PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
7604001EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
7604001FA ACTIVE CFP W 16 1 TBD Call TI Call TI
7604001FA ACTIVE CFP W 16 1 TBD Call TI Call TI
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
M38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
M38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
M38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
M38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54194, SN54LS194A, SN54S194, SN74194, SN74LS194A, SN74S194 :
•Catalog: SN74194, SN74LS194A, SN74S194
•Military: SN54194, SN54LS194A, SN54S194
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 4
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
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