PIC32MX210F016DT-V/TL - Microchip Technology

PIC32MX1XX/2XX

The PIC32MX1XX/2XX family devices that you have

received conform functionally to the current Device Data

Sheet (DS61168D), except for the anomalies described

in this document.

The errata described in this document will be addressed

in future revisions of the PIC32MX1XX/2XX silicon.

Data Sheet clarifications and corrections start on page 7,

following the discussion of silicon issues.

The silicon revision level can be identified using the

current version of MPLAB® IDE and Microchip’s

programmers, debuggers and emulation tools, which

are available at the Microchip corporate web site

(www.microchip.com).

For example, to identify the silicon revision level

using MPLAB IDE in conjunction with the REAL

ICE™ in-circuit emulator:

1. Using the appropriate interface, connect the

device to the REAL ICE in-circuit emulator.

2. From the main menu in MPLAB IDE, select

Configure>Select Device, and then select the

target part number in the dialog box.

3. Select the MPLAB hardware tool

(Debugger>Select Tool).

4. Perform a “Connect” operation to the device

(Debugger>Connect). Depending on the devel-

opment tool used, the part number and Device

Revision ID value appear in the Output window.

The Device and Revision ID values for the various

silicon revisions are provided in Table 1 and Table 2.

Note: The silicon issues discussed in the

following pages are for silicon revisions

with the Device and Revision IDs listed in

Table 1 and Table 2. The last column of

each table represents the latest silicon

revision for the devices listed. The silicon

issues are summarized in Ta b l e 3 .

Note: If you are unable to extract the silicon

revision level, please contact your local

Microchip sales office for assistance.

TABLE 1: SILICON DEVREV VALUES FOR DEVICES WITH 16/32 KB FLASH

Part Number Device ID(1) Revision ID for Silicon Revision(1)

A0 A1

PIC32MX110F016B 0x04A07053

0x0 0x1

PIC32MX110F016C 0x04A09053

PIC32MX110F016D 0x04A0B053

PIC32MX210F016B 0x04A01053

PIC32MX210F016C 0x04A03053

PIC32MX210F016D 0x04A05053

PIC32MX120F032B 0x04A06053

PIC32MX120F032C 0x04A08053

PIC32MX120F032D 0x04A0A053

PIC32MX220F032B 0x04A00053

PIC32MX220F032C 0x04A02053

PIC32MX220F032D 0x04A04053

Note 1: Refer to the “PIC32MX Flash Programming Specification” (DS61145) for detailed information on Device

and Revision IDs for your specific device.

PIC32MX1XX/2XX Family

Silicon Errata and Data Sheet Clarification

PIC32MX1XX/2XX

TABLE 2: SILICON DEVREV VALUES FOR DEVICES WITH 64/128 KB FLASH

Part Number Device ID(1) Revision ID for Silicon Revision(1)

A0 A1

PIC32MX130F064B 0x04D07053

0x0 0x1

PIC32MX130F064C 0x04D09053

PIC32MX130F064D 0x04D0B053

PIC32MX230F064B 0x04D01053

PIC32MX230F064C 0x04D03053

PIC32MX230F064D 0x04D05053

PIC32MX150F128B 0x04D08053

PIC32MX150F128C 0x04D08053

PIC32MX150F128D 0x04D0A053

PIC32MX250F128B 0x04D00053

PIC32MX250F128C 0x04D02053

PIC32MX250F128D 0x04D04053

Note 1: Refer to the “PIC32MX Flash Programming Specification” (DS61145) for detailed information on Device

and Revision IDs for your specific device.

PIC32MX1XX/2XX

TABLE 3: SILICON ISSUE SUMMARY

Module Feature Item # Issue Summary

Affected Device

Flash

Memory

(KB)

Silicon

Revision

A0 A1

Voltage

Regulator BOR 1. Device may not exit Brown-out Reset (BOR) state if a

BOR event occurs.

16/32 X

64/128 X

Oscillator Clock Switch 2.

If a Fail-Safe Clock Monitor (FSCM) event occurs when

Primary Oscillator (POSC) mode is used, firmware clock

switch requests to switch from FRC mode will fail.

16/32 X X

64/128 X X

I2C™ Slave Mode 3.

