DSC1104/24 Low Jitter Precision HCSL Oscillator Features General Description * Low RMS Phase Jitter: <1 ps (typ.) * High Stability: 10 ppm, 20 ppm, 25 ppm, 50 ppm * Wide Temperature Range - Industrial: -40C to +85C - Ext. Commercial: -20C to +70C - Ext. Industrial: -40C to +105C * High Supply Noise Rejection: -50 dBc * Wide Frequency Range: 2.3 MHz to 460 MHz * Small Industry Standard Footprints: - 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm * Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 * High Reliability - 20x Better MTF than Quartz Oscillators * Low Current Consumption * Supply Range of 2.25V to 3.6V * Standby and Output Enable Function * Lead Free and RoHS Compliant The DSC1104 and DSC1124 series of high performance oscillators utilizes a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. Applications * Storage Area Networks - SATA, SAS, Fibre Channel * Passive Optical Networks - EPON, 10G-EPON, GPON, 10G-PON * Ethernet - 1G, 10GBASE-T/KR/LR/SR, and FCoE * HD/SD/SDI Video and Surveillance * PCI Express: Gen 1 to Gen 4 * Display Port 2017 Microchip Technology Inc. DSC1104 has a standby feature allowing it to completely power down when EN pin is pulled low; whereas for DSC1124, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are drop-in replacements for standard 6-pin HCSL quartz crystal oscillators. Block Diagram Pin 1 ENABLE Pin 2 NC MEMS OSCILLATOR PLL Pin 3 GND TABLE 1: EN Pin Pin 6 VDD TEMP SENSOR & COMPENSATION CIRCUITRY DIVIDER DRIVER Pin 5 OUTPUT Pin 4 OUTPUT OUTPUT ENABLE MODES DSC1104 DSC1124 High Outputs Active Outputs Active NC Outputs Active Outputs Active Low Standby Outputs Disabled DS20005870A-page 1 DSC1104/24 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Supply Voltage .......................................................................................................................................... -0.3V to +4.0V Input Voltage .....................................................................................................................................-0.3V to VDD + 0.3V ESD Protection (HBM) ...............................................................................................................................................4 kV ESD Protection (MM) ................................................................................................................................................400V ESD Protection (CDM) ............................................................................................................................................1.5 kV Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Specifications: VDD = 3.3V; TA = +25C unless otherwise specified. Parameters Supply Voltage (Note 1) Supply Current Frequency Stability Sym. Min. Typ. Max. Units VDD 2.25 -- 3.6 V -- -- 0.095 mA IDD f -- 20 22 -- -- 10 -- -- 20 -- -- 25 -- -- 50 Conditions -- DSC1104, EN pin low, Output is disabled DSC1124, EN pin low, Output is disabled ppm Includes frequency variation due to initial tolerance, temp., and power supply voltage One year at +25C Aging fY1 -- -- 5 ppm Start-up Time (Note 2) tSU -- -- 5 ms VIH 0.75 x VDD -- -- VIL -- -- 0.25 x VDD Output Disable Time (Note 3) tDA -- -- 5 ns -- Output Enable Time tEN -- -- 5 ms DSC1104 -- -- 20 ns DSC1124 Enable Pull-Up Resistor (Note 4) RPU -- 40 -- k Pull-up resistor exists IDD -- 40 42 mA Output Enabled, RL = 50 VOH 0.725 -- -- VOL -- -- 0.1 -- -- 750 -- tr 200 -- 400 tf 200 -- -- f0 2.3 -- 460 MHz SYM 48 -- 52 % Input Logic Levels V T = +25C Input logic high Input logic low HCSL Outputs Supply Current Output Logic Levels Peak-to-Peak Output Swing Output Transition Time (Note 3) Frequency Output Duty Cycle DS20005870A-page 2 V mV ps Output logic high, RL = 50 Output logic low Single-Ended Rise time, 20% to 80%,RL = 50, CL = 2 pF Fall time, 20% to 80%,RL = 50, CL = 2 pF Single frequency Differential 2017 Microchip Technology Inc. DSC1104/24 ELECTRICAL CHARACTERISTICS (CONTINUED) Specifications: VDD = 3.3V; TA = +25C unless otherwise specified. Parameters Period Jitter Integrated Phase Noise Note 1: 2: 3: 4: Sym. Min. Typ. Max. Units JPER -- 2.5 -- psRMS -- 0.25 -- -- 0.38 -- -- 1.7 2 JPH Conditions -- 200 kHz to 20 MHz @ 156.25 MHz psRMS 100 kHz to 20 MHz @ 156.25 MHz 12 kHz to 20 MHz @ 156.25 MHz Pin 6 VDD should be filtered with a 0.1 F capacitor. tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. Output Waveform and Test Circuit figures below define the parameters. Output is enabled if pad is floated or not connected. 