. All types of Read operations will be terminated if the bus Master does not
respond with an ACK (it NACKs) during the ninth clock cycle, which will force the device into standby mode.
After the NACK response, the Master may send a Stop condition to complete the protocol, or it can send a Start
condition to begin the next sequence.
Figure 6-3. Sequential Read
7. Device Default Condition from Atmel
The AT24C32E is delivered with the EEPROM array set to Logic 1, resulting in FFh data in all locations.
SCL
SDA
Start Condition
by Master
Device Address Byte First Word Address Byte
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
1 0 1 0 A2 A
1 A
0 0 0
Dummy Write
Start Condition
by Master
Device Address Byte Data Word (n)
Stop Condition
by Master
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
1 0 1 0 A2 A
1 A
0 1 0 D7 D6 D5 D4 D3 D2 D1 D0 1
X X X X A11 A10 A9 A8 0
ACK
from Slave
ACK
from Slave
ACK
from Slave
NACK
from Master
Second Word Address Byte
MSB
A7 A6 A5 A4 A3 A2 A1 A0 0
ACK
from Slave
SCL
SDA
Start Condition
by Master ACK
from Slave
ACK
from Master
Device Address Byte Data Word (n)
MSB MSB
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
1 0 1 0 A2 A
1 A0 1 0 D7 D6 D5 D4 D3 D2 D1 D0 0
ACK
from Master
NACK
from Master
Stop Condition
by Master
ACK
from Master
Data Word (n+1) Data Word (n+2) Data Word (n+x)
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 1
MSB MSB MSB
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
14
8. Electrical Specifications
8.1 Absolute Maximum Ratings
8.2 DC and AC Operating Range
8.3 DC Characteristics
Table 8-2. DC Characteristics
Notes: 1. Typical values characterized at TA = +25°C unless otherwise noted.
2. This parameter is characterized but is not 100% tested in production.
Temperature under Bias . . . . . . . -55C to +125C
Storage Temperature . . . . . . . . . -65C to +150C
Supply Voltage
with respect to ground . . . . . . . . . -0.5V to +4.10V
Voltage on any pin
with respect to ground . . . . . . -0.6V to VCC + 0.5V
DC Output Current . . . . . . . . . . . . . . . . . . . 5.0mA
Functional operation at the “Absolute Maximum Ratings” or
any other conditions beyond those indicated in Section 8.2 “DC
and AC Operating Range” is not implied or guaranteed.
Stresses beyond those listed under “Absolute Maximum
Ratings” and/or exposure to the “Absolute Maximum Ratings”
for extended periods may affect device reliability and cause
permanent damage to the device.
The voltage extremes referenced in the “Absolute Maximum
Ratings” are intended to accommodate short duration
undershoot/overshoot pulses that the device may be subjected
to during the course of normal operation and does not imply or
guarantee functional device operation at these levels for any
extended period of time.
Table 8-1. DC and AC Operating Range
AT24C32E
Operating Temperature (Case) Industrial Temperature Range -40C to +85C
VCC Power Supply Low Voltage Grade 1.7V to 3.6V
Parameters are applicable over the operating range in specified Section 8.2, unless otherwise noted.
Symbol Parameter Test Conditions Min Typical(1) Max Units
VCC Supply Voltage 1.7 3.6 V
ICC1 Supply Current, Read
VCC = 1.8V(2) Read at 400kHz 0.08 0.3 mA
VCC = 3.6V Read at 1MHz 0.15 0.5 mA
ICC2 Supply Current, Write VCC = 3.6V Write at 1MHz 0.20 1.0 mA
ISB Standby Current
VCC = 1.8V(2)
VIN = VCC or VSS
0.08 0.4 μA
VCC = 3.6V 0.10 0.8 μA
ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA
ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA
VIL Input Low Level(2) –0.6 VCC x 0.3 V
VIH Input High Level(2) VCC x 0.7 VCC + 0.5 V
VOL1 Output Low Level VCC = 1.8V IOL = 0.15mA 0.2 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V
15
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
8.4 AC Characteristics
Table 8-3. AC Characteristics
Notes: 1. These parameters are determined through product characterization and are not 100% tested in production.
