1
FEATURES
DESCRIPTION
APPLICATIONS
TYPICAL APPLICATION
5
6
7
8
19
3
AC
USB
SW
VSS
STAT1
STAT2 13
12
ISET2
ISET1
bq25012RHL
PACK+
PACK−
VDC
GND
VBUS
GND
D+
D −
USB Port
AC Adapter
15CE
2FB
16BAT/OUT +
DSP
Processor
Bluetooth Chipset
Battery
Pack
1.8 V
17BAT/OUT
9
18
VSS
VSS
EN
4 20FPWM
UDG−04070
RSET
14PG
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007www.ti.com
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR PORTABLE APPLICATIONS(bq2501x)
2
•Li-Ion Or Li-Pol Charge Management andSynchronous DC-DC Power Conversion In a
The bq2501x series are highly integrated charge andSingle Chip
power management devices targeted at space-limitedbluetooth applications. The bq2501x series offer•Optimized for Powering Bluetooth™ Headsets
integrated power FET and current sensor for chargeand Accessories
control, reverse blocking protection, high accuracy•Charges and Powers the System from Either
current and voltage regulation, charge status, chargethe AC Adapter or USB with Autonomous
termination, and a highly efficient and low-powerPower Source Selection
dc-dc converter in a small package.•Integrated USB Charge Control with
The bq2501x charges the battery in three phases:Selectable 100 mA and 500 mA Charge Rates
conditioning, constant current and constant voltage.•Integrated Power FET and Current Sensor for
Charge is terminated based on minimum current. AnUp to 500 mA Charge Applications AND internal charge timer provides a backup safety featurefor charge termination. The bq2501x automatically100 mA DC-DC Controller with Integrated
re-starts the charge if the battery voltage falls belowFETs
an internal threshold. The bq2501x automatically•Reverse Leakage Protection Prevents Battery
enters sleep mode when V
CC
supply is removed.Drainage
The integrated low-power high-efficiency dc-dc•Automatic Power Save Mode For High
converter is designed to operate directly from aEfficiency at Low Current, or Forced PWM for
single-cell Li-Ion or Li-Pol battery pack. The outputFrequency Sensitive Applications
voltage is either adjustable from 0.7 V to VBAT•3.5 mm ×4.5 mm QFN Package
(bq25010), fixed at 3.3 V (bq25011), or fixed at 1.8 V(bq25012), and is capable of delivering up to 150-mAof load current. The dc-dc converter operates at asynchronized 1 MHz switching frequency allowing for•Bluetooth™ Headsets
the use of small inductors.•Bluetooth™ Accessories•Low-Power Handheld Devices
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2004 – 2007, Texas Instruments IncorporatedPRODUCTION DATA information current as of publication date.Products conform to specifications per the terms of TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
PACKAGET
A
OUTPUT VOLTAGE (V) PART NUMBER
(2) (3)
MARKING
Adjustable bq25010RHLR ANC-40 °C to 125 °C 3.3 bq25011RHLR
(4)
ANE1.8 bq25012RHLR ANF
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com(2) The RHL package is available taped and reeled only in quantities of 3,000 devices per reel.(3) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable foruse in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, includingbromine (Br) or antimony (Sb) above 0.1% of total product weight.(4) Advanced Information, contact factory for availability.
over operating free-air temperature range (unless otherwise noted)
bq25010
bq25011
bq25012
Supply voltage AC, USB (wrt VSS) – 0.3 V to 7 VPG, OUT, ISET1, ISET2, STAT1, STAT2, TS (wrt VSS) – 0.3 V to 7 VInput voltage
EN, FB, FPWM, SW (wrt VSS) V
OUT
+ 0.3 VPG, STAT1, STAT2 15 mAOutput sink/source current
TS 200 μAOutput source current OUT 1.5 AStorage temperature range, T
stg
– 65 °C to 150 °CJunction temperature range, T
J
0°C to 125 °CLead temperature (soldering, 10 seconds) 260 °CESD rating (human body model, HBM) 1500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltagevalues are with respect to the network ground terminal unless otherwise noted.
MIN MAX UNIT
V
CC
Supply voltage (from AC input) 4.5 6.5
VV
CC
Supply voltage (from USB input) 4.35 6.5T
J
Operating junction temperature range – 40 125 °C
T
A
< 40 °C DERATING FACTORPACKAGE θ
JAPOWER RATING ABOVE T
A
= 40 °C
20-pin RHL
(1)
1.81 W 21 mW/ °C 46.87 °C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This isconnected to the ground plane by a 2 ׳via matrix.
