© Semiconductor Components Industries, LLC, 2016
October, 2016 − Rev. 7 1Publication Order Number:
MURA160T3/D
MURA160, NRVUA160V,
SURA8160
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•Small Compact Surface Mountable Package with J−Bend Leads
•Rectangular Package for Automated Handling
•High Temperature Glass Passivated Junction
•Low Forward Voltage Drop (1.05 V Max @ 1.0 A, TJ = 150°C)
•NRVUA and SURA8 Prefixes for Automotive and Other
Applications Requiring Unique Site and Control Change
Requirements; AEC−Q101 Qualified and PPAP Capable*
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 70 mg (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Polarity: Polarity Band Indicates Cathode Lead
•ESD Protection:
♦Human Body Model > 4000 V (Class 3)
♦Machine Model > 400 V (Class C)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping†
ORDERING INFORMATION
ULTRAFAST RECTIFIER
1 AMPERE, 600 VOLTS
www.onsemi.com
MURA160T3G SMA
(Pb−Free) 5,000/Tape & Ree
l
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SMA
CASE 403D
MARKING DIAGRAM
U4J
AYWW G
U4J = Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb−Free Package
NRVUA160VT3G SMA
(Pb−Free) 5,000/Tape & Ree
l
SURA8160T3G SMA
(Pb−Free) 5,000/Tape & Ree
l
MURA160, NRVUA160V, SURA8160
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600 V
Average Rectified Forward Current
@ TL = 145°C
@ TL = 110°C
IF(AV) 1.0
2.0
A
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 30 A
Operating Junction Temperature Range TJ−65 to +175 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1)
Thermal Resistance, Junc tion−to−Ambient (Note 1)
PsiJL
(Note 2)
RqJA
24
216
°C/W
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Max Unit
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 1.0 A, TJ = 25°C)
(iF = 1.0 A, TJ = 150°C)
vF1.25
1.05
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 150°C)
iR5.0
150
mA
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms) trr 75 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
MURA160, NRVUA160V, SURA8160
www.onsemi.com
3
10
0.1
200100 600
VR, REVERSE VOLTAGE (VOLTS)
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current
Figure 3. Typical Forward Voltage Figure 4. Maximum Forward Voltage
1
100
0
I
R
, REVERSE CURRENT (
m
A)
1.10.90.70.5 1.3
0.01
10
1
0.1
1.5
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
100
200100 60
0
VR, REVERSE VOLTAGE (VOLTS)
VF, INSTANTANEOUS VOLTAGE (VOLTS)
1
1000
0
IR, REVERSE CURRENT (mA)
1.10.9 1.3
0.01
10
1
0.1
1.71.5
IF, INSTANTANEOUS FORWARD CURRENT (A)
TJ = 150°C
TJ = 100°C
TJ = 25°C
TJ = 150°C
TJ = 100°C
TJ = 25°C
TC = 150°C100°C
25°CTC = 150°C100°C
25°C
300 300
1.7 1.9
400 500
0.01 400 500
0.70.50.3 0.3
10
MURA160, NRVUA160V, SURA8160
www.onsemi.com
4
dc
15
322416
0840
VR, REVERSE VOLTAGE (VOLTS)
TL, LEAD TEMPERATURE (°C)
Figure 5. Typical Capacitance Figure 6. Maximum Capacitance
Figure 7. Current Derating, Lead Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
5
0
100
0
1
120 180
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
15
0
VR, REVERSE VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (°C)
10
30
80604020 100
00
1
0.1
140120
Figure 9. Power Dissipation
1.5
021.510.5
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
3
0
282012436
10
C, CAPACITANCE (pF)
32241684
0
0282012436
20
5
C, CAPACITANCE (pF)
2
3
PF, AVERAGE POWER DISSIPATION (W)
160 18
0
NOTE: TYPICAL
CAPACITANCE AT
0 V = 24 pF
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 27 pF
SQUARE WAVE
dc
SQUARE WAVE
SQUARE
WAVE
140 160
4
20
25
25
1
2
2.5
60
5
dc
3.5
0.5
IF(AV), AVERAGE FORWARD CURRENT (A)
80
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
2.5 3
3.5
4
4.5
MURA160, NRVUA160V, SURA8160
www.onsemi.com
5
PACKAGE DIMENSIONS
SMA
CASE 403D
ISSUE H
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
DIM
AMIN NOM MAX MIN
MILLIMETERS
1.97 2.10 2.20 0.078
INCHES
A1 0.05 0.10 0.20 0.002
b1.27 1.45 1.63 0.050
c0.15 0.28 0.41 0.006
D2.29 2.60 2.92 0.090
E4.06 4.32 4.57 0.160
L0.76 1.14 1.52 0.030
0.083 0.087
0.004 0.008
0.057 0.064
0.011 0.016
0.103 0.115
0.170 0.180
0.045 0.060
NOM MAX
4.83 5.21 5.59 0.190 0.205 0.220
HE
E
bD
Lc
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
4.000
0.157
2.000
0.079
2.000
0.079
ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
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