MPXV4006DP - Freescale Semiconductor

MPXV4006G

Rev 6, 01/2007

Freescale Semiconductor

Technical Data

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

The MPXV4006G series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications, but

particularly those employing a microcontroller or microprocessor with A/D inputs.

This sensor combines a highly sensitive implanted strain gauge with advanced

micromachining techniques, thin-film metallization, and bipolar processing to

provide an accurate, high level analog output signal that is proportional to the

applied pressure.

Features

• Temperature Compensated over 10° to 60°C

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

• Available in Gauge Surface Mount (SMT) or Through-hole (DIP)

Configurations

• Durable Thermoplastic (PPS) Package

MPXV4006G series pressure sensors are available in the basic element

package or with pressure ports. Two packing options are offered for the 482 and

482A case configurations.

ORDERING INFORMATION

Device

Type Options Case

No.

MPX Series Order

No.

Packing

Options Marking

Basic

Element

Element Only 482 MPXV4006G6U Rails MPXV4006G

Element Only 482 MPXV4006G6T1 Tape & Reel MPXV4006G

Element Only 482B MPXV4006G7U Rails MPXV4006G

Ported

Element

Axial Port 482A MPXV4006GC6U Rails MPXV4006G

Axial Port 482A MPXV4006GC6T1 Tape & Reel MPXV4006G

Axial Port 482C MPXV4006GC7U Rails MPXV4006G

Side Port 1369 MPXV4006GP Trays MPXV4006G

Dual Port 1351 MPXV4006DP Trays MPXV4006G

MPXV4006G

INTEGRATED

PRESSURE SENSOR

0 to 6 kPa (0 to 0.87 psi)

0.2 to 4.7 V OUTPUT

PIN NUMBERS(1)

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch i n the lead.

1 N/C 5 N/C

2 VS6 N/C

3Gnd 7 N/C

4 Vout 8 N/C

SMALL OUTLINE PACKAGE

THROUGH-HOLE

MPXV4006G7U

CASE 482B-03

MPXV4006GC7U

CASE 482C-03

SMALL OUTLINE PACKAGE

SURFACE MOUNT

MPXV4006G6U/6T1

CASE 482-01

MPXV4006GC6U/C6T1

CASE 482A-01

MPXV4006DP

CASE 1351-01

MPXV4006GP

CASE 1369-01

MPXV4006G

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2Freescale Semiconductor

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Parametrics Symbol Value Units

Maximum Pressure (P1 >P2) Pmax 24 kPa

Storage Temperature Tstg -30° to +100°°C

Operating Temperature TA-10° to +60°°C

Table 2. Operating Characteristics

Characteristic Symbol Min Typ Max Unit

Pressure Range POP 0—6.0kPa

Supply Voltage(1)

1. Device is ratiometric within this specified excitation range.

VS4.75 5.0 5.25 Vdc

Supply Current IS— — 10 mAdc

Full Scale Output(2) (RF = 51kΩ)

2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFSS —4.6— V

Offset(3)(5) (RF = 51kΩ)

3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

Voff 0.100 0.225 0.430 V

Sensitivity V/P — 766 — mV/kPa

Accuracy(4)(5) (10 to 60°C)

4. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum

or maximum rated pressure, at 25°C.

• Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with

minimum rated pressure applied.

• TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C.

• TcOffset: Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.

5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect

the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is

defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations.

———±5.0%V

FSS

Sensing

Element

GND

Vout

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitry

for small outline package device

MPXV4006G

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Freescale Semiconductor 3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the gauge configuration in the basic

chip carrier (Case 482). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the silicon diaphragm.

The MPXV4006G series sensor operating characteristics

are based on use of dry air as pressure media. Media, other

than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory. Contact the factory for information regarding

media tolerance in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum and maximum output

curves are shown for operation over a temperature range of

10°C to 60°C using the decoupling circuit shown in Figure 3.