2. AC measurement conditions:
CL : 100pF
RPUP (SDA bus line pull-up resistor to VCC): 1.3k (1000kHz), 4k (400kHz), 10k (100kHz)
Input pulse voltages: 0.3 x VCC to 0.7 x VCC
Input rise and fall times: 50ns
Input and output timing reference voltages: 0.5 x VCC
Figure 8-1. Bus Timing
Parameters are applicable over operating range in Section 8.2 unless otherwise noted. Test conditions shown in Note 2.
Symbol Parameter
Standard Mode Fast Mode Fast Mode Plus
Units
VCC1.7V to 3.6V VCC1.7V to 3.6V VCC 2.5V to 3.6V
Min Max Min Max Min Max
fSCL Clock Frequency, SCL 100 400 1000 kHz
tLOW Clock Pulse Width Low 4,700 1300 500 ns
tHIGH Clock Pulse Width High 4,000 600 400 ns
tIInput Filter Spike Suppression (SCL,SDA)(1) 100 100 100 ns
tAA Clock Low to Data Out Valid 4,500 900 450 ns
tBUF Bus Free Time between Stop and Start(1) 4,700 1300 500 ns
tHD.STA Start Condition Hold Time 4,000 600 250 ns
tSU.STA Start Condition Set-up Time 4,700 600 250 ns
tHD.DAT Data In Hold Time 0 0 0 ns
tSU.DAT Data In Set-up Time 200 100 100 ns
tRInputs Rise Time(1) 1,000 300 100 ns
tFInputs Fall Time(1) 300 300 100 ns
tSU.STO Stop Condition Set-up Time 4,700 600 250 ns
tSU.WP Write Protect Setup Time 4,000 600 100 ns
tHD.WP Write Protect Hold Time 4,000 600 400 ns
tDH Data Out Hold Time 100 50 50 ns
tWR Write Cycle Time 5 5 5 ms
SCL
SDA IN
SDA OUT
t
F
t
HIGH
t
LOW
t
R
t
AA
t
DH
t
BUF
t
SU.STO
t
SU.DAT
t
HD.DAT
t
HD.STA
t
SU.STA
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
16
8.5 Pin Capacitance
Table 8-4. Pin Capacitance(1)
Note: 1. This parameter is characterized but is not 100% tested in production.
8.6 Power-Up Requirements and Reset Behavior
During a power-up sequence, the VCC supplied to the AT24C32E should monotonically rise from GND to the
minimum VCC level as specified in Section 8.2, “DC and AC Operating Range” with a slew rate no faster than
0.1V/μs.
8.6.1 Device Reset
To prevent inadvertent write operations or other spurious events from happening during a power-up sequence,
the AT24C32E includes a power-on-reset (POR) circuit. Upon power-up, the device will not respond to any
commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of reset
and into standby mode.
The system designer must ensure that instructions are not sent to the device until the VCC supply has reached a
stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is greater than or equal
to the minimum VCC level, the bus Master must wait at least tPUP before sending the first command to the device.
See Table 8-5 for the values associated with these power-up parameters.
Table 8-5. Power-up Conditions(1)
Note: 1. These parameters are characterized but they are not 100% tested in production.
If an event occurs in the system where the VCC level supplied to the AT24C32E drops below the maximum VPOR
level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to
GND, waiting at least the minimum tPOFF time, and then performing a new power-up sequence in compliance
with the requirements defined in this section.
8.7 EEPROM Cell Performance Characteristics
Notes: 1. Write endurance performance is determined through characterization and the qualification process.
