SP211ECA-L - EXAR - Datasheet.Directory

SP207E–SP213E

+5V High Performance RS232 Transceivers

■Single +5V Supply Operation

■0.1µF External Charge Pump Capacitors

■Typical 230kbps Transmission Rates

■Standard SOIC and SSOP Packages

■Lower Supply Current Than Competition

(typical 3mA)

■1µA Shutdown Mode

■WakeUp Feature in Shutdown Mode

■Tri–State Receiver Outputs

■Meets All EIA-232 and ITU V.28

Specifications

■Improved ESD Specifications:

+15kV Human Body Model

+15kV IEC1000-4-2 Air Discharge

+8kV IEC1000-4-2 Contact Discharge

Number of RS232 No. of Receivers No. of External

Model Drivers Receivers Active in Shutdown 0.1µF Capacitors Shutdown WakeUp TTL Tri–State

SP207E 53 0 4 NoNoNo

SP208E 44 0 4 NoNoNo

SP211E 4 5 0 4 Yes No Yes

SP213E 4 5 2 4 Yes Yes Yes

Table 1. Model Selection Table

DESCRIPTION

The SP200E Series are enhanced multi–channel RS-232 line transceivers with improved

electrical performance. The SP200E family is pin-to-pin compatible with our previous SP200

family as well as popular industry standards. As with the orignal SP200 family, all models in this

Series feature low–power CMOS construction and Sipex–patented (5,306,954) on-board

charge pump circuitry to generate the ±10V RS-232 voltage levels, using 0.1µF charge pump

capacitors to save board space and reduce circuit cost. The SP211E and SP213E models feature

a low–power shutdown mode, which reduces power supply drain to 1µA. Enhancements include

lower power supply current at 3mA typical (no load) and superior ESD performance. The ESD

tolerance has been improved on this family to over ±15kV for both Human Body Model and

IEC1000-4-2 Air Discharge test methods.

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional

operation of the device at these or any other

above those indicated in the operation sections

of the specifications below is not implied. Exposure

to absolute maximum rating conditions for extended

periods of time may affect reliability.

VCC .................................................................. +6V

V+.......................................(VCC – 0.3V) to +13.2V

V–................................................................ 13.2V

Input Voltages

TIN ..........................................–0.3V to (VCC +0.3V)

RIN ................................................................ ±20V

Output Voltages

TOUT ................................(V+, +0.3V) to (V–, –0.3V)

ROUT .......................................–0.3V to (VCC +0.3V)

Short Circuit Duration on TOUT .............. Continuous

PARAMETER MIN. TYP. MAX. UNIT CONDITIONS

TTL INPUTS TIN, EN, SD

Logic Threshold

VIL 0.8 Volts

VIH 2.0 Volts

Logic Pullup Current 15 200 µAT

IN = 0V

Maximum Transmssion Rate 120 230 kbps CL = 1000pF, RL = 3KΩ

TTL OUTPUTS

Compatibility TTL/CMOS

VOL 0.4 Volts IOUT = 3.2mA; VCC = +5V

VOH 3.5 Volts IOUT = –1.0mA

Leakage Current 0.05 +10 µA0V ≤ ROUT ≤ VCC ; SP211 EN = 0V;

SP213 EN = VCC

TA = +25°C

RS232 OUTPUT

Output Voltage Swing +5 +7 Volts All transmitter outputs loaded

with 3KΩ to ground

Output Resistance 300 ΩVCC = 0V; VOUT = +2V

Output Short Circuit Current +25 mA Infinite duration, VOUT = 0V

RS232 INPUT

Voltage Range –15 +15 Volts

Voltage Threshold

Low 0.8 1.2 Volts VCC = 5V, TA = +25°C

High 1.7 2.8 Volts VCC = 5V, TA = +25°C

Hysteresis 0.2 0.5 1.0 Volts VCC = +5V

Resistance 3 5 7 kΩVIN =+15V; TA = +25°C

DYNAMIC CHARACTERISTICS

Driver Propagation Delay 1.5 µs TTL–to–RS-232

Receiver Propagation Delay 0.5 1.5 µs RS-232–to–TTL

Instantaneous Slew Rate 30 V/µsC

= 50pF, RL = 3–7KΩ;

TA = +25°C; from +3V

Transition Time 1.5 µsC

= 2,500pF, RL = 3KΩ;

measured from +3V to –3V

or –3V to +3V

Output Enable Time 400 ns

Output Disable Time 250 ns

SPECIFICATIONS

VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.

