We protect the environment with our products Corporate Profile Hynix Semiconductor is a leading supplier of advanced semiconductor memory solutions and Image sensor products. We design, develop, manufacture and market a wide variety of DRAM and NAND Flash memories and CMOS Image Sensors (CIS). These memory components are essential in today's leading-edge computing, consumer and wireless communications applications. Image Sensors are used in a wide range of portable consumer electronics products such as handsets and handheld games. DRAM and NAND Flash memories are focus products CMOS Image Sensors will diversify Hynix product portfolio 2009 Revenues of USD $6.2B Market capitalization of USD $11.7B as of December 2009 Global presence with 3 manufacturing sites and 30 sales offices worldwide 20,200 employees worldwide The simply designed symbolic mark of superposition of two circles implies Hynix's will to develop environment-friendly products. The image of a sprout and green wings representing reborn nature symbolizes Hynix's volitional environmental management initiative. The 'Eco-mark' conveys our passions to contribute to customers and society with ecological practices (Environment Consciousness Outreach), and environmental awareness of each employee (Environment Creates Ourselves). Recent Accomplishments 2010 02 Developed 26nm 64Gb NAND Flash memory 01 Developed the World's First 2Gb Mobile Low Power DDR2 DRAM 2009 12 Introduced the World's First 40nm Class 2Gb GDDR5 DRAM 11 10 08 04 03 02 01 Acquired Intel Validation for 40nm Class 2Gb DDR3 Products Introduced the Second Generation 1Gb DDR3 Introduced 4Gb Mobile DDR SDRAM Supported on Intel's Moorestown Platform Developed the world's first Low Power-High Speed Mobile 1Gb DDR2 DRAM Announced the world's first 8GB 2-Rank DDR3 R-DIMM validation Developed the world's first 44nm DDR3 DRAM Acquired Intel validation for the world's first ultra-high speed DDR3 based module for servers 4GB ECC UDIMM 2008 12 Developed the World's First 2Gb Mobile DRAM 11 04 02 01 Introduced Industry's Fastest 7Gbps, 1Gb GDDR5 Graphics DRAM Developed the world's fastest Mobile LPDDR2 Introduced 2-Rank 8GB DDR2 RDIMM Announced 800MHz, 1GB/2GB UDIMM Validation 2007 11 Acquired Intel validation for 1Gb DDR2 DRAM 09 08 05 03 01 Developed industry's first 1Gb GDDR5 DRAM Developed the world's first NAND Flash MCP with 24 stacked chips Developed industry's fastest, smallest 1Gb Mobile DRAM Acquired the industry's first validation on DDR3 DRAMs from Intel Developed the world's fastest ECC Mobile DRAM Developed the fastest memory module based on 'Wafer Level Package' technology 2006 12 Announced industry's first 60nm 1Gb DDR2 800MHz based modules Developed the world's fastest 200MHz 512Mb mobile DRAM 09 Launched 300mm research fab line 03 Acquired the industry's first validation on 80nm 512Mb DDR2 DRAMs from Intel 01 Announced joint development plan of DOC H3 (new generation DiskOnChip embedded flash drive) with M-Systems 2005 12 Developed the world's first 512Mb GDDR4, the industry's fastest and highest density graphics DRAM 11 Launched the industry's first JEDEC standard 8GB DDR2 R-DIMM 04 Launched Hynix-ST joint venture construction in Wuxi City, Jiangsu Province, China 2004 03 Developed the industry's first ultra-high speed DDR SDRAM 550MHz Acquired 1Gb DDR2 SDRAM validation from Intel 02 Developed NAND Flash memory 2003 08 Developed the world's first DRAM 1Gb DDR2 07 Developed the world's first ultra-high speed DDR500 06 Acquired the industry's first Intel validation for 512Mb DDR400 05 Launched production on 0.10-micron process technology Launched volume production of ultra-low power 256 Mb SDRAM 04 Signed agreement with STMicroelectronics to cooperate in NAND flash memory business 03 Introduced the world's first commercially applicable mega-level FeRAM 2002 10 Developed 0.10-micron 512MB DDR 08 Developed the world's first high-density, wide-bandwidth 256MB DDR 06 Developed the world's first 256MB SDR SDRAM for high-end consumer application 03 Developed 1G DDR DRAM module 2001 12 Developed the world's first 128Mb DDR SDRAM for graphics 08 Completed spun-off from Hyundai Group 03 Changed the Company name to "Hynix Semiconductor Inc." 1999 10 1998 09 1997 05 1995 10 1993 09 1992 09 1991 08 1989 09 1988 01 1986 04 1985 10 1983 02 Merged LG Semiconductor