2. The data retention capability is determined through qualification and is checked on each device in production.
Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 3.6V
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V
Symbol Parameter Min Max Units
tPUP Time required after VCC is stable before the device can accept commands. 100 μs
VPOR Power-On Reset Threshold Voltage 1.5 V
tPOFF Minimum time at VCC = 0V between power cycles. 1 ms
Table 8-6. EEPROM Cell Performance Characteristics
Operation Test Condition Min Max Units
Write Endurance(1) TA = 25°C, VCC(min)< VCC < VCC(max)
Byte or Page Write Mode 1,000,000 — Write Cycles
Data Retention(2) TA = 55°C, VCC(min)< VCC < VCC(max) 100 — Years
17
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
9. Ordering Code Detail
Atmel Designator
Product Family
24C = Standard I2C-compatible
Serial EEPROM
Device Density
Shipping Carrier Option
Package Device Grade or
Wafer/Die Thickness
Package Option
32 = 32 Kilobit
T = Tape and Reel, Standard Quantity Option
E = Tape and Reel, Expanded Quantity Option
B = Bulk (Tubes)
Operating Voltage
M = 1.7V to 3.6V
H = Green, NiPdAu Lead Finish
Industrial Temperature Range
(-40°C to +85°C)
U = Green, Matte Tin Lead Finish
or SnAgCu Ball
Industrial Temperature Range
(-40°C to +85°C)
11 = 11mil Wafer Thickness
SS = JEDEC SOIC
X = TSSOP
MA = 2.0mm x 3.0mm UDFN
P = PDIP
ST = SOT23
C = VFBGA
U = 3x3 Grid, 5-ball WLCSP
U1 = 2x2 Grid, 4-ball WLCSP
WWU = Wafer Unsawn
AT24C32E-SSHMxx-T
Device Revision
Product Variation
xx = Applies to select packages only.
See ordering table for variation
details.
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
18
10. Ordering Information
Notes: 1. WLCSP Package:
This device includes a backside coating to increase product robustness.
CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells.
Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light
does not occur.
2. For wafer sales, please contact Atmel Sales.
Atmel Ordering Code Lead Finish Package
Delivery Information Operation
Range
Form Quantity
AT24C32E-SSHM-T
NiPdAu
(Lead-free/Halogen-free)
8S1
Tape and Reel 4,000 per Reel
Industrial
Temperature
(-40C to 85C)
AT24C32E-SSHM-B Bulk (Tubes) 100 per Tube
AT24C32E-XHM-T
8X
Tape and Reel 5,000 per Reel
AT24C32E-XHM-B Bulk (Tubes) 100 per Tube
AT24C32E-MAHM-T
8MA2 Tape and Reel
5,000 per Reel
AT24C32E-MAHM-E 15,000 per Reel
AT24C32E-MAHMML-T 5,000 per Reel
AT24C32E-PUM Matte Tin
(Lead-free/Halogen-free)
8P3 Bulk (Tubes) 50 per Tube
AT24C32E-STUM-T 5TS1 Tape and Reel 5,000 per Reel
AT24C32E-CUM-T
SnAgCu Ball
(Lead-free/Halogen-free)
8U3-1
Tape and Reel 5,000 per Reel
AT24C32E-UUM0B-T(1) 5U-2
AT24C32E-U1UM0B-T(1)
4U-11
AT24C32E-U1UMML-T(1)
AT24C32E-WWU11M(2) N/A Wafer
Sale Note 2
Package Type
8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8MA2 8-pad, 2.0mm x 3.0mm x 0.6mm body, 0.5mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)
8P3 8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP)
5TS1 5-lead, 1.6mm body, Plastic Thin Shrink Small Outline (SOT23)
8U3-1 8-ball, 1.5mm x 2.0mm body, 0.5mm pitch, Very thin Fine Ball Grid Array (VFBGA)
5U-2 5-ball, 3 x 3 Grid Array, 0.4mm minimum pitch, Wafer Level Chip Scale Package (WLCSP)
4U-11 4-ball, 2 x 2 Grid Array, 0.4mm minimum pitch, Wafer Level Chip Scale Package (WLCSP)
19
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
11. Part Markings
DRAWING NO. REV. TITLE
24C32ESM E
12/6/16
24C32ESM, AT24C32E Package Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
AAAAAAAA
###% @
ATMLHYWW
8-lead SOIC 8-lead TSSOP
AAAAAAA
###% @
ATHYWW
8-pad UDFN
###
H%@
YXX
2.0 x 3.0 mm Body
4-ball / 5-ball WLCSP
1.5 x 2.0 mm Body
8-ball VFBGA
PIN 1
###U
YMXX
Note 2: Package drawings are not to scale
Note 1: designates pin 1
AT24C32E: Package Marking Information
Catalog Number Truncation
AT24C32E Truncation Code ###: 32E / ##: BE
Date Codes Voltages
Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage
6: 2016 0: 2020 A: January 02: Week 2 M: 1.7V min
7: 2017 1: 2021 B: February 04: Week 4
8: 2018 2: 2022 ... ...
