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FEATURES
DCCD Signal Processing:
− Correlated Double Sampling (CDS)
− Programmable Black Level Clamping
DProgrammable Gain Amplifier (PGA)
−6-dB to 42-dB Gain Ranging
D10-Bit Digital Data Output:
− Up to 28-MHz Conversion Rate
− No Missing Codes
D77-dB Signal-To-Noise Ratio
DPortable Operation:
− Low Voltage: 2.7 V to 3.6 V
− Low Power: 93 mW (Typ) at 3 V
− Stand-By Mode: 6 mW
APPLICATIONS
DDSC, DVC, Security Camera
DESCRIPTION
The VSP2270 device is a complete mixed-signal
processing IC for digital cameras providing signal
conditioning and analog-to-digital conversion for the
output of a charge-coupled device (CCD) array. The
primary CCD channel provides correlated double
sampling (CDS) to extract the video information from
the pixels, –6-dB to 42-dB gain range with digital control
for varying illumination conditions, and black level
clamping for an accurate black level reference. Input
signal clamping and offset correction of the input CDS
are also performed. The stable gain control is linear in
dB. Additionally, the black level is quickly recovered
after gain change.
The VSP2270Y device is available in a 48-lead LQFP
package and the VSP2270M device is available in a
48-lead P-VQFN package. Both devices operate from
a single 3-V/3.3-V supply.
AVAILABLE OPTIONS
PRODUCT PACKAGE PACKAGE
OUTLINE
DESIGNATOR†
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING ORDERING
NUMBER‡TRANSPORT
MEDIA
VSP2270Y
VSP2270Y
VSP2270M
VSP2270M
48-Lead LQFP
48-Lead LQFP
48-Lead P-VQFN
48-Lead P-VQFN
PT
PT
RGN
RGN
−25°C to 85°C
−25°C to 85°C
−25°C to 85°C
−25°C to 85°C
VSP2270Y
VSP2270Y
VSP2270M
VSP2270M
VSP2270Y
VSP2270Y/2K
VSP2270M
VSP2270M/2K
250-piece tray
Tape and reel
250-piece tray
Tape and reel
†A detailed drawing and a dimension table are located at the end of the data sheet.
‡Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2,000 devices per reel). Ordering 2,000
pieces of the VSP2270Y/2K device will get a single 2,000-piece tape and reel.
! "#$ %!&
% "! "! '! ! !( !
%% )*& % "!+ %! !!$* $%!
!+ $$ "!!&
Copyright 2001, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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pin assignments
23
VCC
CLPDM
SHD
SHP
CLPOB
PBLK
VCC
GNDA
ADCCK
GNDA
DRVGND
DRVDD
24
23
22
21
20
19
18
17
16
15
14
13
4
37
38
39
40
41
42
43
44
45
46
47
48
CM
REFP
REFN
VCC
GNDA
GNDA
NC
NC
RESET
SLOAD
SDATA
SCLK
5678
BYPP2
COB
GNDA
35 34 33 32 3136 30
GNDA
GNDA
V
BYPM
B7
B8
B9(MSB)
B0(LSB)
B2
B3
B4
B5
B6
28 27 2629
910 11 12
25
1
GNDA
BYP
CCDIN
NC
NC
B1
PT PACKAGE
(TOP VIEW)
CC
VCC
VCC
NC − No internal connection
VSP2270Y
VCC
CLPDM
SHD
SHP
CLPOB
PBLK
VCC
GNDA
ADCCK
GNDA
DRVGND
DRVDD
24
23
22
21
20
19
18
17
16
15
14
13
37
38
39
40
41
42
43
44
45
46
47
48
CM
REFP
REFN
VCC
GNDA
GNDA
NC
NC
RESET
SLOAD
SDATA
SCLK 12
25
RGN PACKAGE
(TOP VIEW)
VSP2270M
11
26
10
27
9
28
8
29
7
30
6
31
5
32
4
33
3
34
2
35
1
36
NC
NC
B0(LSB)
B1
B2
B3
B4
B5
B6
B7
B8
B9(MSB)
GNDA
GNDA
VCC
VCC
BYPM
BYP
CCDIN
BYPP2
COB
VCC
