SN20086APF - SONiX Technology Company

Data Sheet

USB2.0 Flash Disk Controller SN20086

DATA SHEET

SN20086

USB2.0 Flash Disk Controller

Revision 0.2

ll ri

hts reserved.

SN20086 2004/9/2 ver 0.2

1 General Description

SN20086 is a high-performance integrated circuit to access the NAND type Flash memory

via the 480 MHz USB 2.0 bus. It provides a flexible and cost efficient single chip solution

for external storage applications such as USB Disk (Flash Disk). With all the features

inherited from the popular SN11085/86/88, the users can easily upgrade to SN20086 and

enjoy the tremendous speed increment.

Although the USB speed is increased 40 times from 12 M to 480 M, the external crystal

frequency of SN20086 is still kept at 6MHz, keeping the EMI at low level. The functions that

ensure the data integrity like the embedded translation table, the Sonix proprietary

randomization algorithm, and the real time ECC correction function are all the implemented

as the USB 1.1 version. SN20086 also incorporates Sonix in-house algorithm to improve the

performance of the flash disk.

To enrich the product line of the OEM manufacture and reduce the effort of component

sourcing, SN20086 supports both single channel and dual channel modes in a single chip. In

addition, SN20086 supports NAND flash memories of Samaung, Toshiba, Hynix,

STMicroelectronics and Micron, providing more flexibility for the flash memory’s

purchasing.

With the ability to support 8 pieces of flash memories and the new types of 2G, 4G, and 8G

bits flashes, SN20086 can be used to build up a storage device up to 8 Giga bytes large.

The USB Mass Storage Class compliance capability of SN20086 makes it a truly

“plug-and-play” device without vendor drivers under Windows 2000/ME/XP, Mac OS

8.6/9/10, and Linux. SN20086 also provides PC boot up function as a USB floppy disk

(1.44M), USB ZIP, USBB HDD or USB CD-ROM, which makes it an ideal replacement for

the legacy floppy disk.

SN20086 2004/9/2 ver 0.2

2 Features

 USB 2.0 480 MHz high-speed compatible

 USB 1.1 Mass Storage Class compliant

 USB Mass Storage Class Bulk-Only Transport 1.0 supported

 USB Mass Storage Class SCSI transparent command set supported

 Low system clock (6MHz) to reduce EMI

 Customized USB VID, PID, serial number, and USB vendor/product strings

 28 characters of Vendor/Product/Revision string supported for each LUN separately

 Support Samsung and Toshiba NAND-type flash memory, from 32Mbits to 1Gbits

 Support new type of Samsung NAND type flash memory, from 1Gbits to 8Gbits

 Support Hynix / Micron / STMicroelectronics flash memories

 Support FDD/ZIP/HDD/CD-ROM format through Sonix mass production tool

 Support Autorun function

 Support CD-RW function

 Real-time ECC correction circuit for data integrity and memory access speed

acceleration

 Embedded SRAM for logical-to-physical address translation to extend the life time of

NAND-type flash

 Support up to 8 NAND type flash memories are supported (single channel mode)

 Support dual channel mode for speed improvement (two NAND flash memories only)

 Support up to 8 Gbytes of disk capacity

 Embedded FIFO for upstream and downstream data transfer

 Built-in power MOS to meet USB suspend requirement (500 uA)

 Data transfer rate up to 60MB/s (burst)

 LED indicator pin

 Three modes of LED flashing patterns can be selected

 Five speed of LED flashing speed provided

 PC boot up capability (host BIOS with USB boot up support is necessary)

 Flash disk security function provided, up to 16 characters of password for high sensitive

data protection from illegally access

 Five types of security functions can be selected

 ROM-type flash disk capability provided (permanent write protect)

 Different LUN can be set to write protect separately

 No driver needed under Microsoft Windows ME/2000/XP, Mac OS 8.6/9.x/10.xNo

driver needed for Linux kernel 2.4 or above

 Sonix Driver for Microsoft Windows 98/98SE

 Sonix mass production tool available for mass production (under win2k/xp)

SN20086 2004/9/2 ver 0.2

 Sonix utility program available (under Windows and Mac 10.2 or above)

 Sonix driver and utility program available (under Mac 9, version 9.1 or above)

