SN74LS157 Quad 2-Input Multiplexer The LSTTL/MSI SN74LS157 is a high speed Quad 2-Input Multiplexer. Four bits of data from two sources can be selected using the common Select and Enable inputs. The four buffered outputs present the selected data in the true (non-inverted) form. The LS157 can also be used to generate any four of the 16 different functions of two variables. The LS157 is fabricated with the Schottky barrier diode process for high speed and is completely compatible with all ON Semiconductor TTL families. * * * * * * http://onsemi.com LOW POWER SCHOTTKY Schottky Process for High Speed Multifunction Capability Non-Inverting Outputs Input Clamp Diodes Limit High Speed Termination Effects Special Circuitry Ensures Glitch Free Multiplexing ESD > 3500 Volts 16 1 PLASTIC N SUFFIX CASE 648 GUARANTEED OPERATING RANGES Symbol VCC Parameter Supply Voltage Min Typ Max Unit 4.75 5.0 5.25 V 0 25 70 C TA Operating Ambient Temperature Range IOH Output Current - High -0.4 mA IOL Output Current - Low 8.0 mA 16 1 SOIC D SUFFIX CASE 751B 16 1 SOEIAJ M SUFFIX CASE 966 ORDERING INFORMATION Device Package Shipping SN74LS157N 16 Pin DIP 2000 Units/Box SN74LS157D SOIC-16 38 Units/Rail SN74LS157DR2 SOIC-16 2500/Tape & Reel SN74LS157M SOEIAJ-16 See Note 1 SN74LS157MEL SOEIAJ-16 See Note 1 1. For ordering information on the EIAJ version of the SOIC package, please contact your local ON Semiconductor representative. Semiconductor Components Industries, LLC, 2002 February, 2002 - Rev. 8 1 Publication Order Number: SN74LS157/D SN74LS157 VCC E I0c I1c Zc I0d I1d Zd 16 15 14 13 12 11 10 9 NOTE: 1 S 2 I0a 3 I1a 4 Za 5 I0b 6 I1b 7 Zb The Flatpak version has the same pinouts (Connection Diagram) as the Dual In-Line Package. 8 GND LOADING (Note a) PIN NAMES S E I0a - I0d I1a - I1d Za - Zd Common Select Input Enable (Active LOW) Input Data Inputs from Source 0 Data Inputs from Source 1 Multiplexer Outputs HIGH LOW 1.0 U.L. 1.0 U.L. 0.5 U.L. 0.5 U.L. 10 U.L. 0.5 U.L. 0.5 U.L. 0.25 U.L. 0.25 U.L. 5 U.L. NOTES: a) 1 TTL Unit Load (U.L.) = 40 A HIGH/1.6 mA LOW. Figure 1. Connection Diagram DIP (TOP VIEW) 15 2 3 5 6 14 13 11 10 E I0a I1a I0b I1b I0c I1c I0d I1d 1 S Za Zb Zc Zd 4 7 12 9 VCC = PIN 16 GND = PIN 8 Figure 2. Logic Symbol http://onsemi.com 2 SN74LS157 2 3 5 4 6 14 11 13 10 15 12 7 9 1 VCC = PIN 16 GND = PIN 8 = PIN NUMBERS Figure 3. Logic Diagram FUNCTIONAL DESCRIPTION A common use of the LS157 is the moving of data from two groups of registers to four common output busses. The particular register from which the data comes is determined by the state of the Select Input. A less obvious use is as a function generator. The LS157 can generate any four of the 16 different functions of two variables with one variable common. This is useful for implementing highly irregular logic. The LS157 is a Quad 2-Input Multiplexer fabricated with the Schottky barrier diode process for high speed. It selects four bits of data from two sources under the control of a common Select Input (S). The Enable Input (E) is active LOW. When E is HIGH, all of the outputs (Z) are forced LOW regardless of all other inputs. The LS157 is the logic implementation of a 4-pole, 2-position switch where the position of the switch is determined by the logic levels supplied to the Select Input. The logic equations for the outputs are: Za = E (I1a S + I0a S) Zb = E (I1b S + I0b S) Zc = E (I1c S + I0c S) Zd = E (I1d S + I0d S) TRUTH TABLE ENABLE SELECT INPUT E S I0 I1 Z H L L L L X H H L L X X X L H X L H X X L L H L H INPUTS H = HIGH Voltage Level L = LOW Voltage Level X = Don't Care http://onsemi.com 3 OUTPUT SN74LS157 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol VIH Input HIGH Voltage VIL Input LOW Voltage VIK Input Clamp Diode Voltage VOH Output HIGH Voltage VOL Output LOW Voltage IIH Min Parameter Typ Max Unit 2.0 0.8 -0.65 2.7 -1.5 3.5 Short Circuit Current (Note 2) ICC Power Supply Current Guaranteed Input LOW Voltage for All Inputs V VCC = MIN, IIN = -18 mA V VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table VCC = VCC MIN, VIN = VIL or VIH per Truth Table V IOL = 4.0 mA 0.35 0.5 V IOL = 8.0 mA 20 40 A VCC = MAX, VIN = 2.7 V mA VCC = MAX, VIN = 7.0 V -0.4 -0.8 mA VCC = MAX, VIN = 0.4 V -100 mA VCC = MAX 16 mA VCC = MAX 0.1 0.2 IOS V 0.4 I0, I1 E, S Input LOW Current I0, I1 E, S V 0.25 Input HIGH Current I0, I1 E, S IIL Test Conditions Guaranteed Input HIGH Voltage for All Inputs -20 2. Not more than one output should be shorted at a time, nor for more than 1 second. AC CHARACTERISTICS (TA = 25C) Limits Symbol Min Parameter Typ Max Unit Test Conditions tPLH tPHL Propagation Delay Data to Output 9.0 9.0 14 14 ns Figure 2 tPLH tPHL Propagation Delay Enable to Output 13 14 20 21 ns Figure 1 tPLH tPHL Propagation Delay Select to Output 15 18 23 27 ns Figure 2 VCC = 5.0 V CL = 15 pF AC WAVEFORMS VIN VOUT 1.3 V 1.3 V VIN tPHL tPLH 1.3 V 1.3 V VOUT Figure 1. 1.3 V tPHL tPLH 1.3 V 1.3 V Figure 2. http://onsemi.com 4 1.3 V SN74LS157 PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 9 1 8 B F C L S -T- SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 5 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 SN74LS157 PACKAGE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -A- 16 9 1 8 -B- P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 8 PL 0.25 (0.010) M B S G R K F X 45 C -T- SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 SN74LS157 PACKAGE DIMENSIONS M SUFFIX SOEIAJ PACKAGE CASE 966-01 ISSUE O 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.031 SN74LS157 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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