19-3572; Rev 0; 4/05 ILABLE N KIT AVA IO T A U L A EV High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator The MAX2022 low-noise, high-linearity, direct upconversion quadrature modulator is designed for single and multicarrier 1800MHz to 2200MHz UMTS/WCDMA, cdma2000(R), and DCS/PCS base-station applications. Direct upconversion architectures are advantageous since they significantly reduce transmitter cost, part count, and power consumption as compared to traditional IF-based double upconversion systems. In addition to offering excellent linearity and noise performance, the MAX2022 also yields a high level of component integration. This device includes two matched passive mixers for modulating in-phase and quadrature signals, three LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. Features 1500MHz to 2500MHz RF Frequency Range Meets Four-Carrier WCDMA 65dBc ACLR +23.3dBm Typical OIP3 +51.5dBm Typical OIP2 45.7dBc Typical Sideband Suppression -40dBm Typical LO Leakage -173.2dBm/Hz Typical Output Noise, Eliminating the Need for an RF Output Filter Broadband Baseband Input DC-Coupled Input Provides for Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers Ordering Information PART PKG CODE TEMP RANGE PIN-PACKAGE MAX2022ETX -40C to +85C 36 Thin QFN-EP* T3666-2 (6mm x 6mm) MAX2022ETX-T -40C to +85C 36 Thin QFN-EP* T3666-2 (6mm x 6mm) Single and Multicarrier WCDMA/UMTS Base Stations MAX2022ETX+D -40C to +85C 36 Thin QFN-EP* T3666-2 (6mm x 6mm) Single and Multicarrier cdmaOneTM and cdma2000 Base Stations MAX2022ETX+TD -40C to +85C 36 Thin QFN-EP* T3666-2 (6mm x 6mm) Applications Single and Multicarrier DCS 1800/PCS 1900 EDGE Base Stations PHS/PAS Base Stations Predistortion Transmitters Fixed Broadband Wireless Access *EP = Exposed paddle. + = Lead free. -T = Tape-and-reel package. WCDMA, ACLR, ALTCLR and Noise vs. RF Output Power at 2140MHz for Single, Two, and Four Carriers -60 Private Mobile Radio -62 Military Systems -64 Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. ACLR AND ALT CLR (dBc) Wireless Local Loop Microwave Links D = Dry pack. -125 4C ADJ 4C ALT -135 -66 -68 -145 2C ADJ -70 1C ADJ -72 -155 4C 2C -74 2C ALT 1C ALT -76 -165 1C -78 NOISE FLOOR -80 -175 -50 cdmaOne is a trademark of CDMA Development Group. NOISE FLOOR (dBm/Hz) The MAX2022 operates from a single +5V supply. It is available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range. -40 -30 -20 -10 0 RF OUTPUT POWER PER CARRIER (dBm) ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX2022 General Description MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V COMP .............................................................................0 to VCC BBIP, BBIN, BBQP, BBQN to GND ............-2.5V to (VCC + 0.3V) LO, RFOUT to GND Maximum Current ...............................50mA Baseband Differential I/Q Input Power (Note A) ............+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA RBIASLO3 Maximum Current .............................................10mA JA (without air flow) ......................................................34C/W JA (2.5m/s air flow) .........................................................28C/W JC (junction to exposed paddle) ...................................8.5C/W Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering 10s, non-lead free)...........+245C Lead Temperature (soldering 10s, lead free) ..................+260C Note A: Maximum reliable continuous power applied to the baseband differential port is +12dBm from an external 100 source. