MAX2022ETX - Maxim Integrated Products, Inc.

General Description

The MAX2022 low-noise, high-linearity, direct upcon-

version quadrature modulator is designed for single

and multicarrier 1800MHz to 2200MHz UMTS/WCDMA,

cdma2000®, and DCS/PCS base-station applications.

Direct upconversion architectures are advantageous

since they significantly reduce transmitter cost, part

count, and power consumption as compared to tradi-

tional IF-based double upconversion systems.

In addition to offering excellent linearity and noise perfor-

mance, the MAX2022 also yields a high level of compo-

nent integration. This device includes two matched

passive mixers for modulating in-phase and quadrature

signals, three LO mixer amplifier drivers, and an LO

quadrature splitter. On-chip baluns are also integrated to

allow for single-ended RF and LO connections. As an

added feature, the baseband inputs have been matched

to allow for direct interfacing to the transmit DAC, there-

by eliminating the need for costly I/Q buffer amplifiers.

The MAX2022 operates from a single +5V supply. It is

available in a compact 36-pin thin QFN package (6mm

x 6mm) with an exposed paddle. Electrical perfor-

mance is guaranteed over the extended -40°C to

+85°C temperature range.

Applications

Single and Multicarrier WCDMA/UMTS Base

Stations

Single and Multicarrier cdmaOne™ and cdma2000

Base Stations

Single and Multicarrier DCS 1800/PCS 1900 EDGE

Base Stations

PHS/PAS Base Stations

Predistortion Transmitters

Fixed Broadband Wireless Access

Wireless Local Loop

Private Mobile Radio

Military Systems

Microwave Links

Digital and Spread-Spectrum Communication

Systems

Features

♦1500MHz to 2500MHz RF Frequency Range

♦Meets Four-Carrier WCDMA 65dBc ACLR

♦+23.3dBm Typical OIP3

♦+51.5dBm Typical OIP2

♦45.7dBc Typical Sideband Suppression

♦-40dBm Typical LO Leakage

♦-173.2dBm/Hz Typical Output Noise, Eliminating

the Need for an RF Output Filter

♦Broadband Baseband Input

♦DC-Coupled Input Provides for Direct Launch

DAC Interface, Eliminating the Need for Costly I/Q

Buffer Amplifiers

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

________________________________________________________________ Maxim Integrated Products 1

RF OUTPUT POWER PER CARRIER (dBm)

ACLR AND ALT CLR (dBc)

-10-20-30-40

-78

-76

-74

-72

-70

-68

-66

-64

-62

-60

-80

NOISE FLOOR (dBm/Hz)

-165

-155

-145

-135

-125

-175

-50 0

4C ADJ

4C ALT

2C ADJ 1C ADJ

2C ALT

1C ALT

4C 2C

NOISE FLOOR

WCDMA, ACLR, ALTCLR and Noise vs. RF

Output Power at 2140MHz for Single,

Two, and Four Carriers

Ordering Information

19-3572; Rev 0; 4/05

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

EVALUATION KIT AVAILABLE

PART

TEMP RANGE

PIN-PACKAGE

PKG

CODE

MAX2022ETX

-40°C to +85°C36 Thin QFN-EP*

(6mm x 6mm)

T3666-2

MAX2022ETX-T

-40°C to +85°C36 Thin QFN-EP*

(6mm x 6mm)

T3666-2

MAX2022ETX+D

-40°C to +85°C36 Thin QFN-EP*

(6mm x 6mm)

T3666-2

MAX2022ETX+TD

-40°C to +85°C36 Thin QFN-EP*

(6mm x 6mm)

T3666-2

cdma2000 is a registered trademark of Telecommunications

Industry Association.

cdmaOne is a trademark of CDMA Development Group.

*EP = Exposed paddle. += Lead free. D = Dry pack.

-T = Tape-and-reel package.

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC_ to GND ........................................................-0.3V to +5.5V

COMP .............................................................................0 to VCC

BBIP, BBIN, BBQP, BBQN to GND ............-2.5V to (VCC + 0.3V)

LO, RFOUT to GND Maximum Current ...............................50mA

Baseband Differential I/Q Input Power (Note A) ............+20dBm

LO Input Power...............................................................+10dBm

RBIASLO1 Maximum Current .............................................10mA

RBIASLO2 Maximum Current .............................................10mA

RBIASLO3 Maximum Current .............................................10mA

θJA (without air flow) ..........................................…………34°C/W

θJA (2.5m/s air flow) .........................................................28°C/W

θJC (junction to exposed paddle) ...................................8.5°C/W

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering 10s, non-lead free)...........+245°C

Lead Temperature (soldering 10s, lead free) ..................+260°C

DC ELECTRICAL CHARACTERISTICS

(MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q inputs terminated into 100Ωdifferential, LO input ter-

minated into 50Ω, RF output terminated into 50Ω, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC= -40°C to +85°C, unless otherwise noted.

Typical values are at VCC = +5V, TC= +25°C, unless otherwise noted.) (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage VCC

4.75 5.00 5.25

Total Supply Current ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC

292

342 mA

Total Power Dissipation

1460 1796

Note A: Maximum reliable continuous power applied to the baseband differential port is +12dBm from an external 100Ωsource.