2Submit Documentation Feedback Copyright © 2004 – 2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
www.ti.com
ELECTRICAL CHARACTERISTICS
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
over junction temperature range (0 °C≤T
J
≤125 °C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT CURRENT
I
CC(VCC)
Supply current 1, VCC V
VCC
> V
VCC(min)
1.2 2 mASum of currents into OUT/BAT,I
CC(SLP)
Sleep current 2 5V
VCC
< V
(SLP)
I
CC(STDBY)
Stand by current CE = High, 0 °C≤T
J
≤85 °C 150
μACharge DONE, V
VCC
> V
VCC(min)
,I
IB(OUT)
Input current, OUT 15 35I
OUT(SW)
= 0 mA, Converter not switchingI
IB(CE)
Input current, CE 1
CHARGE VOLTAGE REGULATION (V
BAT(REG)
+ V
(DO-MAX)
≤V
VCC
, I
(TERM)
< I
OUT(BAT)
≤0.5 A)
V
REG(BAT)
Charger regulation voltage 4.2 VT
A
= 25 °C – 0.35% 0.35%Charge voltage regulationaccuracy
– 1% 1%(V
(AC)
– V
(OUT)
) AC dropout voltage V
OUT (BAT)
= V
REG (BAT)
, I
OUT(BAT)
= 0.5 A 175 250V
OUT (BAT)
= V
REG (BAT)
, ISET2 = High 350 500 mV(V
(USB)
– V
(OUT)
) USB dropout voltage
V
OUT (BAT)
= V
REG (BAT)
, ISET2 = Low 60 100
CHARGE CURRENT REGULATION
V
VCC
≥4.5 V, V
OUT (BAT)
= V
(LOWV)
,I
OUT (BAT)
AC output current range V
VCC
– V
OUT (BAT)
> V
(DO-MAX)
, 50 500I
OUT(BAT)
= (K
(SET)
×V
(SET)
/ R
SET
)V
VCC(min)
≥4.5 V, V
OUT (BAT)
= V
(LOWV)
, mA80 100V
VCC
– V
OUT (BAT)
> V
(DO-MAX)
, ISET2 = LowI
OUT (BAT)
USB output current range
V
VCC(min)
≥4.5 V, V
OUT (BAT)
= V
(LOWV)
,
400 500V
VCC
– V
OUT (BAT)
> V
(DO-MAX)
, ISET2 = HighVoltage on ISET1, V
VCC
≥4.5 V,V
(SET)
Output current set voltage V
OUT (BAT)
= V
(LOWV)
, 2.436 2.500 2.538 VV
VCC
– V
OUT (BAT)
> V
(DO-MAX)
, ISET2 = High50 mA ≤I
OUT(OUT)
≤500 mA 307 322 337K
(SET)
Output current set factor 10 mA ≤I
OUT(OUT)
≤50 mA 296 320 34610 mA ≤I
OUT(OUT)
≤10 mA 246 320 416
PRECHARGE and SHORT-CIRCUIT CURRENT REGULATION
Precharge to fast-chargeV
(LOWV)
Voltage on OUT/BAT 2.8 3 3.2 Vtransition threshold
V
VCC(min)
≥4.5 V, t
FALL
= 100 ns,Deglitch time for fast-charge tot
PRECHG_DG
10 mV overdrive, 250 375 500 msprecharge transition
V
IN(BAT)
decreasing below threshold0 V < V
IN(BAT)
< V
(LOWV)
, t < t
(PRECHG)
,I
OUT(PRECHG)
Precharge range 5 100 mAI
OUT(PRECHG)
= (K
(SET)
נV
(PRECHG)
)/ R
SET
Voltage on ISET1, V
REG(BAT)
= 4.2 V,V
(PRECHG)
Precharge set voltage 0 V < V
IN(BAT)
< V
(LOWV)
, 240 255 270 mVt < t
(PRECHG)
CHARGE TAPER and TERMINATION DETECTION
V
IN(BAT)
> V
(RCH)
, t < t
(PRECHG)
,I
(TAPER)
Charge taper detection range 5 100 mAI