2017 Microchip Technology Inc. DS20005870A-page 3 DSC1104/24 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions -20 -- +70 C Ordering Option E -40 -- +85 C Ordering Option I Operating Temperature Range TA -40 -- +105 C Ordering Option L Junction Temperature TJ -- -- +150 C -- Storage Temperature Range TS -55 -- +150 C -- Soldering Temperature -- -- -- +260 C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above +150C can impact the device reliability. DS20005870A-page 4 2017 Microchip Technology Inc. DSC1104/24 2.0 PIN DESCRIPTIONS FIGURE 2-1: EN 1 6 VDD NC 2 5 OUT GND 3 4 OUT Pin Configuration, 6-Lead QFN. The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin Number PIN FUNCTION TABLE Pin Name Description 1 EN Enable. 2 NC Leave unconnected. 3 GND 4 OUT Output. 5 OUT Complementary output. 6 VDD Input. Ground. 2017 Microchip Technology Inc. DS20005870A-page 5 DSC1104/24 3.0 NOMINAL PERFORMANCE PARAMETERS Unless specified otherwise, T = +25C, VDD = 3.3V. 2.5 0 100-mV -20 Phase Jitter (ps RMS) Rejection (dBc) 50MHz-HCSL 50-mV -10 -30 -40 -50 -60 -70 106MHz-HCSL 2.0 156MHz-HCSL 1.5 212MHz-HCSL 1.0 0.5 -80 0.1 1 10 100 1000 Supply Noise Frequency (kHz) 10000 0.0 0 200 400 600 800 1000 Low-end of integration BW: x kHz to 20 MHz FIGURE 3-1: Ratio. DS20005870A-page 6 Power Supply Rejection FIGURE 3-2: Phase Noise). Phase Jitter (Integrated 2017 Microchip Technology Inc. DSC1104/24 4.0 OUTPUT WAVEFORM tR Output tF 80% 830 mv 50% Output 20% tEN 1/f o tDA VIH Enable FIGURE 4-1: VIL Output Waveform. 2017 Microchip Technology Inc. DS20005870A-page 7 DSC1104/24 5.0 TYPICAL TERMINATION SCHEME VDD 0.1uF 6 2 5 3 4 Rs = 0 f or test Rs 100 Rs Rs serves to match the trace impedances. Depending on board layout, the value may range from 0 to 30 ohms. FIGURE 5-1: 6.0 50 50 Typical Termination Scheme. TEST CIRCUIT FIGURE 6-1: DS20005870A-page 8 Test Circuit. 2017 Microchip Technology Inc. DSC1104/24 7.0 SOLDER REFLOW PROFILE MSL 1 @ 260C refer to JSTD-020C Ramp-Up Rate (200C to Peak Temp) Preheat Time 150C to 200C Time Maintained above 217C Peak Temperature Time within 5C of Actual Peak 3C/sec. max. 60-180 sec. 60-150 sec. 255C to 260C 20-40 sec. Ramp-Down Rate 6C/sec. max. Time 25C to Peak Temperature 8 minutes max. 2017 Microchip Technology Inc. DS20005870A-page 9 DSC1104/24 8.0 PACKAGE MARKING INFORMATION 8.1 Package Marking Information 6-Pin CDFN/VDFN* XXXXXXX DCPYYWW 0SSS Legend: XX...X Y YY WW SSS e3 * Example 0750000 DCP1723 0421 Product code, customer-specific information, or frequency in MHz without printed decimal point Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. DS20005870A-page 10 2017 Microchip Technology Inc. DSC1104/24 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C A A1 SEATING PLANE 6X 0.08 C SIDE VIEW 2X b2 1 2 L2 5X L1 N 4X b1 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1005A Sheet 1 of 2 2017 Microchip Technology Inc. DS20005870A-page 11 DSC1104/24 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 Overall Length D Overall Width E b1 Terminal Width Terminal Width b2 Terminal Length L1 Terminal Length L2 MILLIMETERS MAX NOM 6 0.825 BSC 0.80 0.90 0.85 0.05 0.02 0.00 2.50 BSC 2.00 BSC 0.60 0.70 0.65 0.20 0.25 0.30 0.60 0.70 0.80 0.665 0.865 0.765 MIN Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1005A Sheet 2 of 2 DS20005870A-page 12 2017 Microchip Technology Inc. DSC1104/24 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X1 X2 2 1 Y G2 C 6 G1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch X1 Contact Pad Width (X4) Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Contact Pad Spacing C Space Between Contacts (X4) G1 Space Between Contacts (X3) G2 MIN MILLIMETERS NOM 0.825 BSC MAX 0.65 0.25 0.85 1.45 0.38 0.60 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3005A 2017 Microchip Technology Inc. DS20005870A-page 13 DSC1104/24 6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C A1 A SEATING PLANE 6X 0.08 C SIDE VIEW 2X b2 1 2 NOTE 1 L N 4X b1 L1 e BOTTOM VIEW 0.07 0.05 C A B C Microchip Technology Drawing C04-1007A Sheet 1 of 2 DS20005870A-page 14 2017 Microchip Technology Inc. DSC1104/24 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Terminals e Pitch A Overall Height Standoff A1 Overall Length D E Overall Width b1 Terminal Width b2 Terminal Width L Terminal Length Terminal Pullback L1 MIN 0.80 0.00 0.85 0.45 0.65 MILLIMETERS NOM 6 1.05 BSC 0.85 0.02 3.20 BSC 2.50 BSC 0.90 0.50 0.70 0.10 REF MAX 0.90 0.05 0.95 0.55 0.