GNDA
GNDA
NC − No internal connection
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functional block diagram
Correlated
Double
Sampling
(CDS)
Programmable
Gain Amplifier
(PGA)
−6 to
+42 dB Analog-to-Digital
Converter Output
Latch
CCDIN
CCD
Output
Signal
Timing Control
Reference Voltage GeneratorPreblanking
Input
Clamp
Optical Black (OB)
Level Clamping
Serial Interface
CLPDM SHP SHD SLOAD SCLK SDATA RESET ADCCK
DRV
DD
V
CC
10-Bit
Digital
Output B[9:
0]
PBLK COB CLPOB GNDADRVGNDBYPP2 REFPBYP BYPM REFN CM
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Terminal Functions
TERMINAL
TYPE (see
DESCRIPTION
NO. NAME
TYPE (see
Note 1)
DESCRIPTION
1, 2, 43, 44 NC Must be left open
3B0 (LSB) DO A/D converter output, bit 0 (LSB)
4 B1 DO A/D converter output, bit 1
5 B2 DO A/D converter output, bit 2
6 B3 DO A/D converter output, bit 3
7 B4 DO A/D converter output, bit 4
8 B5 DO A/D converter output, bit 5
9 B6 DO A/D converter output, bit 6
10 B7 DO A/D converter output, bit 7
11 B8 DO A/D converter output, bit 8
12 B9 (MSB) DO A/D converter output, bit 9 (MSB)
13 DRVDD PPower supply for digital output
14 DRVGND P Digital ground for digital output
15, 17. 25, 26
35, 36, 41, 42 GNDA P Analog ground
16 ADCCK DI Clock for digital output buffer
18, 24, 27, 33, 34, 40 VCC PAnalog power supply
19 PBLK DI Preblanking: High = Normal operation mode
Low = Preblanking mode: digital outputs are all 0s
20 CLPOB DI Optical black clamp pulse (default = active low) (see Note 5)
21 SHP DI CDS reference level sampling pulse (default = active low) (see Note 5)
22 SHD DI CDS data level sampling pulse (default = active low) (see Note 5)
23 CLPDM DI Dummy pixel clamp pulse (default = active low) (see Note 5)
28 COB AO Optical black clamp loop reference (bypass to ground) (see Note 2)
29 BYPP2 AO Internal reference P (bypass to ground) (see Note 3)
30 CCDIN AI CCD signal input
31 BYP AO Internal reference C (bypass to ground) (see Note 4)
32 BYPM AO Internal reference N (bypass to ground (see Note 3)
37 CM AO A/D converter common mode voltage (bypass to ground) (see Note 4)
38 REFP AO A/D converter positive reference (bypass to ground) (see Note 4)
39 REFN AO A/D converter negative reference (bypass to ground) (see Note 4)
45 RESET DI Asynchronous system reset (active low)
46 SLOAD DI Serial data latch signal (triggered at the rising edge)
47 SDATA DI Serial data input
48 SCLK DI Clock for serial data shift (triggered at the rising edge)
NOTES: 1. Designators in TYPE: P: power supply and ground, DI: digital input, DO: digital output, AI: analog input, AO: analog output
2. Must be connected to ground with a bypass capacitor. The recommended value is 0.1 µF to 0.22 µF, however it depends on the
application environment. Refer to the optical black level clamp loop section for details.
3. Must be connected to ground with a bypass capacitor. The recommended value is 400 pF to 1000 pF, however it depends on the
application environment. Refer to the voltage reference section for details.