Co., Ltd. Developed 64M DDR synchronous DRAM Developed the world's first 1G synchronous DRAM Developed the world's first 256M SDRAM Acquired ISO 9001 certification on semiconductor category Developed 64M DRAM Developed 16Mb DRAM Developed 4M DRAM Developed 1M DRAM Established Semiconductor Research Institute Started mass production of 256K DRAM Founded Hyundai Electronics Industries Co., Ltd. Main Memory General Description Users now demand a powerful, full-featured mobile system, with low power consumption, extended battery life and connectivity. There is a lot of concern about protecting the environment and it is quickly becoming one of the top priorities. Highly virtualized applications such as data centers, servers and supercomputers, could take advantage of the low power features of the DDR3 SDRAM to enable cooler, power efficient systems. Hynix is responding to the industry demand for eco-friendly or 'green' products that reduce power consumption, utility expenditures, improve reliability and reduce carbon emissions. The new Hynix 1.5V 1Gb DDR3 features 25% lower power consumption than legacy or competing solutions. The 1.35V (DDR3L) product will yield an additional 20% power savings. It will be an attractive solution for applications requiring compliance to energy star specifications. This product would also be ideal in mobile applications, such as notebooks, where it markedly extends battery life. The new design philosophy adopted on the second generation 1Gb DDR3, will also be applied to future high density DRAM components from Hynix. The new 44nm process along with Hynix's design optimization and internal signaling innovations, reduces power consumption and enhances performance. Devices operating at 1.5V and 1.35V (Low Voltage) exhibit similar performance characteristics. The demand for low power consumption in both mobile system like notebooks and server systems such as datacenters, is the emerging trend. Hynix's strategy is to satisfy customers needs for reduced power consumption and improved performance with technology advancements such as this 40nm class product. Transition to Notebook Form Factor A crossover to mobile computers from the traditional desktop has already occurred. Declining prices is the primary driving factors, especially in light of the current global economic conditions. Mobility and weight are other features that make mobile computers attractive to consumers, in addition to the computing power that now rival desktops SODIMM Density Organization Speed Number of Rank 4GB So-DIMM 512Mx64 1333 Mbps 2 Ranks PC & Server Memory Speed Transition in Notebook The technology leap from DDR2 to DDR3 doubles system performance. As DDR3 offers superior performance and power savings, notebooks are rapidly adopting DDR3 memory. With rapid transition trend to DDR3, processor makers are also supporting DDR3 platforms up to speeds of 1333Mbps. Hynix estimates DDR3 1333Mbps portion in notebook will be around 70% by the second half of 2010. RDIMM Density Organization Speed Number of Rank 16GB RDIMM 2Gx72 1066 Mbps 4 Ranks 5 Main Memory Product Line-up DDR2 SDRAM MODULE (240pin-UDIMM) VDD MODULE DENSITY 4GB BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 512Mx64 512Mx72 256Mx8 256Mx8 DDR2 800-666 DDR2 800-666 256Mx64 128Mx8 DDR2 800-555 256Mx72 128Mx8 DDR2 800-555 128Mx64 128Mx8 DDR2 800-555 128Mx72 128Mx8 DDR2 800-555 64Mx64 64Mx16 DDR2 800-555 HMP351U6AFR8C-S6 HMP351U7AFR8C-S6 HYMP125U64CP8-S5 HMP125U6EFR8C-S5 HMP125U6NFR8C-S5 HYMP125U72CP8-S5 HMP125U7EFR8C-S5 HYMP112U64CP8-S5 HMP112U6EFR8C-S5 HMP112U6NFR8C-S5 HYMP112U72CP8-S5 HMP112U7EFR8C-S5 HYMP164U64CP6-S5 FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 2 2 2 2 2 2 1 1 1 1 1 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Q2 '10 Now Now Now Now Q2 '10 Now Now Now ORG. 2GB 1.8V 1GB 512MB DDR2 SDRAM MODULE (240pin-RDIMM) VDD MODULE DENSITY ORG. 8GB 1Gx72 4GB 512Mx72 1.8V 2GB 256Mx72 BASED COM. SPEED 512Mx4 256Mx4 (DDP) DDR2 800-666 DDR2 667-555 256Mx4 DDR2 800-555 256Mx8 DDR2 800-555 128MX8 DDR2 800-555 256MX4 DDR2 800-555 128Mx8 DDR2 667-555 PART NUMBER HMP31GP7AFR4C-S6 HYMP31GP72CMP4-Y5 HYMP151P72CP4-S5 HMP151P7EFR4C-S5 HMP351P7AFR8C-S5 HYMP125P72CP8-S5 HMP125P7EFR8C-S5 HYMP125P72CP4-S5 HMP125P7EFR4C-S5 HYMP112P72CP8-Y5 PACKAGE RANK HEIGHT AVAILABILITY FBGA (60ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 