AC ELECTRICAL CHARACTERISTICS

(MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled

source, 0V common-mode input, PLO = 0dBm, 1900MHz ≤fLO ≤2200MHz, 50ΩLO and RF system impedance, R1 = 432Ω, R2 =

562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential,

fIQ = 1MHz, TC= +25°C, unless otherwise noted.) (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

BASEBAND INPUT

Baseband Input Differential

Impedance fIQ = 1MHz 43 Ω

BB Common-Mode Input Voltage

Range

-2.5

+1.5

Output Power TC = +25°C -24

dBm

RF OUTPUTS (fLO = 1960MHz)

Output IP3

VBBI, VBBQ = 547mVP-P differential per tone

into 50Ω,

fBB1 = 1.8MHz,

fBB2 = 1.9MHz

21.8

dBm

Output IP2

VBBI, VBBQ = 547mVP-P differential per tone

into 50Ω,

fBB1 = 1.8MHz,

fBB2 = 1.9MHz

48.9

dBm

Output Power

-20.5

dBm

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

_______________________________________________________________________________________ 3

AC ELECTRICAL CHARACTERISTICS (continued)

(MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100ΩDC-coupled

source, 0V common-mode input, PLO = 0dBm, 1900MHz ≤fLO ≤2200MHz, 50ΩLO and RF system impedance, R1 = 432Ω, R2 =

562Ω, R3 = 301Ω, TC= -40°C to +85°C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential,

fIQ = 1MHz, TC= +25°C, unless otherwise noted.) (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Output Power Variation Over

Temperature TC = -40°C to +85°C

-0.004

dB/°C

Output-Power Flatness fLO = 1960MHz, sweep fBB,

PRF flatness for fBB from 1MHz to 50MHz 0.6 dB

ACLR (1st Adjacent Channel

5MHz Offset)

Single-carrier WCDMA (Note 2),

RFOUT = -16dBm 70 dBc

LO Leakage No external calibration, with each baseband

input terminated in 50Ω

-46.7

dBm

Sideband Suppression No external calibration 47.3 dBc

Output Return Loss 15.3 dB

Output Noise Density fmeas = 2060MHz, with each baseband

input terminated in 50Ω

-173.4

dBm/Hz

LO Input Return Loss 10.1 dB

RF OUTPUTS (fLO = 2140MHz)

Output IP3

VBBI, VBBQ = 547mVP-P differential per tone

into 50Ω,

fBB1 = 1.8MHz,

fBB2 = 1.9MHz

23.3

dBm

Output IP2

VBBI, VBBQ = 547mVP-P differential per tone

into 50Ω,

fBB1 = 1.8MHz,

fBB2 = 1.9MHZ

51.5

dBm

Output Power

-20.8

dBm

Output Power Variation Over

Temperature TC = -40°C to +85°C

-0.005

dB/°C

Output-Power Flatness

fLO = 2140MHz,

sweep fBB,

PRF flatness for fBB from 1MHz to 50MHz

0.32 dB

ACLR (1st Adjacent Channel

5MHz Offset)

Single-carrier WCDMA (Note 2),

RFOUT = -16dBm, fLO = 2GHz 70 dBc

LO Leakage No external calibration, with each baseband

input terminated in 50Ω

-40.4

dBm

Sideband Suppression No external calibration 45.7 dBc

Output Return Loss 13.5 dB

Output Noise Density fmeas = 2240MHz, with each baseband

input terminated in 50Ω

-173.2

dBm/Hz

LO Input Return Loss 18.1 dB

Note 1: TCis the temperature on the exposed paddle.

Note 2: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complimentary cumulative distribution function.

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

4 _______________________________________________________________________________________

Typical Operating Characteristics

(MAX2022 Typical Application Circuit, 50ΩLO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = +5V, PLO = 0dBm, VIFI = VIFQ =

109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100ΩDC-coupled source, common-mode input from 0V, TC=

+25°C, unless otherwise noted.)

ACLR vs. OUTPUT POWER

MAX2022 toc01

OUTPUT POWER (dBm)

ACLR (dB)

-10-20-30-40 0

-78

-76

-74

-72

-70

-68

-66

-64

-62

-60

-80

ADJACENT CHANNEL

ALTERNATE CHANNEL

SINGLE CARRIER

ACLR vs. OUTPUT POWER

MAX2022 toc02

OUTPUT POWER (dBm)

ACLR (dB)

-10-20-30-40 0

-78

-76

-74

-72

-70

-68

-66

-64

-62

-60

-80

ADJACENT CHANNEL

ALTERNATE CHANNEL

TWO CARRIER

ACLR vs. OUTPUT POWER

MAX2022 toc03

OUTPUT POWER (dBm)

ACLR (dB)

-20-30-40-50 -10

-78

-76

-74

-72

-70

-68

-66

-64

-62

-60

-80

ADJACENT CHANNEL

ALTERNATE CHANNEL

FOUR CARRIER

OUTPUT POWER vs. LO FREQUENCY

MAX2022 toc04

LO FREQUENCY (GHz)