4. Must be connected to ground with a bypass capacitor (0.1 µF). Refer to the voltage reference section for details.
5. Refer to the serial interface section for details.
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absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage: VCC, DRVDD 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage differences: VCC ±0.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ground voltage differences: GNDA, DRVDD ±0.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital input voltage −0.3 V to 5.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog input voltage −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current (any leads except supplies) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating temperature −25°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature −55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 5 sec) 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package temperature (IR reflow, peak, 10 sec) 235°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
electrical characteristics all specifications at TA = 25°C, VCC = 3 V, DRVDD = 3 V, conversion rate
(fADCCK) = 20 MHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VSP2270Y, VSP2270M
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
Resolution 10 Bits
Maximum conversion rate 28 MHz
DIGITAL INPUTS
Logic family TTL
VT+ Input low-to-high threshold voltage 1.7 V
VT− Input high-to-low threshold voltage 1 V
IIH Input logic high current VI = 3 V ±20 µA
IIL Input logic low current VI = 0 V ±20 µA
ADCCK clock duty cycle 50%
Input capacitance 5 pF
Maximum input voltage – 0.3 5.3 V
DIGITAL OUTPUTS
Logic family CMOS
Logic coding Straight binary
VOH Output logic high voltage IOH = –2 mA 2.4 V
VOL Output logic low voltage IOL = 2 mA 0.4 V
J[1:0] = 00 0
Additional output data delay
J[1:0] = 01 5
ns
Additional output data delay J[1:0] = 10 10 ns
J[1:0] = 11 13
REFERENCE
Positive reference voltage 1.75 V
Negative reference voltage 1.25 V
ANALOG INPUT (CCDIN)
Input signal level for full-scale out PGA gain = 0 dB 900 mV
Input capacitance 15 pF
Input limit –0.3 3.3 V
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electrical characteristics all specifications at TA = 25°C, VCC = 3 V, DRVDD = 3 V, conversion rate
(fADCCK) = 20 MHz (unless otherwise noted) (continued)
PARAMETER
TEST CONDITIONS
VSP2270Y, VSP2270M
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
TRANSFER CHARACTERISTICS
DNL Differential nonlinearity PGA gain = 0 dB ±0.5 LSB
INL Integral nonlinearity PGA gain = 0 dB ±1 LSB
No missing codes Assured
Step response settling time Full-scale step input 1 pixel
Overload recovery time Step input from 1.8 V to 0 V 2 pixels
Data latency 9 (fixed) Clock
Cycles
Signal-to-noise ratio (see Note 1)
Grounded input capacitor, PGA gain = 0 dB 77
dB
Signal-to-noise ratio (see Note 1) Grounded input capacitor, gain = 24 dB 53 dB
CCD offset correction range –180 200 mV
CDS
Reference sample settling time Within 1 LSB, driver impedance = 50 Ω8.9 ns
Data sample settling time Within 1 LSB, driver impedance = 50 Ω8.9 ns
INPUT CLAMP
Clamp-on resistance 400 Ω
Clamp level 1.5 V
PROGRAMMABLE GAIN AMPLIFIER (PGA)
Gain control resolution 10 Bits
Maximum gain Gain code = 1111111111 42
High gain Gain code = 1101001000 34
Medium gain Gain code = 1000100000 20
dB
Low gain Gain code = 0010000000 0dB
Minimum gain Gain code = 0000000000 –6
Gain control error ±0.5
OPTICAL BLACK CLAMP LOOP
Control DAC resolution 10 Bits
Optical black clamp level
Programmable range of clamp level 0 60
LSB
Optical black clamp level OBCLP level at CODE = 1000 32 LSB
Minimum output current for control DAC COB pin ±0.15 µA
Maximum output current for control DAC COB pin ±153 µA
Loop time constant CCOB = 0.1 µF 40.7 µs
Slew rate CCOB = 0.1 µF, Saturated output current of
control DAC 1530 V/s
POWER SUPPLY
Supply voltage VCC, DRVDD 2.7 3 3.6 V
Power dissipation
Normal operation mode: No load 93
mW
Power dissipation Stand-by mode: fADCCK = Does not apply 6mW
TEMPERATURE RANGE
Operating temperature –25 85 °C
θJA
Thermal resistance
VSP2270Y: 48-lead LQFP 100
°C/W
θJA Thermal resistance VSP2270M: 48-lead P-VQFN 107 °C/W
NOTE 1: SNR = 20 log (full-scale voltage / rms noise)
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timing specification
VSP2270 CDS
CCD
Output
Signal
SHP
(See
Note 9)
SHD
(See
Note 9)
A
DCCK
B[9:0]
N+1N N+2 N+3
tw(P)
tw(D)
t(PD)
t(DP)
t(S)
t(S)
t(CKP)
t(CKP)
t(CKP)
t(ADC)
t(ADC)
t(INHIBIT)
th(O) td(O)
N−10N−11 N−9 N−8 N−7
SYMBOL PARAMETER MIN TYP MAX UNIT
t(CKP) Clock period 35 ns
t(ADC) ADCCK high/low pulse width 17 ns
tw(P) SHP pulse width 8 ns
tw(D) SHD pulse width 8 ns
t(PD) SHP trailing edge to SHD leading edge (see Note 9) 8 ns
t(DP) SHD trailing edge to SHP leading edge (see Note 9) 8 ns
t(S) Sampling delay 3 ns
t(INHIBIT) Inhibited clock period 20 ns
th(O) Output hold time 2 ns
td(O) Output delay (no load) 22 ns
DL Data latency, normal operation mode 9 (fixed) Clock
Cycles
NOTES: 9. The description and the timing diagrams in this data sheet are all based on the polarity of active low (default value).