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q inputs terminated into 100 differential, LO input terminated into 50, RF output terminated into 50, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER Supply Voltage Total Supply Current SYMBOL CONDITIONS VCC ITOTAL MIN TYP MAX UNITS 4.75 5.00 5.25 V Pins 3, 13, 15, 31, 33 all connected to VCC Total Power Dissipation 292 342 mA 1460 1796 mW AC ELECTRICAL CHARACTERISTICS (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, PLO = 0dBm, 1900MHz fLO 2200MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS BASEBAND INPUT Baseband Input Differential Impedance fIQ = 1MHz BB Common-Mode Input Voltage Range Output Power -2.5 TC = +25C 43 0 -24 +1.5 V dBm RF OUTPUTS (fLO = 1960MHz) Output IP3 VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz 21.8 dBm Output IP2 VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz 48.9 dBm -20.5 dBm Output Power 2 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, PLO = 0dBm, 1900MHz fLO 2200MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS Output Power Variation Over Temperature TC = -40C to +85C Output-Power Flatness MIN TYP MAX UNITS -0.004 dB/C fLO = 1960MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz 0.6 dB ACLR (1st Adjacent Channel 5MHz Offset) Single-carrier WCDMA (Note 2), RFOUT = -16dBm 70 dBc LO Leakage No external calibration, with each baseband input terminated in 50 -46.7 dBm Sideband Suppression No external calibration 47.3 dBc 15.3 dB -173.4 dBm/Hz 10.1 dB Output IP3 VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz 23.3 dBm Output IP2 VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHZ 51.5 dBm -20.8 dBm -0.005 dB/C 0.32 dB 70 dBc Output Return Loss Output Noise Density fmeas = 2060MHz, with each baseband input terminated in 50 LO Input Return Loss RF OUTPUTS (fLO = 2140MHz) Output Power Output Power Variation Over Temperature TC = -40C to +85C Output-Power Flatness fLO = 2140MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz ACLR (1st Adjacent Channel 5MHz Offset) Single-carrier WCDMA (Note 2), RFOUT = -16dBm, fLO = 2GHz LO Leakage No external calibration, with each baseband input terminated in 50 -40.4 dBm Sideband Suppression No external calibration 45.7 dBc 13.5 dB -173.2 dBm/Hz 18.1 dB Output Return Loss Output Noise Density LO Input Return Loss fmeas = 2240MHz, with each baseband input terminated in 50 Note 1: TC is the temperature on the exposed paddle. Note 2: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complimentary cumulative distribution function. _______________________________________________________________________________________ 3 MAX2022 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) ACLR vs. OUTPUT POWER -72 ALTERNATE CHANNEL -74 -66 -68 ADJACENT CHANNEL -70 -72 -74 -68 -72 -74 ALTERNATE CHANNEL -76 -78 -78 -78 -80 -80 -80 -10 0 -40 -30 -20 -10 0 FOUR CARRIER -50 -40 OUTPUT POWER (dBm) OUTPUT POWER vs. LO FREQUENCY OUTPUT POWER vs. LO FREQUENCY -2 MAX2022 toc04 -2 VI = VQ = 0.611VP-P DIFFERENTIAL VI = VQ = 0.611VP-P DIFFERENTIAL -3 OUTPUT POWER (dBm) -3 -4 PLO = -3dBm, 0dBm, +3dBm -5 -6 TC = +25C -20 -10 OUTPUT POWER vs. LO FREQUENCY -4 -5 -30 OUTPUT POWER (dBm) -2 VI = VQ = 0.611VP-P DIFFERENTIAL -3 OUTPUT POWER (dBm) -20 OUTPUT POWER (dBm) -76 MAX2022 toc05 -30 ALTERNATE CHANNEL -70 -76 -40 OUTPUT POWER (dBm) -64 ACLR (dB) -70 ADJACENT CHANNEL -62 -66 -68 ACLR (dB) ACLR (dB) -64 ADJACENT CHANNEL -66 TWO CARRIER -62 TC = -40C -6 MAX2022 toc06 -64 -60 MAX2022 toc02 MAX2022 toc01 SINGLE