F-PLA600-2 - COSEL - Datasheet.Directory

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Revision: 23-Feb-18 1Document Number: 60022

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CECC ( ) 40401-010 Qualified Thin Film Chip Resistors

DESIGN SUPPORT TOOLS

Utilizing proven expertise in Thin Film resistors, VISHAY

provides a CECC qualified chip with the same reliability

and stability found in QPL resistors. These chips are

available in a wide range of sizes, values and performance

characteristics.

CONSTRUCTION

FEATURES

• Nickel barrier for high temperature operating

conditions

• Tight TCR < 10 ppm/°C, and in lot tracking

< 5 ppm/°C in (-55 °C, +155 °C temperature

range)

• Very low noise < 35 dB and voltage coefficient

0.1 ppm/V

•Non-inductive

• Laser trimmed down to 0.1 %

• Wraparound resistance less than 0.01 

• Antistatic waffle-pack or tape and reel packaging

available

• High stability (0.05 % - 1000 h at Pn at +70 °C)

• Withstand moisture resistance test of AEC-Q200

• Conform to EN 140401 804

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Note

This datasheet provides information about parts that are



RoHS-compliant and / or parts that are non RoHS-compliant. For



example, parts with lead (Pb) terminations are not RoHS-compliant.



Please see the information / tables in this datasheet for details

Notes

(1) Extended resistance range on request

(2) For ohmic range versus tolerance and TCR, see detailed table

Note

(3) Rn: Nominal resistance

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Available

Models

Passivated NiCr

resistance film

Adhesion layer

High purity

alumina substrate

Nickel barrier

Solder

coating

Passivation

Available

STANDARD ELECTRICAL SPECIFICATIONS

MODEL SIZE

RESISTANCE

RANGE (1) (2)



RATED POWER

LIMITING ELEMENT

VOLTAGE (UL)

TOLERANCE

± %

TEMPERATURE

COEFFICIENT

± ppm/°C

RV 0505 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25

RV 0603 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25

RV 0805 100 to 300K 0.200 50 0.1, 0.5, 1, 2, 5 10, 25

RV 1206 100 to 1M 0.330 75 0.1, 0.5, 1, 2, 5 10, 25

CLIMATIC SPECIFICATIONS

Operating temperature range -55 °C to +155 °C

Storage temperature range -55 °C to +155 °C

MECHANICAL SPECIFICATIONS

Resistive material Nichrome

Substrate material Alumina

Plating Tin lead over nickel or tin silver

over nickel or gold over nickel

Marking resistance to solvents Per CECC Specs

OHMIC RANGE VS. TOLERANCE AND TCR

CASE SIZE OHMIC RANGE



TOLERANCE

TCR

ppm/°C

0505 100 < 500 0.5; 1; 2; 5 10, 25

0505 500 to 260K 0.1; 0.5; 1; 2; 5 10, 25

0603 100 < 500 0.5; 1; 2; 5 10, 25

0603 500 to 260K 0.1; 0.5; 1; 2; 5 10, 25

0805 100 < 500 0.5; 1; 2; 5 10, 25

0805 500 to 300K 0.1; 0.5; 1; 2; 5 10, 25

1206 100 < 500 0.5; 1; 2; 5 10, 25

1206 500 to 1M 0.1; 0.5; 1; 2; 5 10, 25

TECHNICAL SPECIFICATIONS

TEST SPECIFICATIONS CONDITIONS

Absolute TCR E: ± 25 ppm/°C / Y: ± 10 ppm/°C -55 °C to +155 °C

Absolute tolerance ± 0.1 %, ± 0.5 %, ± 1 %, ± 2 %, ± 5 % (R  500 )

± 0.5 %, ± 1 %, ± 2 %, ± 5 % (R  100 )

Voltage coefficient 0.1 ppm/V

Noise -35 dB typical

Thermal EMF < 0.1 μV/°C

Load life stability ± (0.1 % Rn (3) ± 0.05 ) 1000 h Pn at +70 °C

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Revision: 23-Feb-18 2Document Number: 60022

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

POPULAR OPTION

AEC-Q200 moisture resistance

Option to order: 0058: Specific production process to withstand 85 °C/85 % RH at Pn/10

Notes

(1) Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste

alloy. Gold termination will be tested as B termination

(2) Rn: Nominal Resistance

Pn: Nominal Power

(3) Option to order: 0058

DIMENSIONS in millimeters (inches)

SERIES/

CASE SIZES

ABD/EC

Min. Max. Min. Max. Min. Max. Min. Max.