Power Dissipation Per Package

24-pin SSOP (derate 11.2mW/oC above +70oC)....900mW

24-pin PDIP (derate 15.9mW/oC above +70oC)....1300mW

24-pin SOIC (derate 12.5mW/oC above +70oC)...1000mW

28-pin SSOP (derate 11.2mW/oC above +70oC)....900mW

28-pin SOIC (derate 12.7mW/oC above +70oC)...1000mW

Transmitter Output @ 120kbps

RL=3KΩ, CL=2,500pF

Transmitter Output @ 120kbps

RL=3KΩ, CL=1,000pF

Transmitter Output @ 240kbps

RL=3KΩ, CL=1,000pF Transmitter Output @ 240kbps

RL=3KΩ, CL=2,500pF

SPECIFICATIONS

VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.

PARAMETER MIN. TYP. MAX. UNIT CONDITIONS

POWER REQUIREMENTS

VCC

SP207 4.75 5.00 5.25 Volts

All other parts 4.50 5.00 5.50 Volts

ICC TA = +25°C

3 6 mA No load; VCC = ±10%

15 mA All transmitters RL = 3KΩ

Shutdown Current 1 10 µAT

= +25°C

ENVIRONMENTAL AND MECHANICAL

Operating Temperature

Commercial, –C 0 +70 °C

Extended, –E –40 +85 °C

Storage Temperature –65 +125 °C

Package

–A Shrink (SSOP) small outline

–T Wide (SOIC) small outline

–P Narrow (PDIP) Plastic Dual-In-Line

PINOUT

SP213E

OUT

GND

V+

–

OUT

SHUTDOWN (SD)

OUT

V–

–

SP211E

OUT

GND

V+

–

OUT

SHUTDOWN (SD)

OUT

V–

–

SP208E

OUT

GND

V+

–

OUT

V–

–

SP207E

OUT

GND

V+

–

OUT

V–

–

FEATURES

As in the original RS-232 multi-channel

products, the SP207E Series multi–channel

RS-232 line transceivers provide a variety of

configurations to fit most communication

needs, especially those applications where +12V

is not available. All models in this Series feature

low–power CMOS construction and SIPEX–

proprietary on-board charge pump circuitry to

generate the +10V RS-232 voltage levels. The

ability to use 0.1µF charge pump capacitors

saves board space and reduces circuit cost.

Different models within the Series provide

different driver/receiver combinations to

match any application requirement.

The SP211 and SP213E models feature a low–

power shutdown mode, which reduces power

supply drain to 1µA. The SP213E includes a

Wake-Up function which keeps two receivers

active in the shutdown mode, unless disabled by

the EN pin.

The family is available in 28–pin SO (wide) and

SSOP (shrink) small outline packages. Devices

can be specified for commercial (0°C to +70°C)

and industrial/extended (–40°C to +85°C)

operating temperatures.

THEORY OF OPERATION

The SP207E Series devices are made up of

three basic circuit blocks — 1) transmitter/

driver, 2) receiver and 3) the SIPEX–

proprietary charge pump. Each model within

the Series incorporates variations of these

circuits to achieve the desired configuration

and performance.

Charge–Pump

The charge pump is a Sipex–patented design

(5,306,954) and uses a unique approach

compared to older less–efficient designs. The

charge pump still requires four external capacitors,

but uses a four–phase voltage shifting technique

to attain symmetrical 10V power supplies.