 Single 3.3V operation

 48 pin LQFP package

SN20086 2004/9/2 ver 0.2

3. Pin Assignment

FLCE7

FLWPSW

RSTN

FLWP

FLRB1

FLCE1

FLCE2

FLCE3

FLCE4

VS S

VD18

VD33

GPIO0

FLD2

FLALE

FLWE

VS S

VD18

VD33

XIN

XOUT

FLD1

FLD0

FLCE8

LED

15 10

VDDA

RPU

PADP

PADM

VSSA

UVDD33

UVDD18

UVSSD

VDDA

VSSA

VRES

FLD7

FLCE6

FLRE

FLVDOUT

VD33

VD18

FLD6

FLCE5

FLD5

FLD4

FLCLE

FLD3

Table 1 SN20086 pin list

# pin name type drive description

1 LED DO 8mA LED output

2 VDDA PWR Analog 3.3V

3 RPU AIO Connect to 1.5K pull up resistor

4 DPLUS AIO USB D+

5 DMINUS AIO USB D-

6 VSSA PWR Analog ground

7 UVDD33 PWR UTMI Digital 3.3V

8 UVDD18 PWR UTMI Digital 1.8V

9 UVSSD PWR UTMI Digital ground

10 VDDA PWR Analog 3.3V

11 VSSA PWR Analog ground

SN20086 2004/9/2 ver 0.2

12 VRES AIO Reference voltage, connect to 6.2K resistor

13 FLCE8 DIO 8mA Flash chip select 8 / Flash data 15

14 FLD0 DIO 8mA Flash data 0

15 FLD1 DIO 8mA Flash data 1

16 XOUT DO Crystal output

17 XIN DI Crystal input

18 VD33 PWR Digital 3.3V

19 VD18 PWR Digital 1.8V

20 VSS PWR Digital ground

21 FLWE DO 8mA Flash write enable

22 FLALE DO 8mA Flash address latch enable

23 FLD2 DIO 8mA Flash data 2

24 GPIO0 DIO 8mA General purpose input/output 0 / flash chip

enable (dual channel mode), PU: dual channel

mode, PD: single channel mode

25 FLD3 DIO 8mA Flash data 3

26 FLCLE DO 8mA Flash command latch enable

27 FLD4 DIO 8mA Flash data 4

28 FLD5 DIO 8mA Flash data 5

29 FLCE5 DIO 8mA Flash chip enable 5 / Flash data 12

30 FLD6 DIO 8mA Flash data 6

31 VD18 PWR Digital 1.8V

32 VD33 PWR Digital 3.3V

33 FLVDOUT PWR Flash power 3.3V

34 FLRE DO 8mA Flash read enable

35 FLCE6 DIO 8mA Flash chip enable 6 / Flash data 13

36 FLD7 DIO 8mA Flash data 7

37 FLCE7 DIO 8mA Flash chip enable 7 / Flash data 14

38 FLWPSW DI Write protect switch input

39 RSTN DI - Chip mater reset

40 FLWP DO 8mA Flash write protect

41 FLRB1 DI Flash ready/busy

42 FLCE1 DIO 8mA Flash chip enable 1 / Flash data 8

43 FLCE2 DIO 8mA Flash chip enable 2 / Flash data 9

44 FLCE3 DIO 8mA Flash chip enable 3 / Flash data 10

SN20086 2004/9/2 ver 0.2

45 FLCE4 DIO 8mA Flash chip enable 4 / Flash data 11

46 VSS PWR Digital ground

47 VD18 PWR Digital 1.8 V

48 VD33 PWR - Digital 3.3V

Note:

1. P: power pin; AI: analog input pin, AIO: analog input/output pin; DI: digital input pin; DO: digital output pin;

DIO: digital input/output pin.

2. PD: pull down; PU: pull up.

3. All pads are Schmitt triggered and with slew rate control

SN20086 2004/9/2 ver 0.2

4 Block diagram

Switch Matrix flash memory

interface logics

FIFO

CPU

USB interface

lo g ic s

ROM

SRAM

5 Functional description

5.1 Flash memory connection

In single channel mode, up to 8 NAND type flash memories can be connected to

SN20086 (in dual channel mode, only 2 flash memories can be connected), the

number of flash memory connected can be detected automatically upon power on.

Each flash memory has its own chip enable control signal path (FLCE 1 to FLCE8).

All flash memories connected to SN20086 must be of the same capacity There is no

special rule for the number of flash memory. (e.g. not necessarily to be the multiples

SN20086 2004/9/2 ver 0.2

of 2 or 4).

5.2 USB VID/PID/SN and Strings format

The USB vendor ID, product ID, serial number, and the strings can be changed by

using the Sonix Mass Production tool. The vendor name and product name of each

LUN can also be changed. The serial number (defined in mass storage device class)

can also be customized or disabled. It should be noted that the VID and PID values

cannot be set to 0x0000 or 0xFFFF or any value that reserved by the USB standard. If

there is no customized VID/PID, default USB vendor ID (hex 0C45) and product ID

(hex 2060) are returned to the host.

5.3 Software support

Sonix provides the following software to customers. Please contact Sonix sales for

detail.