4 2 2 2 2 2 1 1 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now Now Now DDR2 SDRAM MODULE (240pin-VLP RDIMM) VDD 1.8V MODULE BASED COM. SPEED 4GB 512Mx72 256x4(DDP) DDR2 667-555 2GB 256Mx72 256MX4 DDR2 800-555 1GB 128Mx72 128Mx8 DDR2 800-555 DENSITY ORG. PART NUMBER HYMP351P72CMP4L-Y5 HYMP125P72CP4L-S5 HMP125V7EFR4C-S5 HYMP112P72CP8L-S5 HMP112V7EFR8C-S5 PACKAGE RANK HEIGHT AVAILABILITY FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 2 2 1 2 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm Now Now Now Now Now PACKAGE RANK HEIGHT AVAILABILITY FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 4 4 2 2 2 4 4 2 2 1 1 2 2 2 2 2 1 1 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now DDR2 SDRAM MODULE (240pin-FBDIMM) VDD MODULE DENSITY 8GB 1.8V 1.55V 4GB ORG. 1Gx72 BASED COM. SPEED 512Mx4 (DDP) 512Mx4 DDR2 800-666 256Mx4 DDR2 800-555 128Mx8 DDR2 800-555 DDR2 800-666 512Mx72 2GB 256Mx72 128MX8 DDR2 800-555 1GB 128Mx72 128Mx8 DDR2 800-555 8GB 1Gx72 512Mx4 DDR2 667-555 4GB 512Mx72 256Mx4 DDR2 667-555 2GB 256Mx72 128MX8 DDR2 667-555 1GB 128Mx72 128Mx8 DDR2 667-555 PART NUMBER HMP31GF7EMR4C-S6xx HYMP31GF72CMP4xx-S6 HMP31GF7AFR4C-S6xx HMP151F7EFR4C-S5xx HYMP151F72CP4xx-S5 HMP151F7EFR8C-S5xx HYMP151F72CP8xx-S5 HMP125F7EFR8C-S5xx HYMP125F72CP8xx-S5 HMP112F7EFR8C-S5xx HYMP112F72CP8xx-S5 HMP31GL7AFR4C-Y5xx HMP151L7EFR4C-Y5xx HYMP151L72CP4xx-Y5 HMP125L7EFR8C-Y5xx HYMP125L72CP8xx-Y5 HMP112L7EFR8C-Y5xx HYMP112L72CP8xx-Y5 DDR2 SDRAM MODULE (200pin-SODIMM) VDD MODULE FBD P/N xx : (AMB vender)(Revison) BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 4GB 512Mx64 256Mx8 DDR2 800-666 2GB 256Mx64 128Mx8 DDR2 800-555 1GB 128Mx64 64Mx16 DDR2 800-555 512MB 64Mx64 64Mx16 DDR2 800-555 HMP351S6AFR8C-S6 HYMP125S64CP8-S5 HMP125S6EFR8C-S5 HMP125S6NFR8C-S5 HYMP112S64CP6-S5 HMP112S6EFR6C-S5 HYMP164S64CP6-S5 HMP164S6EFR6C-S5 FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 2 2 2 2 2 1 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Q2 '10 Now Now Now Now DENSITY ORG. 1.8V 6 AMB vender N: intel, D: IDT, E NEC Main Memory Product Line-up DDR3 SDRAM MODULE(240pin-UDIMM) VDD MODULE DENSITY 4GB 1.5V ORG. 512Mx64 512Mx72 256Mx64 2GB 256Mx72 1GB 4GB 1.35V 128Mx64 128Mx72 512Mx72 2GB 256Mx72 1GB 128Mx72 BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 256Mx8 256Mx8 128Mx8 256Mx8 128Mx8 256Mx8 128Mx8 128Mx8 256Mx8 256Mx8 128Mx8 128Mx8 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 HMT351U6BFR8C-H9 HMT351U7BFR8C-H9 HMT125U6TFR8C-H9 HMT325U6BFR8C-H9 HMT125U7TFR8C-H9 HMT325U7BFR8C-H9 HMT112U6TFR8C-H9 HMT112U7TFR8C-H9 HMT351U7BFR8A-H9 HMT325U7BFR8A-H9 HMT125U7TFR8A-H9 HMT112U7TFR8A-H9 FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) 2 2 2 1 2 1 1 1 2 1 2 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now Now Now Now Now DDR3 SDRAM MODULE(240pin-RDIMM) VDD 1.5V 1.35V MODULE DENSITY ORG. 16GB 2Gx72 8GB 1Gx72 4GB 512Mx72 2GB 256Mx72 1GB 16GB 128Mx72 2Gx72 8GB 1Gx72 4GB 512Mx72 2GB 256Mx72 1GB 128Mx72 BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 1Gx4 (DDP) 512Mx4 256Mx8 256Mx8 512Mx4 256Mx4 256Mx8 256Mx4 128Mx8 128Mx8 1Gx4 (DDP) 512Mx4 256Mx8 256Mx8 128Mx8 256Mx4 256Mx8 256Mx4 128Mx8 128Mx8 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 HMT42GR7BMR4C-H9 HMT31GR7BFR4C-H9 HMT31GR7BFR8C-H9 HMT351R7BFR8C-H9 HMT351R7BFR4C-H9 HMT151R7TFR4C-H9 HMT325R7BFR8C-H9 HMT125R7TFR4C-H9 HMT125R7TFR8C-H9 HMT112R7TFR8C-H9 HMT42GR7BMR4A-H9 HMT31GR7BFR4A-H9 HMT31GR7BFR8A-H9 HMT351R7BFR8A-H9 HMT151R7TFR8A-H9 HMT151R7TFR4A-H9 HMT325R7BFR8A-H9 HMT125R7TFR4A-H9 HMT125R7TFR8A-H9 HMT112R7TFR8A-H9 FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (78ball) 4 2 4 2 1 2 1 1 2 1 4 2 4 2 4 2 1 1 1 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now Now Now Q2 '10 Now Now Now Now Now Now Now Now Now DDR3 SDRAM MODULE(240pin-VLP RDIMM) VDD MODULE DENSITY ORG. 8GB 1Gx72 4GB 512Mx72 2GB 256Mx72 1GB 128Mx72 8GB 1Gx72 4GB 512Mx72 2GB 256Mx72 1GB 128Mx72 1.5V 1.35V BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 1Gx4(DDP) 512Mx8(DDP) 512Mx4(DDP) 256Mx8 256Mx4 128Mx8 256Mx8 128Mx8 1Gx4(DDP) 512Mx8(DDP) 512Mx4(DDP) 256Mx8 256Mx4 128Mx8 256Mx8 128Mx8 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 HMT41GV7BMR4C-H9 HMT41GV7BMR8C-H9 HMT351V7BMR4C-H9 HMT351V7BFR8C-H9 HMT125V7TFR4C-H9 HMT125V7TFR8C-H9 HMT325V7BFR8C-H9 HMT112V7TFR8C-H9 HMT41GV7BMR4A-H9 