9: 2019 3: 2023 L: December 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number U: Industrial/Matte Tin/SnAgCu
H: Industrial/NiPdAu
Trace Code Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel
Example: AA, AB.... YZ, ZZ ATM: Atmel
ATML: Atmel
XX
5-lead SOT-23
8-lead PDIP
AAAAAAAA
###% @
ATMLUYWW
PIN 1
##@%U
YMXX
Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (
@
) mark on the top line.
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
20
12. Packaging Information
12.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 – 0.25
A – – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 H
3/6/2015
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC) SWB
21
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
12.2 8X — 8-lead TSSOP
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 0.25 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
packagedrawings@atmel.com
8X E
2/27/14
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
22
12.3 8MA2 — 8-pad UDFN
DRAWING NO. REV. TITLE GPC
8MA2 H
11/2/15
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
YNZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A 0.50 0.55 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
D 1.90 2.00 2.10
D2 1.40 1.50 1.60
E 2.90 3.00 3.10
E2 1.20 1.30 1.40
b 0.18 0.25 0.30 3
C 0.152 REF
L 0.35 0.40 0.45
e 0.50 BSC
K 0.20 - -
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
packagedrawings@atmel.com
C
E
Pin 1 ID
D
8
7
6
5
1
2
3
4
A
A1
A2
D2
E2
e (6x)
L (8x)
b (8x)
Pin#1 ID
K
1
2
3
4
8
7
6
5
Notes: 1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
C
23
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
12.4 8P3 — 8-lead PDIP
DRAWING NO. REV. TITLE GPC
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
A - - 5.334 2
A1 0.381 - -
A2 2.921 3.302 4.953
b 0.356 0.457 0.559 5
b2 1.143 1.524 1.778 6
b3 0.762 0.991 1.143 6
c 0.203 0.254 0.356
D 9.017 9.271 10.160 3
D1 0.127 0.000 0.000 3
E 7.620 7.874 8.255 4
E1 6.096 6.350 7.112 3
e 2.540 BSC
eA 7.620 BSC 4
L 2.921 3.302 3.810 2
Top View
Side View
End View
Package Drawing Contact:
packagedrawings@atmel.com
A1
Gage Plane
.381
8P3 E
07/31/14
8P3, 8-lead, 0.300” Wide Body, Plastic Dual
In-line Package (PDIP) PTC
v0.254 mC
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
24
12.5 5TS1 — 5-lead SOT23
DRAWING NO. REV. TITLE GPC
Package Drawing Contact:
packagedrawings@atmel.com
5TS1 D
5/31/12
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT) TSZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.00
A1 0.00 - 0.10
A2 0.70 0.90 1.00
c 0.08 - 0.20 3
D 2.90 BSC 1,2
E 2.80 BSC 1,2
E1 1.60 BSC 1,2
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 - 0.50 3,4
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
54
2
L1
L
C
END VIEW
C
A
A2
A1
b
e
PLANE
SEATING
D
SIDE VIEW
E
e1
E1
3
1
TOP VIEW
25
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
12.6 8U3-1 — 8-ball VFBGA
DRAWING NO. REV. TITLE GPC
Package Drawing Contact:
packagedrawings@atmel.com
8U3-1 F
6/11/13
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU
COMMON DIMENSIONS
(Unit of Measure - mm)
SYMBOL MIN NOM MAX NOTE
A
0.73 0.79 0.85
A1 0.09 0.14 0.19
A2 0.40 0.45 0.50
b 0.20 0.25 0.30 2
D
1.50 BSC
E
2.0 BSC
e
0.50 BSC
e1 0.25 REF
d
1.00 BSC
d1 0.25 REF
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
Notes:
A2
SIDE VIEW
A
PIN 1 BALL PAD CORNER
TOP VIEW
E
D
A1
b
8 SOLDER BALLS
BOTTOM VIEW
(d1)
d
4
3
2
(e1)
6
e
5
7
PIN 1 BALL PAD CORNER
1
8
2.
