©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/07/16
General Purpose ESD Protection - SP1044 Series
Description
Applications
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes at ±30kV
(contact discharge, IEC 61000-4-2) without performance
degradation. Additionally, each diode can safely dissipate
3A of 8/20μs surge current (IEC 61000-4-5 2nd edition)
with very low clamping voltages
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, IEC 61000-
4-5,2nd edition, 3A
(tP=8/20μs)
• Low capacitance of 30pF
(@ VR=0V)
• Low leakage current of
0.1μA at 5V
• Industries smallest ESD
footprint available (01005)
• Halogen free, Lead free
and RoHS compliant
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• Wearable Technology
• Portable Navigation
Devices
• Tablets
• Point of Sale Terminals
Pinout
Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
SP1044 Series 30pF 30kV Unidirectional Discrete TVS
12
0201 Flipchip
Note: Drawing not to scale
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/07/16
General Purpose ESD Protection - SP1044 Series
Notes:
1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 3.0 1A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 6.0 V
Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 8.3 V
IPP=2A, tp=8/20µs, Fwd 9.3 V
Dynamic Resistance2RDYN TLP, tP=100ns, I/O to GND 0.18 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CDReverse Bias=0V 30 35 pF
Note:
1 Parameter is guaranteed by design and/or device characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Thermal Information
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
8/20μS Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Capacitance vs. Reverse Bias
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
012345
Capacitance (pF)
Bias Voltage (V)
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/07/16
General Purpose ESD Protection - SP1044 Series
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Clamping Voltage vs IPP
0
2
4
6
8
10
12
11.5 22.5 3
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
0
5
10
15
20
25
30
35
40
0 3 6 9 12 15
TLP Voltage (V)
TLP Current (A)
Postive Transmission Line Pulsing(TLP) Plot
-40
-35
-30
-25
-20
-15
-10
-5
0
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0
TLP Voltage (V)
TLP Current (A)
Negative Transmission Line Pulsing(TLP) Plot
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 12/07/16
General Purpose ESD Protection - SP1044 Series
Embossed Carrier Tape & Reel Specification — 01005 Flipchip
Package Dimensions — 01005 Flipchip
Symbol
01005 Flipchip
Millimeters Inches
Min Typ Max Min Typ Max
A0.168 0.181 0.194 0.007 0.007 0.008
A1 0.008 0.011 0.014 0.000 0.000 0.001
A2 0.160 0.170 0.180 0.006 0.007 0.007
e0.280 BSC 0.011 BSC
D0.200 0.230 0.260 0.008 0.009 0.010
E0.400 0.430 0.460 0.016 0.017 0.018
F0.110 0.130 0.150 0.004 0.005 0.006
G0.180 0.200 0.220 0.007 0.008 0.009
P0.130 0.150 0.170 0.005 0.006 0.007
F
G
e
P
A2
A
A1
Bottom View
Side View
E
D
Top View
Pin 1
0.15mm
0.23mm
0.30mm
0.15mm
0.23mm
0.30mm
0.15mm
Recommended soldering pad layout Stencil apertures
Ordering Information
Part Number Package Min. Order Qty.
SP1044-01WTG 01005 Flipchip 15000
Part Numbering System
Part Marking System
SP 1044 01 TG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
–
W: 01005 Flipchip
TVS Diode Arrays
(SPA® Diodes)
W