The I2C module does not respond to address 0x78 when

the STRICT and A10M bits are cleared in the I2CxCON

16/32 X X

64/128 X X

USB UIDLE

Interrupt 4. UIDLE interrupts cease if the UIDLE interrupt flag is

cleared.

16/32 X X

64/128 X X

ADC —5.

The DNL parameter of the ADC module is not within the

published data sheet specifications when the ADC

module is operating at maximum conversion rate.

16/32 X X

64/128 X X

ADC CTMU

Calibration 6. Open selection for Channel 0 positive input is not

functional.

16/32 X X

64/128

ADC

Conversion

Trigger from

INT0 Interrupt

The ADC module conversion triggers occur on the rising

edge of the INT0 signal even when INT0 is configured to

generate an interrupt on the falling edge.

16/32 X X

64/128 X X

Parallel

Master Port

(PMP)

Address Pins 8. When the Parallel Master Port (PMP) module is enabled,

address pins cannot be used as GPIO output pins.

16/32 X X

64/128 X X

I/O Ports RA0 and RA1

Output 9. Output High Voltage (VOH) on pins RA0 and RA1 is not

within the published data sheet specification.

16/32 X X

64/128 X X

CPU Data Write to

a Peripheral 10.

A data write operation by the CPU to a peripheral may be

repeated if an interrupt occurs during initial write

operation.

16/32 X X

64/128 X X

Oscillator Clock Out 11.

A clock signal is present on the CLKO pin, regardless of

the clock source and setting of the CLKO Enable

Configuration bit, during a Power-on Reset (POR)

condition.

16/32 X X

64/128 X X

Legend: An ‘X’ indicates the issue is present in this revision of silicon;

Shaded cells with an Em dash (‘—’) indicate that this silicon revision does not exist for this issue;

Blank cells indicate an issue has been corrected in this revision of silicon.

PIC32MX1XX/2XX

Silicon Errata Issues

1. Module: Voltage Regulator

Device may not exit the Brown-out Reset (BOR)

state if a BOR event occurs.

Work arounds

Work around 1:

VDD must remain within the published specification

(see parameter DC10 of the device data sheet).

Work around 2:

Reset the device by providing the Power-on Reset

(POR) condition.

Affected Silicon Revisions

2. Module: Oscillator

If the Primary Oscillator (POSC) mode is

implemented and a Fail-Safe Clock Monitor

(FSCM) event occurs (failure of the external

primary clock), the internal clock source will switch

to the FRC oscillator. Subsequent firmware clock

switch requests from the FRC oscillator to other

clock sources will fail and the device will continue

to execute on the FRC oscillator. Upon repair of

the external clock source and a power-on state,

the device will resume operation with the primary

oscillator clock source.

Work around

None.

Affected Silicon Revisions

3. Module: I2C™

The slave address, 0x78, is one of a group of

reserved addresses. It is used as the upper byte of

a 10-bit address when 10-bit addressing is

enabled. The I2C module control register allows

the programmer to enable both 10-bit addressing

and strict enforcement of reserved addressing,

with the A10M and STRICT bits, respectively.

When both bits are cleared, the device should

respond to the reserved address 0x78, but does

not.

Work around

None.

Affected Silicon Revisions

4. Module: USB

In the case where the bus has been idle for more

than 3 ms, and the UIDLE interrupt flag is set, if

software clears the interrupt flag and the bus

remains idle, the UIDLE interrupt flag will not be

set again.

Work around

Software can leave the UIDLE bit set until it has

received some indication of bus resumption (i.e.,

Resume, Reset, SOF, or Error).

Affected Silicon Revisions

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. The table

provided in each issue indicates which

issues exist for a particular revision of

silicon based on memory size.

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X

64/128 X

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

Note: Resume and Reset are the only interrupts

that should be gotten following UIDLE

assertion. If, at any point in time, the

UIDLE bit is set, it should be okay to sus-

pend the USB module (as long as this

code is protected by the GUARD and/or

ACTPEND logic). Note that this will

require software to clear the UIDLE

interrupt enable bit to exit the USB ISR (if

using interrupt driven code).

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

PIC32MX1XX/2XX

5. Module: ADC

If the ADC module is configured to operate at a

maximum conversion rate of 1.1 Msps, missing

codes are possible every 25 codes and the DNL

parameter will not be within the published

specification.

Work around

Configure the ADC module to operate for a

maximum conversion rate of 500 ksps.