1) Application software and driver for Win98/2000/Me/XP; boot up utility is

included for Win98/Me

2) Application software and driver for Mac OS9 (version 9.1 or above)*

3) Application software for Mac OS 10.2 or above*

4) Mass production tool under Win2000/XP

* The functions of the application software between different OS might be

different

SN20086 2004/9/2 ver 0.2

6 Operating rating and electrical characteristics

6.1 Absolute maximum rating

Table 2

symbol Parameter value unit

Dvmin min digital supply voltage DGND – 0.3 V

Dvmax max digital supply voltage DGND + 3.6 V

Avmin min analog supply voltage AGND – 0.3 V

Avmax max analog supply voltage AGND + 3.6 V

Dvinout voltage on any digital input or output pin DGND –0.3 to 3.6 V

Avinout voltage on any analog input or output pin AGND –0.3 to Avdd + 0.3 V

Tstg storage temperature range -40 to +125 0C

ESD (HBM) ESD human body mode

C=100pF, R=1.5KΩ

5000 V

ESD (MM) ESD machine mode 200 V

Ioff leakage current 10 uA

Ilatch minimum latch up current 100 mA

6.2 Operation conditions

Table 3

symbol Parameter value unit

DVdd digital supply voltage +3 to +3.6 V

Avdd analog supply voltage +3 to +3.6 V

TA operating ambient temperature range 0 to 70 0C

TJ operating junction temperature range 0 to 115 0C

SN20086 2004/9/2 ver 0.2

6.3 DC electrical characteristics

Table 4

symbol parameter test condition value unit

VDI USB full speed differential input

iti it

| (D+) – (D-) | 0.2 (min) V

VCM USB full speed differential

common mode range Included VDI

range 0.8 (min)

2.5 (max) V

VHSSQ USB high speed squelch detection

threshold 100 (min)

150 (max) mV

VHSDSC USB high speed disconnect

detection threshold 525 (min)

625 (max) mV

VHSSQ USB high speed data signaling

common mode voltage range

dihhld

-50 (min)

500 (max) mV

VIH high level input voltage 2.0 (min) V

VIL low level input voltage 0.8 (max) V

VOH high level output voltage IOH = -4 mA 2.3 (min) V

VOL low level output voltage IOL= 4 mA 0.5 (max) V

IIL low level input current VI = 0 V RSTN pin : - 50.0 (max)

the other pins : - 3.0 (max) µA

IIH high level input current VI = 3.6 V 3.0 (max) µA

IDD input supply current 20 (max) mA

Isuspend supply current in suspend TBD µA

6.4 AC electrical characteristics

6.4.1 USB transceiver signal (full speed mode)

Table 5

symbol parameter test condition min max unit

Tr transition rise time for DP or DM 4 20 ns

Tf transition fall time for DP or DM 4 20 ns

Trfm rise / fall time matching (Tr / Tf ) * 100 90 111.11 %

Vo (crs) signal crossover voltage 1.3 2.0 V

6.4.2 USB transceiver signal (high speed mode)

SN20086 2004/9/2 ver 0.2

Table 6

symbol parameter test condition min max unit

Tr transition rise time for DP or DM 0.5 ns

Tf transition fall time for DP or DM 0.5 ns

6.4.3 Operation clocks

Table 7

symbol parameter value unit

USBCLKin XI/XOUT crystal value 6 (typ) MHz

USBCLKin duty cycle 50 ± 2 %

6.5 Power consumption

Table 8

symbol parameter value unit

Io_max Max current in operation 80 mA

Is_max Max current in suspend mode TBD uA

SN20086 2004/9/2 ver 0.2

7. Packaging dimension

SN20086 2004/9/2 ver 0.2

Revision History

Revision Revision Date Description of changes

Revision V0.1 Oct. 08, 2004 Draft release.

Revision V0.2 Dec. 13,2004 GPIO0 Definition Modify.

Data Sheet

USB2.0 Flash Disk Controller SN20086

DISCLAIMER

The information appearing in this publication is believed to be accurate. However, this

publication could contain te chni cal inaccura cie s or typographi cal e rrors. T he read er shoul d not

assume that this publication is error-free or that it will be suitable for any particular purpose.

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This publication was developed for products offered in Taiwan. SONiX may not offer the

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without notice. Please contact SONiX or its local representative for information on offerings

available. Integrated circuits sold by SONiX are covered by the warranty and patent

indemnification provisions stipulated in the terms of sale only. The application circuits

illustrated in this document are for reference purposes only. SONIX DISCLAIMS ALL

WARRANTIES, INCLUDING THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR

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prices, and discontinue marketing the Products listed at any time without notice. Accordingly,

the reader is cautioned to verify that the data sheets and other information in this publication

are current before placing orders.

Products described herein are intended for use in normal commercial applications.

Applications involving unusual environmental or reliability requirements, e.g. military

equipment or medical life support equipment, are specifically not recommended without

additional processing by SONIX for such application.

ain Office

Address: 9F, No. 8 Lane 32, Hsien Chen 5th St. Chupei City,

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Tel: 886-3-551 0520

Fax: 886-3-551 0523

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