HMT41GV7BMR8A-H9 HMT351V7BMR4A-H9 HMT351V7BFR8A-H9 HMT125V7TFR4A-H9 HMT125V7TFR8A-H9 HMT325V7BFR8A-H9 HMT112V7TFR8A-H9 FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) FBGA (78ball) FBGA (82ball) FBGA (78ball) 2 4 2 2 1 2 1 1 2 4 2 2 1 2 1 1 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm 18.75mm Now Now Now Now Now Now Now Now Q2 '10 Q2 `10 Now Now Now Now Now Now DDR3 SDRAM MODULE(204pin-SODIMM) VDD 1.5V 1.35V MODULE DENSITY ORG. 4GB 512Mx64 2GB 256Mx64 1GB 128Mx64 4GB 2GB 512Mx64 256Mx64 BASED COM. SPEED PART NUMBER PACKAGE RANK HEIGHT AVAILABILITY 256Mx8 128Mx8 256Mx8 128Mx16 128Mx8 64Mx16 256Mx8 256Mx8 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 1333-999 HMT351S6BFR8C-H9 HMT125S6TFR8C-H9 HMT325S6BFR8C-H9 HMT325S6BFR6C-H9 HMT112S6TFR8C-H9 HMT112S6BFR6C-H9 HMT351S6AFR8A-H9 HMT325S6AFR8A-H9 FBGA (82ball) FBGA (78ball) FBGA (82ball) FBGA (96ball) FBGA (78ball) FBGA (96ball) FBGA (82ball) FBGA (82ball) 2 2 1 2 1 2 2 1 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now 7 Graphics Memory Product Line-up DDR2 SDRAM DENSITY ORG. 1Gb 64Mx16 512Mb 32Mx16 SPEED 500MHz (2.0ns) 400MHz (2.5ns) 400MHz (2.5ns) 600MHz (1.6ns) 500MHz (2.0ns) 500MHz (2.0ns) 400MHz (2.5ns) 500MHz (2.0ns) 450MHz (2.2ns) 400MHz (2.5ns) 350MHz (2.8ns) 300MHz (3.3ns) PART NUMBER H5PS1G63EFR-20L H5PS1G63EFR-25C HY5PS1G1631CFR-25C H5PS5162FFR-16C H5PS5162FFR-20C H5PS5162FFR-20L H5PS5162FFR-25C HY5PS121621CFP-2 HY5PS121621CFP-22 HY5PS121621CFP-25 HY5PS121621CFP-28 HY5PS121621CFP-33 PACKAGE FEATURE AVAILABILITY FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V Now Now Now Now Now Now Now Now Now Now Now Now DDR3 SDRAM DENSITY ORG. 2Gb 128Mx16 1Gb 64Mx16 SPEED 1,000MHz (1.0ns) 900MHz (1.1ns) 800MHz (1.2ns) 900MHz (1.1ns) 800MHz (1.2ns) 800MHz (1.2ns) 700MHz (1.4ns) 800MHz (1.2ns) 700MHz (1.4ns) 600MHz (1.6ns) 700MHz(1.4ns) 600MHz (1.6ns) 500MHz (2.0ns) PART NUMBER PACKAGE FEATURE AVAILABILITY H5TQ2G63BFR-N0C H5TQ2G63BFR-11C H5TQ2G63BFR-12C H5TS1G63BFR-11C H5TS1G63BFR-12C H5TQ1G63BFR-12C H5TQ1G63BFR-14C H5TS1G63AFR-12C H5TS1G63AFR-14C H5TS1G63AFR-16C H5TQ1G63AFR-14C H5TQ1G63AFR-16C H5TQ1G63AFR-20C FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V Now Now Now Now Now Now Now Now Now Now Now Now Now FEATURE AVAILABILITY GDDR3 SDRAM DENSITY ORG. 1Gb 32Mx32 512Mb 16Mx32 SPEED 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 500MHz (2.0ns) 1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 500MHz (2.0ns) 700MHz (1.4ns) 550MHz (1.8ns) PART NUMBER H5RS1H23MFR-N2C H5RS1H23MFR-N0C H5RS1H23MFR-11C H5RS1H23MFR-14C H5RS5223DFR-N3C H5RS5223DFR-N2C H5RS5223DFR-N0C H5RS5223DFR-11C H5RS5223DFR-14C H5RS5223DFR-20C H5RS5223CFR-N3C H5RS5223CFR-N2C H5RS5223CFR-N0C H5RS5223CFR-11C H5RS5223CFR-14C H5RS5223CFR-20C H5RS5223CFR-14L H5RS5223CFR-18C PACKAGE FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) 8banks, 1.9V / 1.9V 8banks, 1.9V / 1.9V 8banks, 1.8V / 1.8V 8banks, 1.8V / 1.8V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now GDDR5 SDRAM DENSITY ORG. 2Gb 64Mx32 1Gb 32Mx32 SPEED PART NUMBER 6.0Gbps 5.5Gbps 5.0Gbps 6.0Gbps 5.5Gbps 5.0Gbps 4.5Gbps 4.0Gbps 3.2Gbps H5GQ2H24MFR-R0C H5GQ2H24MFR-T3C H5GQ2H24MFR-T2C H5GQ1H24AFR-R0C H5GQ1H24AFR-T3C H5GQ1H24AFR-T2C H5GQ1H24AFR-T1C H5GQ1H24AFR-T0C H5GQ1H24AFR-T2L PACKAGE FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FEATURE 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, TBD 16Bank, 1.5V /1.5V 16Bank, 1.5V /1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.35V / 1.35V AVAILABILITY Q3 '10 Q3 '10 Q3 '10 Now Now Now Now Now Now 9 Consumer Memory General Description We now live in the Digital Era. Digital televisions, DVD and Set-Top Box give us rich entertainment, while Car navigation systems provide comfort and convenience. All of these digital consumer appliances need semiconductor memory for performance improvement, power savings and size reduction. Hynix has full line-up of DRAM (Dynamic RAM) to meet the needs of a wide range of consumer applications. Hynix offers a family of SDRAM (Synchronous DRAM) in 128Mb~256Mb densities, packaged in TSOP-II and FBGA offered at industrial temperature range of -40 to 85 and featuring very low power consumption. DDR, DDR2 and DDR3 SDRAMs (Double Data Rate SDRAMs) are available for high-end consumer applications requiring higher data transfer rates. In many applications, such