10. The user can select the active polarity (active low or active high) through the serial interface, refer to the serial interface section for
details.
11. Output hold time is specified at additional output delay = 0 ns, refer to the serial interface section for details.
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timing specifications (continued)
VSP2270 serial interface
SLOAD
SCLK
SDATA
tw(CKH) t(CKP)
MSB LSB
tsu(X) th(X)
tw(CKL)
tsu(D)
th(D)
2 Bytes
SYMBOL PARAMETER MIN TYP MAX UNIT
t(CKP) Clock period 100 ns
tw(CKH) Clock high pulse width 40 ns
tw(CKL) Clock low pulse width 40 ns
tsu(D) Data setup time 30 ns
th(D) Data hold time 30 ns
tsu(X) SLOAD to SCLK setup time 30 ns
th(X) SCLK to SLOAD hold time 30 ns
NOTES: 12. Data shift operation must decode at the rising edges of SCLK while SLOAD is low. Two bytes of input data are loaded to the parallel
latch in the VSP2270 device at the rising edge of SLOAD.
13. When the input serial data is longer than 2 bytes (16 bits), the last 2 bytes become effective and the former bits are lost.
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PRINCIPLES OF OPERATION
introduction
The VSP2270 device is a complete mixed-signal IC that contains all the key features associated with the
processing of CCD imager output signals in a video camera, a digital still camera, security camera, or similar
applications. A simplified block diagram is shown on page 3 of this data sheet. The VSP2270 device includes
correlated double sampler (CDS), programmable gain amplifier (PGA), analog-to-digital converter (ADC), input
clamp, optical black (OB) level clamp loop, serial interface, timing control, and reference voltage generator.
An off-chip emitter follower buffer is recommended between the CCD output and the VSP2270 CCDIN input.
The PGA gain control, the clock polarity setting, and the operation mode can be selected through the serial
interface. All parameters are reset to their default values when pin 45 (RESET) goes low asynchronously from
the clocks.
correlated double sampler (CDS)
The output signal of a CCD imager is sampled twice during one pixel period; once at the reference interval and
again at the data interval. Subtracting these two samples extracts the video information of the pixel and removes
any noise that is common—or correlated—to both intervals. Thus, the CDS reduces the reset noise and the low
frequency noises that are present on the CCD output signal. Figure 1 shows the simplified block diagram of the
CDS and input clamp.
−
+
CLPDM
VSP2270
OPA
C1 = 10 pF
C2 = 10 pF
SHP
SHD
CCDIN
SHP
CM (1.5 V)
CIN
CCD Output
Figure 1. Simplified Block Diagram of CDS and Input Clamp
The CDS is driven through an off-chip coupling capacitor CIN. AC-coupling is strongly recommended because
the dc level of the CCD output signal is usually too high (several volts) for the CDS to work properly. A 0.1-µF
capacitor is recommended for CIN, but it depends on the application environment.
Also, an o ff-chip emitter follower buffer is recommended to drive more than 10 pF, because the 10-pF sampling
capacitor and a few pF of stray capacitance can be seen at the input pin. The analog input signal range at pin 30
(CCDIN) is 1 Vp-p, and the appropriate common mode voltage for the CDS is around 0.5 to 1.5 V.
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PRINCIPLES OF OPERATION
correlated double sampler (CDS) (continued)
The reference level is sampled during the SHP active period, and the voltage level is held by the sampling
capacitor C 1 at the trailing edge of SHP. The data level is sampled during the SHD active period, and the voltage
level is held by the sampling capacitor C2 at the trailing edge of SHD. Then, the switched-capacitor amplifier
performs the subtraction of these two levels.