(TAPER)
= (K
(SET)
נV
(TAPER)
)/ R
SET
Charge taper detection set Voltage on ISET1, V
REG(BAT)
= 4.2 V,V
(TAPER)
235 250 265voltage V
IN(BAT)
> V
(RCH)
, t < t
(PRECHG)
mVVoltage on ISET1, V
REG(BAT)
= 4.2 V,Charge termination detectionV
(TERM)
V
IN(BAT)
> V
(RCH)
, t < t
(PRECHG)
, 11 18 25set voltage
I
(TERM)
= (K
(SET)
נV
(TERM)
)/ R
SET
Copyright © 2004 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): bq25010 bq25011 bq25012
www.ti.com
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS (continued)over junction temperature range (0 °C≤T
J
≤125 °C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
VCC(min)
≥4.5 V, t
FALL
= 100 ns,Deglitch time for tapert
TPRDET_DG
10 mV overdrive, I
CHG
increasing above or 250 375 500detection
decreasing below threshold
msV
VCC(min)
≥4.5 V, t
FALL
= 100 ns,Deglitch time for terminationt
TERMDET_DG
10 mV overdrive, 350 375 500detection
I
CHG
decreasing below threshold
BATTERY RECHARGE THRESHOLD
V
REG(BAT)
V
REG(BAT)
V
REG(BAT)V
RCH
Recharge threshold voltage V– 0.115 – 0.10 – 0.085V
VCC(min)
≥4.5 V, t
FALL
= 100 ns,Deglitch time for recharget
RCHDET
10 mV overdrive, I
CHG
decreasing below or 250 375 500 msdetect
increasing above threshold
STAT1, STAT2 and PG OUTPUTS
V
OL
Low-level output voltage I
OL
= 5 mA 0.25 V
ISET2 and CE INPUTS
V
IL
Low-level input voltage I
IL
= 10 μA 0 0.4
VV
IH
High-level input voltage I
IL
= 20 μA 1.4I
IL
Low-level input current, CE – 1I
IH
High-level input current, CE 1I
IL
Low-level input current, ISET2 V
ISET2
= 0 V – 20 μAI
IH
High-level input current, ISET2 V
ISET2
= V
CC
40I
IHZ
High-Z input current, ISET2 V
ISET2
= High-Z 1
TIMERS
t
(PRECHG)
Precharge time limit 1620 1800 1930t
(TAPER)
Taper time limit 1620 1800 1930 st
(CHG)
Charge time limit 16200 18000 19300I
(FAULT)
Timer fault recovery current 200 μA
SLEEP COMPARATOR for CHARGER
V
VCC
≤V
(SLP)
Sleep mode entry threshold 2.3 V ≤V
IN(BAT)
≤V
REG(BAT)
V
IN(BAT)
+80 mV
VV
VCC
≥V
(SLP_DG)
Sleep mode exit threshold 2.3 V ≤V
IN(BAT)
≤V
REG(BAT)
V
IN(BAT)
+190 mVV
CC
decreasing below threshold,t
(DEGL)
Deglitch time for sleep mode 250 375 500 mst
FALL
= 100 ns, 10 mV overdrive,
THERMAL SHUTDOWN
Thermal trip thresholdT
(SHTDWN)
165temperature
°CThermal hysteresis 15
UNDERVOLTAGE LOCKOUT AND POR
Undervoltage lockoutV
(UVLO_CHG)
Decreasing V
CC
2.4 2.5 2.6 Vthreshold voltageHysteresis 27 mVV
POR
POR threshold voltage
(1)
2.3 2.4 2.5 V
(1) Ensured by design. Not production tested.