CARRIER -62 ACLR vs. OUTPUT POWER -60 MAX2022 toc03 ACLR vs. OUTPUT POWER -60 -4 VCC = 4.75V, 5.0V, 5.25V -5 -6 TC = +85C -7 -8 -7 -8 1.7 1.9 2.1 2.3 -8 1.5 1.7 1.9 2.1 2.3 2.5 1.5 1.7 1.9 2.1 2.3 LO FREQUENCY (GHz) LO FREQUENCY (GHz) LO LEAKAGE vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY -50 -70 TC = -40C, +85C -30 -50 -70 PLO = 0dBm BASEBAND INPUTS TERMINATED IN 50 -10 LO LEAKAGE (dBm) LO LEAKAGE (dBm) PLO = -3dBm, +3dBm -30 BASEBAND INPUTS TERMINATED IN 50 -10 MAX2022 toc08 LO FREQUENCY (GHz) BASEBAND INPUTS TERMINATED IN 50 -10 2.5 MAX2022 toc07 1.5 -30 2.5 MAX2022 toc09 -7 LO LEAKAGE (dBm) MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator VCC = 4.75V, 5.0V -50 -70 TC = +25C VCC = 5.25V -90 -90 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) 4 2.3 2.5 -90 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) 2.3 2.5 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) _______________________________________________________________________________________ 2.3 2.5 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator fBB = 1MHz, VI = VQ = 112mVP-P 50 TC = -40C, +25C, +85C 30 20 PLO = -3dBm fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) IMAGE REJECTION (dB) 40 IMAGE REJECTION vs. LO FREQUENCY 60 MAX2022 toc11 MAX2022 toc10 fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) IMAGE REJECTION vs. LO FREQUENCY 60 40 PLO = 0dBm 30 20 MAX2022 toc12 IMAGE REJECTION vs. LO FREQUENCY 60 40 VCC = 4.75, 5.0V, 5.25V 30 20 PLO = +3dBm 10 10 0 0 1.7 1.9 2.1 2.3 2.5 0 1.5 1.7 1.9 2.1 2.3 2.5 1.5 OUTPUT NOISE vs. OUTPUT POWER IF FLATNESS vs. BASEBAND FREQUENCY TC = +25C -165 TC = +85C -170 -164 TC = +85C TC = +25C -168 -15 -16 IF POWER (dBm) -160 -172 -175 -176 -180 -180 -20 -15 -10 -5 0 10 5 MAX2022 toc15 PLO = 0dBm, fLO = 2140MHz 2.5 -14 AMX2022 toc14 AMX2022 toc13 TC = -40C -160 -156 fLO - fRF -17 -18 -19 -20 fLO + fRF -21 -22 -23 TC = -40C fLO = 1960MHz, PBB = -12dBm/PORT INTO 50 -24 -25 -20 -15 -10 -5 0 5 0 10 20 40 60 80 100 BASEBAND FREQUENCY (MHz) IF FLATNESS vs. BASEBAND FREQUENCY BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY -17 fLO - fRF -18 -19 -20 -21 fLO + fRF -22 fLO = 2140MHz, PBB = -12dBm/PORT INTO 50 -24 20 40 60 80 BASEBAND FREQUENCY (MHz) 100 44.5 VCC = 4.75V 44.0 43.5 43.0 VCC = 5.0V 42.5 VCC = 5.25V 42.0 41.5 fLO = 2GHz, PLO = 0dBm 41.0 0 20 40 60 80 BASEBAND FREQUENCY (MHz) 100 44.5 MAX2022 toc18 -16 45.0 MAX2022 toc17 MAX2022 toc16 -15 BASEBAND DIFFERENTIAL INPUT RESISTANCE () OUTPUT POWER (dBm) BASEBAND DIFFERENTIAL INPUT RESISTANCE () OUTPUT POWER (dBm) -14 IF POWER (dBm) 2.3 OUTPUT NOISE vs. OUTPUT POWER -155 0 2.1 LO FREQUENCY (GHz) PLO = 0dBm, fLO = 1960MHz -23 1.9 LO FREQUENCY (GHz) -150 -25 1.7 LO FREQUENCY (GHz) OUTPUT NOISE (dBm/Hz) 1.5 OUTPUT NOISE (dBm/Hz) 10 44.0 PLO = +3dBm 43.5 PLO = -3dBm 43.0 PLO = 0dBm fLO = 2GHz, VCC = 5.0V 42.5 0 20 40 60 80 100 BASEBAND FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) OUTPUT IP3 vs. LO FREQUENCY 20 5 15 10 5 2.1 2.3 2.5 1.7 1.9 2.1 2.3 2.5 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) LO FREQUENCY (GHz) OUTPUT IP3 vs. COMMON-MODE BASEBAND VOLTAGE OUTPUT IP2 vs. LO FREQUENCY OUTPUT IP2 vs. LO FREQUENCY TC = +25C 60 TC = +85C 20 40 TC = -40C 30 20 fLO = 1960MHz 10 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz -2 -1 0 1 2 3 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) OUTPUT IP2 vs. LO FREQUENCY OUTPUT IP2 vs. COMMON-MODE BASEBAND VOLTAGE 50 OIP2 (dBm) 40 PLO = 0dBm PLO = -3dBm 30 30 20 20 10 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 