RV 0505 1.198

(0.047)

1.502

(0.059)

1.143

(0.045)

1.397

(0.055)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 0603 1.368

(0.054)

1.672

(0.066)

0.623

(0.025)

0.877

(0.035)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 0805 1.758

(0.069)

2.062

(0.081)

1.143

(0.045)

1.397

(0.055)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

RV 1206 2.908

(0.114)

3.212

(0.126)

1.473

(0.058)

1.727

(0.068)

0.250

(0.010)

0.510

(0.020)

0.373

(0.015)

0.627

(0.025)

ENVIRONMENTAL TEST

TEST CONDITIONS VALUES AND DRIFTS (R/R ± %)

CECC REQUIREMENTS TYPICAL PERFORMANCE

Overload 6.25 x rated power / 2 s (or 2 UL) 0.05 % Rn (2) + 0.05 0.01 % Rn (2)

Climatic sequences (1) -55 °C / +155 °C

5 moisture cycles 0.1 % Rn (2) + 0.05 0.02 % Rn (2)

Thermal shock (1) -55 °C / +155 °C

5 cycles 30 min 0.05 % Rn (2) + 0.05 0.02 % Rn (2)

Load life (1) +70 °C/Pn

1000 h 0.1 % Rn (2) + 0.05 0.05 % Rn (2)

Resistance to solder heat +260 °C/ 10 s 0.05 % Rn (2) + 0.05 0.02 % Rn (2)

Moisture resistance (1)

+40 °C / 93 % HR

Pn / 10 0.1 % Rn (2) + 0.05 0.01 % Rn (2)

AEC-Q200 (3)

85 °C / 85 % RH / Pn / 10

1000 h

0.5 % + 0.05 Max. < 0.3 % + 0.05 

High temperature storage 1000 h at + 155 °C 0.1 % Rn (2) + 0.05 0.05 % Rn (2)

Bending (1) 10 bends / 2 mm / 5 s 0.05 % Rn (2) + 0.05 0.02 % Rn (2)

SPECIFIC CONDITIONS DUE TO TERMINATION TYPE

TEST CONDITIONS VALUES AND DRIFTS

B; G N VISHAY REQUIREMENTS TYPICAL PERFORMANCE

Solderability +235 °C/2 s

Sn60Pb40 alloy

+245 °C/3 s

Sn97Ag3 alloy VISUAL INSPECTION

High T° reflow profile N/A +255 °C/40 s

(on parts) 0.02 % Rn (2) + 0.05 0.01 % Rn (2) + 0.05 

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Revision: 23-Feb-18 3Document Number: 60022

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DERATING CURVE

PACKAGING INFORMATION

SIZE

NUMBER OF PIECES PER PACKAGE

WAFFLE PACK

(2" x 2")

TAPE AND REEL TAPE

WIDTH

Min. Max.

0505

100

4000

8 mm

(0.315”)

0603 5000

0805 100

4000

1206 140

07020 40 60 80 100 120 140 155

100

Ambient Temperature in °C

Rated Power (%)

125

GLOBAL PART NUMBER INFORMATION

New Global Part Numbering: RV0505E1001DBT0099

GLOBAL

MODEL SIZE TCR VALUE TOLERANCE TERMINATION PACKAGING OPTION

0505

0603

0805

1206

E = ± 25 ppm/°C

Y = ± 10 ppm/°C

The first 3 digits

(2 digits are enough

for tolerance G and J)

are significant figures

and the last digit

specifies the number

of zeros to follow.

R designates

decimal point

10R0 = 10 

3901 = 3900 

1004 = 1 M

B = ± 0.1 %

D = ± 0.5 %

F = ± 1 %

G = ± 2 %

J = ± 5 %

B: SnPb over

nickel barrier

N: SnAg over

nickel barrier

G: gold over

nickel barrier

For more

information

see

“Codification

of packaging”

table

Leave blank

if no option



B: lead bearing version

N and G: lead (Pb)-free / RoHS version

Historical Part Number example: RV 0505 25PPM 1K 0.5 % B TR R1016

PART NUMBER DESCRIPTION (for information only)

RV 0505 25 PPM 1K 0.5 % B TR R1016

MODEL SIZE TCR OHMIC VALUE TOLERANCE TERMINATION PACKAGING OPTION

V0505E100R1DBT0 099

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Revision: 23-Feb-18 4Document Number: 60022

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

CODIFICATION OF PACKAGING

CODE 18 PACKAGING

WAFFLE PACK

W100 min., 1 mult

WA 100 min., 100 mult (available only in size 1206)

PLASTIC TAPE (Standard for all sizes.)

T100 min., 1 mult

TA 100 min., 100 mult

TB 250 min., 250 mult

TC 500 min., 500 mult

TD 1000 min., 1000 mult

TE 2500min., 2500 mult

TF Full tape (quantity depending on size of chips)

PAPER TAPE (Available for 0603, 0805, and 1206. Please consult Vishay Sfernice for other sizes.)

PT 100 min., 1 mult

PA 100 min., 100 mult

PB 250 min., 250 mult

PC 500 min., 500 mult

PD 1000 min., 1000 mult

PE 2500min., 2500 mult

PF Full tape (quantity depending on size of chips)

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Revision: 08-Feb-17 1Document Number: 91000

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

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