as Digital Television and Set-Top-Box, SDR SDRAM has been replaced by DDR, DDR2 and DDR3 SDRAM technologies. Sometimes, the most important things are not be visible. Although hidden from view, Hynix Consumer memories have been used in a variety of applications offered by a number of companies to realize a multitude of miracles. Consumer DRAM Readiness Green Solution LC (Low Current) DDR2 provides a Green Solution - Eco-friendly & Low power consumption 10 Consumer Memory Product Line-up SDR SDRAM DENSITY 128Mb 256Mb ORG. PART NUMBER SPEED POWER OPERATION TEMP. PACKAGE VOLTAGE x16 HY57V281620FTP 5/6/7/H Normal / Low 0~70 / -40~85 [] TSOP 3.3V AVAILABILITY Now x16 HY5V26FFP 5/6/7/H Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now x16 H57V1262GTR 50 / 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] TSOP 3.3V Now x16 H57V1262GFR 50 / 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now x8 HY57V56820FTP 6/H Normal / Low 0~70 / -40~85 [] TSOP 3.3V Now x16 HY57V561620FTP 6/H Normal / Low 0~70 / -40~85 [] TSOP 3.3V Now x16 HY5V56FFP 6/H Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now x32 HY5V52AFP 6/H Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now x8 H57V2582GTR 50 / 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] TSOP 3.3V Now x16 H57V2562GTR 50 / 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] TSOP 3.3V Now x16 H57V2562GFR 50 / 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now x32 H57V2622GMR 60 / 70 / 75 Normal / Low 0~70 / -40~85 [] FBGA 3.3V Now DDR SDRAM DENSITY ORG. 64Mb x16 H5DU6462CTR x16 HY5DU281622FTP x16 H5DU1262GTR x8 x16 128Mb 256Mb 512Mb PART NUMBER SPEED POWER OPERATION TEMP. PACKAGE VOLTAGE AVAILABILITY FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now 4 / 5 / D43 / D4 / J / H Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now FA / FB / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now HY5DU568822FTP 4 / D43 / J Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now HY5DU561622FTP 4 / D43 / J Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now Now x16 HY5DU561622FFP 4 / D43 / J Normal / Low 0~70 / -40~85 [] FBGA 2.5V x8 H5DU2582GTR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now x16 H5DU2562GFR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] FBGA 2.5V Now x8 H5DU2582GTR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now x16 H5DU2562GFR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] FBGA 2.5V Now x8 HY5DU128822DTP D43 / J / K / H / L Normal Power 0~70 / -40~85 [] TSOP 2.5V Now x8 HY5DU12822DFP D43 / J / K / H / L Normal Power 0~70 / -40~85 [] FBGA 2.5V Now x16 HY5DU121622DTP D43 / J / K / H / L Normal Power 0~70 / -40~85 [] TSOP 2.5V Now x16 HY5DU121622DFP D43 / J / K / H / L Normal Power 0~70 / -40~85 [] FBGA 2.5V Now x8 H5DU5182ETR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now x8 H5DU5182EFR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] FBGA 2.5V Now x16 H5DU5162ETR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] TSOP 2.5V Now x16 H5DU5162EFR FA / E3 / E4 / J3 / K2 / K3 Normal / Low 0~70 / -40~85 [] FBGA 2.5V Now SPEED POWER OPERATION TEMP. PACKAGE VOLTAGE AVAILABILITY DDR2 SDRAM DENSITY 512Mb 1Gb 2Gb ORG. PART NUMBER x8 H5PS5182FFR E3 / C4 / Y4 / Y5 / S6 / S5 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x16 H5PS5162FFR E3 / C4 / Y4 / Y5 / S6 / S5 / G7 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x8 HY5PS1G831CFP E3 / C4 / Y5 / S6 / S5 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x8 H5PS1G83EFR E3 / C4 / Y5 / S6 / S5 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x16 HY5PS1G1631CFP E3 / C4 / Y5 / S6 / S5 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x16 H5PS1G63EFR E3 / C4 / Y5 / S6 / S5 / G7 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x32 H5PS1GC2FMR E3 / C4 / Y5 / S6 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x8 H5PS2G83AFR E3 / C4 / Y5 / S6 / S5 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x16 H5PS2G63EMR Y5 / S6 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now x32 H5PS2GC3FMR Y5 / S6 Normal / Low 0~95 / -40~95 [] Note FBGA 1.8V Now Note : At tOPER 85~95, Double refresh rate is required. DDR3 SDRAM DENSITY 1Gb 2Gb ORG. SPEED POWER OPERATION TEMP. PACKAGE VOLTAGE x8 H5TQ1G83BFR PART NUMBER S5 / S6 / G7 / G8 / H9 / PB Normal / Low 0~95 / -40~95 [] Note FBGA 1.5V Now x16 H5TQ1G63BFR S5 / S6 / G7 / G8 / H9 / PB Normal / Low 0~95 / -40~95 [] Note FBGA 1.5V Now Now AVAILABILITY x8 H5TQ2G83AFR S5 / S6 / G7 / G8 / H9 Normal / Low 0~95 / -40~95 [] Note FBGA 1.5V x8 H5TQ2G83BFR S5 / S6 / G7 / G8 / H9 / PB Normal / Low 0~95 / -40~95 [] Note FBGA 1.5V Now x16 H5TQ2G63BFR S5 / S6 / G7 / G8 / H9 / PB Normal / Low 0~95 / -40~95 [] Note FBGA 1.5V Now Note : At tOPER 85~95, Double refresh rate is required. 