ECN.NO. MODIFY.CONTENT DATE pcmiooso2td| BAR ABIL AK 03/08'10 CNNI090675| R734 2035-4 9/27'nt REV. E |ks.po906.o17| add post length 2009 /06 At F G + 0PEN@ SIM OPERATION STEP HOW TO INSERT AND EXTRACT 2 0.80 5 MICRO SD OPERATION STEP ni | : 4 : HQ-D-CQO M+ P INSERT PROCESS:@-@----D- O- HOW TO INSERT AND EXTRACT EXTRACT PROCESS:@---@ > 27.20 5B = x 3 SIM =<. OPEN = ol ft age a = =| 8] = | 8 3/8 n = ~ ea & zy | = _| Vv Oo _ ct Boo f= 1.75 Eo 2.88 | 5.07 SECTION B-B SCALE 1:1 SECTION A-A SCALE 1:1 GENERAL TOLERANCE | FILE.NO. 10100492 PART.NO. 10100492** DRAWN Yan. he MATERIAL SCALE at X.0.50 5 REV. , a * = G TITLE | SIM+MICRO SD CONN. | CHECKED DATE 9/27 2011 uN . . x? SIZE . veto ss eat TAA x) SHEET 1/2 APPROVED Amphenol Shouhmin Industry 1 Il Zz Il 2 Il 4 ll 2 ll L ll 5 ll 91 I 2 I 3 I 4 I 5 I 6 I Z I 8 I REV.| ECN.NO. MODIFY.CONTENT DATE E |\es.poso6.o17/ add post length 2009 /06 /o4 F |kewtoo20264) #898 2 SP i 03/08'10| G. | BON11090675| WEATS# Jada 9/7 Nt 0.05 2-00.90" 0.00 > 2.50 3.00 GROUNDING-I GROUNDING-IT S Grounding III di ding-l & ~ - S g Gr g-lI Gro ms , _ S ~ GROUNDING HI : : Eros onl 8 2 ea oa 8? [| 1.30 = nN cS] % ~ o3| Cc? WM coy IX c3 <i ] C6 , HS ya Grounding-V Grounding-IV - ct n 2.38 a a 1.10 a" : L Ds |}} | 2 7.45 LF 180 os GROUNDINGIV GROUNDING- VI GROUNDING-V 8-0.70 - RECOMMENDER P.C.B LAYOUT (ALL TOLERANCES:0.03mm) NOTE: 1. MATERIAL A.INSULATOR: HIGH TEMPERATURE THERMOPLASTIC,UL94 V-O. B.SHELL: STAINLESS STEEL. C.CONTACT:COPPER ALLOY. &. PLATED: PART. NO: CONTACT AREA: COLD 1~50u" SELECTIVE SIM pin assignment || Micro SD pin assignment 1010049 2%* SOLIDER TAIL:TIN PLATED OR GOLD FLASH PIN} Name PIN# Name 7: Contact area tu, Solder tail plating gold flash UNDERPLATING :50u" NICKEL Cl VEC Pf DAT2 8: Contact area 3u, Solder tail plating gold flash 3.PAD:GOLD PLATING OVER NICKEL. C2 RST P2 CD/DAT3* 9: Contact area 5u, Solder tail plating gold flash C8 CLK P3 CMD 0: Contact area 15u, Solder tail plating gold flash C4 Reserved P4 Von oi contact area aoe Solder ie prawn gold vash . ontact area UU, olaer tat ALUN 0. as C5 GND P5 CLK POs F MATERIALS & PLATINGS TABLE C6 VPP P6 eS c? 1/0 P? DATO A\ | TeRuinaL/crounpine | 8 | PHOSPHER BRONZE(t=0.20) C8 Reserved PB DATI A\ | SIM TERMINAL-II 4 | PHOSPHER BRONZE(t=0.20) AX | SIM TERMINAL-| 4 | PHOSPHER BRONZE(t=0.20) A\ | MICRO SD SHELL 1 | STAINLESS STEEL(t=0.20) AX | SIM SHELL 1 | STAINLESS STEEL (t=0.20) A\_| INSULATOR 1 | LCP UL 94V-0 ITEMDESCRIPTION Q'TY MATERIAL GENERAL TOLERANCE | FILE.NO. 10100492 PART.NO. 10100492** DRAWN Yan. he MATERIAL SCALE at X.0.50 x. 5 REV. DATE 9/27 2011 UNIT > C title | SIM+MICRO SD CONN. | CHECKED / um .X0.38 xe+ 2 SIZE i ozs owst bn Om SHEET 2/2 APPROVED Amphenol Shouhmin Industry 1 I 2 I 3 I Z I 5 | 6 I 7 I B I 9