10 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) 2.3 2.5 -3 -2 -1 0 1 1.9 2.1 2.3 2.5 LO LEAKAGE vs. LO FREQUENCY NULLED AT fLO = 1960MHz AT PRF = -18dBm -20 2 COMMMON-MODE BASEBAND VOLTAGE (V) -40 -60 -80 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 0 1.7 0 LO LEAKAGE (dBm) fLO = 2140MHz 40 1.5 MAX2022 toc26 fLO = 1960MHz 50 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz LO FREQUENCY (GHz) 60 MAX2022 toc25 PLO = +3dBm 60 30 0 1.5 COMMMON-MODE BASEBAND VOLTAGE (V) 70 VCC = 5.25V 10 0 -3 40 20 10 0 2.5 50 OIP2 (dBm) OIP2 (dBm) fLO = 2140MHz 30 VCC = 4.75V, 5.0V 60 50 40 2.3 70 MAX2022 toc23 70 MAX2022 toc22 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 50 OIP3 (dBm) 0 1.5 LO FREQUENCY (GHz) 60 6 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 1.9 10 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 1.7 15 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.5 PLO = -3dBm PLO = 0dBm, +3dBm MAX2022 toc24 10 VCC = 5.0V, 5.25V MAX2022 toc27 OIP3 (dBm) OIP3 (dBm) 15 20 VCC = 4.75V TC = -40C, +25C, +85C OIP3 (dBm) 20 25 MAX2022 toc20 25 MAX2022 toc19 25 OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc21 OUTPUT IP3 vs. LO FREQUENCY OIP2 (dBm) MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator 3 -100 1.945 1.950 1.955 1.960 1.965 LO FREQUENCY (GHz) _______________________________________________________________________________________ 1.970 1.975 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator -74 -76 -78 -80 NULLED AT -14dBm, -18dBm, -22dBm -82 -84 -76 NULLED AT -10dBm -78 -80 NULLED AT -14dBm, -18dBm, -22dBm -82 -84 -10 -20 fLO = 1960MHz -90 -40 -35 -30 -25 -20 -15 -90 -90 -10 -40 -35 -30 -25 -20 -15 LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF LO LEAKAGE vs. DIFFERENTIAL DC OFFSET ON Q-SIDE PRF = -18dBm, I-SIDE NULLED fLO = 2140MHz fLO = 1960MHz LO LEAKAGE (dBm) -50 -30 -40 -50 -60 -60 -70 -70 1.85 60 -80 2.05 2.10 2.15 2.20 40 30 20 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 1960MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm 0 -15 -14 -13 -12 -11 -10 -9 -8 -30 -25 -20 -15 SIDEBAND SUPRESSION vs. PRF RF PORT RETURN LOSS vs. LO FREQUENCY LO PORT RETURN LOSS vs. LO FREQUENCY 1.8MHz 30 20 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 2140MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm MAX2022 toc35 -5 -10 VCC = 4.75V, 5.0V, 5.25V -15 -15 MODULATOR POUT (dBm) VCC = 4.75V, 5.0V, 5.25V -10 -15 -20 -30 -20 -20 -5 -25 0 -25 -10 0 LO PORT RETURN LOSS (dB) 9MHz 0 RF PORT RETURN LOSS (dB) MAX2022 toc34 40 -30 9MHz MODULATOR POUT (dBm) 50 2.10 1.8MHz DC DIFFERENTIAL OFFSET ON Q-SIDE (mV) 60 10 2.05 LO FREQUENCY (GHz) 70 SIDEBAND SUPPRESSION (dB) 2.25 2.00 50 10 2.00 1.95 70 -80 -90 1.90 SIDEBAND SUPRESSION vs. PRF MAX2022 toc32 -20 -10 fLO = 1960MHz, NULLED AT -10dBm PRF LO FREQUENCY (GHz) -40 MAX2022 toc31 fLO = 2140MHz, NULLED AT -10dBm PRF -60 -80 OUTPUT POWER PRF (dBm) -10 -50 -88 OUTPUT POWER PRF (dBm) 0 -40 MAX2022 toc36 -88 -30 -70 -86 SIDEBAND SUPPRESSION (dB) -86 LO LEAKAGE (dBm) -74 MAX2022 toc30 -72 LO LEAKAGE (dBm) NULLED AT -10dBm 0 LO LEAKAGE (dBm) -72 fLO = 2140Hz -70 LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc29 -70 LO LEAKAGE (dBm) -68 MAX2022 toc28 -68 LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc33 LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF -10 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) 2.3 2.5 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) _______________________________________________________________________________________ 