Figure 3a shows the waveform found on the

positive side of capcitor C2, and Figure 3b

shows the negative side of capcitor C2. There is

a free–running oscillator that controls the four

phases of the voltage shifting. A description of

each phase follows.

Phase 1

— VSS charge storage —During this phase of the

clock cycle, the positive side of capacitors C1

and C2 are initially charged to +5V. Cl+ is then

switched to ground and the charge in C1– is

transferred to C2–. Since C2+ is connected to

+5V, the voltage potential across capacitor C2 is

now 10V.

Phase 2

— VSS transfer — Phase two of the clock

connects the negative terminal of C2 to the VSS

storage capacitor and the positive terminal of C2

to ground, and transfers the generated –l0V to

C3. Simultaneously, the positive side of

capacitor C 1 is switched to +5V and the negative

side is connected to ground.

Phase 3

— VDD charge storage — The third phase of the

clock is identical to the first phase — the charge

transferred in C1 produces –5V in the negative

terminal of C1, which is applied to the negative

side of capacitor C2. Since C2+ is at +5V, the

voltage potential across C2 is l0V.

= +5V

–5V –5V

+5V

Storage Capacitor

–

––

Figure 1. Charge Pump — Phase 1

Figure 2. Charge Pump — Phase 2

Figure 3. Charge Pump Waveforms

+10V

a) C2+

GND

b) C2–

–10V

Phase 4

— VDD transfer — The fourth phase of the clock

connects the negative terminal of C2 to ground,

and transfers the generated l0V across C2 to C4,

the VDD storage capacitor. Again, simultaneously

with this, the positive side of capacitor C1 is

switched to +5V and the negative side is

connected to ground, and the cycle begins again.

Since both V+ and V– are separately generated

from VCC; in a no–load condition V+ and V– will

be symmetrical. Older charge pump approaches

that generate V– from V+ will show a decrease in

the magnitude of V– compared to V+ due to the

inherent inefficiencies in the design.

The clock rate for the charge pump typically

operates at 15kHz. The external capacitors can

be as low as 0.1µF with a 16V breakdown

voltage rating.

Transmitter/Driver

The drivers are inverting transmitters, which

accept either TTL or CMOS inputs and output the

RS-232 signals with an inverted sense relative to

the input logic levels. Typically, the RS-232

output voltage swing is +9V with no load, and +5V

minimum with full load. The transmitter outputs

are protected against infinite short–circuits to

ground without degradation in reliability. The

drivers of the SP211E, and SP213E can be

tri–stated by using the SHUTDOWN function.

In the “power-off” state, the output impedance will

remain greater than 300 ohms, again satisfying the

RS-232 specifications. Should the input of the

driver be left open, an internal 400Kohm pullup

resistor to VCC forces the input high, thus committing

the output to a low state. The slew rate of the

transmitter output is internally limited to a

maximum of 30V/µs in order to meet the EIA

standards (EIA RS-232D 2.1.7, Paragraph 5). The

transition of the loaded output from high to low

also meets the monotonicity requirements of the

standard.

= +5V

–10V

Storage Capacitor

–

––

Figure 4. Charge Pump — Phase 3

= +5V

–5V

+5V

–5V

Storage Capacitor

–

––

Receivers

The receivers convert RS-232 input signals to

inverted TTL signals. Since the input is usually

from a transmission line where long cable lengths

and system interference can degrade the signal,

the inputs have a typical hysteresis margin of

500mV. This ensures that the receiver is virtu-

ally immune to noisy transmission lines. Should

an input be left unconnected, a 5kΩ pulldown

resistor to ground will commit the output of the

receiver to a high state.

SHUTDOWN MODE

The SP211E, and SP213E all feature a control

input which will disable the device and reduce

the power supply current to less than 10µA,

making the parts ideal for battery–powered

systems. In the “shutdown” mode the receivers

and transmitters will both be tri–stated. The V+

output of the charge pump will discharge to VCC,

and the V– output will discharge to ground.

