© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 1
One world. One KEMET
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric is
designed to signicantly minimize the probability of a low IR or
short circuit condition when forced to failure in a board stress
ex situation, thus reducing the potential for catastrophic failure.
The Open Mode capacitor may experience a drop in capaci-
tance; however, a short is unlikely because a crack will not
typically propagate across counter electrodes within the device’s
“active area.” Since there will not be any current leakage associ-
ated with a typical Open Mode ex crack, there is no localized
heating and therefore little chance for a catastrophic and poten-
tially costly failure event.
Driven by the demand for a more robust and reliable com-
ponent, the Open Mode capacitor was designed for critical
applications where higher operating temperatures and mechani-
cal stress are a concern. These capacitors are widely used in
automotive circuits as well as power supplies (input and output
lters) and general electronic applications.
Concerned with ex cracks resulting from excessive tensile
and shear stresses produced during board exure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating ex cracks
which can result in low IR or short circuit failures. Although ex-
ible termination technology does not eliminate the potential for
mechanical damage that may propagate during extreme envi-
ronmental and handling conditions, it does provide superior ex
performance over standard termination systems. When combined
with exible termination technology these devices offer the ultimate
level of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode (FE-
CAP) and Floating Electrode with Flexible Termination (FF-CAP)
product lines by providing a fail-safe design optimized for mid to
high range capacitance values. These devices exhibit a predict-
able change in capacitance with respect to time and voltage and
boast a minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from -55°C
to +125°C.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC
(Commercial & Automotive Grade)
Ordering Information
C1210 J685 K 3 R A C TU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance Voltage Dielectric Failure Rate/
Design Termination Finish1Packaging/Grade
(C-Spec)2
0805
1206
1210
1812
F = Open Mode
J = Open Mode
with Flexible
Termination
2 Signicant Digits
+ Number of Zeros
K = ±10%
M = ±20%
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
R = X7R A = N/A C = 100% Matte Sn
L = SnPb (5%
minimum)
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel Marked
AUTO = Automotive
Grade
1 Additional termination nish options may be available. Contact KEMET for details.
1, 2 SnPb termination nish option is not available on automotive grade product.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
B
W
S
T
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
See Table 2 for
Thickness
0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or
Solder Reow
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
Dimensions – Millimeters (Inches) – Flexible Termination
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
See Table 2 for
Thickness
0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or
Solder Reow
1206 3216
3.30 (.130) ± 0.40 (.016)
1.60 (.063) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)
N/A
1210 3225
3.30 (.130) ± 0.40 (.016)
2.50 (.098) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)
Solder Reow Only
1812 4532
4.50 (.178) ± 0.40 (.016)
3.20 (.126) ± 0.30 (.012) 0.70 (.028) ± 0.35 (.014)
Benets
• -55°C to +125°C operating temperature range
• Open Mode/fail open design
• Mid to high capacitance ex mitigation
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V
• Capacitance offerings ranging from 1,000 pF to 6.8 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination nish allowing for
excellent solderability
• Commercial and Automotive (AEC–Q200) grades available
• SnPb termination nish option available upon request (5%
minimum)
• Flexible termination option available upon request
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Applications
Typical applications include input side ltering (power plane/bus), high current (battery line) and circuits that cannot be fused to open
when short circuits occur due to ex cracks. Markets include automotive applications that are directly connected to the battery and/or
involve conversion to a 42 V system and raw power input side ltering in power conversion.
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance and Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualication for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination nish option).
Electrical Parameters/Characteristics
Item
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
Dielectric Withstanding Voltage (DWV)
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
Insulation Resistance (IR) Limit @ 25°C
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial Limit16/25 5.0
< 16 7.5
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201 N/A ALL
0402 < 0.012 µF ≥ 0.012 µF
0603 < 0.047 µF ≥ 0.047 µF
0805 < 0.15 µF ≥ 0.15 µF
1206 < 0.47 µF ≥ 0.47 µF
1210 < 0.39 µF ≥ 0.39 µF
1808 ALL N/A
1812 < 2.2 µF ≥ 2.2 µF
1825 ALL N/A
2220 < 10 µF ≥ 10 µF
2225 ALL N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)
Capacitance Cap
Code
Case Size/
Series C0805F C1206F C1210F C1812F
Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2
Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF 102 K M DD DD DD DD DD
1,200 pF 122 K M DD DD DD DD DD
1,500 pF 152 K M DD DD DD DD DD
1,800 pF 182 K M DD DD DD DD DD
2,200 pF 222 K M DD DD DD DD DD
2,700 pF 272 K M DD DD DD DD DD
3,300 pF 332 K M DD DD DD DD DD
3,900 pF 392 K M DD DD DD DD DD
4,700 pF 472 K M DD DD DD DD DD
5,600 pF 562 K M DD DD DD DD DD
6,800 pF 682 K M DD DD DD DD DD
8,200 pF 822 K M DD DD DD DD DD
10,000 pF 103 K M DD DD DD DD DD
12,000 pF 123 K M DD DD DD DD DG
15,000 pF 153 K M DD DD DD DD DG
18,000 pF 183 K M DD DD DD DD EC EC EC EC EC
22,000 pF 223 K M DD DD DD DG EC EC EC EC EC
27,000 pF 273 K M DD DD DD DG EC EC EC EC EC
33,000 pF 333 K M DD DD DD DG EC EC EC EC EC
39,000 pF 393 K M DD DD DD DG EC EC EC EC EC
47,000 pF 473 K M DD DD DD DE EC EC EC EC EG GB GB GB GB
56,000 pF 563 K M DD DD DD EC EC EC EC EG GB GB GB GB