OUTPUT POWER (dBm)

2.32.11.91.7

-7

-6

-5

-4

-3

-2

-8

1.5 2.5

VI = VQ = 0.611VP-P DIFFERENTIAL

PLO = -3dBm, 0dBm, +3dBm

OUTPUT POWER vs. LO FREQUENCY

MAX2022 toc05

LO FREQUENCY (GHz)

OUTPUT POWER (dBm)

2.32.11.91.7

-7

-6

-5

-4

-3

-2

-8

1.5 2.5

VI = VQ = 0.611VP-P DIFFERENTIAL

TC = +85°C

TC = +25°C

TC = -40°C

OUTPUT POWER vs. LO FREQUENCY

MAX2022 toc06

LO FREQUENCY (GHz)

OUTPUT POWER (dBm)

2.32.11.91.7

-7

-6

-5

-4

-3

-2

-8

1.5 2.5

VI = VQ = 0.611VP-P DIFFERENTIAL

VCC = 4.75V, 5.0V, 5.25V

LO LEAKAGE vs. LO FREQUENCY

MAX2022 toc07

LO FREQUENCY (GHz)

LO LEAKAGE (dBm)

2.32.11.91.7

-70

-50

-30

-10

-90

1.5 2.5

BASEBAND INPUTS TERMINATED IN 50Ω

PLO = -3dBm, +3dBm

PLO = 0dBm

LO LEAKAGE vs. LO FREQUENCY

MAX2022 toc08

LO FREQUENCY (GHz)

LO LEAKAGE (dBm)

2.32.11.91.7

-70

-50

-30

-10

-90

1.5 2.5

BASEBAND INPUTS TERMINATED IN 50Ω

TC = -40°C, +85°C

TC = +25°C

LO LEAKAGE vs. LO FREQUENCY

MAX2022 toc09

LO FREQUENCY (GHz)

LO LEAKAGE (dBm)

2.32.11.91.7

-70

-50

-30

-10

-90

1.5 2.5

BASEBAND INPUTS TERMINATED IN 50Ω

VCC = 4.75V, 5.0V

VCC = 5.25V

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

_______________________________________________________________________________________ 5

IMAGE REJECTION (dB)

IMAGE REJECTION vs. LO FREQUENCY

MAX2022 toc10

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

fBB = 1MHz, VI = VQ = 112mVP-P

TC = -40°C, +25°C, +85°C

IMAGE REJECTION (dB)

IMAGE REJECTION vs. LO FREQUENCY

MAX2022 toc11

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

fBB = 1MHz, VI = VQ = 112mVP-P

PLO = 0dBm

PLO = +3dBm

PLO = -3dBm

IMAGE REJECTION (dB)

IMAGE REJECTION vs. LO FREQUENCY

MAX2022 toc12

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

fBB = 1MHz, VI = VQ = 112mVP-P

VCC = 4.75, 5.0V, 5.25V

Typical Operating Characteristics (continued)

(MAX2022 Typical Application Circuit, 50ΩLO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = +5V, PLO = 0dBm, VIFI = VIFQ =

109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100ΩDC-coupled source, common-mode input from 0V, TC=

+25°C, unless otherwise noted.)

OUTPUT NOISE vs. OUTPUT POWER

AMX2022 toc13

OUTPUT POWER (dBm)

OUTPUT NOISE (dBm/Hz)

50-10 -5-15-20

-175

-170

-165

-160

-155

-150

-180

-25 10

PLO = 0dBm, fLO = 1960MHz

TC = +85°C

TC = -40°C

TC = +25°C

OUTPUT NOISE vs. OUTPUT POWER

AMX2022 toc14

OUTPUT POWER (dBm)

OUTPUT NOISE (dBm/Hz)

50-10 -5-15-20

-176

-172

-168

-164

-160

-156

-180

-25 10

PLO = 0dBm, fLO = 2140MHz

TC = -40°C

TC = +85°C

TC = +25°C

IF FLATNESS

vs. BASEBAND FREQUENCY

MAX2022 toc15

BASEBAND FREQUENCY (MHz)

IF POWER (dBm)

80604020

-23

-22

-21

-20

-19

-18

-17

-16

-15

-14

-24

0 100

fLO = 1960MHz, PBB = -12dBm/PORT INTO 50Ω

fLO - fRF

fLO + fRF

IF FLATNESS

vs. BASEBAND FREQUENCY

MAX2022 toc16

BASEBAND FREQUENCY (MHz)

IF POWER (dBm)

80604020

-23

-22

-21

-20

-19

-18

-17

-16

-15

-14

-24

0 100

fLO = 2140MHz, PBB = -12dBm/PORT INTO 50Ω

fLO - fRF

fLO + fRF

BASEBAND DIFFERENTIAL INPUT RESISTANCE

vs. BASEBAND FREQUENCY

BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω)

41.5

42.0

42.5

43.0

43.5

44.0

44.5

45.0

41.0

MAX2022 toc17

BASEBAND FREQUENCY (MHz)

