CPC1394 Single-Pole, Normally Open 4-Pin OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 600 120 35 Description Units VP mArms / mADC The CPC1394 is a single-pole, normally-open (1-Form-A) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Features * * * * * * * 5000Vrms Input/Output Isolation 600VP Blocking Voltage 100% Solid State Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Approvals * UL Certified Component: File E76270 * EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Applications * * * * * * * * * * Ordering Information Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment--Patient/Equipment Isolation Security Aerospace Industrial Controls Part Number CPC1394G CPC1394GV CPC1394GR CPC1394GRTR Description 4-Pin DIP (100/Tube) 4-Pin DIP V-Bend (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Control 1 4 2 3 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1394-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1394 Absolute Maximum Ratings @ 25C Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / C 2 Derate linearly 3mW / C Ratings 600 5 50 1 100 550 5000 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameters Output Characteristics Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=600VP IL ILPK RON ILEAK - 26 - 120 400 35 1 mArms / mADC mAP IF=5mA, VL=10V (See Timing Diagram) IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.85 0.46 50 5 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.45 0.4 1.2 - 2 1.4 10 VIO=0V, f=1MHz CIO - 3 - A ms pF mA V A pF Measurement taken within 1 second of on-time. For operation at temperatures >60C, a minimum LED drive current of 4mA is recommended. Timing Diagram IF 0 mA 90% IL 2 10% 0 mA ton toff www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1394 PERFORMANCE DATA @25C (Unless Otherwise Noted)* 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) Typical Turn-On Time (N=50, IF=5mA, IL=120mA) 20 25 25 20 15 10 Device Count (N) Device Count (N) Device Count (N) 30 15 10 5 5 0 0 Device Count (N) 25 15 10 5 0 0.35 0.40 0.45 0.50 LED Current (mA) 0.55 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) Typical Blocking Voltage Distribution (N=50) 20 15 10 5 1.0 -40 1.4 0 20 40 60 Temperature (C) 80 3 2 1 10 0.8 0.6 0.4 20 30 LED Current (mA) 40 0 20 40 60 LED Forward Voltage (V) 80 100 0.51 0.49 0.47 0 10 800 2.5 IF=2mA 2.0 1.5 IF=5mA 1.0 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=70mA) 900 IF=5mA 700 600 IF=2mA 500 400 300 0.5 -20 0.53 50 Typical Turn-On Time vs. Temperature (IL=70mA) 3.0 1.0 715 0.45 0 Typical IF for Switch Operation vs. Temperature (IL=70mA) 1.2 0.2 -40 4 100 690 695 700 705 710 Blocking Voltage (VP) 0.55 0 -20 685 Typical Turn-Off Time vs. LED Forward Current (IL=70mA) Turn-Off Time (Ps) 1.1 IF=5mA IF=2mA 5 680 Turn-Off Time (ms) Turn-On Time (ms) 1.2 Turn-On Time (ms) LED Forward Voltage (V) 1.3 10 Typical Turn-On Time vs. LED Forward Current (IL=70mA) 5 1.4 15 25.50 25.75 26.00 26.25 26.50 26.75 27.00 On-Resistance (:) 1.6 Forward Current (mA) 20 0 0.60 IF=50mA IF=20mA IF=10mA 5 0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55 Turn-Off Time (ms) Typical LED Forward Voltage Drop vs. Temperature 1.5 10 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 Turn-On Time (ms) 0 0.30 15 0 1.255 Typical IF for Switch Operation (N=50, IL=120mA) 20 Device Count (N) 1.235 1.240 1.245 1.250 LED Forward Voltage (V) Device Count (N) 1.230 20 -40 -20 0 20 40 60 Temperature (C) 80 100 200 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1394 PERFORMANCE DATA @25C (Unless Otherwise Noted)* Typical On-Resistance vs. Temperature (IF=2mA, IL=70mA) 0.15 25 20 Load Current (mA) 30 0.05 0.00 -0.05 -0.10 -0.15 -20 0 20 40 60 Temperature (C) 80 100 Typical Blocking Voltage vs. Temperature 100 Leakage Current (nA) Blocking Voltage (VP) 725 700 675 650 625 600 -40 -20 0 20 40 60 Temperature (C) 80 100 110 100 90 70 -4 750 120 80 -3 -2 -1 0 1 Load Voltage (V) 2 3 Typical Leakage vs. Temperature (VL=600V) 40 20 0 20 40 60 Temperature (C) 80 0 20 40 60 Temperature (C) 80 100 10s 100s Energy Rating Curve 60 -20 -20 1.0 80 0 -40 -40 4 Load Current (A) 15 -40 Maximum Load Current vs. Temperature (IF=2mA) 130 0.10 Load Current (A) On-Resistance (:) 35 Typical Load Current vs. Load Voltage (IF=2mA) 100 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1394 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1394G / CPC1394GV CPC1394GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)C. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1394GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole devices, CPC1394G and CPC1394GV, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1394GR 250C 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1394 MECHANICAL DIMENSIONS CPC1394G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 0.050 (0.130 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 0.127 (0.250 0.005) 4.572 0.127 (0.180 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) PIN 1 9 (ALL) 9 (ALL) 7.620 0.250 (0.300 0.010) 2.159 (0.085) 0.457 0.076 (0.018 0.003) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 0.127 (0.100 0.005) Dimensions mm (inches) CPC1394GV 0.254 (0.010) 0.991 (0.039) 3.30 0.050 (0.130 0.002) PC Board Pattern (Top View) 10.160 0.508 (0.400 0.020) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 0.050 (0.250 0.002) 4.572 0.050 (0.180 0.002) 9 (ALL) 0.457 0.076 (0.018 0.003) 2.540 0.050 (0.100 0.002) 6 2.540 0.127 (0.100 0.005) 10.160 0.127 (0.400 0.005) Pin 1 9 (ALL) 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 1.778 (0.070) 0.127 (0.005) Dimensions mm (inches) 2.92 (0.115) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1394 CPC1394GR 2.540 0.127 (0.100 0.005) PCB Land Pattern 3.300 0.050 (0.130 0.002) 0.635 0.254 (0.025 0.010) 6.350 0.127 (0.250 0.005) 9.525 (0.375) 7.620 0.254 (0.300 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 3.480 0.076 (0.137 0.003) 4.572 0.127 (0.180 0.005) 9 1 (ALL) 2.287 (0.09) 0.95 (0.037) 0.254 (0.010) 2.540 0.127 (0.100 0.005) Dimensions mm (inches) 0.102 min / 0.254 max (0.004 min / 0.010 max) 2.287 0.127 (0.090 0.005) CPC1394GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.000.30 (0.6300.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = 0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1394-R04 (c)Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: CPC1394GRTR CPC1394G CPC1394GV CPC1394GR