Products with the Wake-Up function can enable

or disable the receivers during shutdown.

Figure 5. Charge Pump — Phase 4

= +5V

+10V

Storage Capacitor

–

––

For complete shutdown to occur and the 10µA

power drain to be realized, the following

conditions must be met:

SP211E:

• +5V must be applied to the SD pin

• ENABLE must be either 0V, +5.0V or not

connected

• the transmitter inputs must be either +5.0V

or not connected

• VCC must be +5V

• Receiver inputs must be >0V and <+5V

SP213E:

• 0V must be applied to the SD pin

• ENABLE must be either 0V, +5.0V or not

connected

• the transmitter inputs must be either +5.0V

or not connected

• VCC must be +5V

• Receiver inputs must be >0V and <+5V

Figure 6. Wake–Up Timing

+5V

ENABLE

DISABLE

OUT

DATA VALID

+5V

OUT

+5V

OUT

WAIT

0 (POWERUP)

ENABLE

DISABLE

POWER UP WITH SD ACTIVE (Charge pump in shutdown mode)

POWER UP WITH SD DISABLED (Charge pump in active mode)

0 (POWERUP)

ENABLE

DATA VALID

DATA VALID DATA VALID DATA VALID

EXERCISING WAKE–UP FEATURE

0 (POWERUP)

ENABLE

WAIT

DISABLE DISABLEENABLE

WAIT

= 2ms typical, 3ms maximum

ENABLE

= 1ms typical, 2ms maximum

= +5V ±10%; T

= 25°C

SP213E Only Power Receiver

SD EN SD EN Up/Down Outputs

0 0 1 1 Up Enable

0 1 1 0 Up Tri–state

1 0 0 1 Down Enable

1 1 0 0 Down Tri–state

Table 2. Wake–Up Truth Table

ENABLE

The SP211E and SP213E all feature an enable

input, which allows the receiver outputs to be

either tri–stated or enabled. This can be especially

useful when the receiver is tied directly to a

microprocessor data bus. For the SP211E, enable

is active low; that is, 0V applied to the ENABLE

pin will enable the receiver outputs. For the

SP213E, enable is active high; that is, +5V

applied to the ENABLE pin will enable the

receiver outputs.

WAKEUP FUNCTION

The SP213E has a wake–up feature that keeps

two receivers (R4 and R5) in an enabled state

when the device is in the shutdown mode. With

only the receivers active during shutdown, the

devices draw 5–10µA of supply current.

A typical application of this function would be

where a modem is interfaced to a computer in a

power–down mode. The ring indicator signal

from the modem could be passed through an

active receiver in the SP213E that is itself in the

shutdown mode. The ring indicator signal would

propagate through the SP213E to the power

management circuitry of the computer to power

up the microprocessor and the SP213E drivers.

After the supply voltage to the SP213E reaches

+5.0V, the SHUTDOWN pin can be disabled,

taking the SP213E out of the shutdown mode.

All receivers that are active during shutdown

maintain 500mV (typ.) of hysteresis.

ESD TOLERANCE

The SP207E Family incorporates ruggedized

ESD cells on all driver output and receiver input

pins. The ESD structure is improved over our

previous family for more rugged applications

and environments sensitive to electro-static

discharges and associated transients. The

improved ESD tolerance is at least +15kV

without damage nor latch-up.

SW1SW1 SW2SW2

Device

Under

Test

DC Power

Source

SW1 SW2

There are different methods of ESD testing

applied: a) MIL-STD-883, Method 3015.7

b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

The Human Body Model has been the generally

accepted ESD testing method for semiconductors.

This method is also specified in MIL-STD-883,

Method 3015.7 for ESD testing. The premise of

this ESD test is to simulate the human body’s

potential to store electro-static energy and discharge

it to an integrated circuit. The simulation is

performed by using a test model as shown in

Figure 7. This method will test the IC’s capability

to withstand an ESD transient during normal

handling such as in manufacturing areas where the

ICs tend to be handled frequently.

