CMOS Low Voltage
2 Ω SPST Switches
ADG701/ADG702
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 © 2006 Analog Devices, Inc. All rights reserved.
FEATURES
1.8 V to 5.5 V single supply
2 Ω (typical) on resistance
Low on resistance flatness
–3 dB bandwidth > 200 MHz
Rail-to-rail operation
Fast switching times
tON 18 ns
tOFF 12 ns
Typical power consumption < 0.01 μW
TTL/CMOS-compatible
APPLICATIONS
Battery-powered systems
Communications systems
Sample-and-hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement
FUNCTIONAL BLOCK DIAGRAM
D
S
IN
ADG701
DS
IN
ADG702
SWITCHES SHOWN FOR A LOGIC 1 INPUT
00039-001
Figure 1.
GENERAL DESCRIPTION
The ADG701/ADG702 are monolithic CMOS SPST switches.
These switches are designed on an advanced submicron process
that provides low power dissipation yet high switching speed,
low on resistance, and low leakage currents. In addition, −3 dB
bandwidths of greater than 200 MHz can be achieved.
The ADG701/ADG702 can operate from a single 1.8 V to 5.5 V
supply, making it ideal for use in battery-powered instruments
and with the new generation of DACs and ADCs from Analog
Devices, Inc.
Figure 1 shows that with a logic input of 1, the switch of the
ADG701 is closed and that of the ADG702 is open. Each switch
conducts equally well in both directions when on.
The ADG701/ADG702 are available in 5-lead SOT-23, 6-lead
SOT-23, and 8-lead MSOP packages.
PRODUCT HIGHLIGHTS
1. 1.8 V to 5.5 V Single-Supply Operation.
The ADG701/ADG702 offer high performance, including
low on resistance and fast switching times, and are fully
specified and guaranteed with 3 V and 5 V supply rails.
2. Ver y Low RON (3 Ω Maximum at 5 V, 5 Ω Maximum at 3 V).
At 1.8 V operation, RON is typically 40 Ω over the tempera-
ture range.
3. On Resistance Flatness RFLAT(ON) (1 Ω Maximum).
4. −3 dB Bandwidth > 200 MHz.
5. Low Power Dissipation.
CMOS construction ensures low power dissipation.
6. Fast tON/tOFF.
Table 1. Related Devices
Part No. Description
ADG701L/ADG702L Low voltage 2 Ω SPST switches
with guaranteed leakage
specifications
ADG701/ADG702
Rev. C | Page 2 of 12
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ..............................................7
Terminology .......................................................................................8
Test Circuits........................................................................................9
Applications Information.............................................................. 10
ADG701/ADG702 Supply Voltages......................................... 10
Bandwidth ................................................................................... 10
Off Isolation ................................................................................ 10
Outline Dimensions ....................................................................... 11
Ordering Guide .......................................................................... 12
REVISION HISTORY
7/06—Rev. B to Rev. C
Changes to Product Highlights....................................................... 1
Added Table 1.................................................................................... 1
Changes to Table 2............................................................................ 3
Changes to Table 3............................................................................ 4
Added Pb-Free Reflow Soldering to Absolute Maximum Ratings .. 5
Changes to Ordering Guide .......................................................... 13
6/04—Rev. A to Rev. B
Updated Format..................................................................Universal
Added 5-Lead SOT-23 Package ........................................Universal
Updated Outline Dimensions....................................................... 10
Changes to Ordering Guide .......................................................... 11
8/98—Rev. 0 to Rev. A
ADG701/ADG702
Rev. C | Page 3 of 12
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V. Temperature range for B version is −40°C to +85°C, unless otherwise noted.
Table 2.
