

SDAS159D − APRIL 1982 − REVISED DECEMBER 1994
Copyright 1994, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
AND-Gated (Enable/Disable) Serial Inputs
Fully Buffered Clock and Serial Inputs
Direct Clear
Package Options Include Plastic
Small-Outline (D) Packages and Standard
Plastic (N) 300-mil DIPs
description
This 8-bit parallel-out serial shift register features
AND-gated serial (A and B) inputs and an
asynchronous clear (CLR) input. The gated serial
inputs permit control over incoming data because a low at either input inhibits entry of the new data and resets
the first flip-flop to the low level at the next clock pulse. A high-level input enables the other input, which
determines the state of the first flip-flop. Data at the serial inputs can be changed while the clock is high or low,
provided that the minimum setup-time requirements are met. Clocking occurs on the low-to-high-level transition
of the clock (CLK) input. All inputs are diode clamped to minimize transmission-line effects.
The SN74ALS164A is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS OUTPUTS
CLR CLK A B QAQB...Q
H
L X X X L L L
HLXXQ
A0 QB0 QH0
HHHHQAn QGn
HLXLQAn QGn
HX L L QAn QGn
QA0, Q B0, QH0 = the level of QA, QB, or QH, respectively,
before the indicated steady-state input conditions were
established.
H = high level (steady state), L = low level (steady state)
X = irrelevant (any input, including transitions)
= transition from low to high level
QAn, QGn = the level of QA or QG before the most recent
transition of the clock; indicates a 1-bit shift.
D OR N PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
A
B
QA
QB
QC
QD
GND
VCC
QH
QG
QF
QE
CLR
CLK
  !" # $%&" !#  '%()$!" *!"&+
*%$"# $ " #'&$$!"# '& ",& "&#  &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0  !)) '!!&"&#+


SDAS159D − APRIL 1982 − REVISED DECEMBER 1994
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
logic symbol
SRG8
R
9
8
CLK C1/
1
A3
2
B
CLR
4
&1D
5
6
10
11
12
13
QA
QB
QC
QD
QE
QF
QG
QH
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
R
C1
1R
1S
9
8
1
2
A
B
Serial Inputs
CLR
CLK
3 4 5 6 10 11 12 13
QAQBQCQDQEQFQGQH


SDAS159D − APRIL 1982 − REVISED DECEMBER 1994
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
typical clear, shift, and clear sequences
CLK
A
B
CLR
QA
QB
QC
QD
QE
QF
QG
QH
Clear Clear
Serial InputsOutputs
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.


SDAS159D − APRIL 1982 − REVISED DECEMBER 1994
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
IOH High-level output current 0.4 mA
IOL Low-level output current 8 mA
fclock Clock frequency 50 MHz
tw
Pulse duration
CLK 10
ns
twPulse duration CLR low 16 ns
tsu
Setup time before CLK
Data 6
ns
tsu Setup time before CLKCLR inactive 8ns
thHold time, data after CLK2 ns
TAOperating free-air temperature 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VIK VCC = 4.5 V, II = −18 mA 1.5 V
VOH VCC = 4.5 V to 5.5 V, IOH = −0.4 mA VCC −2 V
VOL
VCC = 4.5 V
IOL = 4 mA 0.25 0.4
V
VOL VCC = 4.5 V IOL = 8 mA 0.35 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 µA
IIL VCC = 5.5 V, VI = 0.4 V 0.1 mA
IOVCC = 5.5 V, VO = 2.25 V −30 −112 mA
ICC VCC = 5.5 V, See Note 1 14 24 mA
All typical values are at VCC = 5 V, TA = 25°C.
The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
NOTE 1: With 4.5 V applied to the serial input and all other inputs, except the CLK, grounded, ICC is measured after a clock transition from
0 to 4.5 V.
switching characteristics (see Figure 1)
PARAMETER FROM
(INPUT) TO
(OUTPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 ,
TA = MIN to MAX§UNIT
MIN TYPMAX
fmax 50 75 MHz
tPHL CLR Any Q 6 15 20 ns
tPLH
CLK
Any Q
4 9 16
ns
tPHL
CLK
Any Q
511 17
ns
§For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
All typical values are at VCC = 5 V, TA = 25°C.


SDAS159D − APRIL 1982 − REVISED DECEMBER 1994
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
tPHZ
tPLZ
tPHL tPLH
0.3 V
tPZL
tPZH
tPLH tPHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
From Output
Under Test Test
Point
R1
S1
CL
(see Note A)
7 V
1.3 V
1.3 V1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
1.3 V 1.3 V 3.5 V
3.5 V
0.3 V
0.3 V
High-Level
Pulse
Low-Level
Pulse
tw
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note C)
1.3 V 1.3 V
1.3 V1.3 V
1.3 V 1.3 V
1.3 V1.3 V
1.3 V
1.3 V
3.5 V
3.5 V
0.3 V
0.3 V
VOL
VOH
VOH
VOL
Output
Control
(low-level
enabling)
Waveform 1
S1 Closed
(see Note B)
Waveform 2
S1 Open
(see Note B) [0 V
VOH
VOL
[3.5 V
In-Phase
Output
0.3 V
1.3 V 1.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
R2
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
From Output
Under Test Test
Point
CL
(see Note A) RL
RL = R1 = R2
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74ALS164AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74ALS164ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74ALS164ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALS164ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ALS164ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74ALS164ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALS164ADR SOIC D 14 2500 367.0 367.0 38.0
SN74ALS164ANSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated