GaAlAs-IR-Lumineszenzdiode (880 nm) und grune GaP-LED (565 nm) GaAlAs-Infrared-Emitter (880 nm) and green GaP-LED (565 nm) Lead (Pb) Free Product - RoHS Compliant SFH 7222 Wesentliche Merkmale Features * SMT-Gehause mit IR-Sender (880 nm) und grunem Sender (565 nm) * Geeignet fur SMT-Bestuckung * Gegurtet lieferbar * Sender und Empfanger getrennt ansteuerbar * SMT package with IR emitter (880 nm) and green emitter (565 nm) * Suitable for SMT assembly * Available on tape and reel * Emitter und detector can be controlled separately Anwendungen Applications * Kombination von Anzeigeelement mit: - Datenubertragung - Fernsteuerung - Infrarotschnittstelle * Combination of display with: - data transmission - remote control - infrared interface Typ Type Bestellnummer Ordering Code Gehause Package SFH 7222 Q65110A2742 SMT Multi TOPLED(R) 2007-04-02 1 SFH 7222 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value IRED LED Einheit Unit Betriebstemperatur Operating temperature range Top - 40 ... + 100 - 40 ... + 100 C Lagertemperatur Storage temperature range Tstg - 40 ... + 100 - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 5 V Durchlassstrom Forward current IF (DC) 100 30 mA Stostrom Surge current tp 10 s, D = 0 IFSM 2.5 0.5 A Verlustleistung Total power dissipation Ptot 180 100 mW Warmewiderstand Thermal resistance junction/ambient1) Rth JA 450 500 K/W Warmewiderstand Thermal resistance junction/ambient2) Rth JA 1) nur ein Chip betrieben / only one chip on 2) beide Chips betrieben / both chips on 650 Hinweis/Notes Die angegebenen Grenzdaten gelten fur einen Chip, wenn nicht anders angegeben. The stated maximum ratings refer to one chip, unless otherwise specified. 2007-04-02 2 K/W SFH 7222 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value IRED LED Einheit Unit Wellenlange der Strahlung Wavelength of peak emission IF = 100 mA peak 880 565 (IF = 10 mA) nm Dominantwellenlange Dominant wavelength IF = 10 mA dom - 570 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 80 25 (IF = 10 mA) nm Abstrahlwinkel Half angle 60 60 Grad deg. Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.4 x 0.4 0.25 x 0.25 mm2 Schaltzeiten Switching times 10%/90%, IF = 100 mA, RL = 50 tr , tf 500 450, 200 ns Kapazitat Capacitance VR = 0 V, f = 1 MHz Co 25 15 pF Durchlassspannung Forward voltage IF = 10 mA IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s VF Sperrstrom, VR = 5 V Reverse current V - 1.5 ( 1.8) 3.0 ( 3.8) 2.0 ( 2.6) - - IR 0.01 ( 1) 0.01 ( 10) A Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e 23 - mW Lichtstarke Luminous intensity IF = 2 mA IV - >0.25 mcd Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 100 mA TCI - 0.5 - 0.3 %/K 2007-04-02 3 SFH 7222 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value IRED LED Einheit Unit Temperaturkoeffizient von VF Temperature coefficient of VF IF = 100 mA TCV -2 - 1.4 mV/K Temperaturkoeffizient von Temperature coefficient of IF = 100 mA TC + 0.25 0.30 (peak) 0.07 (dom) nm/K Strahlstarke Ie der IRED in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie of the IRED in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Description Symbol Symbol Werte Values Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min. 4 mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ. 