7 MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) PLO = -3dBm PLO = 0dBm -25 -30 -35 PLO = +3dBm -40 4 MAX2022 toc38 2 0 -2 -4 -6 6 4 2 0 -2 -4 -45 -8 -8 -10 -10 1.7 1.9 2.1 2.3 2.5 -2 3 8 18 13 TC = -40C, +25C, +85C -6 TC = -40C, +25C, +85C -50 -2 3 8 18 13 LO FREQUENCY (GHz) INPUT POWER (PIN*) (dBm) INPUT POWER (PIN*) (dBm) TOTAL SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOA SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOI1 SUPPLY CURRENT vs. TEMPERATURE (TC) 320 VCC = 5.25V 300 280 VCC = 5.0V 260 90 VCC = 5.25V 85 80 75 VCC = 5.0V 70 VCC = 4.75V 65 55 VCCLOI1 SUPPLY CURRENT (mA) MAX2022 toc40 340 MAX2022 toc41 1.5 PLO = 2140MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50 BASEBAND SOURCES 8 MAX2022 toc42 -20 6 OUTPUT POWER vs. INPUT POWER (PIN*) 10 OUTPUT POWER (dBm) -15 OUTPUT POWER (dBm) -10 fLO = 1960MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50 BASEBAND SOURCES 8 VCCLOA SUPPLY CURRENT (mA) LO PORT RETURN LOSS (dB) -5 TOTAL SUPPLY CURRENT (mA) OUTPUT POWER vs. INPUT POWER (PIN*) 10 MAX2022 toc37 0 MAX2022 toc39 LO PORT RETURN LOSS vs. LO FREQUENCY 50 VCC = 5.25V 45 VCC = 5.0V 40 VCC = 4.75V 35 VCC = 4.75V 240 60 -15 10 35 60 85 10 35 60 -15 10 35 60 TEMPERATURE (C) VCCLOI2 SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOQ1 SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOQ2 SUPPLY CURRENT vs. TEMPERATURE (TC) 55 VCC = 5.0V VCC = 4.75V 45 VCC = 5.25V 45 VCC = 5.0V 40 VCC = 4.75V 35 30 -15 10 35 TEMPERATURE (C) 60 85 VCC = 5.25V 65 85 MAX2022 toc45 50 70 VCCLOQ2 SUPPLY CURRENT (mA) 60 55 MAX2022 toc44 MAX2022 toc43 VCC = 5.25V 65 -40 -40 85 TEMPERATURE (C) 40 8 -15 TEMPERATURE (C) 70 50 30 -40 VCCLOQ1 SUPPLY CURRENT (mA) -40 VCCLOI2 SUPPLY CURRENT (mA) MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator 60 55 VCC = 5.0V VCC = 4.75V 50 45 40 -40 -15 10 35 TEMPERATURE (C) 60 85 -40 -15 10 35 TEMPERATURE (C) _______________________________________________________________________________________ 60 85 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator PIN NAME 1, 5, 9-12, 14, 16-19, 22, 24, 27-30, 32, 34, 35, 36 2 RBIASLO3 3 VCCLOA GND FUNCTION Ground 3rd LO Amplifier Bias. Connect a 301 resistor to ground. LO Input Buffer Amplifier Supply Voltage 4 LO 6 RBIASLO1 Local Oscillator Input. 50 input impedance. 1st LO Input Buffer Amplifier Bias. Connect a 432 resistor to ground. 7 COMP Compensation Capacitor Input. Connect a 22pF capacitor to ground. 8 RBIASLO2 2nd LO Amplifier Bias. Connect a 562 resistor to ground. 13 VCCLOI1 I-Channel 1st LO Amplifier Supply Voltage 15 VCCLOI2 20 BBIP Baseband In-Phase Positive Input 21 BBIN Baseband In-Phase Negative Input 23 RFOUT RF Output 25 BBQN Baseband Quadrature Negative Input 26 BBQP Baseband Quadrature Positive Input 31 VCCLOQ2 Q-Channel 1st LO Amplifier Supply Voltage 33 VCCLOQ1 Q-Channel 2nd LO Amplifier Supply Voltage EP GND I-Channel 2nd LO Amplifier Supply Voltage Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane using multiple vias. Detailed Description The MAX2022 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 1500MHz to 2500MHz RF frequency range. Applications include single and multicarrier 1800MHz to 2200MHz UMTS/WCDMA, cdma2000, and DCS/PCS base stations. Direct upconversion architectures are advantageous since they significantly reduce transmitter cost, part count, and power consumption as compared to traditional IF-based double upconversion systems. The MAX2022 