B Version
Parameter +25°C
–40°C to
+85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 2 Ω typ VS = 0 V to VDD, IS = –10 mA; Figure 11
3 4 Ω max
On Resistance Flatness (RFLAT(ON)) 0.5 Ω typ VS = 0 V to VDD, IS = –10 mA
1.0 Ω max
LEAKAGE CURRENTS VDD = 5.5 V
Source OFF Leakage, IS (OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; Figure 12
Drain OFF Leakage, ID (OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; Figure 12
Channel ON Leakage, ID, IS (ON) ±0.01 nA typ VS = VD = 1 V, or 4.5 V; Figure 13
DIGITAL INPUTS
Input High Voltage, VINH 2.4 V min
Input Low Voltage, VINL 0.8 V max
Input Current
IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
DYNAMIC CHARACTERISTICS1
tON 12 ns typ RL = 300 Ω, CL = 35 pF
18 ns max VS = 3 V; Figure 14
tOFF 8 ns typ RL = 300 Ω, CL = 35 pF
12 ns max VS = 3 V; Figure 14
Charge Injection 5 pC typ VS = 2 V, RS = 0 Ω, CL = 1 nF; Figure 15
Off Isolation –55 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz
–75 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Figure 16
Bandwidth –3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; Figure 17
CS (OFF) 17 pF typ
CD (OFF) 17 pF typ
CD, CS (ON) 38 pF typ
POWER REQUIREMENTS VDD = 5.5 V
Digital inputs = 0 V or 5 V
IDD 0.001 μA typ
1.0 μA max
1 Guaranteed by design, not subject to production test.
ADG701/ADG702
Rev. C | Page 4 of 12
VDD = 3 V ± 10%, GND = 0 V. Temperature range for B version is −40°C to +85°C, unless otherwise noted.
Table 3.
B Version
Parameter +25°C
−40°C to
+85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 3.5 Ω typ VS = 0 V to VDD, IS = −10 mA; Figure 11
5 6 Ω max
On Resistance Flatness (RFLAT(ON)) 1.5 Ω typ VS = 0 V to VDD, IS = −10 mA
LEAKAGE CURRENTS VDD = 3.3 V
Source OFF Leakage IS (OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; Figure 12
Drain OFF Leakage ID (OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; Figure 12
Channel ON Leakage ID, IS (ON) ±0.01 nA typ V = VD = 1 V, or 3 V; Figure 13
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.4 V max
Input Current
IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
DYNAMIC CHARACTERISTICS1
tON 14 ns typ RL = 300 Ω, CL = 35 pF
20 ns max VS = 2 V, Figure 14
tOFF 8 ns typ RL = 300 Ω, CL = 35 pF
13 ns max VS = 2 V, Figure 14
Charge Injection 4 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; Figure 15
Off Isolation −55 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz
−75 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Figure 16
Bandwidth −3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; Figure 17
CS (OFF) 17 pF typ
CD (OFF) 17 pF typ
CD, CS (ON) 38 pF typ
POWER REQUIREMENTS VDD = 3.3 V
Digital inputs = 0 V or 3 V
IDD 0.001 μA typ
1.0 μA max
1 Guaranteed by design, not subject to production test.
ADG701/ADG702
Rev. C | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
Analog and Digital Inputs1−0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Continuous Current, S or D 30 mA
Peak Current, S or D 100 mA, pulsed at 1 ms,
10% duty cycle maximum
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package, Power Dissipation 315 mW
θJA Thermal Impedance 206°C/W
θJC Thermal Impedance 44°C/W
SOT-23 Package, Power Dissipation 282 mW
θJA Thermal Impedance 229.6°C/W
θJC Thermal Impedance 91.99°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Pb-free Reflow Soldering
Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
ESD 2 kV
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
Table 5. Truth Table
ADG701 In ADG702 In Switch Condition
0 1 Off
1 0 On
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ADG701/ADG702
Rev. C | Page 6 of 12
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
00039-002
NC = NO CONNECT
ADG701/
ADG702
TOP VIEW
(Not to Scale)
D
1
NC
2
NC
3
V
DD 4
S
GND
IN
NC
8
7
6
5
00039-003
NC = NO CONNECT
ADG701/
ADG702
TOP VIEW
(Not to Scale)
D
1
S
2
G
ND
3
V
DD
6
NC
5
IN
4
00039-004
ADG701/
ADG702
TOP VIEW
(Not to Scale)
D
1
S
2
G
ND
3
V
DD
5
IN
4
Figure 2. 8-Lead MSOP Figure 3. 6-Lead SOT-23 Figure 4. 5-Lead SOT-23
Table 6. Pin Descriptions
Pin No.
