Phone: +1.661.295.5920 | www.novacap.com
Technical Summary
Palladium Silver
Palladium Silver
Solderable
Palladium Silver
Nickel Barrier
100% tin
Nickel Barrier
90/10% tin/lead
Nickel Barrier
Gold flash
FlexiCap™/Nickel Barrier
100% tin
FlexiCap™/Nickel Barrier
90/10% tin/lead
Copper Barrier
100% tin
Copper Barrier
90/10% tin/lead
Solderable Silver
RoHS RoHS RoHS RoHS RoHS RoHS RoHS
Dielectric Code
P PR K N Y NG C D B E S
C0G/NP0
N/RN
•••••••• •
R3L
K
••••••••
X7R
B/RB
•••••••• •
X5R
W
•••
BX
X
•••••••• •
Y5V
Y
• • • •
Z5U
Z
• • • •
C0G/NP0 (Mag free)
M
••• ••
X7R (Mag free)
C
••• ••
X8R
S
••••• •• •
C0G/NP0 (160ºC)
F
••••• •• •
C0G/NP0 (200ºC)
D
• •
Class II (160ºC)
G
••••• •• •
Class II (200ºC)
E
• •
Pulse Power
P
•••
R2D
R
•••
Technical Information
Novacap provides application notes throughout this catalog as
a guide to chip selection and attachment methods. Refer to the
Novacap Technical Brochure found at www.novacap.com for
more details. This technical information includes the nature of
capacitance, dielectric properties, electrical properties, classes
of dielectrics, ferroelectric behavior, test standards, and high
reliability test plans. Please do not hesitate to contact the sales
office for any product or technical assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value with
temperature. The choice of components is therefore largely
determined by the temperature stability required of the device
and the size necessary for the desired capacitance value and
voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged. Bar
coded labels are standard for reeled and bulk packaging.
Dielectric
Termination
Combinations
Primary Dielectric Types
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time. Used
in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is limited
to ±15% maximum change in capacitance between 25°C and
-55°C or +125°C and also has a voltage restriction of +15%
/ -25% maximum change in capacitance between 25°C and
-55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
Termination Material
We recommend the following
termination types:
Solder Attachment:
N Nickel Barrier, 100% matte tin
plated - RoHS
C FlexiCap™ with Nickel Barrier,
100% tin plated - RoHS
Y Nickel Barrier, tin-lead plated
D FlexiCap™ Nickel Barrier, tin-lead
plated
B Copper Barrier 100% matte tin
plated - RoHS
E Copper Barrier, tin-lead plated
K Solderable Palladium Silver -
RoHS
S Solderable Silver - RoHS
Conductive Epoxy attachment:
P Palladium Silver
PR Palladium Silver - RoHS
NG Nickel Barrier Gold Flash,
also suitable for soldering
attachment - RoHS
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