RPM871-H12 Photo Link Module IrDA Infrared communication Module RPM871-H12 RPM871-H12 is an infrared communication module for IrDA Ver. 1.2 (Low Power). The infrared LED, PIN photo diode, LSI are all integrated into a single package. This module is designed with power down function and low current consumption at stand-by mode. The ultra small package makes it a perfect fit for mobile devices. zFeatures 1) Infrared LED, PIN photo diode, LED driver & Receiver frequency formation circuit built in. Improvement of EMI noise protection because of Shield Case. 2) Applied to SIR (2.4 to 115.2kbps) 3) VCC supply voltage range is from 2.6V to 3.6V. 4) Surface mount type. 5) Power down function built in. 6) Adjustable communication distance by LED load resistance value. (approximately 20cm to 60cm) zApplications Cellular phone, PDA, DVC, Digital Still Camera, Printer, Handy Terminal etc. zAbsolute maximum ratings (Ta=25C) Parameter Symbol Limits Unit Vmax 7.01 V Vin -0.3 to Vcc+0.3 V Operation temperature Topr -20 to +85 C Storage temperature Tstg -30 to +100 C LED peak current IFP 2002 mA Power dissipation Pd 1503 mW Supply voltage Input voltage 1 This applies to all pins basis ground pins (1.4pin) 2 LED peak current<90s. ON duty<20% 3 When glass-epoxy board (70x70x1.6mm) mounted. In case operating environment is over 25C, 2mW would be reduced per each 1C stepping up. zRecommended operating conditions (Ta=25C) Parameter Supply voltage LED supply voltage Symbol Min. Typ. Max. Unit VCC 2.6 3.0 3.6 V LEDVCC 2.6 2.8 5.5 V 1/7 RPM871-H12 Photo Link Module zBlock diagram and application circuit AMP 2 1 AMP GND NC VCC AMP 3 VCC GND 4 GND C1 PWDOWN PWDOWN 5 7 6 POWER DOWN RXD RXD TXD TXD R1 (LEDVCC) 8 LEDA LED DRIVER VCC (3pin) and VLEDA (8pin) can be used on either common power source or different one 2/7 RPM871-H12 Photo Link Module zTerminal description Circuit Function Pin No Terminal 1, 4 GND 2 NC This Terminal must be left open. VCC VCC For preventing from infection, connect a capacitor between VCC (3pin) and GND (4pin). 3 GND Pin1 and Pin4 must be connected to the ground. VCC 5 Power-down Control Terminal H : POWERDOWN L : OPERATION CMOS Logic Level Input When input is H, it will stop the receiving circuit, Pin-PD current and transmitting LED operation. PWDOWN VCC PWDOWN 6 VCC 300k RXD VCC 7 TXD 200K 8 LEDA - Shield Case LED Receiving Data Output Terminal CMOS Logic Level Output When PWDOWN (5pin)=H, the RXD output will be pulled up to VCC at approximately 300k. Transmitting Data Input Terminal H : LED (PWDOWN=L) CMOS Logic Level Input Holding TXD="H" status, LED will be turn off approximately 45s. LED ANODE Terminal Other power source can be used difference between LEDVCC and VCC. LED current depends on LED load resistance value. Connect to Ground. 3/7 RPM871-H12 Photo Link Module zElectrical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta=25C) Parameter Symbol Min. Consumption current1 ICC1 - 73 99 A Stand-by for receiving At no input light Consumption current2 ICC2 - 0.01 0.2 A PWDOWN PIN High At no input light 2.4 - 115.2 kbps PWDOWN input high voltage VPDH VCC-0.55 - - V PWDOWN input low voltage VPDL - - 0.55 V PWDOWN input high current IPDH -1.0 0 1.0 A PWDOWN=VCC [V] PWDOWN input low current IPDL -1.0 0 1.0 A PWDOWN=0 [V] TXD input high voltage VTXH VCC-0.55 - - V TXD input low voltage VTXL - - 0.55 V TXD input high current ITXH 7 14 28 A TXD=VCC [V] Transmission rate Typ. Max. Unit Conditions ITXL -1.0 0 1.0 A TXD=0 [V] ILEDA - 144 - mA R1=7.5 [] RXD output high voltage VRXH VCC-0.5 - - V IRXH= -50A RXD output low voltage TXD input low current LED anode current VRXL - - 0.4 V IRXL=200A RXD output rise time tRR - 70 - ns CL=15pF RXD output fall time tFR - 30 - ns CL=15pF twRXD 1.5 2.3 3.6 s CL=15pF, 2.4 to 115.2kbps tRT - 100 300 s RXD output pulse width