The user can select the active polarity of SHP/SHD (active high or active low) through the serial interface; refer
to the serial interface section for details. The default polarity of SHP/SHD is active low. Upon power on, this value
is not defined. For this reason, it must be set to the appropriate value by using the serial interface, and reset
to the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data sheet are
all based on active low polarity (default value).
input clamp and dummy pixel clamp
The buffered CCD output is capacitively coupled to the VSP2270 device. The input clamp restores the dc
component of the input signal that was lost with the ac-coupling and establishes the desired dc bias point for
the CDS. Figure 1 also shows a simplified block diagram of the input clamp. The input level is clamped to the
internal reference voltage CM (1.5 V) during the dummy pixel interval. Specifically, when both CLPDM and SHP
are active, the dummy clamp function becomes active. If the dummy pixels and/or the CLPDM pulse are not
available in your system, the CLPOB pulse can be used in place of the CLPDM pulse, as long as the clamping
takes place during black pixels. In this case, both the CPLDM (active at the same timing as CLPOB) and SHP
signals become active during the optical black pixel interval; then the dummy clamp function becomes active.
The user can select the active polarity of CLPDM and SHP (active high or active low) through the serial interface,
refer to the serial interface section for details. The default value of CLPDM and SHP is active low. Upon power
on, this value is not defined. For this reason, it must be set to the appropriate value by using the serial interface,
and reset to the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data
sheet are all based on active low polarity (default value).
high performance analog-to-digital converter (ADC)
The analog-to-digital converter (ADC) utilizes a fully differential and pipelined architecture. This ADC is well
suited for low voltage operation, low power consumption requirements, and high-speed applications. Ten-bit
resolution with no missing code is assured.
The VSP2270 device includes the reference voltage generator for the ADC. Positive reference voltage, pin 38
(REFP), negative reference voltage, pin 39 (REFN), and common-mode voltage, pin 37 (CM) must be bypassed
to the ground with a 0.1-µF ceramic capacitor. Do not use these voltages elsewhere in the system. They affect
the stability of these reference levels, which causes ADC performance degradation. Also, these are analog
output pins. Do not apply external voltages.
programmable gain amplifier (PGA)
Figure 2 shows the characteristics of the PGA gain. The PGA provides a gain range of –6 dB to 42 dB, which
is linear in dB. The gain is controlled by a digital code with 10-bit resolution, and it can be set through the serial
interface, refer to the serial interface section for details. The default value of the gain control code is 128 (PGA
gain = 0 dB).
Upon power on, this value is unknown. For this reason, it must be set to the appropriate value by using the serial
interface, and reset to the default value by strobing pin 45 (RESET).
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PRINCIPLES OF OPERATION
optical black (OB) level clamp loop
To extract the video information correctly, the CCD signal must be referenced to a well-established optical black
(OB) level. The VSP2270 device has an auto-calibration loop to establish the OB level, using the optical black
pixel output from the CCD imager. The input signal level of the OB pixels is identified as the real OB level, and
the loop must be closed while CLPOB is active. During the effective pixel interval, the reference level of the CCD
output signal is clampled to the OB level by the OB level clamp loop. To determine the loop time constant, a
required off-chip capacitor must be connected to pin 28 (COB). The time constant T is given the following
equation:
T+C
ǒ16384 IminǓ
where, C is the capacitor value connected to pin 28 (COB). I min is the minimum current (0.15 µA) of the control
DAC in the OB level clamp loop, and 0.15 µA is equivalent to 1 LSB of the DAC output current. When C is 0.1 µF,
the time constant T is 40.7 µs. The slew rate SR is given the following equation:
SR +Imax
C
where, C i s the capacitor value connected to pin 28 (COB). Imax is the maximum current (153 µA) of the control
DAC in the OB level clamp loop, and 153 µA is equivalent to 1023 LSB of the DAC output current.
Generally, the OB level clampling at high-speed causes clamp noise or white streak noise. However, the noise
is reduced by making C large. On the other hand, a large C requires a much longer time to restore from the
stand-by mode or right after the power goes ON. Therefore, 0.1 µF to 0.22 µF is considered the reasonable value
range for C. However, the value depends on the application environment. Make careful adjustments by the trial
and error method.
The OB clamp level (the pedestal level) is programmable through the serial interface, refer to the serial interface
section for details. Table 1 shows the relationship between input code and the OB clamp level.
The user can choose the active polarity of CLPOB (active high or active low) through the serial interface, refer
to the serial interface section for details. The default value of CLPOB is active low. Upon power on, this value
is unknown. For this reason, it must be set to the appropriate value by using the serial interface, and reset to
the default value by strobing pin 45 (RESET). The description and the timing diagrams in this data sheet are
all based on a polarity of active low (default value).
