©2005 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
October 2005
FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
FODM3051, FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random Phase Triac
Driver Output Optocouplers
Features
Compact 4-pin surface mount package (2.4 mm maximum
standoff height)
Peak blocking voltage – 600V
Guaranteed static dv/dt of 1000 V/µs
Available in tape and reel quantities of 500 and 2500.
Applicable to Infrared Ray reflow (230°C max, 30 seconds.)
BSI, CSA and VDE certifications pending
UL (File# E90700) certified
Applications
Solenoid/valve controls
Interfacing microprocessors to 115 and 240 Vac peripherals
Temperature controls
Solid state relays
Lamp ballast
Static AC power switch
Motor control
Incandescent lamp dimmers
Description
The FODM305X series consists of a galium arsenide diode
driving a silicon bilateral switch housed in a compact 4-pin mini-
flat package. The lead pitch is 2.54 mm. The FODM305X series
isolates low voltage logic from 115 and 240 Vac lines to provide
random phase control of high current triacs or thyristors. It also
features greatly enhanced static dv/dt capability to ensure
stable switching performance of inductive loads.
Package Dimensions
0.287 (7.29)
0.248 (6.30)
0.020 (0.51)
0.012 (0.30)
0.169 (4.29)
0.154 (3.91)
0.173 (4.40)
TYP
0.035 (0.89)
0.012 (0.30)
0.008 (0.20)
0.000 (0.0)
0.100 (2.54) TY
0.026 (0.66)
P
0.033 (0.85)
0.026 (0.65)
0.094 (2.39)
0.079 (2.01)
PIN 1
1
2
4
3
MAIN
TERMINAL
MAIN
TERMINAL
ANODE
CATHODE
NOTE
All dimensions are in inches (millimeters)
2
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise specified)
Electrical Characteristics
(T
A
= 25°C Unless otherwise specified)
Individual Component Characteristics
Transfer Characteristics
(T
A
= 25°C Unless otherwise specified)
Isolation Characteristics
(T
A
= 25°C Unless otherwise specified)
* All typicals at T
A
= 25°C
Note
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an I
F
value less than or equal to max I
FT
. Therefore, recommended operating I
F
lies
between max I
FT
(15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max I
F
(60 mA).
Parameter Symbol Value Units
TOTAL PACKAGE
Storage Temperature T
STG
-40 to +125 °C
Junction Temperature T
J
125 °C
Operating Temperature T
OPR
-40 to +100 °C
EMITTER
Continuous Forward Current I
F (avg)
60 mA
Peak Forward Current (1 µs pulse, 300 pps.) I
F (pk)
1A
Reverse Input Voltage V
R
3V
Power Dissipation
(No derating required over operating temp. range)
P
D
100 mW
DETECTOR
On-State RMS Current I
T(RMS)
70 mA (RMS)
Off-State Output Terminal Voltage V
DRM
600 V
Power Dissipation
(No derating required over operating temp. range)
P
D
250 mW
Parameter Test Conditions Symbol Device Min Typ* Max Unit
EMITTER
Input Forward Voltage I
F
= 10 mA V
F
All 1.20 1.5 V
Reverse Leakage Current V
R
= 3 V I
R
All 0.01 100 µA
DETECTOR
Peak Blocking Current Either Direction V
DRM
= 600V, I
F
= 0 (note 1) I
DRM
All 3 100 nA
Peak On-State Voltage Either Direction I
TM
= 100mA peak V
TM
All 2.0 2.5 V
Critical Rate of Rise of Off-State Voltage I
F
= 0 (Figure 8, note 2) dV/dt All 1000 V/µs
DC Characteristics Test Conditions Symbol Device Min Typ* Max Unit
LED Trigger Current Main Terminal
Voltage = 3V (note 3)
I
FT
FODM3051 15 mA
FODM3052 10
FODM3053 5
Holding Current, Either Direction I
H
All 300 µA
Characteristic Test Conditions Symbol Device Min Typ* Max Unit
Steady State Isolation Voltage t = 1 Minute V
ISO
All 3750 V(RMS)
3
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current Fig. 2 Leakage Current vs. Ambient Temperature
Fig. 3 Holding Current vs. Ambient Temperature Fig. 4 Trigger Current vs. Ambient Temperature
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature