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
26
12.7 5U-2 — 5-ball WLCSP
DRAWING NO. REV. TITLE GPC
5U-2 D
4/29/15
5U-2, 5-ball 3x3 Array, 0.40mm Pitch, Wafer
Level Chip Scale Package (WLCSP) with BSC GAE
Package Drawing Contact:
packagedrawings@atmel.com
TOP VIEW
SIDE VIEW
BALL SIDE
A
B
C
B
C
A
e1 e2
d1
E
D
1
3
312 2
A1 CORNER A1 CORNER
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN TYP MAX NOTE
A 0.260 0.295 0.330
A1 0.080 0.095 0.110
A2 0.160 0.175 0.190
A3 0.025 REF 3
D Contact Atmel for details
d1 0.400 BSC
E Contact Atmel for details
e1 0.693 BSC
e2 0.400 BSC
b 0.170 0.185 0.200
Note: 1. Dimensions are NOT to scale.
2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.
3. Product offered with Back Side Coating (BSC)
PIN ASSIGNMENT MATRIX
12
A
B
C
GND
WP
SDA
V
CC
SCL
3
n/a
n/a
n/a
n/a
db
vd0.015 C
d0.05 C A B
m
m
B
k0.015 (4X)
A
A1
A2
A3
A
k0.075 C
C
SEATING PLANE
27
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
12.8 4U-11 — 4-ball WLCSP
DRAWING NO. REV. TITLE GPC
4U-11 A
5/6/15
4U-11, 4-ball, 2x2 Array, 0.40mm Pitch
Wafer Level Chip Scale Package (WLCSP) with BSC GTM
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN TYP MAX NOTE
A 0.260 0.295 0.330
A1 0.080 0.095 0.110
A2 0.160 0.175 0.190
A3 0.025 REF 3
D Contact Atmel for details
d1 0.400 BSC
E Contact Atmel for details
e1 0.400 BSC
b 0.170 0.185 0.200
Package Drawing Contact:
packagedrawings@atmel.com
PIN ASSIGNMENT MATRIX
BOTTOM VIEW
TOP VIEW
SIDE VIEW
12
A
B
VCC
SDA
VSS
SCL
d1
e1
E
A2
A1
A
k0.075 C
-C-
B
A
21
B
A
12
A3
Note: 1. Dimensions are NOT to scale.
2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.
3. Product offered with Back Side Coating (BSC)
SEATING PLANE
b (4X)
vd0.015 C
d0.05 C A B
d
m
m
k0.015 (4X)
A
B
D
A1 CORNER A1 CORNER
AT24C32E [DATASHEET]
Atmel-8905H-SEEPROM-AT24C32E-Datasheet_012017
28
13. Revision History
Doc. No. Date Comments
8905H 01/2017 Updated Power On Requirements and Reset Behavior section
8905G 12/2016
Part marking SOT23:
- Moved backside mark (YMXX) to front side line2.
- Added @ = Country of Assembly.
8905F 05/2016 Corrected the device share from two to eight on a common 2-wire bus.
8905E 11/2015 Added the AT24C32E-MAHMML-T and AT24C32E-U1UMML-T package options.
Updated the 8MA2 package drawing.
8905D 06/2015 Updated the part marking page.
8905C 05/2015 Added the 4-ball WLCSP, AT24C32E-U1UM0B-T option and updated the package drawings.
8905B 01/2015
Added the 100kHz timing set for reference, the UDFN extended quantity option, and the figure
for “System Configuration Using 2-Wire Serial EEPROMs”.
Updated Software Reset section, and the 8X, 8MA2, and 8P3 package outline drawings.
Replaced the 5U-4 with the 5U-2 package outline drawing.
8905A 05/2014 Initial document release.
X
XXX
XX
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