11 Mobile Memory General Description Hynix Mobile Memory technology unleashes the best mobile experience on the go. As mobile devices get smaller, sleeker, and lighter than ever, consumers will be able to choose from a wide range of mobile devices to keep them connected, entertained, informed, and productive. As consumers life styles become more mobile, there is ever increasing demand for connectivity. Mobile devices will require high performance memories, with very low power consumption for extended battery life. Devices that use Hynix Mobile Memory enables everything you love on-the-go. Hynix Mobile Memory products offered in small footprint packages have superior power saving features useful in all handheld devices such as cellular phones, PDAs, MP3 players, etc. Hynix Mobile Memories are ideal for portable applications which require very low power consumption. Hynix's Mobile Business Group offers a broad variety of products enabling our customers to deliver next-generation devices in time to market Mobile DRAM Broad Product Line: SDR / DDR, x16 / x32 organizations, 128Mb to 2Gb densities Diverse Packaging Options: Discrete, KGD (Known Good Die), MCP (Multi Chip Package), PoP (Package on Package) Small Form Factor Packages: For use in the most space-constrained handheld applications Low Power Features: Programmable Drive strength, Partial Array Self Refresh, Temperature Compensated Self Refresh Major Applications: Mobile Phone, PDA, MP3 Player, Digital Still Camera, MID(Mobile Internet Device), PND(Portable Navigation Device), Personal Media Player (PMP), Handheld Game Console, e-book LPDDR2 will be the next generation mainstream. Hynix set the standard for LPDDR2 technology along with LPDDR MCP Small Form Factor package saves space in Handheld Devices High Capacity Data Storage, High Speed, with Low Power Consumption In-house manufacturing provides cost efficient solutions in a timely manner Major Application - Mobile Phone, Smartphone, PDA Phone, Digital Still Camera, MID (Mobile Internet Device), Wireless LAN Card, Handheld Game Console, Netbook MCPs in Mobile Application MCP Line-up e-NAND e-NAND : Combination of NAND Flash and the Flash Controller with MMC interface, in a single package Simple read / write memory using standard MMC 4.3 / 4.4 protocol interface. No additional firmware for NAND management required Controller includes NAND software such as FTL, ECC, FAT-16/32 12 Mobile Memory Product Line-up Mobile SDR DENSITY ORG. 64M x 16 2Gb 32M x 32 32M x 32 (reduced page size) 64M x 16 1Gb 32M x 32 32M x 32 (reduced page size) 32M x 16 512M 16M x 32 16M x 16 256Mb 8M x 32 8M x 16 128Mb 4M x 32 SPEED PART NUMBER PACKAGE 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) H55S2G62MFP-60M H55S2G62MFP-75M H55S2G22MFP-60M H55S2G22MFP-75M H55S2G32MFP-60M H55S2G32MFP-75M H55S1G62AFR-60M H55S1G62AFR-75M H55S1G62MFP-60M H55S1G62MFP-75M H55S1G22AFR-60M H55S1G22AFR-75M H55S1G22MFP-60M H55S1G22MFP-75M H55S1G32AFR-60M H55S1G32AFR-60M H55S1G32MFP-60M H55S1G32MFP-75M H55S5162EFR-60M H55S5162EFR-75M H55S5162DFR-60M H55S5162DFR-75M H55S5122EFR-60M H55S5122EFR-75M H55S5122DFR-60M H55S5122DFR-75M H55S2562JFR-60M H55S2562JFR-75M H55S2622JFR-60M H55S2622JFR-75M H55S1262EFP-60M H55S1262EFP-75M H55S1222EFP-60M H55S1222EFP-75M FBGA (54ball) FBGA (54ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (54ball) FBGA (54ball) FBGA (54ball) FBGA (54ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (54ball) FBGA (54ball) FBGA (54ball) FBGA (54ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (54ball) FBGA (54ball) FBGA (90ball) FBGA (90ball) FBGA (54ball) FBGA (54ball) FBGA (90ball) FBGA (90ball) ORG. 64M x 16 2Gb 32M x 32 32M x 32 (reduced page size) 64M x 16 1Gb AVAILABILITY Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now * All SDRAM is Available For Lead Free or Lead & Halogen Free Mobile DDR DENSITY FEATURE 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 