48 mW/sr IRED Radiation Characteristics Irel = f () LED Directional Characteristics Srel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 0.8 2007-04-02 0.6 0.4 0 20 40 60 80 100 4 120 SFH 7222 IRED Forward Current IF = f (VF) TA = 25 C OHR00881 10 1 F Rel Luminous Intensity IV / IV(10 mA) = f (IF) TA = 25 C Perm. Pulse Handling Capability IF = f (tp), Duty cycle D = parameter, TA = 25 C OHR00878 10 2 e e (100mA) A OHR00886 10 4 mA F D = 0.005 0.01 0.02 0.05 10 1 10 0 10 10 3 0.1 0.2 0 10 -1 0.5 10 -1 10 2 10 DC -2 10 -2 D= 10 -3 10 -3 0 1 2 3 4 5 6 V VF 8 Max. Permissible Forward Current IF = f (TA) F mA 100 10 0 10 1 10 2 10 3 mA 10 4 F OHR00877 100 rel % 80 80 R thjA = 450 K/W 60 60 40 40 20 20 0 0 20 2007-04-02 40 60 80 100 C 120 TA tp F T Relative Spectral Emission Irel = f () OHR00883 120 tp T 0 750 800 850 5 900 950 nm 1000 10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp SFH 7222 LED Forward Current IF = f (VF) TA = 25 C Relative Luminous Intensity IV / IV(10 mA) = f (IF), TA = 25 C OHF00577 10 2 F mA Perm. Pulse Handling Capability IF = f (tp) Duty cycle D = parameter, TA = 25 C OHF00578 10 1 OHL01686 10 3 IF V V (10 mA) D= mA 10 tP 5 green 10 -1 10 2 0.2 5 green 5 10 0 10 5 1.8 2.2 2.6 DC 10 -3 10 3.0 V 3.4 -1 5 10 0 10 5 1 mA 10 OHL00241 35 I F mA 30 10 1 -5 10 2 Wavelength at Peak Emission peak = f (TA), IF = 10 mA 10 -3 10 -2 10 -1 peak 25 Dominant Wavelength dom = f (TA), IF = 10 mA OHF00580 690 dom nm 10 0 s 10 1 tp OHF00579 690 nm 650 650 20 630 630 15 610 610 10 590 590 5 570 2 chips on 10 -4 F VF Max. Permissible Forward Current IF = f (TA) 0.5 -2 5 1.4 T 0.01 0.02 0.05 0.1 5 10 -1 1.0 IF T D = 0.005 10 0 1 tP 1 chip on green green 570 TA temp. ambient 0 550 0 20 40 60 80 C 100 0 20 40 60 80 C 100 T TA Forward Voltage VF = f (TA) IF = f (TA) Relative Luminous Intensity IV / IV(25 C) = f (IF), IF = 10 mA OHF00581 2.4 VF V OHF00582 2.0 V V (25 C) 2.2 2.0 1.6 1.2 green green 1.8 0.8 1.6 0.4 1.4 0 20 40 60 80 C 100 0.0 0 20 40 TA 2007-04-02 60 80 C 100 TA 6 550 0 20 40 60 80 C 100 TA SFH 7222 Mazeichnung Package Outlines 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 2.1 (0.083) 1.7 (0.067) 0.1 (0.004) (typ.) 1 4 0.9 (0.035) 0.7 (0.028) 1.1 (0.043) 3.7 (0.146) 3.3 (0.130) Package marking 0.5 (0.020) 3 (2.4 (0.095)) 2 3.4 (0.134) 3.0 (0.118) 0.8 (0.031) 0.6 (0.024) 0.6 (0.024) 0.4 (0.016) 0.18 (0.007) 0.12 (0.005) GEOY7023 Mae in mm (inch) / Dimensions in mm (inch). Gehause / Package wei, klarer Verguss / white, clear resin Anschlussbelegung pin configuration 1: Kathode (cathode) 880nm 2: Anode (anode) 880nm 3: Kathode (cathode) 565nm 4: Anode (anode) 565nm 2007-04-02 7 SFH 7222 Empfohlenes Lotpaddesign Recommended Solder Pad 3.3 (0.130) 3.3 (0.130) 0.4 (0.016) 2.6 (0.102) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Kathoden Markierung / Cathode marking 7.5 (0.295) 0.5 (0.020) 1.5 (0.059) 4.5 (0.177) 1.1 (0.043) Cu Flache / <_ 12 mm 2 per pad Cu-area Lotstoplack Solder resist OHLPY439 Mae in mm (inch) / Dimensions in mm (inch). 2007-04-02 8 SFH 7222 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 255 C 240 C T 250 C 260 C +0 -5 C 245 C 5 C C 235 C +5 -0 C 217 C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 C 0 0 50 100 150 200 250 s 300 t Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 t 2007-04-02 9 s 250 SFH 7222 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-02 10