Chip Outline Electrical Schematic
Chip size: 0.71 x 0.91mm
Bond pad size: 90 µm x 90 µm minimum
Chip thickness: 210 µm
Switching Truth Table
A B RF IN-RF1 RF IN-RF 2
0V -5V Low Loss Isolated
-5V 0V Isolated Low Loss
The P35-4215-0 can be connected such that the isolated switch output is either
terminated in 50 Ωor in a reflective short circuit. A reflective configuration is obtained
by bonding GND-R1 and GND-R2 to ground. A terminated configuration is obtained
by bonding GND-T1 and GND-T2 to ground. In both cases at least two low
inductance bondwires should be attached to each pad.
Chip Handling, Mounting and Bonding
The back of the chip is gold metallized and can be die-attached manually onto gold,
eutectically with Au-Sn (80:20) or with low temperature conductive epoxy. The
maximum allowable chip temperature is 310 °C for 2 minutes. Bonds should be made
onto the exposed gold pads with 17 or 25 microns pure gold, half-hard gold wire.
Bonding should be achieved with the chip face at 225 °C to 275 °C with a heated
thermosonic wedge (approx. 125 °C) and a maximum force of 60 grams. Ball bonds
may be used but care must be taken to ensure the ball size is compatible with the
bonding pads shown. The length of the bond wires should be minimised to reduce
parasitic inductance, particularly those to the RF and ground pads.
Ordering Information
P35-4215-000-200
www.bookham.com 462/SM/00025/200 Issue 1/2
© Bookham Technology 2003 Bookham is a registered trademark of Bookham Technology plc
MMICS
Bookham Technology plc
Caswell
Towcester
Northamptonshire
NN12 8EQ
UK
• Tel: +44 (0) 1327 356 789
• Fax: +44 (0) 1327 356 698
rfsales@bookham.com
Important Notice
Bookham Technology has a policy of
continuous improvement. As a result
certain parameters detailed on this flyer
may be subject to change without notice.
If you are interested in a particular product
please request the product specification
sheet, available from any RF sales
representative.
P35-4215-000-200