ES54K2D20V-16.368M RoHS Pb ES54K2 D 20 V -16.368M Series RoHS Compliant (Pb-free) 2.5V 2mm x 2.5mm Ceramic SMD Clipped Sinewave TC(VC)XO Operating Temperature Range -30C to +60C Nominal Frequency 16.368MHz Control Voltage 1.4Vdc 1.0Vdc Frequency Stability vs. Temperature 2.0ppm Maximum ELECTRICAL SPECIFICATIONS Nominal Frequency 16.368MHz Frequency Stability vs. Frequency Tolerance 1.0ppm Maximum (at 25C 2C, at Vdd=2.5Vdc) Frequency Stability vs. Temperature 2.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=2.5Vdc) Frequency Stability vs. Input Voltage 0.2ppm Maximum (5%) Frequency Stability vs. Aging 1ppm/year Maximum (at 25C) Frequency Stability vs. Load 0.2ppm Maximum (1kOhm//1pF) Frequency Stability vs. Reflow 1.0ppm Maximum (at 25C, 1 hour after reflow, 2 times) Operating Temperature Range -30C to +60C Supply Voltage +2.5Vdc 5% Input Current 2.0mA Maximum Output Voltage 0.8Vp-p Clipped Sinewave Minimum, 0.9Vp-p Typical (External DC-Cut capacitor required, 150pF NPO recommended) Load Drive Capability 10kOhms//10pF Output Logic Type Clipped Sinewave Control Voltage 1.4Vdc 1.0Vdc Frequency Deviation 5ppm Minimum Linearity 10% Maximum Transfer Function Positive Transfer Characteristic Input Impedance 500kOhms Minimum Phase Noise -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset Start Up Time 2mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 5 ES54K2D20V-16.368M MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.60 0.15 0.9 MAX MARKING ORIENTATION 2.50 0.15 4 1 3 2 0.70 0.15 (X4) 2.00 0.15 CONNECTION 1 Voltage Control 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 1.45 0.15 0.50 0.15 (X4) PIN 1 E16.368 E=Ecliptek Designator 2 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year Suggested Solder Pad Layout All Dimensions in Millimeters 0.9 (X4) 0.8 (X4) Solder Land (X4) 1.25 0.55 All Tolerances are 0.1 CLOCK OUTPUT OUTPUT WAVEFORM 0VDC VP-P www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 5 ES54K2D20V-16.368M Test Circuit for Voltage Control Option Oscilloscope Current Meter Power Supply 0.01F (Note 1) Voltage Meter Supply Voltage (VDD) 0.1F (Note 1) Voltage Control Power Supply Frequency Counter Probe (Note 2) Output 150pF Ground RL = 10kOhms CL = 10pF (Note 3) Voltage Meter Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 5 ES54K2D20V-16.368M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 5 ES54K2D20V-16.368M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 5