The IEC-1000-4-2, formerly IEC801-2, is generally

used for testing ESD on equipment and systems.

For system manufacturers, they must guarantee a

certain amount of ESD protection since the system

itself is exposed to the outside environment and

human presence. The premise with IEC1000-4-2

is that the system is required to withstand an

amount of static electricity when ESD is applied to

points and surfaces of the equipment that are

accessible to personnel during normal usage. The

transceiver IC receives most of the ESD current

when the ESD source is applied to the connector

pins. The test circuit for IEC1000-4-2 is shown on

Figure 8. There are two methods within IEC1000-

4-2, the Air Discharge method and the Contact

Discharge method.

Figure 7. ESD Test Circuit for Human Body Model

RRS S andand RRV V add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.

RS and RV add up to 330Ω for IEC1000-4-2.

Contact-Discharge ModuleContact-Discharge Module

SW1SW1 SW2SW2

Device

Under

Test

DC Power

Source

SW1 SW2

Contact-Discharge Module

Figure 8. ESD Test Circuit for IEC1000-4-2

Figure 9. ESD Test Waveform for IEC1000-4-2

With the Air Discharge Method, an ESD voltage is

applied to the equipment under test (EUT) through

air. This simulates an electrically charged person

ready to connect a cable onto the rear of the system

only to find an unpleasant zap just before the

person touches the back panel. The high energy

potential on the person discharges through an

arcing path to the rear panel of the system before he

or she even touches the system. This energy,

whether discharged directly or through air, is

predominantly a function of the discharge current

rather than the discharge voltage. Variables with

an air discharge such as approach speed of the

object carrying the ESD potential to the system

and humidity will tend to change the discharge

current. For example, the rise time of the discharge

current varies with the approach speed.

The Contact Discharge Method applies the ESD

current directly to the EUT. This method was

devised to reduce the unpredictability of the ESD

arc. The discharge current rise time is constant

since the energy is directly transferred without the

air-gap arc. In situations such as hand held systems,

the ESD charge can be directly discharged to the

equipment from a person already holding the

equipment. The current is transferred on to the

keypad or the serial port of the equipment directly

and then travels through the PCB and finally to the IC.

The circuit model in Figures 7 and 8 represent the

typical ESD testing circuit used for all three

methods. The CS is initially charged with the DC

power supply when the first switch (SW1) is on.

Now that the capacitor is charged, the second

switch (SW2) is on while SW1 switches off. The

voltage stored in the capacitor is then applied

through RS, the current limiting resistor, onto the

device under test (DUT). In ESD tests, the SW2

switch is pulsed so that the device under test

receives a duration of voltage.

t=0ns t=30ns

15A

30A

t ➙

i ➙

For the Human Body Model, the current limiting

resistor (RS) and the source capacitor (CS) are

1.5kΩ an 100pF, respectively. For IEC-1000-4-2,

the current limiting resistor (RS) and the source

capacitor (CS) are 330Ω an 150pF, respectively.

The higher CS value and lower RS value in the

IEC1000-4-2 model are more stringent than the

Human Body Model. The larger storage capacitor

injects a higher voltage to the test point when SW2

is switched on. The lower current limiting resistor

increases the current charge onto the test point.