The output will saturate outside of the specified pressure

range.

Figure 2. Cross Sectional Diagram SOP

(Not to Scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering Recommendations

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

P2 Die Bond

Die

1.0 µF

IPS

470 pF

OUTPUT

+5 V

0.01 µFGND

Vout

Max Min

Differential Pressure (kPa)

See Note 5 in Operating Characteristics

4.5

3.5

2.5

1.5

0.5

Output (V)

03 6

Typical

VS = 5.0 V ± 0.25 Vdc

TEMP = 10 to 60° C

Transfer Funct ion:

Vout = VS*[(0.1533*P) + 0.045] ± 5% VFSS

MPXV4006G

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4Freescale Semiconductor

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing silicone gel which

isolates the die from the environment. The pressure sensor is

designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table

Part Number Case Type Pressure (P1) Side Identifier

MPXV4006G6U/T1 482 Stainless Steel Cap

MPXV4006GC6U/T1 482A Side with Port Attached

MPXV4006G7U 482B Stainless Steel Cap

MPXV4006GC7U 482C Side with Port Attached

MPXV4006GP 1369 Side with Port Attached

MPXV4006DP 1351 Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

inch

PACKAGE DIMENSIONS

D8 PL

0.25 (0.010) A S

-A-

-B-

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C5.380.2300.212 5.84

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.405 0.415 10.29 10.54

S0.709 0.725 18.01 18.41

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

SURFACE MOUNT

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C12.700.5200.500 13.21

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.444 0.448 11.28 11.38

S0.709 0.725 18.01 18.41

V0.245 0.255 6.22 6.48

W0.115 0.125 2.92 3.17

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

D8 PL

0.25 (0.010) AT

-A-

-B-

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

SURFACE MOUNT

MPXV4006G

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Freescale Semiconductor 5

PACKAGE DIMENSIONS

MILLIMETERSINCHES

0.100 BSC 2.54 BSC

DIM

MIN

0.415

0.210

0.026

0.009

0.100

0˚

0.405

0.540

MAX

0.425

0.220

0.034

0.011

0.120

15˚

0.415

0.560

MIN

10.54

5.33

0.66

0.23

2.54

0˚

10.29

13.72

MAX

10.79

5.59

0.864

0.28

3.05

15˚

10.54

14.22

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DETAIL X

-A-

-B-

D8 PL

0.25 (0.010) A S

DETAIL X

NOTES:

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

MAXIMUM MOLD PROTRUSION 0.15 (0.006).

ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

CASE 482B-03

ISSUE B

SMALL OUTLINE PACKAGE

THROUGH-HOLE

MILLIMETERSINCHES

0.100 BSC 2.54 BSC

DIM

MIN

0.415

0.500

0.026

0.009

0.100

0˚

0.444

0.540

0.245

0.115

MAX

0.425

0.520

0.034

0.011

0.120

15˚

0.448

0.560

0.255

0.125

MIN

10.54

12.70

0.66

0.23

2.54

0˚

11.28

13.72

6.22

2.92

MAX

10.79

13.21

0.864

0.28

3.05

15˚

11.38

14.22

6.48

3.17

PIN 1

IDENTIFIER

SEATING

PLANE

-T-

DETAIL X

-A-

-B-

D8 PL

0.25 (0.010) A S

DETAIL X

NOTES:

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

MAXIMUM MOLD PROTRUSION 0.15 (0.006).

ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

CASE 482C-03

ISSUE B

SMALL OUTLINE PACKAGE

THROUGH-HOLE

MPXV4006G

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PACKAGE DIMENSIONS

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CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

SURFACE MOUNT

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SMALL OUTLINE PACKAGE

SURFACE MOUNT

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PACKAGE DIMENSIONS

CASE 1369-01

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SMALL OUTLINE PACKAGE

SURFACE MOUNT

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MPXV4006G

Rev. 6

01/2007

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