Receiver latency time zOptical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta=25C) Symbol Min. Typ. Max. Unit Peak wave length Parameter P 850 870 900 nm Intensity1 IE1 14.4 36 93.6 mW/Sr Half-angle L/2 - 18 30 deg Rise time / Fall time Tr/Tf Optical over shoot - - 100 ns - - 25 % Edge jitter Tj -40 - 40 Irradiance in angular Ee 0.0068 - 500 D/2 15 - - deg TLEDmax 10 45 120 s Input half-angle Maximum emitting time Conditions -15 L 15 R1=7.5 [] 10% to 90% ns mW/cm2 -15deg L +15deg TXD=VCC 1. This product is not designed for protection against radioactive rays. 2. This product dose not include laser transmitter. 3. This product includes one PIN photo diode. 4. This product dose not include optical load. 4/7 RPM871-H12 Photo Link Module zTiming chart (Emitting side) TXD (7pin) less than 45s more than 45s (emitting) (emitting) (emitting) Internal LED (Light output) approximately 45s (Detecting side) Light input less than 2.3s more than 2.3s RXD (6pin) pull up to VCC at approximately 300k approximately 2.3s approximately 2.3s PWDOWN (5pin) zAttached components Recommended values Part symbol C1 R1 Recommended value 1F, tantalum or ceramic Ex.) TCFGA1A105M8R (ROHM) 7.55%, 1/4W (VLEDVCC=2.8V) Notice Bigger capacitance is recommended with much noise from power supply More than 60cm distance, more than 4[W/cm2] at detecting side. (vs ver1.0) More than 46cm distance, more than 6.8[W/cm2] at detecting side. (vs RPM871-H12) In case of using R1 with different condition from the above, formula is as follows : LED resistance value : R1[], LED average consumption current : ILED[mA], Supply voltage : VLEDVCC[V], necessary d[cm] (Including LED's distribution within 15deg) R1=T x (VLEDVCC-4.45) / d2-3.5 [] ILED=Duty x (VLEDVCC-1.36) / (R1+2.5) [A] Duty : LED duty at emitting T : 17300 (vs. RPM871-H12), 29400 (vs. ver1.0) Please set up to be ILED / Duty < 200[mA] (Duty < 20%) 5/7 RPM871-H12 Photo Link Module zNotes 1) LEDVCC (8pin) and VCC (3pin) * Other power source can be used difference between LEDVCC and VCC. 2) Caution in designing board lay-out To get maximum potential from RPM871-H12, please keep in mind following instruction. * The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H12 pin lead. Better not to be close to photo diode side (1pin). This is to minimize feedback supplied to photo diode from RXD. * As for C1 between 3-4 pin should be placed close to RPM871-H12. * Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts which generates noise, such as DC / DC converter. 3) Others * Please be sure to set up the TXD (7pin) input to be "L" (under 0.55V) except transmitting data (for < 90s, on duty < 20%). * Power down current might increase if exposed by strong light (ex. direct sunlight) at powerdown mode. * Please use by the signal format which is specified by IrDA Ver1.2 (2.4k to 115.2kbps). There might be on error if used by different signal format. MAXIMUM LED PEAK CURRENT : Iledp (mA) 4) LED current derating and ambient temperature The relation between LED peak current and maximum ambient temperature is shown below. We recommend you to use within the range as indicated in below. a) When glass-epoxy board (70x70x1.6mm) mounted. 250 Duty=10% 200 150 Duty=20% 100 50 0 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta (C) MAXIMUM LED PEAK CURRENT : Iledp (mA) b) RPM871-H12 250 Duty=10% 200 150 Duty=20% 100 50 0 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta (C) 6/7 RPM871-H12 Photo Link Module zExternal dimensions (Unit : mm) 0.840.1 1.75 LED PinPD 0.150.1 2.0 2.4 3.0 0.6 3.0 8.0 5.6 2.49 0.56 8 A Part Size (Shield Case underside size) 0.370.1 0.75 1 P0.95x7=6.65 7.6 3.0 0.60.1 0.680.1 NOTE 0.60.1 2.72 2.8 A TOLERANCE 0.2mm COPLANARITY:0.1mmMAX UNIT:mm ETH450 7/7 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction. Appendix1-Rev1.1