Affected Silicon Revisions

6. Module: ADC

If the ADC module is used in conjunction with the

CTMU module in Absolute Capacitive/Time

Measurement mode, Channel 0 positive input

must remain open (CH0SA<3:0> = 1111 or

CH0SB<3:0> = 1111) during calibration step.

However, open selection for Channel 0 positive

input is not functional and connects this input to

AVSS.

Work around

Use the ADC and CTMU modules for relative

capacitive/time measurement, where calibration

step is not required.

Affected Silicon Revisions

7. Module: ADC

When the ADC module is configured to start

conversion on an external interrupt

(SSRC<2:0> = 001), the start of conversion

always occurs on a rising edge detected at the

INT0 pin, even when the INT0 pin has been

configured to generate an interrupt on a falling

edge (INT0EP = 0).

Work around

Generate ADC conversion triggers on the rising

edge of the INT0 signal.

Alternately, use external circuitry to invert the

signal appearing at the INT0 pin, so that a falling

edge of the input signal is detected as a rising

edge by the INT0 pin.

Affected Silicon Revisions

8. Module: Parallel Master Port (PMP)

If the PMP module is enabled, any pin with a PMP

addressing capability (PMAx) cannot be used as a

general purpose output pin, even when the

corresponding PTEN<10:0> bit in the PMAEN

pins, including GPIO input functionality is not

affected.

Work around

To use a GPIO pin as an output when this pin is

shared with PMP addressing functionality and

PMP is enabled, do the following:

1. Enable PMP addressing by setting the

corresponding PTEN<10:0> bit in the

PMAEN register.

2. Instead of using corresponding LATx

registers to output GPIO data, use the

PMADDR register.

Affected Silicon Revisions

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 X X

64/128 X X

PIC32MX1XX/2XX

9. Module: I/O Ports

Output High Voltage (VOH) on pins RA0 and RA1

is not within the published data sheet specification.

Work around

Disable slew rate control of the I2C1 module by

setting the DISSLW bit (I2C1CON<9>).

Affected Silicon Revisions

10. Module: CPU

During normal operation, if a CPU write operation

is interrupted by an incoming interrupt, it should be

aborted (not completed) and resumed after the

interrupt is serviced. However, some of these write

operations may not be aborted, resulting in a

double write to peripherals by the CPU (the first

write during the interrupt and the second write after

the interrupt is serviced).

Work around

Most peripherals are not affected by this issue, as

a double write will not have a negative impact.

However, the following communication peripherals

will double-send data if their respective transmit

buffers are written twice: SPI, I2C, UART and PMP.

To avoid double transmission of data, utilize DMA

to transfer data to these peripherals.

Affected Silicon Revisions

11. Module: Oscillator

A clock signal is present on the CLKO pin,

regardless of the clock source and setting of the

CLKO Enable Configuration bit, OSCIOFNC

(DEVCFG1<10>), during a Power-on Reset

(POR) condition.

Work around

Do not connect the CLKO pin to a device that

would be adversely affected by rapid pin toggling

or a frequency other than that defined by the

oscillator configuration. Do not use the CLKO pin

as an input if the device connected to the CLKO

pin would be adversely affected by the pin driving

a signal out.

Affected Silicon Revisions

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 XX

64/128 XX

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 XX

64/128 XX

Device Flash

Memory (KB)

Device Silicon Revision

A0 A1

16/32 XX

64/128 XX

PIC32MX1XX/2XX

Data Sheet Clarifications

The following typographic corrections and clarifications

are to be noted for the latest version of the device data

sheet (DS61168D):

None to report at this time.

APPENDIX A: REVISION HISTORY

Rev A Document (10/2011)

Initial release of this document; issued for revision

A0 silicon.

Includes silicon issues 1 (Voltage Regulator),

2(Oscillator), 3 (I2C™), 4 (USB), 5 (ADC), 6 (ADC),

7(ADC), 8 (Parallel Master Port (PMP)), and 9 (I/O

Ports).

Rev B Document (2/2012)

Added silicon revision A1 for 16/32 KB Flash devices.

Added 64/128 KB Flash devices.

Added silicon issues 10 (CPU) and 11 (Oscillator).

Note: Corrections are shown in bold. Where

possible, the original bold text formatting

has been removed for clarity.

PIC32MX1XX/2XX

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC32 logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient Code Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance, TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-046-8

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

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