84324AM www.icst.com/products/hiperclocks.html REV. A JANUARY 22, 2003
9
Integrated
Circuit
Systems, Inc.
ICS84324
CRYSTAL-TO-3.3V L VPECL
FREQUENCY SYNTHESIZER WITH FANOUT BUFFER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS84324.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS84324 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 135mA = 468mW
•Power (outputs)MAX = 30.2mW/Loaded Output pair
If all outputs are loaded, the total power is 6 * 30.2mW = 181mW
Total Power_MAX (3.465V, with all outputs switching) = 468mW + 181mW = 649mW
2. Junction T emperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly af fects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient T emperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 43°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.649W * 43°C/W = 98°C. This is well below the limit of 125°C
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow ,
and the type of board (single layer or multi-layer).
qJA by V elocity (Linear Feet per Minute)
0 200 500
Multi-Layer PCB, JEDEC Standard Test Boards 50°C/W 43°C/W 38°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE qJA FOR 24-PIN SOIC, FORCED CONVECTION