8-Lead
MSOP
6-Lead
SOT-23
5-Lead
SOT-23 Mnemonic Description
1 1 1 D Drain Terminal. Can be an input or output.
2, 3, 5 5 NC No Connect
4 6 5 VDD Most Positive Power Supply Potential.
6 4 4 IN Logic Control Input.
7 3 3 GND Ground (0 V) Reference.
8 2 2 S Source Terminal. Can be an input or output.
ADG701/ADG702
Rev. C | Page 7 of 12
TYPICAL PERFORMANCE CHARACTERISTICS
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
00039-005
V
D
OR V
S
(DRAIN OR SOURCE VOLTAGE (V))
R
ON
(Ω)
V
DD
= 2.7V T
A
= 25°C
V
DD
= 3.0V
V
DD
= 5.0V
V
DD
= 4.5V
Figure 5. On Resistance as a Function of VD (VS) Single Supplies
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.5 1.0 1.5 2.0 2.5 3.0
00039-006
V
D
OR V
S
(DRAIN OR SOURCE VOLTAGE (V))
R
ON
(Ω)
+85°C
+25°C
–40°C
V
DD
= 3V
Figure 6. On Resistance as a Function of VD (VS) for Different Temperatures
VDD = 3 V
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
00039-007
V
D
OR V
S
(DRAIN OR SOURCE VOLTAGE (V))
R
ON
(Ω)
V
DD
= 5V
+85°C
+25°C
–40°C
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures
VDD = 5 V
10m
1n
10n
100n
1μ
10μ
100μ
1m
10 100 1k 10k 100k 1M 10M
00039-008
FREQUENCY (Hz)
I
SUPPLY
(A)
V
DD
= 5V
Figure 8. Supply Current vs. Input Switching Frequency
–10
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
10k 100k 1M 10M 100M
00039-009
FREQUENCY (Hz)
OFF ISOLATION (dB)
V
DD
= 5V, 3V
Figure 9. Off Isolation vs. Frequency
0
–6
–4
–2
10k 100k 1M 10M 100M
00039-010
FREQUENCY (Hz)
ON RESPONSE (dB)
V
DD
= 3V
Figure 10. Bandwidth
ADG701/ADG702
Rev. C | Page 8 of 12
TERMINOLOGY
Table 7.
Term Description
RON Ohmic resistance between D and S.
RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the
specified analog signal range.
IS (OFF) Source leakage current with the switch off.
ID (OFF) Drain leakage current with the switch off.
ID, IS (ON) Channel leakage current with the switch on.
VD (VS) Analog voltage on terminals D and S.
CS (OFF) Off switch source capacitance.
CD (OFF) Off switch drain capacitance.
CD, CS (ON) On switch capacitance.
tON Delay between applying the digital control input and the output switching on. See Figure 14.
tOFF Delay between applying the digital control input and the output switching off.
Off Isolation A measure of unwanted signal coupling through an off switch.
Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching.
Bandwidth The frequency at which the output is attenuated by −3 dB.
On Response The frequency response of the on switch.
On Loss The voltage drop across the on switch seen in Figure 10 as the number of decibels that the signal is from 0 dB at very
low frequencies.
