DS90C383,DS90CF384 DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-65 MHz Literature Number: SNLS124 DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-- 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-- 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999). This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. n 20 to 65 MHz shift clock support n Programmable transmitter (DS90C383) strobe select (Rising or Falling edge strobe) n Single 3.3V supply n Chipset (Tx + Rx) power consumption < 250 mW (typ) n Power-down mode ( < 0.5 mW total) n Single pixel per clock XGA (1024x768) ready n Supports VGA, SVGA, XGA and higher addressability. n Up to 227 Megabytes/sec bandwidth n Up to 1.8 Gbps throughput n Narrow bus reduces cable size and cost n 290 mV swing LVDS devices for low EMI n PLL requires no external components n Low profile 56-lead TSSOP package. n DS90CF384 also available in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package n Falling edge data strobe Receiver n Compatible with TIA/EIA-644 LVDS standard n ESD rating > 7 kV n Operating Temperature: -40C to +85C Block Diagrams Application DS012887-2 TRI-STATE (R) is a registered trademark of National Semiconductor Corporation. (c) 1999 National Semiconductor Corporation DS012887 www.national.com DS90C383/DS90CF384 +3.3V Programmable LVDS 24-Bit-Color Flat Panel Display (FPD) Link -- 65 MHz September 1999 Block Diagrams (Continued) DS90C383 DS012887-1 Order Number DS90C383MTD See NS Package Number MTD56 DS90CF384 DS012887-24 Order Number DS90CF384MTD or DS90CF384SLC See NS Package Number MTD56 or SLC64A www.national.com 2 Absolute Maximum Ratings (Note 1) DS90C383MTD 12.5 mW/C above DS90CF384MTD 12.4 mW/C above Maximum Package Power Dissipation Capacity 25C SLC64A Package: DS90CF384SLC Package Derating: DS90CF384SLC 10.2 mW/C above If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) -0.3V to +4V CMOS/TTL Input Voltage -0.3V to (VCC + 0.3V) CMOS/TTL Output Voltage -0.3V to (VCC + 0.3V) LVDS Receiver Input Voltage -0.3V to (VCC + 0.3V) LVDS Driver Output Voltage -0.3V to (VCC + 0.3V) LVDS Output Short Circuit Duration Continuous Junction Temperature +150C Storage Temperature -65C to +150C Lead Temperature (Soldering, 4 sec for TSSOP) +260C Solder Reflow Temperature (20 sec for FBGA) +220C Maximum Package Power Dissipation Capacity 25C MTD56 (TSSOP) Package: DS90C383MTD 1.63 W DS90CF384MTD 1.61 W Package Derating: ESD Rating (HBM, 1.5 k, 100 pF) +25C +25C 2.0 W +25C > 7 kV Recommended Operating Conditions Supply Voltage (VCC) Operating Free Air Temperature (TA) Receiver Input Range Supply Noise Voltage (VCC) Min 3.0 Nom 3.3 Max 3.6 Units V -40 0 +25 +85 2.4 100 C V mVPP Max Units V Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ CMOS/TTL DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VCC VIL Low Level Input Voltage GND 0.8 VOH High Level Output Voltage IOH = -0.4 mA 2.7 3.3 V V VOL Low Level Output Voltage IOL = 2 mA 0.06 0.3 V VCL Input Clamp Voltage ICL = -18 mA -0.79 -1.5 V IIN Input Current VIN = VCC, GND, 2.5V or 0.4V 5.1 10 A IOS Output Short Circuit Current VOUT = 0V -60 -120 mA 345 450 mV 35 mV LVDS DC SPECIFICATIONS VOD Differential Output Voltage VOD Change in VOD between RL = 100 250 complimentary output states VOS Offset Voltage (Note 4) VOS Change in VOS