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. Precision matching between the in-phase and quadrature channels, and highly linear mixers achieves excellent dynamic range, ACLR, 1dB compression point, and LO and sideband suppression, making it ideal for four-carrier WCDMA/UMTS operation. LO Input Balun, LO Buffer, and Phase Splitter The MAX2022 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer's input impedance to 50 over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90 with respect to the original. The 0 and 90 LO signals drive the I and Q mixers, respectively. LO Driver Following the phase splitter, the 0 and 90 LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. While a nominal LO power of 0dBm is specified, the MAX2022 can tolerate LO level swings from -3dBm to +3dBm. I/Q Modulator The MAX2022 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to beyond 100MHz with differential amplitudes _______________________________________________________________________________________ 9 MAX2022 Pin Description MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator up to 2VP-P differential (common-mode input equals 0V). The wide input bandwidth allows for direct interface with the baseband DACs. No active buffer circuitry between the baseband DAC and the MAX2022 is required. The I and Q signals directly modulate the 0 and 90 LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to a singled-ended RF output. above 3.5MHz. For GSM, connecting a 1nF capacitor from COMP to ground is recommended for filtering out noise and frequency offsets above 600kHz. Baseband I/Q Input Drive The MAX2022 I and Q baseband inputs should be driven differentially for best performance. The baseband inputs have a 50 differential input impedance. The optimum source impedance for the I and Q inputs is 100 differential. This source impedance will achieve the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2022 can accept input power levels of up to +12dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA or WCDMA carriers, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2022. The input common-mode voltage should be confined to the -2V to +1.5V DC range. The MAX2022 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements. Such DACs include the MAX5875 series of dual DACs, and the MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50 load Applications Information LO Input Drive The LO input of the MAX2022 requires a single-ended drive at a 1500MHz to 2500MHz frequency. It is internally matched to 50. An integrated balun converts the singled-ended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -3dBm to +3dBm range. COMP Pin The COMP pin is used to provide additional lowpass filtering to the bias circuit noise. An external capacitor can be used from the COMP pin to ground to reduce the close-in noise of the modulator. For UMTS, connecting a 22pF capacitor from the COMP pin to ground is recommended to filter out noise and frequency offsets MAX5895 DUAL 16-BIT INTERP DAC MAX2022 RF MODULATOR 50 BBI 50 FREQ 50 0 LO I/Q GAIN AND OFFSET ADJUST 50 90 50 FREQ 50 BBQ 50 Figure 1. MAX5895 DAC Interfaced with MAX2022 10 ______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator RF Output The MAX2022 utilizes an internal passive mixer architecture. This enables a very low noise floor of -173.2dBm/Hz for low-level signals, below about -20dBm output power level. For higher output level signals, the noise floor will be determined by the internal LO noise level at approximately -162dBc/Hz. The I/Q input