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PRINCIPLES OF OPERATION
Table 1. Programmable OB Clamp Level
INPUT CODE OB CLAMP LEVEL, LSBS OF 10 BITS
0000 0 LSB
0001 4 LSB
0010 8 LSB
0011 12 LSB
0100 16 LSB
0101 20 LSB
0110 24 LSB
0111 28 LSB
1000 (Default) 32 LSB
1001 36 LSB
1010 40 LSB
1011 44 LSB
1100 48 LSB
1101 52 LSB
1110 56 LSB
1111 60 LSB
Input Code for Gain Control ( 0 to 1023)
−10
0
10
20
30
40
50
0 200 400 600 800 1000
Gain − dB
GAIN
vs
INPUT CODE
Figure 2. The Characteristics of PGA Gain
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PRINCIPLES OF OPERATION
preblanking and data latency
The VSP2270 device has an input blanking (or preblanking) function.
When pin 19 (PBLK) goes low, the digital outputs go to all 0s at the 11th rising edge of ADCCK counting from
PBLK.
In this mode, the digital output data comes out on the rising edge of ADCCK with a delay of 11 clock cycles (data
latency i s 11). This is different from the preblanking mode, in which the digital output data comes out on the rising
edge of ADCCK with a delay of 9 clock cycles (data latency is 9).
If the input voltage is higher than the supply rail by 0.3 V, or lower than the ground rail by 0.3 V, then protection
diodes are turned on to prevent the input voltage from going further. Such a high signal swing, which may cause
damage to the VSP2270 device, must be avoided.
stand-by mode
For the purpose of saving power , the VSP2270 device can be put into the stand-by mode (or power down mode)
through the serial interface when the device is not in operation. Refer to the serial interface section for details.
In this mode, all the function blocks are disabled and the digital outputs are all 0s. Current consumption drops
to 2 mA.
As all bypass capacitors discharge during this mode, a substantial time (usually of the order of 200 ms to
300 ms) is required to restore the device from the stand-by mode.
additional output delay control
The VSP2270 device can control the delay time of output data by setting the register through the serial interface.
In some cases, the transition of output data affects analog performance. Generally, this is avoided by adjusting
the timing of ADCCK. In case ADCCK timing cannot be adjusted, this output delay control is ef fective in reducing
the influence of transient noise. Refer to the serial interface section for details.
voltage reference
All reference voltages and bias currents needed by the VSP2270 device are generated by internal bandgap
circuitry. The CDS and the ADC mainly use three reference voltages, positive reference, pin 38 (REFP),
negative reference, pin 39 (REFN), and common-mode voltage, pin 37 (CM). All REFP, REFN, and CM voltages
must be heavily decoupled with appropriate capacitors (for example: 0.1-µF ceramic capacitor). Do not use
these voltages elsewhere in the system. They affect the stability of these reference levels, which causes ADC
performance degradation. These are analog output pins. Do not apply external voltages.
Pins 29 (BYPP2), 31 (BYP), and 32 (BYPM) are also reference voltages to be used in the analog circuit. Pin 31
must be connected to ground with a 0.1-µF ceramic capacitor. The capacitor values for pins 29 and 32 affect
the step response. For many applications, 400 pF to 1000 pF is a reasonable value.
Depending on the application environment, TI recommends careful adjustment by the trial-and-error method.
Pins 29 (BYPP2), 31 (BYP), and 32 (BYPM) must be heavily decoupled with the appropriate capacitors. Do not
use these voltages elsewhere in the system. They affect the stability of these reference levels, which causes
performance degradation. These are analog output pins. Do not apply external voltages.
SLES019 − DECEMBER 2001
14 www.ti.com
PRINCIPLES OF OPERATION
serial interface
The serial interface has a 2-byte shift register and various parallel registers to control all the digitally
programmable features of the VSP2270 device. Writing to these registers is controlled by the signals at pins
46 (SLOAD), 48 (SCLK), 47 (SDATA), and 45 (RESET). To enable the shift register, SLOAD must be pulled low.
SDATA is the serial data input, and SCLK is the shift clock. The data at SDATA is taken into the shift register
at the rising edge of SCLK. The data length must be 2 bytes.