DEVICE PIN HUMAN BODY IEC1000-4-2

TESTED MODEL Air Discharge Direct Contact Level

Driver Outputs +15kV +15kV +8kV 4

Receiver Inputs +15kV +15kV +8kV 4

Specification RS–232D RS–423A RS–422 RS–485 RS–562

Mode of Operation Single–Ended Single–Ended Differential Differential Single–Ended

No. of Drivers and Receivers 1 Driver 1 Driver 1 Driver 32 Drivers 1 Driver

Allowed on One Line 1 Receiver 10 Receivers 10 Receivers 32 Receivers 1 Receiver

Maximum Cable Length 50 feet 4,000 feet 4,000 feet 4,000 feet C ≤ 2,500pF @ <20Kbps;

C ≤1,000pF @ >20Kbps

Maximum Data Rate 20Kb/s 100Kb/s 10Mb/s 10Mb/s 64Kb/s

Driver output Maximum Voltage ±25V ±6V –0.25V to +6V –7V to +12V –3.7V to +13.2V

Driver Output Signal Level

Loaded ±5V ±3.6V ±2V ±1.5V ±3.7V

Unloaded ±15V ±6V ±5V ±5V ±13.2V

Driver Load Impedance 3 – 7Kohm 450 ohm 100 ohm 54 ohm 3–7Kohm

Max. Driver Output Current

(High Impedance State)

Power On ±100µA

Power Off VMAX/300 100µA±100µA±100µA

Slew Rate 30V/µs max. Controls Provided 30V/µs max.

Receiver Input Voltage Range ±15V ±12V –7V to +7V –7V to +12V ±15V

Receiver Input Sensitivity ±3V ±200mV ±200mV ±200mV ±3V

Receiver Input Resistance 3–7Kohm 4Kohm min. 4Kohm min. 12Kohm min. 3–7Kohm

Table 4. EIA Standard Definitions

EIA STANDARDS

The Electronic Industry Association (EIA)

developed several standards of data transmission

which are revised and updated in order to meet

the requirements of the industry. In data

processing, there are two basic means of

communicating between systems and components.

The RS--232 standard was first introduced in

1962 and, since that time, has become an

industry standard.

Table 3. Transceiver ESD Tolerance Levels

The RS-232 is a relatively slow data exchange

protocol, with a maximum baud rate of only

20kbps, which can be transmitted over a

maximum copper wire cable length of 50 feet.

The SP207E through SP213E Series of data

communications interface products have been

designed to meet both the EIA protocol

standards, and the needs of the industry.

TYPICAL APPLICATION CIRCUITS...SP207E TO SP213E

+5V INPUT

400KOHM

OUT

0.1µF

6.3V 0.1µF

6.3V

0.1µF

16V

0.1µF

16V

0.1µF

6.3V

–

400KOHM

OUT

400KOHM

OUT

400KOHM

OUT

OUT R

SP207E

TTL/CMOS INPUTS

RS-232 OUTPUTS

GND

OUT R

TTL/CMOS OUTPUTS

RS-232 INPUTS

5KOHM

400KOHM

OUT

21 20

+5V INPUT

400KOHM

OUT

0.1µF

6.3V 0.1µF

6.3V

0.1µF

16V

0.1µF

16V

0.1µF

6.3V

–

400KOHM

OUT

400KOHM

OUT

400KOHM

OUT

OUT R

SP208E

TTL/CMOS INPUTS

RS-232 OUTPUTS

GND

OUT R

22 23

TTL/CMOS OUTPUTS

RS-232 INPUTS

5KOHM

OUT R

17 16

5KOHM

+5V INPUT

400KOHM

OUT

0.1µF

6.3V 0.1µF

6.3V

0.1µF

16V

0.1µF

16V

0.1µF

6.3V

–

400KOHM

OUT

400KOHM

OUT

400KOHM

OUT

OUT R

SP213E

TTL/CMOS INPUTS

RS-232 OUTPUTS

GND

OUT R

26 27

TTL/CMOS OUTPUTS

RS-232 INPUTS

5KOHM

OUT* R

IN*

22 23

5KOHM

OUT* R

IN*

19 18

5KOHM SD

*Receivers active during shutdown

+5V INPUT

400KOHM

OUT

0.1µF

6.3V 0.1µF

6.3V

0.1µF

16V

0.1µF

16V

0.1µF

6.3V

–

400KOHM

OUT

400KOHM

OUT

400KOHM

OUT

OUT R

SP211E

TTL/CMOS INPUTS

RS-232 OUTPUTS

GND

OUT R

26 27

TTL/CMOS OUTPUTS

RS-232 INPUTS

5KOHM

OUT R

22 23

5KOHM

OUT R

19 18

5KOHM SD

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE

(SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm) 24–PIN

28–PIN

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.397/0.407

(10.07/10.33)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.317/0.328

(8.07/8.33)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(WIDE)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