68,000 pF 683 K M DD DD DG DG EC EC EC EC EG FD FD FD FD FD GB GB GB GB
82,000 pF 823 K M DD DD DG EC EC EC EC EG FD FD FD FD FD GB GB GB GB
0.10 µF 104 K M DG DG DG EC EC EC EC EG FD FD FD FD FG GB GB GB GB
0.12 µF 124 K M DG DG EC EC EC EC FD FD FD FD FG GB GB GB GB
0.15 µF 154 K M DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB
0.18 µF 184 K M DG DG EC EC EC EG FD FD FD FD FH GB GB GB GB
0.22 µF 224 K M DG DD DG EC EC EC ED FD FD FD FG FJ GB GB GB GC
0.27 µF 274 K M DD DD EC EC EC FD FD FD FG GB GB GB GF
0.33 µF 334 K M DD DG EG EG EG EG FD FD FD FH GB GB GB GK
0.39 µF 394 K M DD DG EG EG FD FD FG FH GB GB GB GL
0.47 µF 474 K M DE DG EG EG EC FD FD FG FJ GB GB GC
0.56 µF 564 K M EG FD FD FG FR GB GB GD
0.68 µF 684 K M DG EG FD FG FH FR GD GD GF
0.82 µF 824 K M EG FD FG FH FR GD GD GK
1.0 µF 105 K M EG EC EH FD FH FJ FS GN GN GM
1.2 µF 125 K M FG
1.5 µF 155 K M FH
1.8 µF 185 K M FH
2.2 µF 225 K M EC EH FJ FM FM
3.3 µF 335 K M FM
4.7 µF 475 K M EH FG FM GK GK
6.8 µF 685 K M FS FS
Capacitance Cap
Code
Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200
Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2
Case Size/
Series C0805F C1206F C1210F C1812F
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
DD
0805
0.90 ± 0.10
4,000
10,000
0
0
DE
0805
1.00 ± 0.10
0
0
2,500
10,000
DG
0805
1.25 ± 0.15
0
0
2,500
10,000
EC
1206
0.90 ± 0.10
0
0
4,000
10,000
ED
1206
1.00 ± 0.10
0
0
2,500
10,000
EG
1206
1.60 ± 0.15
0
0
2,000
8,000
EH
1206
1.60 ± 0.20
0
0
2,000
8,000
FD
1210
0.95 ± 0.10
0
0
4,000
10,000
FG
1210
1.25 ± 0.15
0
0
2,500
10,000
FH
1210
1.55 ± 0.15
0
0
2,000
8,000
FM
1210
1.70 ± 0.20
0
0
2,000
8,000
FJ
1210
1.85 ± 0.20
0
0
2,000
8,000
FR
1210
2.25 ± 0.20
0
0
2,000
8,000
FS
1210
2.50 ± 0.30
0
0
1,000
4,000
GB
1812
1.00 ± 0.10
0
0
1,000
4,000
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GD
1812
1.25 ± 0.15
0
0
1,000
4,000
GF
1812
1.50 ± 0.10
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
GN
1812
1.70 ± 0.20
0
0
1,000
4,000
GL
1812
1.90 ± 0.20
0
0
500
2,000
GM
1812
2.00 ± 0.20
0
0
500
2,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on nished chip thickness specications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00
1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Reow Soldering Prole:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended prole conditions for convection and IR reow reect the prole conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reow passes at these conditions.
Prole Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL)60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)235°C 260°C
Time Within 5°C of Maximum
Peak Temperature (tP)20 seconds maximum 30 seconds maximum
Ramp-Down Rate (TP to TL)6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature 6 minutes maximum 8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
Tsmin
25°C to Peak
tL
tS
25
tP
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Dielectric Material
(BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Base Metal
(Cu)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Base Metal
(Cu)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Construction – Flexible Termination
Dielectric Material
(BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Base Metal
(Cu)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Barrier Layer
(Ni)
Base Metal
(Cu)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Epoxy Layer
(Ag)
Epoxy Layer
(Ag)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identi er(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
EIA Case Size Metric Size Code Capacitance
0603
1608
≤ 170 pF
0805
2012
≤ 150 pF
1206
3216
≤ 910 pF
1210
3225
≤ 2,000 pF
1808
4520
≤ 3,900 pF
1812
4532
≤ 6,700 pF
1825
4564
≤ 0.018 µF
2220
5650
≤ 0.027 µF
2225
5664
≤ 0.033 µF
KEMET
ID
2-Digit
Capacitance
Code
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identi ers
Alpha
Character
Numeral
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
0.1
1 0
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
B
0.11
1.1
11
110
1,10 0
11,000
110,000
1,100,000
11,000,000
110,000,000
C
0.12
1 2
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
1 3
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
1 5
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
F
0.16
1 6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
160,000,000
G
0.18
1 8
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
2 0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2 2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
3 0
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
3 3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3 6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3 9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4 3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5 6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6 2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6 8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
7 5
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
8 2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2 5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3 5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
4 0
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
4 5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
5 0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
6 0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
7 0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
8 0
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
9 0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape Size (W)* Pitch (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W
1
W
2
Maximum W
3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-306-9353
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Europe
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Sasso Marconi, Italy
Tel: 39-051-939111
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Kamen, Germany
Tel: 49-2307-438110
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
Espoo, Finland
Tel: 358-9-5406-5000
Asia
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Shenzhen, China
Tel: 86-755-2518-1306
Beijing, China
Tel: 86-10-5829-1711
Shanghai, China
Tel: 86-21-6447-0707
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 4/30/2014 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.