After the 2-byte shift operation, the data in the shift register is transferred to the parallel latch at the rising edge
of SLOAD. In addition to the parallel latch, there are several registers dedicated to the specific features of the
device, and they are synchronized with ADCCK clock. It takes 5 or 6 clock cycles for the data in the parallel latch
to be written to those registers. Thus, to complete the data updates requires 5 or 6 clock cycles after the parallel
latching by the rising edge of SLOAD.
Serial interface data format is shown in Table 2.
Table 2. Serial Interface Data Format
MSB LSB
REGISTERS TEST A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Configuration 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C0
PGA gain 0 0 0 1 0 0 G9 G8 G7 G6 G5 G4 G3 G2 G1 G0
OB clamp level 0 0 1 0 0 0 0 0 0 0 0 0 O3 O2 O1 O0
Clock polarity 0 0 1 1 0 0 0 0 0 0 0 0 0 P2 P1 P0
Output delay 0 1 0 0 0 0 0 0 0 0 0 0 0 0 J1 J0
Reserved 0 1 0 1 X X X X X X X X X X X X
Reserved 0 1 1 0 X X X X X X X X X X X X
Reserved 0 1 1 1 X X X X X X X X X X X X
Reserved 1 X X X X X X X X X X X X X X X
X = Don’t care
C0: Operation Mode, Normal/Stand-by
Serial interface and registers are always active, independent from the operation mode.
C0 = operation mode for the entire device without serial interface and registers. (C0 = 0 active, C0 = 1 stand-by)
G[9:0]: The Characteristics of PGA Gain (refer to Figure 2)
O[3:0]: Programmable OB Clamp Level (refer to Table 1)
P[2:0]: Clock Polarity
P0 = polarity for CLPDM
(P0 = 0 active low, P0 = 1 active high)
P1 = for CLPOB
(P0 = 0 active low, P0 = 1 active high)
P2 = for SHP/SHD
(P0 = 0 active low, P0 = 1 active high)
J[1:0]: Additional Output Delay Control
Control additional output data delay time.
SLES019 − DECEMBER 2001
15
www.ti.com
PRINCIPLES OF OPERATION
serial interface (continued)
Table 3. Output Delay Control
J1 J0 OUTPUT DATA DELAY TIME
0 0 Additional delay = 0 ns
0 1 Additional delay = 5 ns (typical)
1 0 Additional delay = 10 ns (typical)
1 1 Additional delay = 13 ns (typical)
Upon power on, these values are not defined. These registers must be set to an appropriate value by using the
serial interface, and reset to the default values by strobing pin 45 (RESET).
Default values are:
C[0] = 0: Normal operation mode
G[9:0] = 0010000000: PGA gain = 0 dB
O[3:0] = 1000: OB clamp level = 32 LSB
P[2:0] = 000: CLPDM, CLPOB, SHP/SHD are all active low. [The description and the timing
diagrams in this data sheet are all based on a polarity of active low (default
value).]
J[1:0] = 00: Additional output delay = 0 ns
timing
The CDS and the ADC are operated by SHP/SHD, and their derivative timing clocks generated by the on-chip
timing generator. The digital output data is synchronized with ADCCK. The timing relationship among the CCD
signal, SHP/SHD, ADCCK, and the output data is shown in the VSP2270 CDS timing specifications.
CLPOB activates the black level clamp loop during the OB pixel interval. CLPDM activates the input clamping
during the dummy pixel interval. If the CLPDM pulse is not available in your system, the CLPOB pulse can be
used in place of CLPDM, as long as the clamping takes place during black pixels, refer to the input clamp and
dummy pixel clamp section for details. When activating CLPOB and CLPDM on the same timing, the black level
may shift a few LSB on high gain. In this case, OB offset correction by the system is needed.
The clock polarities of SHP/SHD, CLPOB, and CLPDM can be independently set through the serial interface,
refer to the serial interface section for details. The description and the timing diagrams in this data sheet are
all based on active low polarity (default value). In order to keep a stable and accurate OB clamp level, CLPOB
must not be activated during the PBLK active period.
Refer to the preblanking and data latency section for details.