24–PIN

0.093/0.104

(2.352/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.599/0.614

(15.20/15.59)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

28–PIN

0.093/0.104

(2.352/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.697/0.713

(17.70/18.09)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

ALTERNATE

END PINS

(BOTH ENDS)

D1 = 0.005" min.

(0.127 min.)

PACKAGE: PLASTIC

DUAL–IN–LINE

(NARROW)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

A = 0.210" max.

(5.334 max).

LA2

A1 = 0.015" min.

(0.381min.)

e = 0.100 BSC

(2.540 BSC) eA = 0.300 BSC

(7.620 BSC)

24–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

1.230/1.280

(31.24/32.51)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the

application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.

ORDERING INFORMATION

RS232 Transceivers:

Model .................... Drivers ..........................Receivers ..................................... Temperature Range .................................Package Type

SP207ECA ................. 5 ....................................... 3................................................... 0°C to +70°C ............................................... 24–pin SSOP

SP207ECP ................. 5 ....................................... 3 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP

SP207ECT ................. 5 ....................................... 3 ................................................... 0°C to +70°C ................................................ 24–pin SOIC

SP207EEA ................. 5 ....................................... 3 ............................................... –40°C to +85°C ............................................... 24–pin SSOP

SP207EEP ................. 5 ....................................... 3 ............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP

SP207EET ................. 5 ....................................... 3 ............................................... –40°C to +85°C ................................................ 24–pin SOIC

SP208ECA ................. 4 ....................................... 4 ................................................... 0°C to +70°C ............................................... 24–pin SSOP

SP208ECP ................. 4 ....................................... 4 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP

SP208ECT ................. 4 ....................................... 4 ................................................... 0°C to +70°C ................................................ 24–pin SOIC

SP208EEA ................. 4 ....................................... 4 ............................................... –40°C to +85°C ............................................... 24–pin SSOP

SP208EEP ................. 4 ....................................... 4 ............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP

SP208EET ................. 4 ....................................... 4 ............................................... –40°C to +85°C ................................................ 24–pin SOIC

RS232 Transceivers with Low–Power Shutdown and Tri–state Enable:

Model .................... Drivers ..........................Receivers ..................................... Temperature Range .................................Package Type

SP211ECA ................. 4 ....................................... 5 ................................................... 0°C to +70°C ............................................... 28–pin SSOP

SP211ECT ................. 4 ....................................... 5 ................................................... 0°C to +70°C ................................................ 28–pin SOIC

SP211EEA ................. 4 ....................................... 5 ............................................... –40°C to +85°C ............................................... 28–pin SSOP

SP211EET ................. 4 ....................................... 5 ............................................... –40°C to +85°C ................................................ 28–pin SOIC

RS232 Transceivers with Low–Power Shutdown, Tri–state Enable, andWake–Up Function:

Model .................... Drivers ..........................Receivers ..................................... Temperature Range .................................Package Type

SP213ECA ................. 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ............................................... 28–pin SSOP

SP213ECT ................. 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ................................................ 28–pin SOIC

SP213EEA ................. 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ............................................... 28–pin SSOP

SP213EET ................. 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ................................................ 28–pin SOIC

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation

Headquarters and

Sales Office

22 Linnell Circle

Billerica, MA 01821

TEL: (978) 667-8700

FAX: (978) 670-9001

e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive

Milpitas, CA 95035

TEL: (408) 934-7500

FAX: (408) 935-7600

Please consult the factory for pricing and availability on a Tape-On-Reel option.