6040 80200100

fLO = 2GHz, PLO = 0dBm

VCC = 5.0V

VCC = 4.75V

VCC = 5.25V

BASEBAND DIFFERENTIAL INPUT RESISTANCE

vs. BASEBAND FREQUENCY

BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω)

43.0

43.5

44.0

44.5

42.5

MAX2022 toc18

BASEBAND FREQUENCY (MHz)

6040 80200100

fLO = 2GHz, VCC = 5.0V

PLO = -3dBm

PLO = +3dBm

PLO = 0dBm

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

6 _______________________________________________________________________________________

OUTPUT IP3

vs. LO FREQUENCY

MAX2022 toc19

LO FREQUENCY (GHz)

OIP3 (dBm)

2.32.11.91.7

1.5 2.5

TC = -40°C, +25°C, +85°C

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

OUTPUT IP3

vs. LO FREQUENCY

MAX2022 toc20

LO FREQUENCY (GHz)

OIP3 (dBm)

2.32.11.91.7

1.5 2.5

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

VCC = 5.0V, 5.25V

VCC = 4.75V

OUTPUT IP3

vs. LO FREQUENCY

MAX2022 toc21

LO FREQUENCY (GHz)

OIP3 (dBm)

2.32.11.91.7

1.5 2.5

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

PLO = 0dBm, +3dBm

PLO = -3dBm

COMMMON-MODE BASEBAND VOLTAGE (V)

210-1-2

-3 3

OUTPUT IP3

vs. COMMON-MODE BASEBAND VOLTAGE

MAX2022 toc22

OIP3 (dBm)

fLO = 2140MHz

fLO = 1960MHz

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

OUTPUT IP2

vs. LO FREQUENCY

MAX2022 toc23

LO FREQUENCY (GHz)

OIP2 (dBm)

2.32.11.91.71.5 2.5

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

TC = +25°C

TC = +85°C

TC = -40°C

OUTPUT IP2

vs. LO FREQUENCY

MAX2022 toc24

LO FREQUENCY (GHz)

OIP2 (dBm)

2.32.11.91.71.5 2.5

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

VCC = 4.75V, 5.0V

VCC = 5.25V

OUTPUT IP2

vs. LO FREQUENCY

MAX2022 toc25

LO FREQUENCY (GHz)

OIP2 (dBm)

2.32.11.91.71.5 2.5

PLO = +3dBm

PLO = 0dBm

PLO = -3dBm

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

COMMMON-MODE BASEBAND VOLTAGE (V)

210-1-2

-3 3

OUTPUT IP2

vs. COMMON-MODE BASEBAND VOLTAGE

MAX2022 toc26

OIP2 (dBm)

fLO = 2140MHz

fLO = 1960MHz

VBB = 0.61VP-P DIFFERENTIAL PER TONE,

fBB1 = 1.8MHz, fBB2 = 1.9MHz

LO LEAKAGE vs. LO FREQUENCY

MAX2022 toc27

LO FREQUENCY (GHz)

LO LEAKAGE (dBm)

1.9701.9651.9601.9551.950

-80

-60

-40

-20

-100

1.945 1.975

NULLED AT fLO = 1960MHz AT

PRF = -18dBm

Typical Operating Characteristics (continued)

(MAX2022 Typical Application Circuit, 50ΩLO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = +5V, PLO = 0dBm, VIFI = VIFQ =

109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100ΩDC-coupled source, common-mode input from 0V, TC=

+25°C, unless otherwise noted.)

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

_______________________________________________________________________________________ 7

LO LEAKAGE vs. PRF WITH

LO LEAKAGE NULLED AT SPECIFIC PRF

MAX2022 toc28

OUTPUT POWER PRF (dBm)

LO LEAKAGE (dBm)

-20-30 -25 -15-35

-88

-86

-84

-82

-80

-78

-76

-74

-72

-70

-68

-90

-40 -10

fLO = 1960MHz

NULLED AT -10dBm

NULLED AT -14dBm,

-18dBm, -22dBm

LO LEAKAGE vs. PRF WITH

LO LEAKAGE NULLED AT SPECIFIC PRF

MAX2022 toc29

OUTPUT POWER PRF (dBm)

LO LEAKAGE (dBm)

-20-30 -25 -15-35

-88

-86

-84

-82

-80

-78

-76

-74

-72

-70

-68

-90

-40 -10

fLO = 2140Hz

NULLED AT -10dBm

NULLED AT -14dBm,

-18dBm, -22dBm

LO FREQUENCY (GHz)

2.05

2.001.951.90

-80

-70

-60

-50

-40

-30

-20

-10

-90

1.85 2.10

LO LEAKAGE vs. fLO WITH

LO LEAKAGE NULLED AT SPECIFIC PRF

LO LEAKAGE (dBm)

fLO = 1960MHz, NULLED AT -10dBm PRF

MAX2022 toc30

LO FREQUENCY (GHz)

2.20

2.152.102.05

-80

-70

-60

-50

-40

-30

-20

-10

-90

2.00 2.25

LO LEAKAGE vs. fLO WITH

LO LEAKAGE NULLED AT SPECIFIC PRF

LO LEAKAGE (dBm)

fLO = 2140MHz, NULLED AT -10dBm PRF

MAX2022 toc31

LO LEAKAGE vs. DIFFERENTIAL

DC OFFSET ON Q-SIDE

MAX2022 toc32

DC DIFFERENTIAL OFFSET ON Q-SIDE (mV)

