Resistors High Surge Film TM Surface Mount Metal Glaze HSF Film Surface Mount Metal GlazeTM 150C maximum operating temperature Metal GlazeTM lm element red at 1000C to solid ceramic High HSF SeriesSurge Metal GlazeTM thick film element fired at 1000C to solid ceramic RoHS - compatible components available Up to triple the surge rating of the rugged CHP1 * 1 Watt and 1/2 Watt power rating costly surface-mount wirewound resistors *Replaces 150C maximum operating temperature High temperature dielectric coating Solder over nickel barrier * RoHS - Compatible Components Available High temperature * Up to triple the surge rating of the rugged CHP1 dielectric * Replaces costly surface-mount wirewound resistors coating All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) OBSOLETE Solder over nickel barrier Electrical Data Industry Footprint Type Maximum Power Rating Working Voltage Resistance Range () Tolerance (%) TCR (ppm/C) Product Category 2512 HSF-1 1W @ 70C 350 5R9, 6R8, 11R, 27R, 12R, 68R, 270R 10 200 1 High Surge 3612 HSF-2 2W @ 25C 500 8R2, 22R, 300R 10 2001 High Surge Note 1 - Standard TCR is 200ppm/C. TCR of 100ppm/C is available at selected values on request. Environmental Data Characteristics Maximum Change Temperature Coefficient As specified Test Method MIL-R-55342H Par 4.7.9 (-55C +125C) Thermal Shock 0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65C +150C, 5 cycles) Low Temperature Operation 0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65C @ working voltage) Short Time Overload 0.5% +0.01 ohm High Temperature Exposure 0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150C for 100 hours) Resistance to Bonding Exposure 0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260C for 10 seconds) Solderability 95% min. coverage MIL-STD-202, Method 208 (245C for 5 seconds) Moisture Resistance 0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) Life Test 0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70C intermittent) MIL-R-55342H Par 4.7.5 2.5 x P x R for 5 seconds Terminal Adhesion Strength 1% +0.01 ohm 1200 gram push from underside of mounted chip for 60 seconds no mechanical damage Resistance to Board bending Chip mounted in center of 90mm long board, deflected 5mm so 1% +0.01 ohm no mechanical damage as to exert pull on chip contacts for 10 seconds General Note General Note TT Electronics reserves thechanges right to make changes inwithout product specification IRC reserves the right to make in product specification notice or liability. without notice or liability. All is subject to IRC's and is considered accurate of going toaccurate print. Allinformation information is subject toown TT data Electronics' own data and atis time considered at time of going to print. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 *plc Facsimile: 361 992 3377 * Website: www.irctt.com (c) TT Electronics BI Technologies IRC Welwyn A subsidiary of www.ttelectronics.com/resistors TT electronics plc HSF-1 Series Issue October 2010 Sheet 1 of 4 06.18 HSF High Surge Film Surface Mount Metal High Surge Film GlazeTM OBSOLETE TM HSF Series Mount Metal Glaze Surface Physical Data L C W Dimensions (Inches and (mm)) Industry Footprint Type L (Length) W (Width/Diameter) C (Termination Width) 2512 HSF-1 0.251 0.010 (6.38 0.25) 0.079 0.006 (2.01 0.15) 0.040 0.010 (1.02 0.25) 3612 HSF-2 0.367 0.010 (9.32 0.25) 0.105 0.006 (2.67 0.15) 0.050 0.010 (1.27 0.25) Recommended Solder Pad Dimensions (Reflow): F B A C A E D Industry Footprint Dimensions (Inches and mm)) A B C D E F HSF 1 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) HSF 2 3610 0.17 (4.32) 0.16 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics' own data and is considered accurate at time of going to print. HSF-1 Series Issue October 2010 Sheet 2 of 4 BI Technologies IRC Welwyn www.ttelectronics.com/resistors (c) TT Electronics plc 06.18 HSF High Surge Film High FilmGlazeTM SurfaceSurge Mount Metal TM OBSOLETE Surface HSF Series Mount Metal Glaze IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C / second max. 3C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100C 150C 60 -120 seconds 150C 200C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183C 60 - 150 seconds 217C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Average Ramp-up rate (Tsmax to Tp) Time within 5C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25C to Peak Temperature 10 - 30 seconds 20 - 40 seconds 6C / second max. 6C / second max. 6 minutes max. 8 minutes max. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 < 2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260C * 260C * 260C * 1.6 mm - 2.5 mm 260C * 250C * 245C * 2.5 mm 250C * 245C * 245C * Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specied for the reow proles is a "supplier" minimum and a "user" maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reow depends on package thickness and volume. The use of convection reow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and proles dened in Table 1, 2 and reow prole whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classication temperature at the rated MSL level. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics' own data and is considered accurate at time of going to print. HSF-1 Series Issue October 2010 Sheet 3 of 4 BI Technologies IRC Welwyn www.ttelectronics.com/resistors (c) TT Electronics plc 06.18 HSF High Surge Film High Film GlazeTM SurfaceSurge Mount Metal TM OBSOLETE HSF Series Mount Metal Glaze Surface Surge Capability Data 2512 CHP, HSF SURGE CAPABILITY for Non-repetitive or Low Repetition Rate Surges 1000000 For Non-repetitive or Low Repetitive Rate Surges on HSF-1 1,000,000 10,000 Peak Power (Watts) Peak Power (watts) 100,000 1,000 100000 10000 1000 100 100 10 1 1.E-09 Note: 10 1.E-08 1 1.0E-09 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Surge or Pulse Duration (seconds) 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 Use for low repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for low-repetitive surges may be significantly greater than shown above. Contact factory 1.0E+00 Surge or Pulse Duration (Seconds) Power Derating Curve Percent of Rated Power 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Ambient Temperature (C) Ordering Data Sample Part No. HSF-1 200 11R0 K LF 13 Type HSF-1 or HSF-2 Temperature Coefficient 200 = 200ppm/C (standard) Note - Standard TCR is 200ppm/C. TCR of 100ppm/C is available at selected values on request. Resistance Value Standard 4-digit resistance code. Tolerance K = 10% Lead-Free Construction Omit for SnPb. Packaging Code BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics' own data and is considered accurate at time of going to print. HSF-1 Series Issue October 2010 Sheet 4 of 4 BI Technologies IRC Welwyn www.ttelectronics.com/resistors (c) TT Electronics plc 06.18