32M x 32 32M x 32 (reduced page size) 32M x 16 512Mb 16M x 32 16M x 16 256Mb 8M x 32 8M x 16 128Mb 4M x 32 SPEED PART NUMBER PACKAGE 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 200MHz (5.0ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) 166MHz (6.0ns) 133MHz (7.5ns) H5MS2G62MFR-EBM H5MS2G62MFR-J3M H5MS2G22MFR-EBM H5MS2G22MFR-J3M H5MS2G32MFR-EBM H5MS2G32MFR-J3M H5MS1G62AFR-E3M H5MS1G62AFR-J3M H5MS1G62MFP-E3M H5MS1G62MFP-J3M H5MS1G62MFP-K3M H5MS1G22AFR-E3M H5MS1G22AFR-J3M H5MS1G22MFP-E3M H5MS1G22MFP-J3M H5MS1G22MFP-K3M H5MS1G32AFR-E3M H5MS1G32AFR-J3M H5MS1G32MFP-E3M H5MS1G32MFP-J3M H5MS1G32MFP-K3M H5MS5162EFR-E3M H5MS5162EFR-J3M H5MS5162DFR-E3M H5MS5162DFR-J3M H5MS5162DFR-K3M H5MS5122EFR-E3M H5MS5122EFR-J3M H5MS5122DFR-E3M H5MS5122DFR-J3M H5MS5122DFR-K3M H5MS2562JFR-E3M H5MS2562JFR-J3M H5MS2562JFR-K3M H5MS2622JFR-E3M H5MS2622JFR-J3M H5MS2622JFR-K3M H5MS1262EFP-J3M H5MS1262EFP-K3M H5MS1222EFP-J3M H5MS1222EFP-K3M FBGA (60ball) FBGA (60ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (90ball) FBGA (90ball) FBGA (90ball) FBGA (60ball) FBGA (60ball) FBGA (90ball) FBGA (90ball) FEATURE 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V AVAILABILITY Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now * All SDRAM is Available For Lead Free or Lead & Halogen Free 13 NAND Flash Memory General Description Hynix provides a broad range of NAND Flash products density from 128Mb to 256Gb with various types of packaging (TSOP, VLGA and FBGA). Due to the proliferation of digital content, NAND Flash memory products are used in a wide variety of applications such as MP3, PMP, Digital camera, Camcorder, Memory card, USB flash drive and other consumer electronics such as Game console, Navigation. Currently, Hynix NAND Flash Memory is being widely adopted in the mobile handset applications and we are also developing PC storage solutions based on the NAND Flash chips. To meet the growing demand for high capacity and improved performance in mobile applications, Hynix is offering HiFFS (Flash File System) software with eHiFFS system that enhances NAND chip performance and reliability. NAND Flash Key Features Features Voltage Organization Page & Block size (P/B) tRC(min) / tWC (min) tR (max) Program time (typ.) Erase time (typ.) MONO / DDP Operating current QDP / DSP Copyback Cache Program Function Cache Read 2 Plane Op. Enhanced Data Out Special / Function OTP Unique ID F48 16G MLC 3.3V X8 4KB+128B / 512KB 25ns 60us 800us 2.5ms 15mA(typ.) ~ 30mA(max) 20mA(typ.) ~ 40mA(max) O with Data out Write, Read & Erase O O O F41 32G MLC 3.3V X8 4KB+224B / 512KB 25ns 60us 1000us 3ms 30mA(typ.) ~ 50mA(max) 30mA(typ.) ~ 50mA(max) O with Data out O O Write, Read & Erase O O O F32 32G MLC 3.3V x8 8KB+448B / 2MB 25ns 200us 1600us 2.5ms 30mA(typ.) ~ 50mA(max) 30mA(typ.) ~ 60mA(max) O with Data out O O Write, Read & Erase O O O 5K / 10 years 1 TSOP / VLGA / COP 5K / 10 years 1 VLGA 3K / 10 years (TBD) 1 VLGA / TSOP Endurance / Package E/W Cycles / Retention NOP Package NAND Flash Applications 14 Hynix NAND Flash Software Support HiFFS Software HiFFS is a Flash file system solution for mobile applications. HiFFS is the essential system software for electronic devices which has Flash memory storage such as mobile phones, PDAs, MP3 players, PMPs, digital TVs, and digital camcorders. Features Flash memory file system solution for mobile embedded system Higher performance and reliability Fully compatible with FAT 12 / 16 / 32 file system standards Journaling error recovery mechanism Support various Nand Flash memory types such as small block, large block, MLC and SLC and TLC. Efficient bad block management and wear-leveling Support UMS(USB Mass Storage) and external Flash memory cards Higher read/write performance Fast booting Support various operating systems such as WinCE, Linux, Non-OS, Windows Mobile Hynix SSD SSD (Solid State Drive) SSD is one of the fastest growing NAND applications in the world. Because of its strengths - Speed, Performance, Reliability, and Power Consumption - many computing devices such as MID, Net Book, Notebook, Server System, etc have replaced conventional hard drives with SSD. Hynix offers SSM (Solid State Module) and SSD for mobile and personal computing devices. SSD Key Features Features Standard ATA / IDE Bus Interface Capacities 16GB, 32GB, 64GB