LO LEAKAGE (dBm)

-9-10-11-12-13-14

-70

-60

-50

-40

-80

-15 -8

PRF = -18dBm, I-SIDE NULLED

fLO = 2140MHz fLO = 1960MHz

SIDEBAND SUPRESSION vs. PRF

MAX2022 toc33

MODULATOR POUT (dBm)

SIDEBAND SUPPRESSION (dB)

-15-20-25

-30 -10

fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 1960MHz,

1.8MHz BASEBAND TONE NULLED AT

PRF = -20dBm

1.8MHz

9MHz

SIDEBAND SUPRESSION vs. PRF

MAX2022 toc34

MODULATOR POUT (dBm)

SIDEBAND SUPPRESSION (dB)

-15-20-25

-30 -10

fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 2140MHz,

1.8MHz BASEBAND TONE NULLED AT

PRF = -20dBm

1.8MHz 9MHz

RF PORT RETURN LOSS (dB)

-15

-10

-5

-20

RF PORT RETURN LOSS

vs. LO FREQUENCY

MAX2022 toc35

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

VCC = 4.75V, 5.0V, 5.25V

-25

-20

-15

-10

-5

-30

LO PORT RETURN LOSS (dB)

LO PORT RETURN LOSS

vs. LO FREQUENCY

MAX2022 toc36

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

VCC = 4.75V, 5.0V, 5.25V

Typical Operating Characteristics (continued)

(MAX2022 Typical Application Circuit, 50ΩLO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = +5V, PLO = 0dBm, VIFI = VIFQ =

109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100ΩDC-coupled source, common-mode input from 0V, TC=

+25°C, unless otherwise noted.)

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

8 _______________________________________________________________________________________

-45

-40

-35

-30

-25

-20

-15

-10

-5

-50

LO PORT RETURN LOSS (dB)

LO PORT RETURN LOSS

vs. LO FREQUENCY

MAX2022 toc37

LO FREQUENCY (GHz)

2.32.11.91.71.5 2.5

PLO = -3dBm

PLO = +3dBm

PLO = 0dBm

OUTPUT POWER vs. INPUT POWER (PIN*)

MAX2022 toc38

INPUT POWER (PIN*) (dBm)

OUTPUT POWER (dBm)

1383

-8

-6

-4

-2

-10

-2 18

fLO = 1960MHz

*PIN IS THE AVAILABLE

POWER FROM ONE OF

THE FOUR 50Ω

BASEBAND SOURCES

TC = -40°C, +25°C, +85°C

OUTPUT POWER vs. INPUT POWER (PIN*)

MAX2022 toc39

INPUT POWER (PIN*) (dBm)

OUTPUT POWER (dBm)

1383

-8

-6

-4

-2

-10

-2 18

PLO = 2140MHz

*PIN IS THE AVAILABLE

POWER FROM ONE OF

THE FOUR 50Ω

BASEBAND SOURCES

TC = -40°C, +25°C, +85°C

TOTAL SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc40

TEMPERATURE (°C)

TOTAL SUPPLY CURRENT (mA)

603510-15

260

280

300

320

340

240

-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

VCCLOA SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc41

TEMPERATURE (°C)

VCCLOA SUPPLY CURRENT (mA)

603510-15-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

VCCLOI1 SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc42

TEMPERATURE (°C)

VCCLOI1 SUPPLY CURRENT (mA)

603510-15

-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

VCCLOI2 SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc43

TEMPERATURE (°C)

VCCLOI2 SUPPLY CURRENT (mA)

603510-15-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

VCCLOQ1 SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc44

TEMPERATURE (°C)

VCCLOQ1 SUPPLY CURRENT (mA)

603510-15

-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

VCCLOQ2 SUPPLY CURRENT

vs. TEMPERATURE (TC)

MAX2022 toc45

TEMPERATURE (°C)

VCCLOQ2 SUPPLY CURRENT (mA)

603510-15-40 85

VCC = 5.25V

VCC = 4.75V

VCC = 5.0V

Typical Operating Characteristics (continued)

(MAX2022 Typical Application Circuit, 50ΩLO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = +5V, PLO = 0dBm, VIFI = VIFQ =

109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100ΩDC-coupled source, common-mode input from 0V, TC=

+25°C, unless otherwise noted.)

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

_______________________________________________________________________________________ 9

MAX2022

Detailed Description

The MAX2022 is designed for upconverting differential

in-phase (I) and quadrature (Q) inputs from baseband to

a 1500MHz to 2500MHz RF frequency range.

Applications include single and multicarrier 1800MHz to

2200MHz UMTS/WCDMA, cdma2000, and DCS/PCS

base stations. Direct upconversion architectures are

advantageous since they significantly reduce transmitter

cost, part count, and power consumption as compared

to traditional IF-based double upconversion systems.