power levels and the insertion loss of the device will determine the RF output power level. The input power is the function of the delivered input I and Q voltages to the internal 50 termination. For simple sinusoidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in an input power level of -17dBm delivered to the I and Q internal 50 terminations. This results in a -27dBm RF output power. Generation of WCDMA Carriers The MAX2022 quadrature modulator makes an ideal signal source for the generation of multiple WCDMA carriers. The combination of high OIP3 and exceptionally low output noise floor gives an unprecedented output dynamic range. The output dynamic range allows the generation of four WCDMA carriers in the UMTS band with a noise floor sufficiently low to meet the 3GPP specification requirements with no additional RF filtering. This promotes an extremely simple and efficient transmitter lineup. Figure 2 illustrates a complete transmitter lineup for a multicarrier WCDMA transmitter in the UMTS band. The MAX5895 dual interpolating-modulating DAC is operated as a baseband signal generator. For generation of four carriers of WCDMA modulation, and digital predistortion, an input data rate of 61.44 or 122.88Mbps can be used. The DAC can then be programmed to operate in x8 or x4 interpolation mode, resulting in a 491.52Msps output sample rate. The DAC will generate four carriers of WCDMA modulation MAX5895 MAX2022 RF-MODULATOR I L-C FILTER MAX2057 +12dB I I/Q GAIN AND OFFSET ADJUST TX OUTPUT Q Q SYNTH CLOCK Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band ______________________________________________________________________________________ 11 MAX2022 resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 50MHz at -0.1dB response. The direct connection of the DAC to the MAX2022 insures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC's output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC's output noise floor and interpolation filter stopband attenuation are sufficiently good to insure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2022 with a Maxim DAC, in this case the MAX5895 dual 16-bit interpolating-modulating DAC. The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2022 quadrature modulator. MAX2022 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator with an ACLR typically greater than 77dB under these conditions. The output power will be approximately -18dBm per carrier, with a noise floor typically less than -144dBc/Hz. The MAX5895 DAC has built-in gain and offset fine adjustments. These are programmable by a 3-wire serial logic interface. The gain adjustment can be used to adjust the relative gains of the I and Q DAC outputs. This feature can be used to improve the native sideband suppression of the MAX2022 quadrature modulator. The gain adjustment resolution of 0.01dB allows sideband nulling down to approximately -60dB. The offset adjustment can similarly be used to adjust the offset DC output of each I and Q DAC. These offsets can then be used to improve the native LO leakage of the MAX2022. The DAC resolution of 4 LSBs will yield nulled LO leakage of typically less than -50dBc relative to four-carrier output levels. The DAC outputs must be filtered by baseband filters to remove the image frequency signal components. The baseband signals for four-carrier operation cover DC to 10MHz. The image frequency appears at 481MHz to 491MHz. This very large frequency spread allows the use of very low-complexity lowpass filters, with