Dimension 54x39x4mm Sustained Performance - 128KB, MAX Random Performance - 4KB, MAX Read: 100MB/s Write: 80MB/s Read: 12117 IOPS (48MB/s) Write: 263 IOPS (1.1MB/s) Active: 0.6W Stand-by: 0.35W 5.0V (3.3V) 0 to 70 for Operating -55 to 90 for Storage Power Consumption Voltage Temperature Range MTBF BER Solid State Module Solid State Drive (2.5", 1.8") SATA 3.0Gbps 128GB, 256GB 1.8" : 52.8x77x5mm 2.5" : 69.9x100x7mm Read: 200MB/s Write: 140MB/s Read: 12500 IOPS (50MB/s) Write: 4000 IOPS (16MB/s) Active: 2.0W Stand-by: 0.35W 5.0V (2.5") / 3.3V (1.8") 0 to 70 for Operating -55 to 95 for Storage 1,000,000 Hrs 1 error in 1014 bits transferred 15 NAND Flash Product Line-up NAND Flash SLC COMPONENT PRODUCT HY27US08281A HY27US08561A HY27US08121B H27U518S2C HY27US081G1M HY27US081G1A HY27UF081G2A HY27US081G2A H27U1G8F2B H27U1G8F2B HY27UF082G2A HY27UF082G2B HY27UF084G2B HY27UG088G5(D)B HY27UH08AG5B DENSITY TECH. BLOCK SIZE STACK VCC/ORG PACKAGE AVAILABILITY REMARK 128Mb 256Mb 512Mb 512Mb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 4Gb 8Gb 16Gb 90nm 90nm 70nm 57nm 70nm 57nm 70nm 70nm 48nm 48nm 70nm 57nm 57nm 57nm 57nm 16KB 16KB 16KB 16KB 16KB 16KB 128KB 128KB 128KB 128KB 128KB 128KB 128KB 128KB 128KB Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono DDP QDP 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 1.8V / x8 3.3V / x8 1.8V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 TSOP/ USOP TSOP / USOP / FBGA TSOP / USOP / FBGA TSOP USOP TSOP TSOP / USOP / FBGA FBGA TSOP, FBGA FBGA TSOP / LGA TSOP, FBGA TSOP TSOP / LGA TSOP Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now 2CE / Dual CH. 2CE DENSITY TECH. BLOCK SIZE STACK VCC/ORG PACKAGE AVAILABILITY REMARK 4Gb 8Gb 8Gb 6Gb 16Gb 16Gb 64Gb 32Gb 32Gb 32Gb 32Gb 32Gb 64Gb 64Gb 64Gb 64Gb 128Gb 128Gb 128Gb 128Gb 128Gb 256Gb 256Gb 57nm 57nm 48nm 57nm 48nm 41nm 57nm 57nm 48nm 41nm 41nm 32nm 48nm 41nm 41nm 32nm 48nm 48nm 48nm 41nm 32nm 41nm 32nm 256KB 256KB 512KB 256KB 512KB (4KB Page) 512KB (4KB Page) 256KB 256KB 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 2MB (8KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 2MB (8KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 2MB (8KB Page) 512KB (4KB Page) 2MB (8KB Page) Mono Mono Mono DDP Mono Mono DSP QDP DDP DDP Mono SDP QDP QDP DDP DDP ODP DSP ODP QDP QDP ODP ODP 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 TSOP TSOP TSOP TSOP TSOP / VLGA TSOP TSOP DSP TSOP TSOP TSOP VLGA TSOP / VLGA TSOP / VLGA TSOP VLGA TSOP / VLGA LSOP TSOP DSP LLGA VLGA TSOP / VLGA LLGA TSOP / VLGA Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now 2Q'10 Now Now Now Now 2Q'10 Now 2Q'10 NAND Flash MLC COMPONENT PRODUCT HY27UT084G2A HY27UT088G2A H27U8G8T2B HY27UU08AG5A H27UAG8T2M H27UAG8T2A HY27UW08CGFA HY27UV08BG5A H27UBG8U5M H27UBG8U5A H27UBG8T2M H27UBG8T2A H27UCG8V5M H27UCG8VFA H27UCG8UDM H27UCG8UDA H27UDG8WFM H27UDG8WFMTR-BC H27UDG8YFMXR-BC H27UDG8VEM H27UDG8VEA H27UEG8YEM H27UEG8YEA 2CE 4CE 2CE 2CE 2CE Dual CH. Dual CH. LGA 4CE 4CE 4CE 4CE, Dual CH. Dual CH. LGA 4CE, Dual CH. Dual CH. LGA NAND Flash TLC COMPONENT PRODUCT DENSITY TECH. BLOCK SIZE STACK VCC/ORG PACKAGE AVAILABILITY REMARK 64Gb 128Gb 16Gb 48nm 48nm 41nm 768KB (192 Block) 768KB (192 Block) 768KB (192 Block) DDP QDP SDP 3.3V / x8 3.3V / x8 3.3V / x8 VLGA LLGA VLGA EOL EOL TBD Emulated NAND Emulated NAND Emulated NAND PRODUCT DENSITY TECH. AVAILABILITY REMARK H26M01002MAR H26M11002AAR H26M11001BAR H26M21002BAR H26M21001CAR H26M32002BAR H26M32001CAR H26M44002AAR H26M42001BAR H26M54001AJR H26M68001MJR 512MB 1GB 1GB 2GB 2GB 4GB 4GB 8GB 8GB 16GB 32GB 57nm 57nm 48nm 48nm 41nm 48nm 41nm 48nm 41nm 41nm 41nm PRODUCT DENSITY TECH. H24U1GTM3ARH H24U2GTM1BRH H24U4GUM1ARH H24U8GVM1MRH H24UAGYM1MRH 1GB 2GB 4GB 8GB 16GB 48nm 41nm 41nm 41nm 41nm H2EUCG8N11YR-C H2EUDG8P11XR-C H2EUAG8M2MYR-C e-NAND COMPONENT BASE COMPONENT DENSITY 4Gb 8Gb 8Gb 16Gb 16Gb 16Gb 16Gb 16Gb 32Gb 32Gb 32Gb STACK 1 1 1 1 1 2 2 4 2 4 8 VCC/ORG 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 VERSION MMC 4.2 MMC 4.2 MMC 4.3 MMC 4.2 MMC 4.3 MMC 4.2 MMC 4.3 MMC 4.2 MMC 4.3 MMC 4.3 MMC 4.3 Now Now Now Now Now Now Now Now Now Now Now uSD COMPONENT 16 BASE COMPONENT DENSITY 8Gb 16Gb 16Gb 16Gb 16Gb STACK 1 1 2 4 4 VCC/ORG 3.3V / x4 3.3V / x4 3.3V / x4 3.3V / x4 3.3V / x4 VERSION Class-4 Class-4 Class-6 Class-6 Class-6 AVAILABILITY Now Now Now Now Now REMARK