IF - FORWARD CURRENT (mA)
110100
VF - FORWARD VOLTAGE (V)
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.8
1.7
TA
= -40°C
TA
= 25°C
TA
= 100°C
PWIN
- LED TRIGGER PULSE WIDTH (µs)
110100
IFT - LED TRIGGER CURRENT (NORMALIZED)
0
2
4
6
8
10
TA - AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80
IFT - TRIGGER CURRENT (NORMALIZED)
0.8
0.9
1.0
1.1
1.2
1.3
VTM = 3V
NORMALIZED TO TA
A
= 25°C
NORMALIZED TO T = 25°C
TA - AMBIENT TEMPERATURE (°C)
-40 -20 100
IH
- HOLDING CURRENT (NORMALIZED)
0.1
1.0
2
5
0.2
0.5
TA - AMBIENT TEMPERATURE (°C)
VDRM
- OFF-STATE OUTPUT TERMINAL VOLTAGE
(NORMALIZED)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
TA - AMBIENT TEMPERATURE (°C)
-40 -20 0 20 406080100
020406080
100
-40 -20
020406080100
IDRM - LEAKAGE CURRENT (nA)
0.1
1
10
100
1000
T
A
IN >> 100µsNORMALIZED TO PW
NORMALIZED TO TA = 25°C
VDRM = 600V
A
T= 25°C
4
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
Figure 8. Static dv/dt Test Circuit
Vdc
400V
R = 10 k
CTEST
X100
SCOPE
PROBE
PULSE
INPUT MERCURY
WETTED
RELAY
252 V
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax =
dv/dt = 0.63 Vmax = 252
RTEST
D.U.T.D.U.T.
τRC
τRC τRC
400 V
Fig. 7 On-State Characteristics
VTM - ON-STATE VOLTAGE (V)
TA = 25°C
ITM - ON-STATE CURRENT (mA)
-800-6 -4 -2 0 2 4 6
-600
-400
-200
0
200
400
600
800
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds
and voltages.
3. The worst-case condition for static dv/dt is estab-
lished by triggering the D.U.T. with a normal LED
input current, then removing the current. The vari-
able RTEST allows the dv/dt to be gradually
increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after
the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering.
τRC is measured at this point and recorded.
5
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
Ordering Information
Marking Information
Option Description
V VDE Approved
R1 Tape and Reel (500 units)
R2 Tape and Reel (2500 units)
R3 Tape and Reel (500 units; unit 180° rotated)
R4 Tape and Reel (2500 units; unit 180° rotated)
R1V Tape and Reel (500 units) and VDE Approved
R2V Tape and Reel (2500 units) and VDE Approved
R3V Tape and Reel (500 units; unit 180° rotated) and VDE Approved
R4V Tape and Reel (2500 units; unit 180° rotated) and VDE Approved
1
2
6
4
35
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE option –
See order entry table)
4 One digit year code
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
3051
XVM
YY
6
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
D
D
W
Kt
d
1
0PP
A
P
0
B0
0
2
E
F
W
1
0
R1
Reel Diameter
R2
Devices Per Reel
Max. Component Rotation or Tilt
Cover Tape Thickness
Cover Tape Width
Pocket Hole Dia.
Pocket Dimension
Pocket Location
Sprocket Hole Location
Sprocket Hole Dia.
Sprocket Hole Pitch
Tape Thickness
Pocket Pitch
Tape Width
Symbol
Description
R1
R2
B
d
W
1
D
K
0
1
0
E
A
P
0
P
F
2
D
P
0
0
t
W
178 mm (7")
330 mm (13")
Dimensions (mm)
12.00±0.4
7.30±0.20
20˚ max
500
1.55±0.20
2.30±0.20
0.065±0.02
9.20
1.75±0.20
8.00±0.20
2.00±0.20
5.50±0.20
4.40±0.20
1.55±0.20
4.00±0.20
0.30±0.20
2.54 Pitch
2500
7
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
Footprint Drawing for PCB Layout
Recommended Infrared Reflow Soldering Profile
0.024
(
0.61
)
0.100
(
2.54
)
0.060
(
1.52
)
0.310
(
7.87
)
0.190
(
4.83
)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
(heating)
to 30 s
to 60 s
90 s
Time (s)
Package Surface Temperature T (°C)
150 s 60 s
180°C
230°C (peak temperature)
210°C
8
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FODM3051, FODM3052, FODM3053 Rev. 1.0.0
FODM3051, FODM3052, FODM3053 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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