between 1.125 1.25 1.375 V 35 mV -3.5 -5 mA 1 10 A +100 mV complimentary output states IOS Output Short Circuit Current VOUT = 0V, RL = 100 IOZ Output TRI-STATE (R) Current Power Down = 0V, VOUT = 0V or VCC VTH Differential Input High Threshold VTL Differential Input Low Threshold IIN Input Current VCM = +1.2V -100 mV VIN = +2.4V, VCC = 3.6V VIN = 0V, VCC = 3.6V 10 10 A A TRANSMITTER SUPPLY CURRENT ICCTW Transmitter Supply Current RL = 100, CL = 5 pF, f = 32.5 MHz 31 45 mA Worst Case Worst Case Pattern f = 37.5 MHz 32 50 mA (Figures 1, 3 ), TA = -40C to +85C f = 65 MHz 42 55 mA 3 www.national.com Electrical Characteristics (Continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units TRANSMITTER SUPPLY CURRENT ICCTG ICCTZ Transmitter Supply Current RL = 100, CL = 5 pF, f = 32.5 MHz 23 35 mA 16 Grayscale 16 Grayscale Pattern f = 37.5 MHz 28 40 mA (Figures 2, 3 ), TA = -40C to +85C f = 65 MHz 31 45 mA 10 55 A Transmitter Supply Current Power Down = Low Power Down Driver Outputs in TRI-STATE (R) under Power Down Mode RECEIVER SUPPLY CURRENT ICCRW ICCRG ICCRZ Receiver Supply Current C f = 32.5 MHz 49 65 mA Worst Case Worst Case Pattern f = 37.5 MHz 53 70 mA (Figures 1, 4 ), TA = -40C to +85C f = 65 MHz 78 105 mA L = 8 pF, Receiver Supply Current, C f = 32.5 MHz 28 45 mA 16 Grayscale 16 Grayscale Pattern f = 37.5 MHz 30 47 mA (Figures 2, 4 ), TA = -40C to +85C f = 65 MHz 43 60 mA 10 55 A L = 8 pF, Receiver Supply Current Power Down = Low Power Down Receiver Outputs Stay Low during Power Down Mode Note 1: "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The tables of "Electrical Characteristics" specify conditions for device operation. Note 2: Typical values are given for VCC = 3.3V and TA = +25C. Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except VOD and VOD). Note 4: VOS previously referred as VCM. Transmitter Switching Characteristics Over recommended operating supply and -40C to +85C ranges unless otherwise specified Symbol Typ Max Units LLHT LVDS Low-to-High Transition Time (Figure 3 ) Parameter Min 0.75 1.5 ns LHLT LVDS High-to-Low Transition Time (Figure 3 ) 0.75 1.5 ns TCIT TxCLK IN Transition Time (Figure 5 ) 5 ns TCCS TxOUT Channel-to-Channel Skew (Figure 6 ) TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 17 ) TPPos1 250 ps -0.4 0 0.3 ns Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11 11.3 ns TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns TCIP TxCLK IN Period (Figure 7) 15 T 50 ns TCIH TxCLK IN High Time (Figure 7) 0.35T 0.5T 0.65T ns TCIL TxCLK IN Low Time (Figure 7) 0.35T 0.5T 0.65T ns TSTC TxIN Setup to TxCLK IN (Figure 7 ) THTC TxIN Hold to TxCLK IN (Figure 7 ) TCCD TxCLK IN to TxCLK OUT Delay 25C, VCC = 3.3V (Figure 9 ) 5.5 ns TPLLS Transmitter Phase Lock Loop Set (Figure 11 ) 10 ms TPDD Transmitter Power Down Delay (Figure 15 ) 100 ns www.national.com f = 65 MHz f = 65 MHz 4 2.5 ns 0 ns 3.0 3.7 Receiver Switching Characteristics Over recommended operating supply and -40C to +85C ranges unless otherwise specified Symbol Typ Max Units CLHT CMOS/TTL Low-to-High Transition Time (Figure 4 ) Parameter Min 2.2 5.0 ns CHLT CMOS/TTL High-to-Low Transition Time (Figure 4 ) 2.2 5.0 ns RSPos0 Receiver Input Strobe Position for Bit 0 (Figure 18 ) 0.7 1.1 1.4 ns RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns RSKM RxIN