excellent in-band gain and phase performance. The low DAC noise floor allows for the use of a very wideband filter, since the filter is not necessary to meet the 3GPP noise floor specification. The MAX2022 quadrature modulator then upconverts the baseband signals to the RF output frequency. The output power of the MAX2022 will be approximately -28dBm per carrier. The noise floor will be less than -169dBm/Hz, with an ACLR typically greater than 65dBc. This performance meets the 3GPP specification requirements with substantial margins. The noise floor performance will be maintained for large offset frequencies, eliminating the need for subsequent RF filtering in the transmitter lineup. The RF output from the MAX2022 is then amplified by a combination of a low-noise amplifier followed by a MAX2057 RF-VGA. This VGA can be used for lineup compensation for gain variance of transmitter and power amplifier elements. No significant degradation of the signal or noise levels will be incurred by this additional amplification. The MAX2057 will deliver an output 12 power of -6dBm per carrier, 0dBm total at an ACLR of 65dB and noise floor of -142dBc/Hz. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed paddle MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lowerlevel ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX2022 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all V CC pins with 22pF and 0.1F capacitors placed as close to the pins as possible. The smallest capacitor should be placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2022 has several RF processing stages that use the various VCC pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability. Exposed Pad RF/Thermal Considerations The EP of the MAX2022's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed paddle (EP) MUST be soldered to a ground plane on the PC board either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible. ______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator GND GND GND VCCLOQ1 GND VCCLOQ2 GND GND GND 35 34 33 32 31 30 29 28 1 RBIASLO1 6 COMP 7 RBIASLO2 8 GND 9 BIAS LO1 BIAS LO2 10 11 12 13 14 15 16 17 18 GND 5 0 GND GND 90 GND 4 VCCLOI1 LO GND 3 VCCLOI1 VCCLOA GND 2 GND RBIASLO3 MAX2022 BIAS LO3 GND GND 36 27 GND 26 BBQP 25 BBQN 24 GND 23 RFOUT 22 GND 21 BBIN 20 BBIP 19 GND THIN QFN Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS Package Information For the latest package outline information, go to www.maxim-ic.com/packages. ______________________________________________________________________________________ 13 MAX2022 Pin Configuration/Functional Diagram High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION C1, C3, C4, C6, C7, C10, C13 22pF 22pF 5%, 50V C0G ceramic capacitors (0402) C2, C5, C8, C11, C12 0.1F 0.1F 10%, 16V X7R ceramic capacitors (0603) C9 1.2pF 1.2pF 0.1pF, 50V C0G ceramic capacitor (0402) R1 432 432 1% resistor (0402) R2 562 562 1% resistor (0402) R3 301 301 1% resistor (0402) Typical Application Circuit C12 0.1F 36 VCC C1 22pF VCCLOA C3 22pF LO GND RBIASLO1 R1 432 COMP C4 22pF RBIASLO2 R2 562 GND 33 VCCLOQ2 GND 34 GND 32 1 GND 28 29 27 MAX2022 BIAS LO3 2 GND GND 30 31 26 3 25 90 4 24 0 5 6 22 7 21 BIAS LO2 8 20 9 19 10 GND VCC GND BBQP BBQN GND Q+ QC9 1.2pF 23 RFOUT BIAS LO1 11 GND C5 0.1F 12 GND C6 22pF 13 14 GND 15 VCCLOI2 RBIASLO3 35 VCCLOI1 GND C2 0.1F GND GND R3 301 C11 0.1F VCC C10 22pF C13 22pF VCCLOQ1 VCC 16 GND 17 GND C7 22pF GND BBIN BBIP II+ GND 18 GND C8 0.1F VCC Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.