ADG701/ADG702
Rev. C | Page 9 of 12
TEST CIRCUITS
SD
V
S
R
ON
= V1/I
DS
I
DS
V1
00039-011
SD
V
S
V
D
I
S
(OFF) I
D
(OFF)
A A
00039-012
SD
V
S
V
D
I
D
(ON)
A
00039-013
Figure 11. On Resistance Figure 12. Off Leakage Figure 13. On Leakage
0.1μF
IN
SD
VDD
RL
300ΩCL
35pF
VOUT
VOUT
t
ON
t
OFF
VIN
VIN
VDD
GND
ADG701
ADG702
50% 50%
90% 90%
50% 50%
VS
00039-014
Figure 14. Switching Times
00039-015
V
IN
V
IN
V
OUT
ON OFF
ΔV
OUT
IN
GND
V
DD
V
DD
C
L
1nF
V
OUT
S
R
S
V
S
D
Q
INJ
= C
L
×ΔV
OUT
ADG701
ADG702
Figure 15. Charge Injection
00039-016
V
DD
R
L
50Ω
0.1μF
V
OUT
V
IN
V
S
V
DD
IN
SD
GND
Figure 16. Off Isolation
00039-017
V
DD
R
L
50Ω
0.1μF
V
OUT
V
IN
V
S
V
DD
IN
SD
GND
Figure 17. Bandwidth
ADG701/ADG702
Rev. C | Page 10 of 12
APPLICATIONS INFORMATION
The ADG701/ADG702 belong to the Analog Devices family
of CMOS switches. This series of general-purpose switches
has improved switching times, lower on resistance, higher
bandwidth, low power consumption, and low leakage currents.
ADG701/ADG702 SUPPLY VOLTAGES
Functionality of the ADG701/ADG702 extends from 1.8 V to
5.5 V single supply, making the parts ideal for battery-powered
instruments, where power efficiency and performance are
important design parameters.
It is important to note that the supply voltage affects the input
signal range, on resistance, and switching times of the part. The
effects of the power supplies can be clearly seen in the Typical
Performance Characteristics and the Specifications sections.
For VDD = 1.8 V operation, RON is typically 40 Ω over the
temperature range.
BANDWIDTH
Figure 18 illustrates the parasitic components that affect the ac
performance of CMOS switches (a box surrounds the switch).
Additional external capacitances further degrade performance by
affecting feedthrough, crosstalk, and system bandwidth.
00039-018
V
IN
SD
R
ON
C
DS
C
D
C
LOAD
R
LOAD
V
OUT
Figure 18. Switch Represented by Equivalent Parasitic Components
The transfer function that describes the equivalent diagram of
the switch (see
Figure 18) is of the form (A)s, shown in the
following equation:
⎥
⎦
⎤
⎢
⎣
⎡
+
+
=1)(
1)(
)(
TT
ON
DSON
TRCRs
CRs
RsA
where CT = CLOAD + CD + CDS.
The signal transfer characteristic is dependent on the switch
channel capacitance, CDS. This capacitance creates a frequency
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The dominant effect of the output capacitance, CD, causes the pole
breakpoint frequency to occur first. To maximize bandwidth, a
switch must have a low input and output capacitance and low
on resistance. The on response vs. frequency for the ADG701/
ADG702 can be seen in Figure 10.
OFF ISOLATION
Off isolation is a measure of the input signal coupled through
an off switch to the switch output. The capacitance, CDS, couples
the input signal to the output load when the switch is off, as
shown in Figure 19.
00039-019
V
IN
SD
C
DS
C
D
C
LOAD
R
LOAD
V
OUT
Figure 19. Off Isolation Is Affected by External Load Resistance and
Capacitance
The larger the value of CDS, the larger the values of feedthrough
produced. Figure 9 illustrates the drop in off isolation as a
function of frequency. From dc to roughly 1 MHz, the switch
shows better than −75 dB isolation. Up to frequencies of 10 MHz,
the off isolation remains better than −55 dB. As the frequency
increases, more of the input signal is coupled through to the
output. Off isolation can be maximized by choosing a switch
with the smallest CDS possible. The values of load resistance and
capacitance also affect off isolation, because they contribute to
the coefficients of the poles and zeros in the transfer function of
the switch when open.