The MAX2022 integrates internal baluns, an LO buffer, a

phase splitter, two LO driver amplifiers, two matched

double-balanced passive mixers, and a wideband

quadrature combiner. Precision matching between the

in-phase and quadrature channels, and highly linear

mixers achieves excellent dynamic range, ACLR, 1dB

compression point, and LO and sideband suppression,

making it ideal for four-carrier WCDMA/UMTS operation.

LO Input Balun, LO Buffer, and

Phase Splitter

The MAX2022 requires a single-ended LO input, with a

nominal power of 0dBm. An internal low-loss balun at

the LO input converts the single-ended LO signal to a

differential signal at the LO buffer input. In addition, the

internal balun matches the buffer’s input impedance to

50Ωover the entire band of operation.

The output of the LO buffer goes through a phase split-

ter, which generates a second LO signal that is shifted

by 90°with respect to the original. The 0°and 90°LO

signals drive the I and Q mixers, respectively.

LO Driver

Following the phase splitter, the 0°and 90°LO signals

are each amplified by a two-stage amplifier to drive the

I and Q mixers. The amplifier boosts the level of the LO

signals to compensate for any changes in LO drive lev-

els. The two-stage LO amplifier allows a wide input

power range for the LO drive. While a nominal LO

power of 0dBm is specified, the MAX2022 can tolerate

LO level swings from -3dBm to +3dBm.

I/Q Modulator

The MAX2022 modulator is composed of a pair of

matched double-balanced passive mixers and a balun.

The I and Q differential baseband inputs accept signals

from DC to beyond 100MHz with differential amplitudes

Pin Description

PIN NAME FUNCTION

1, 5, 9–12, 14,

16–19, 22, 24,

27–30, 32, 34,

35, 36

GND Ground

2 RBIASLO3 3rd LO Amplifier Bias. Connect a 301Ω resistor to ground.

3 VCCLOA LO Input Buffer Amplifier Supply Voltage

4 LO Local Oscillator Input. 50Ω input impedance.

6 RBIASLO1 1st LO Input Buffer Amplifier Bias. Connect a 432Ω resistor to ground.

7 COMP Compensation Capacitor Input. Connect a 22pF capacitor to ground.

8 RBIASLO2 2nd LO Amplifier Bias. Connect a 562Ω resistor to ground.

13 VCCLOI1 I-Channel 1st LO Amplifier Supply Voltage

15 VCCLOI2 I-Channel 2nd LO Amplifier Supply Voltage

20 BBIP Baseband In-Phase Positive Input

21 BBIN Baseband In-Phase Negative Input

23 RFOUT RF Output

25 BBQN Baseband Quadrature Negative Input

26 BBQP Baseband Quadrature Positive Input

31 VCCLOQ2 Q-Channel 1st LO Amplifier Supply Voltage

33 VCCLOQ1 Q-Channel 2nd LO Amplifier Supply Voltage

EP GND Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane using

multiple vias.

MAX2022

up to 2VP-P differential (common-mode input equals 0V).

The wide input bandwidth allows for direct interface with

the baseband DACs. No active buffer circuitry between

the baseband DAC and the MAX2022 is required.

The I and Q signals directly modulate the 0°and 90°

LO signals and are upconverted to the RF frequency.

The outputs of the I and Q mixers are combined

through a balun to a singled-ended RF output.

Applications Information

LO Input Drive

The LO input of the MAX2022 requires a single-ended

drive at a 1500MHz to 2500MHz frequency. It is inter-

nally matched to 50Ω. An integrated balun converts the

singled-ended input signal to a differential signal at the

LO buffer differential input. An external DC-blocking

capacitor is the only external part required at this inter-

face. The LO input power should be within the -3dBm

to +3dBm range.

COMP Pin

The COMP pin is used to provide additional lowpass fil-

tering to the bias circuit noise. An external capacitor

can be used from the COMP pin to ground to reduce

the close-in noise of the modulator. For UMTS, connect-

ing a 22pF capacitor from the COMP pin to ground is

recommended to filter out noise and frequency offsets

above 3.5MHz. For GSM, connecting a 1nF capacitor

from COMP to ground is recommended for filtering out

noise and frequency offsets above 600kHz.

Baseband I/Q Input Drive

The MAX2022 I and Q baseband inputs should be dri-

ven differentially for best performance. The baseband

inputs have a 50Ωdifferential input impedance. The

optimum source impedance for the I and Q inputs is

100Ωdifferential. This source impedance will achieve

the optimal signal transfer to the I and Q inputs, and the

optimum output RF impedance match. The MAX2022

can accept input power levels of up to +12dBm on the I

and Q inputs. Operation with complex waveforms, such

as CDMA or WCDMA carriers, utilize input power levels

that are far lower. This lower power operation is made

necessary by the high peak-to-average ratios of these

complex waveforms. The peak signals must be kept

below the compression level of the MAX2022. The input

common-mode voltage should be confined to the -2V to

+1.5V DC range.

The MAX2022 is designed to interface directly with

Maxim high-speed DACs. This generates an ideal total

transmitter lineup, with minimal ancillary circuit elements.

Such DACs include the MAX5875 series of dual DACs,

and the MAX5895 dual interpolating DAC. These DACs

have ground-referenced differential current outputs.