In the stand-by mode, all of ADCCK, SHP, SHD, CLPOB, and CLPDM are internally masked and pulled high.
power supply, grounding and device decoupling recommendations
The VSP2270 device incorporates a very high precision and high-speed ADC and analog circuitry that are
vulnerable to any extraneous noise from the rails or elsewhere. For this reason, although the VSP2270 device
has analog and digital supply pins, it must be treated as an analog component, and all supply pins except for
DRVDD must be powered by the only analog supply of the system. This will ensure the most consistent results,
since digital power lines often carry a high level of wide band noise that would otherwise be coupled into the
device and degrade the achievable performance.
SLES019 − DECEMBER 2001
16 www.ti.com
PRINCIPLES OF OPERATION
power supply, grounding and device decoupling recommendations (continued)
Proper grounding, short lead length, and the use of ground planes are also very important for high frequency
designs. Multilayer PC boards are recommended for the best performance, since they of fer distinct advantages
like minimizing ground impedance, separation of signal layers by ground layers, etc. Join the analog and digital
ground pins of the VSP2270 device together at the device and connect them only to the analog ground of the
system.
The driver stage of the digital outputs (B[9:0]) is supplied through a dedicated supply at pin 13 (DRVDD), and
it must be separated from the analog supply (VCC) at pins 18, 24, 27, 33, 34, and 40 completely or at least with
a ferrite bead. Keep the capacitive loading on the output data lines (pins 3−12) as low as possible (typically less
than 15 pF). Larger capacitive loads demand higher charging current surges that can feed back into the analog
portion of the VSP2270 device and af fect the performance. Use external buf fers or latches to provide the added
benefit of isolating the VSP2270 device from any digital noise activities on the data lines.
Resistors in series with each data line may help minimize the surge current. Values in the range of 100 Ω to
200 Ω limit the instantaneous current the output stage has to provide for recharging the parasitic capacitances
as the output levels change from low to high or high to low. Because of the high operation speed, the converter
also generates high frequency current transients and noises that are fed back into the supply and reference
lines.
This requires the supply and reference pins be sufficiently bypassed. In most cases, 0.1-µF ceramic chip
capacitors are adequate to decouple the reference pins. Supply pins must be decoupled to the ground plane
with a parallel combination of tantalum (1 µF to 22 µF) and ceramic (0.1 µF) capacitors. The effectiveness of
the decoupling largely depends on the proximity to the individual pin. Pin 13 (DRVDD) must be decoupled to the
proximity of pin 14 (DRVGND).
Pay special attention to the bypassing of pins 28 (COB), 29 (BYPP2), and 32 (BYPM), since these capacitor
values determine important analog performance of the device.
SLES019 − DECEMBER 2001
17
www.ti.com
MECHANICAL DATA
PT (S-PQFP-G48) PLASTIC QUAD FLATPACK
4040052/C 11/96
0,13 NOM
0,17
0,27
25
24
SQ
12
13
36
37
6,80
7,20
1
48
5,50 TYP
0,25
0,45
0,75
0,05 MIN
SQ
9,20
8,80
1,35
1,45
1,60 MAX
Gage Plane
Seating Plane
0,10
0°−ā7°
0,50 M
0,08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. This may also be a thermally enhanced plastic package with leads conected to the die pads.
SLES019 − DECEMBER 2001
18 www.ti.com
MECHANICAL DATA
RGN (S-PQFP-N48) PLASTIC QUAD FLATPACK
S
4202110/A 03/01
7,30
7,10
”B”
1
48
”A”
3x C0,20
C0,60 INDEX
DETAIL ”B”
”C”
DETAIL ”C”
DETAIL ”A”
6,95
7,05
7,10
7,30 7,05
6,95
0,75 NOM
0,50 NOM
0,75 NOM
0,50 NOM 0,27
0,17 0,25 −0,15
+0,40
0,50 NOM/2
0,50
0,95
1,00
MAX
0,00
0,05 0,47
0,23
0,25
0,09 0,05
0,00
0,17
0,27 0,17
0,23
0,09
0,25
0,21
0,09
−0,15
+0,40
3X 0,50
0,05
M
0,05 SAB
B
A
0,17 "0,05
S
S
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. These dimensions include package bend.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
VSP2270M ACTIVE VQFN RGN 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
VSP2270MG4 ACTIVE VQFN RGN 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
VSP2270Y ACTIVE LQFP PT 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
VSP2270YG4 ACTIVE LQFP PT 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
VSP2270YS OBSOLETE DIESALE Y 0 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
IMPORTANT NOTICE
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