⎥
⎦
⎤
⎢
⎣
⎡
+
+
=1))((
1)(
)(
T
LOAD
DSLOAD
TCRs
CRs
RsA
ADG701/ADG702
Rev. C | Page 11 of 12
OUTLINE DIMENSIONS
0.80
0.60
0.40
8°
0°
4
8
1
5
4.90
BSC
PIN 1 0.65 BSC
3.00
BSC
SEATING
PLANE
0.15
0.00
0.38
0.22
1.10 MAX
3.00
BSC
COPLANARITY
0.10
0.23
0.08
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 20. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1 3
45
2
6
2.90 BSC
1.60 BSC 2.80 BSC
1.90
BSC
0.95 BSC
0.22
0.08 10°
4°
0°
0.50
0.30
0.15 MAX
1.30
1.15
0.90
SEATING
PLANE
1.45 MAX
0.60
0.45
0.30
PIN 1
INDICATOR
COMPLIANT TO JEDEC STANDARDS MO-178-AB
Figure 21. 6-Lead Small Outline Transistor Package [SOT-23]
(RT-6)
Dimensions shown in millimeters
ADG701/ADG702
Rev. C | Page 12 of 12
PIN 1
1.60 BSC 2.80 BSC
1.90
BSC
0.95 BSC
5
123
4
0.22
0.08 10°
5°
0°
0.50
0.30
0.15 MAX SEATING
PLANE
1.45 MAX
1.30
1.15
0.90
2.90 BS C
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 22. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model Package Description Package Option Branding
ADG701BRJ-500RL7 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B
ADG701BRJ-REEL 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B
ADG701BRJ-REEL7 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B
ADG701BRM 8-Lead Mini Small Outline Package [MSOP] RM-8 S3B
ADG701BRM-REEL 8-Lead Mini Small Outline Package [MSOP] RM-8 S3B
ADG701BRM-REEL7 8-Lead Mini Small Outline Package [MSOP] RM-8 S3B
ADG701BRT-REEL 6-Lead Small Outline Transistor Package [SOT-23] RT-6 S3B
ADG701BRT-REEL7 6-Lead Small Outline Transistor Package [SOT-23] RT-6 S3B
ADG701BRJZ-500RL715-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B#
ADG701BRJZ-REEL15-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B#
ADG701BRJZ-REEL715-Lead Small Outline Transistor Package [SOT-23] RJ-5 S3B#
ADG701BRMZ18-Lead Mini Small Outline Package [MSOP] RM-8 S0S
ADG701BRMZ-REEL718-Lead Mini Small Outline Package [MSOP] RM-8 S0S
ADG701BRTZ-REEL16-Lead Small Outline Transistor Package [SOT-23] RT-6 S3B#
ADG701BRTZ-REEL716-Lead Small Outline Transistor Package [SOT-23] RT-6 S3B#
ADG702BRJ-500RL7 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S4B
ADG702BRJ-REEL 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S4B
ADG702BRJ-REEL7 5-Lead Small Outline Transistor Package [SOT-23] RJ-5 S4B
ADG702BRM 8-Lead Mini Small Outline Package [MSOP] RM-8 S4B
ADG702BRM-REEL 8-Lead Mini Small Outline Package [MSOP] RM-8 S4B
ADG702BRM-REEL7 8-Lead Mini Small Outline Package [MSOP] RM-8 S4B
ADG702BRT-REEL 6-Lead Small Outline Transistor Package [SOT-23] RT-6 S4B
ADG702BRT-REEL7 6-Lead Small Outline Transistor Package [SOT-23] RT-6 S4B
ADG702BRJZ-500RL715-Lead Small Outline Transistor Package [SOT-23] RJ-5 S14
ADG702BRJZ-REEL15-Lead Small Outline Transistor Package [SOT-23] RJ-5 S14
ADG702BRJZ-REEL715-Lead Small Outline Transistor Package [SOT-23] RJ-5 S14
ADG702BRMZ18-Lead Mini Small Outline Package [MSOP] RM-8 S14
ADG702BRMZ-REEL718-Lead Mini Small Outline Package [MSOP] RM-8 S14
ADG702BRTZ-REEL16-Lead Small Outline Transistor Package [SOT-23] RT-6 S4B#
ADG702BRTZ-REEL716-Lead Small Outline Transistor Package [SOT-23] RT-6 S4B#
1 Z = Pb-free part, # denotes lead-free product, may be top or bottom marked.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00039–0–7/06(C)