Typical termination of each DAC output into a 50Ωload

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

10 ______________________________________________________________________________________

MAX5895

DUAL 16-BIT INTERP DAC

MAX2022

RF MODULATOR

I/Q GAIN AND

OFFSET ADJUST

BBI

BBQ

FREQ 50Ω

50Ω

FREQ 50Ω

50Ω

0°

90°∑

Figure 1. MAX5895 DAC Interfaced with MAX2022

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

______________________________________________________________________________________ 11

resistor to ground, and a 10mA nominal DC output cur-

rent results in a 0.5V common-mode DC level into the

modulator I/Q inputs. The nominal signal level provided

by the DACs will be in the -12dBm range for a single

CDMA or WCDMA carrier, reducing to -18dBm per car-

rier for a four-carrier application.

The I/Q input bandwidth is greater than 50MHz at

-0.1dB response. The direct connection of the DAC to

the MAX2022 insures the maximum signal fidelity, with

no performance-limiting baseband amplifiers required.

The DAC output can be passed through a lowpass filter

to remove the image frequencies from the DAC’s output

response. The MAX5895 dual interpolating DAC can be

operated at interpolation rates up to x8. This has the

benefit of moving the DAC image frequencies to a very

high, remote frequency, easing the design of the base-

band filters. The DAC’s output noise floor and interpola-

tion filter stopband attenuation are sufficiently good to

insure that the 3GPP noise floor requirement is met for

large frequency offsets, 60MHz for example, with no fil-

tering required on the RF output of the modulator.

Figure 1 illustrates the ease and efficiency of interfac-

ing the MAX2022 with a Maxim DAC, in this case the

MAX5895 dual 16-bit interpolating-modulating DAC.

The MAX5895 DAC has programmable gain and differ-

ential offset controls built in. These can be used to opti-

mize the LO leakage and sideband suppression of the

MAX2022 quadrature modulator.

RF Output

The MAX2022 utilizes an internal passive mixer archi-

tecture. This enables a very low noise floor of

-173.2dBm/Hz for low-level signals, below about

-20dBm output power level. For higher output level sig-

nals, the noise floor will be determined by the internal

LO noise level at approximately -162dBc/Hz.

The I/Q input power levels and the insertion loss of the

device will determine the RF output power level. The

input power is the function of the delivered input I and

Q voltages to the internal 50Ωtermination. For simple

sinusoidal baseband signals, a level of 89mVP-P differ-

ential on the I and the Q inputs results in an input power

level of -17dBm delivered to the I and Q internal 50Ω

terminations. This results in a -27dBm RF output power.

Generation of WCDMA Carriers

The MAX2022 quadrature modulator makes an ideal

signal source for the generation of multiple WCDMA

carriers. The combination of high OIP3 and exception-

ally low output noise floor gives an unprecedented out-

put dynamic range. The output dynamic range allows

the generation of four WCDMA carriers in the UMTS

band with a noise floor sufficiently low to meet the

3GPP specification requirements with no additional RF

filtering. This promotes an extremely simple and effi-

cient transmitter lineup. Figure 2 illustrates a complete

transmitter lineup for a multicarrier WCDMA transmitter

in the UMTS band.

The MAX5895 dual interpolating-modulating DAC is

operated as a baseband signal generator. For genera-

tion of four carriers of WCDMA modulation, and digital

predistortion, an input data rate of 61.44 or

122.88Mbps can be used. The DAC can then be pro-

grammed to operate in x8 or x4 interpolation mode,

resulting in a 491.52Msps output sample rate. The

DAC will generate four carriers of WCDMA modulation

MAX2022

MAX5895

MAX2022

RF-MODULATOR

MAX2057

OUTPUT

+12dB

L-C FILTER

I/Q GAIN AND

OFFSET ADJUST

∑

CLOCK

SYNTH

Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band

MAX2022

with an ACLR typically greater than 77dB under these

conditions. The output power will be approximately

-18dBm per carrier, with a noise floor typically less

than -144dBc/Hz.

The MAX5895 DAC has built-in gain and offset fine

adjustments. These are programmable by a 3-wire seri-

al logic interface. The gain adjustment can be used to

adjust the relative gains of the I and Q DAC outputs.

This feature can be used to improve the native side-

band suppression of the MAX2022 quadrature modula-

tor. The gain adjustment resolution of 0.01dB allows

sideband nulling down to approximately -60dB. The off-

set adjustment can similarly be used to adjust the offset

DC output of each I and Q DAC. These offsets can then

be used to improve the native LO leakage of the

MAX2022. The DAC resolution of 4 LSBs will yield

nulled LO leakage of typically less than -50dBc relative

to four-carrier output levels.

The DAC outputs must be filtered by baseband filters to

remove the image frequency signal components. The

baseband signals for four-carrier operation cover DC to

10MHz. The image frequency appears at 481MHz to

491MHz. This very large frequency spread allows the

use of very low-complexity lowpass filters, with excel-

lent in-band gain and phase performance. The low

DAC noise floor allows for the use of a very wideband

filter, since the filter is not necessary to meet the 3GPP

noise floor specification.