Skew Margin (Note 5) (Figure 19 ) RCOP RxCLK OUT Period (Figure 8) T 50 ns RCOH RxCLK OUT High Time (Figure 8 ) 7.3 8.6 ns RCOL RxCLK OUT Low Time (Figure 8) 3.45 4.9 ns RSRC RxOUT Setup to RxCLK OUT (Figure 8 ) 2.5 6.9 ns RHRC RxOUT Hold to RxCLK OUT (Figure 8 ) 2.5 5.7 RCCD RxCLK IN to RxCLK OUT Delay 25C, VCC = 3.3V (Figure 10 ) 5.0 7.1 RPLLS RPDD f = 65 MHz f = 65 MHz 400 15 f = 65 MHz ps ns 9.0 ns Receiver Phase Lock Loop Set (Figure 12 ) 10 ms Receiver Power Down Delay (Figure 16 ) 1 s Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window-RSPOS). This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter (less than 250 ps). AC Timing Diagrams DS012887-3 FIGURE 1. "Worst Case" Test Pattern 5 www.national.com AC Timing Diagrams (Continued) DS012887-4 FIGURE 2. "16 Grayscale" Test Pattern (Notes 6, 7, 8, 9) Note 6: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O. Note 7: The 16 grayscale test pattern tests device power consumption for a "typical" LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical stripes across the display. Note 8: Figures 1, 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT). Note 9: Recommended pin to signal mapping. Customer may choose to define differently. DS012887-5 FIGURE 3. DS90C383 (Transmitter) LVDS Output Load and Transition Times DS012887-6 FIGURE 4. DS90CF384 (Receiver) CMOS/TTL Output Load and Transition Times www.national.com 6 AC Timing Diagrams (Continued) DS012887-7 FIGURE 5. DS90C383 (Transmitter) Input Clock Transition Time DS012887-8 Measurements at Vdiff = 0V TCCS measured between earliest and latest LVDS edges. TxCLK Differential Low High Edge FIGURE 6. DS90C383 (Transmitter) Channel-to-Channel Skew DS012887-9 FIGURE 7. DS90C383 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe) DS012887-10 FIGURE 8. DS90CF384 (Receiver) Setup/Hold and High/Low Times 7 www.national.com AC Timing Diagrams (Continued) DS012887-11 FIGURE 9. DS90C383 (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe) DS012887-12 FIGURE 10. DS90CF384 (Receiver) Clock In to Clock Out Delay DS012887-13 FIGURE 11. DS90C383 (Transmitter) Phase Lock Loop Set Time DS012887-14 FIGURE 12. DS90CF384 (Receiver) Phase Lock Loop Set Time www.national.com 8 AC Timing Diagrams (Continued) DS012887-15 FIGURE 13. Seven Bits of LVDS in Once Clock Cycle DS012887-16 FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs DS012887-17 FIGURE 15. Transmitter Power Down Delay 9 www.national.com AC Timing Diagrams (Continued) DS012887-18 FIGURE 16. Receiver Power Down Delay DS012887-26 FIGURE 17. Transmitter LVDS Output Pulse Position Measurement www.national.com 10 AC Timing Diagrams (Continued) DS012887-25 FIGURE 18. Receiver LVDS Input Strobe Position 11 www.national.com AC Timing Diagrams (Continued) DS012887-21 C -- Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max Tppos -- Transmitter output pulse position (min and max) RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 10) + ISI (Inter-symbol interference) (Note 11) Cable Skew -- typically 10 ps-40 ps per foot, media dependent Note 10: Cycle-to-cycle jitter is less than 250 ps at 65 MHZ Note 11: ISI is dependent on interconnect length; may be zero FIGURE 19. Receiver LVDS Input Skew Margin DS90C383 Pin Description -- FPD Link Transmitter I/O No. TxIN Pin Name I 28 Description