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1007A Sheet 2 of 2 2017 Microchip Technology Inc. DS20005870A-page 15 DSC1104/24 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 G 6 C Y 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (X4) X1 Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Space Between Contacts (X4) G1 MIN MILLIMETERS NOM 1.05 BSC 1.60 MAX 1.00 0.60 0.85 0.25 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3007A DS20005870A-page 16 2017 Microchip Technology Inc. DSC1104/24 6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern 2017 Microchip Technology Inc. DS20005870A-page 17 DSC1104/24 6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 6 C Y2 OV EV G Y1 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X6) X1 Contact Pad Length (X6) Y1 Contact Pad to Center Pad (X2) G Thermal Via Diameter (X6) V Thermal Via Pitch EV MIN MILLIMETERS NOM 2.54 BSC MAX 2.90 1.90 3.70 1.50 1.35 0.20 0.33 1.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3010A DS20005870A-page 18 2017 Microchip Technology Inc. DSC1104/24 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.20 C 1 2 2X 0.20 C TOP VIEW 0.10 C C SEATING PLANE A1 A 6X 0.08 C SIDE VIEW 0.10 C A B D2 1 2 0.10 NOTE 1 C A B E2 6X L (K) N 6X b 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1010A Sheet 1 of 2 2017 Microchip Technology Inc. DS20005870A-page 19 DSC1104/24 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Terminals e Pitch A Overall Height Standoff A1 Overall Length D Exposed Pad Length D2 Overall Width E E2 Exposed Pad Width b Terminal Width L Terminal Length K Terminal-to-Exposed-Pad MIN 0.80 0.00 2.70 1.70 1.35 1.00 MILLIMETERS NOM 6 2.54 0.85 0.02 7.00 BSC 2.80 5.00 BSC 1.80 1.40 1.10 0.20 REF MAX 0.90 0.05 2.90 1.90 1.45 1.20 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1010A Sheet 2 of 2 DS20005870A-page 20 2017 Microchip Technology Inc. DSC1104/24 6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern 2017 Microchip Technology Inc. DS20005870A-page 21 DSC1104/24 NOTES: DS20005870A-page 22 2017 Microchip Technology Inc. DSC1104/24 APPENDIX A: REVISION HISTORY Revision A (December 2017) * Initial conversion of Micrel document DSC1104/24 to Microchip data sheet template DS20005870A. * Minor text changes throughout. 2017 Microchip Technology Inc. DS20005870A-page 23 DSC1104/24 NOTES: DS20005870A-page 24 2017 Microchip Technology Inc. DSC1104/24 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device Device: Package: X X X -XXX.XXXX X Package Temperature Stability Frequency Packaging Range Option DSC1104: Low-Jitter Precision HCSL Oscillator with Standby DSC1124: Low-Jitter Precision HCSL Oscillator A B C D N = = = = = 6-Lead 7.0 mm x 5.0 mm CDFN 6-Lead 5.0 mm x 3.2 mm CDFN 6-Lead 3.2 mm x 2.5 mm CDFN 6-Lead 2.5 mm x 2.0 mm CDFN 6-Lead 7.0 mm x 5.0 mm CDFN w/o center pad Temperature Range: E I L = = = -20C to +70C (Extended Commercial) -40C to +85C (Industrial) -40C to +105C (Extended Industrial) Stability: 1 2 3 5 = = = = 50 ppm 25 ppm 20 ppm 10 ppm Frequency: xxx.xxxx Packing Option: = T = Examples: a) DSC1104AE1053.5000: Low Jitter Precision HCSL Oscillator with Standby, 6-Lead 7x5 CDFN, Ext. Commercial Temp. Range, 50 ppm Stability, 53.5 MHz Frequency, Tube b) DSC1124BI2246.8100T: Low Jitter Precision HCSL Oscillator, 6Lead 5x3.2 VDFN, Industrial Temp. Range, 25 ppm Stability, 246.81 MHz Frequency, 1000/Reel c) DSC1104CL5156.2500: Low Jitter Precision HCSL Oscillator with Standby, 6-Lead 3.2x2.5 VDFN, Ext. Industrial Temp. Range, 10 ppm Standby, 156.25 MHz Frequency, Tube d) DSC1124DE3- Low Jitter Precision HCSL Oscillator, 6094.5500T: Lead 2.5x2.0 CDFN, Ext. commercial Temp. Range, 20 ppm Stability, 94.55 MHz Frequency, 1000/Reel Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. = 2.3 MHz to 460 MHz (User Defined) Tube 1000/Reel 2017 Microchip Technology Inc. DS20005870A-page 25 DSC1104/24 NOTES: DS20005870A-page 26 2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2440-6 == ISO/TS 16949 == 2017 Microchip Technology Inc. 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