The MAX2022 quadrature modulator then upconverts the

baseband signals to the RF output frequency. The output

power of the MAX2022 will be approximately

-28dBm per carrier. The noise floor will be less than

-169dBm/Hz, with an ACLR typically greater than 65dBc.

This performance meets the 3GPP specification require-

ments with substantial margins. The noise floor perfor-

mance will be maintained for large offset frequencies,

eliminating the need for subsequent RF filtering in the

transmitter lineup.

The RF output from the MAX2022 is then amplified by a

combination of a low-noise amplifier followed by a

MAX2057 RF-VGA. This VGA can be used for lineup

compensation for gain variance of transmitter and

power amplifier elements. No significant degradation of

the signal or noise levels will be incurred by this addi-

tional amplification. The MAX2057 will deliver an output

power of -6dBm per carrier, 0dBm total at an ACLR of

65dB and noise floor of -142dBc/Hz.

Layout Considerations

A properly designed PC board is an essential part of

any RF/microwave circuit. Keep RF signal lines as short

as possible to reduce losses, radiation, and induc-

tance. For the best performance, route the ground pin

traces directly to the exposed pad under the package.

The PC board exposed paddle MUST be connected to

the ground plane of the PC board. It is suggested that

multiple vias be used to connect this pad to the lower-

level ground planes. This method provides a good

RF/thermal conduction path for the device. Solder the

exposed pad on the bottom of the device package to

the PC board. The MAX2022 evaluation kit can be used

as a reference for board layout. Gerber files are avail-

able upon request at www.maxim-ic.com.

Power-Supply Bypassing

Proper voltage-supply bypassing is essential for high-

frequency circuit stability. Bypass all VCC pins with

22pF and 0.1µF capacitors placed as close to the pins

as possible. The smallest capacitor should be placed

closest to the device.

To achieve optimum performance, use good voltage-

supply layout techniques. The MAX2022 has several RF

processing stages that use the various VCC pins, and

while they have on-chip decoupling, off-chip interaction

between them may degrade gain, linearity, carrier sup-

pression, and output power-control range. Excessive

coupling between stages may degrade stability.

Exposed Pad RF/Thermal Considerations

The EP of the MAX2022’s 36-pin thin QFN-EP package

provides a low thermal-resistance path to the die. It is

important that the PC board on which the IC is mounted

be designed to conduct heat from this contact. In addi-

tion, the EP provides a low-inductance RF ground path

for the device.

The exposed paddle (EP) MUST be soldered to a

ground plane on the PC board either directly or through

an array of plated via holes. An array of 9 vias, in a 3 x

3 array, is suggested. Soldering the pad to ground is

critical for efficient heat transfer. Use a solid ground

plane wherever possible.

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

12 ______________________________________________________________________________________

MAX2022

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

______________________________________________________________________________________ 13

Package Information

For the latest package outline information, go to

www.maxim-ic.com/packages.

10 11 12 13 14

THIN QFN

15 16 17 18

36 35 34 33 32 31 30 29 28

BIAS

LO2

BIAS

LO1

90°

0°

BIAS

LO3

GND

BBIP

BBIN

GND

RFOUT

GND

BBQN

BBQP

GND

RBIASLO3

VCCLOA

GND

RBIASLO1

COMP

RBIASLO2

GND

VCCLOQ2

GND

MAX2022

VCCLOI1

VCCLOQ1

Pin Configuration/Functional Diagram

Chip Information

TRANSISTOR COUNT: 1414

PROCESS: SiGe BiCMOS

High-Dynamic-Range, Direct Upconversion

1500MHz to 2500MHz Quadrature Modulator

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

MAX2022

10 11 12 13 14 15 16 17 18

36 35 34 33 32 31 30 29 28

BIAS

LO2

BIAS

LO1

90°

0°

BIAS

LO3

GND

BBIP

BBIN

GND

RFOUT

GND

BBQN

BBQP Q+

Q-

GND

I-

I+

1.2pF

0.1µF

VCC

22pF

0.1µF

22pF

VCC

GND GND GND GND

VCCLOI1

VCCLOI2

GND GND GND

GND

RBIASLO3

301Ω

22pF

0.1µF

VCC VCCLOA

GND

RBIASLO1

432ΩC4

22pF

COMP

RBIASLO2

C11

0.1µF

VCC

C10

22pF

C12

0.1µFC13

22pF

VCC

GND

VCCLOQ2

GND

MAX2022

VCCLOQ1

562Ω

Typical Application Circuit

COMPONENT VALUE DESCRIPTION

C1, C3, C4, C6, C7, C10, C13

22pF 22pF ±5%, 50V C0G ceramic capacitors (0402)

C2, C5, C8, C11, C12 0.1µF 0.1µF ±10%, 16V X7R ceramic capacitors (0603)

C9 1.2pF 1.2pF ±0.1pF, 50V C0G ceramic capacitor (0402)

R1 432Ω432Ω ±1% resistor (0402)

R2 562Ω562Ω ±1% resistor (0402)

R3 301Ω301Ω ±1% resistor (0402)

Table 1. Component List Referring to the Typical Application Circuit