TxOUT+ O 4 Positive LVDS differentiaI data output. TxOUT- O 4 Negative LVDS differential data output. FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN. R_FB I 1 Programmable strobe select. RTxCLK OUT+ O 1 Positive LVDS differential clock output. TxCLK OUT- O 1 Negative LVDS differential clock output. PWR DOWN I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at power down. TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines -- FPLINE, FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable). VCC I 3 Power supply pins for TTL inputs. GND I 4 Ground pins for TTL inputs. PLL VCC I 1 Power supply pin for PLL. PLL GND I 2 Ground pins for PLL. LVDS VCC I 1 Power supply pin for LVDS outputs. LVDS GND I 3 Ground pins for LVDS outputs. www.national.com 12 DS90CF384 MTD56 package Pin Description -- FPD Link Receiver Pin Name RxIN+ I/O No. I 4 Description Positive LVDS differentiaI data inputs. RxIN- I 4 RxOUT O 28 Negative LVDS differential data inputs. RxCLK IN+ I 1 Positive LVDS differential clock input. RxCLK IN- I 1 Negative LVDS differential clock input. FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT. PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low. TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines -- FPLINE, FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable). VCC I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL VCC I 1 Power supply for PLL. PLL GND I 2 Ground pin for PLL. LVDS VCC I 1 Power supply pin for LVDS inputs. LVDS GND I 3 Ground pins for LVDS inputs. 13 www.national.com DS90CF384 64 ball FBGA package Pin Description -- FPD Link Receiver Pin Name RxIN+ I/O No. I 4 Description Positive LVDS differentiaI data inputs. RxIN- I 4 RxOUT O 28 Negative LVDS differential data inputs. RxCLK IN+ I 1 RxCLK IN- I 1 Negative LVDS differential clock input. FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT. TTL level input. When asserted (low input) the receiver outputs are low. TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines -- FPLINE, FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable). Positive LVDS differential clock input. PWR DOWN I 1 VCC I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL VCC I 1 Power supply for PLL. PLL GND I 2 Ground pin for PLL. LVDS VCC I 1 Power supply pin for LVDS inputs. LVDS GND I 3 Ground pins for LVDS inputs. 6 Pins not connected. NC Applications Information The DS90C383 and DS90CF384 are backward compatible with the existing 5V FPD Link transmitter/receiver pair (DS90CR583, DS90CR584, DS90CF583 and DS90CF584). To upgrade from a 5V to a 3.3V system the following must be addressed: 1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of both the transmitter and receiver devices. This change may enable the removal of a 5V supply from the system, and power may be supplied from an existing 3V power source. 2. The DS90C383 (transmitter) incorporates a rise/fall strobe select pin. This select function is on pin 17, formerly a VCC connection on the 5V products. When the rise/fall strobe select pin is connected to VCC, the part is configured with a rising edge strobe. In a system currently using a 5V rising edge strobe transmitter (DS90CR583), no layout changes are required to accommodate the new rise/fall select pin on the 3.3V transmitter. The VCC signal may remain at pin 17, and the device will be configured with a rising edge strobe. When converting from a 5V falling edge transmitter (DS90CF583) to the 3V transmitter a minimal board layout change is necessary. The 3.3V transmitter will not be configured with a falling edge strobe if VCC remains connected to the select pin. To guarantee the 3.3V transmitter functions with a falling edge strobe pin 17 should be connected to ground OR left unconnected. When not connected (left open) and internal pull-down resistor ties pin 17 to ground, thus configuring the transmitter with a falling edge strobe. 3. The DS90C383 transmitter input and control inputs accept 3.3V TTL/CMOS levels. They are not 5V tolerant. www.national.com 14 Pin Diagrams DS90C383MTD DS90CF384MTD DS012887-22 DS012887-23 TABLE 1. Programmable Transmitter Pin Condition Strobe Status R_FB R_FB = VCC Rising edge strobe R_FB R_FB = GND Falling edge strobe 15 www.national.com DS90CF384 64 ball, FBGA package pin definition -- FPD Link Receiver By Pin By Pin Type Pin Pin Name Type Pin Pin Name A1 RxOUT17 O A4 GND Type G A2 VCC P B1 GND G A3 RxOUT15 O B6 GND G A4 GND G D8 GND G A5 RxOUT12 O E3 GND G A6 RxOUT8 O E5 LVDS GND G A7 RxOUT7 O G3 LVDS GND G A8 RxOUT6 O G7 LVDS GND G B1 GND G H5 LVDS GND G B2 NC F6 PLL GND G B3 RxOUT16 O G8 PLL GND G B4 RxOUT11 O E6 PWR DWN I B5 VCC P H6 RxCLKIN- I B6 GND G H7 RxCLKIN+ I B7 RxOUT5 O H2 RxIN0- I B8 RxOUT3 O H3 RxIN0+ I C1 RxOUT21 O F4 RxIN1- I G4 RxIN1+ I G5 RxIN2- I C2 NC C3 RxOUT18 O C4 RxOUT14 O F5 RxIN2+ I C5 RxOUT9 O G6 RxIN3- I C6 RxOUT4 O H8 RxIN3+ I C7 NC E7 RxCLKOUT O C8 RxOUT1 O E8 RxOUT0 O D1 VCC P C8 RxOUT1 O D2 RxOUT20 O D5 RxOUT10 O D3 RxOUT19 O B4 RxOUT11 O D4 RxOUT13 O A5 RxOUT12 O D5 RxOUT10 O D4 RxOUT13 O D6 VCC P C4 RxOUT14 O D7 RxOUT2 O A3 RxOUT15 O D8 GND G B3 RxOUT16 O E1 RxOUT22 O A1 RxOUT17 O E2 RxOUT24 O C3 RxOUT18 O E3 GND G D3 RxOUT19 O E4 LVDS VCC P D7 RxOUT2 O E5 LVDS GND G D2 RxOUT20 O E6 PWR DWN I C1 RxOUT21 O E7 RxCLKOUT O E1 RxOUT22 O E8 RxOUT0 O F1 RxOUT23 O F1 RxOUT23 O E2 RxOUT24 O F2 RxOUT26 O G1 RxOUT25 O F3 NC F2 RxOUT26 O F4 RxIN1- H1 RxOUT27 O O I F5 RxIN2+ I B8 RxOUT3 F6 PLL GND G C6 RxOUT4 O F7 PLL VCC P B7 RxOUT5 O F8 NC A8 RxOUT6 O www.national.com 16 DS90CF384 64 ball, FBGA package pin definition -- FPD Link Receiver (Continued) By Pin G1 RxOUT25 G2 NC G3 LVDS GND G4 By Pin Type O A7 RxOUT7 O A6 RxOUT8 O G C5 RxOUT9 O RxIN1+ I E4 LVDS VCC P G5 RxIN2- I H4 LVDS VCC P G6 RxIN3- I F7 PLL VCC P G7 LVDS GND G A2 VCC P G8 PLL GND G B5 VCC P H1 RxOUT27 O D1 VCC P H2 RxIN0- I D6 VCC P H3 RxIN0+ I B2 NC H4 LVDS VCC P C2 NC H5 LVDS GND G C7 NC H6 RxCLKIN- I F3 NC H7 RxCLKIN+ I F8 NC H8 RxIN3+ I G2 NC G:Ground I : Input O:Output P:Power NC:Not connectted 17 www.national.com Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Molded Thin Shrink Small Outline Package, JEDEC Dimensions show in millimeters Order Number DS90C383MTD, DS90CF384MTD NS Package Number MTD56 www.national.com 18 inches (millimeters) unless otherwise noted (Continued) 64 ball, 0.8mm fine pitch ball grid array(FBGA) Package Dimensions show in millimeters Order Number DS90CF384SLC NS Package Number SLC64A LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Francais Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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