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Product Folder Link(s): bq25010 bq25011 bq25012
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bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS (continued)over junction temperature range (0 °C≤T
J
≤125 °C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC-DC INPUT/OUTPUT CURRENT
Input power absent V
(LOWV)
4.2V
(BAT)
Input voltage range
Input power present V
(UVLO)
4.2 V
UVLO
Undervoltage lockout 2I
OUT_L
Maximum output current 150 mA
FPWM – bq25010
V
IH(FPWM)
High-level input voltage 2.0V
IL(FPWM)
Low-level input voltage 0.4
FPWM bq25011 and bq25012
V
IH(FPWM)
High-level input voltage 1.3
VV
IL(FPWM)
Low-level input voltage 0.4I
FPWM
Input bias current V
EN
= GND or V
BAT
, V
FPWM
= GND or V
BAT
0.01 0.1 μA
ENABLE
V
IH(EN)
High-level input voltage 1.3
VV
IL(EN)
Low-level input voltage 0.4I
EN
Input bias current V
EN
= GND or V
BAT
, V
FPWM
= GND or V
BAT
0.01 0.1 μA
POWER SWITCH
V
IN
= V
GS
= 3.6 V 0.97 1.52Internal P-channel MOSFETon-resistance
V
IN
= V
GS
= 2.5 V 1.27 2.00R
DS(on)
ΩV
IN
= V
GS
= 3.6 V 0.68 1.19Internal N-channel MOSFETon-resistance
V
IN
= V
GS
= 2.5 V 0.86 1.45I
lgk(P)
P-channel leakage current V
DS
= 6 V 0.1 1
μAI
lgk(N)
N-channel leakage current V
DS
= 6 V 0.1 1I
(LIM)
P-channel current limit 2.5 V < V
BAT
< 4.2 V 190 230 350 mA
OSCILLATOR
f
SW
Switching frequency 0.65 1 1.5 MHz
OUTPUT
V
REF
Reference voltage bq25010 0.5Feedback 3.6 V ≤V
BAT
≤4.2 V, 0 mA ≤I
OUT
≤150V
FB
bq25010 – 3% +3%voltage
(2)
mAAdjustable output
bq25010 0.7 V
BATvoltage range V3.6 V ≤V
BAT
≤4.2 V, 0 mA ≤I
OUT
≤150V
DC-DC
bq25011 3.2 3.3 3.4mAFixed outputvoltage
3.6 V ≤V
BAT
≤4.2 V, 0 mA ≤I
OUT
≤150bq25012 1.746 1.8 1.854mA
(2) For output voltages ≤1.2 V a 22- μF output capacitor value is required to achieve a maximum output voltage accuracy of +3% whileoperating in power save mode (PFM).
Copyright © 2004 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): bq25010 bq25011 bq25012
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TYPICAL OPERATING CHARACTERISTICS
0 10 20 30 40 50 60 70 80 90 100
50
55
60
65
70
75
80
85
90
95
100
Vbat=2.7V
Vbat=3.7V
Vbat=4.1V
Efficiency − %
PowerSaveMode,
V =1.8V,
T =27 C
O
A
o
IL− LoadCurrent − mA
0 10 20 30 40 50 60 70 80 90 100
50
55
60
65
70
75
80
85
90
95
100
Efficiency − %
Vbat=3.6V
Vbat=4V
Vbat=3.2V
IL− LoadCurrent − mA
ForcedPWM,
V =1.8V,
T =22 C
O
A
o
DEVICE INFORMATION
FB
VSS
EN
AC
USB
STAT1
STAT2
VSS
bq25010, bq25011, bq25012
RHL PACKAGE
(BOTTOM VIEW)
SW
VSS
BAT/OUT
BAT/OUT
CE
PG
ISET2
ISET1
FPWM
N/C
N/C
N/C
20 1
11 10
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
EFFICIENCY EFFICIENCYvs vsLOAD CURRENT LOAD CURRENT
Figure 1. Figure 2.
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Product Folder Link(s): bq25010 bq25011 bq25012
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bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTIONNAME NO.
AC 5 I Charge input voltage from AC adapterBAT/OUT 16 I/O Charge current outputBAT/OUT 17 I Battery input to DC-DC converterCE 15 I Charge enable input (active low)EN 4 I Enable input for DC-DC converter (active high)FB 2 I Feedback pin for DC-DC converterPWM control input for the DC-DC converter. A high on FPWM = forced PWM mode. A low = power saveFPWM 20 I
mode.ISET1 12 I Charge current set point for AC input and precharge and taper set point for both AC and USBISET2 13 I Charge current set point for USB port (High = 500 mA, Low = 100 mA, High-Z = disable USB charge)NC 1, 10, 11 – No connect. These pins must be left floating.PG 14 O Power good status output (active low)STAT1 7 O Charge status output 1 (open-drain)STAT2 8 O Charge status output 2 (open-drain)SW 19 O Phase node of the DC-DC converterUSB 6 I Charge input voltage from USB adapterGround Input. Also note that there is an internal electrical connection between the exposed thermal padand VSS pins of the device. The exposed thermal pad must be connected to the same potential as theVSS 3, 9, 18 –
Vss pin on the printed circuit board. Do not use the thermal pad as the primary ground input for thedevice. All VSS pins must be connected to ground at all times.
Copyright © 2004 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): bq25010 bq25011 bq25012
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5AC
6USB
+
+
16
BAT/OUT
12
ISET1
13 ISET2
Charge
Control,
Timer
and
Display
Logic
Thermal
Shutdown
Precharge
Recharge
Taper
CHG ENABLE
14 PG
7 STAT1
8 STAT2
Term
VI(SET)
VO(REG)
VI(BAT)
VI(ISET)
AC/USB
AC
Sense FET
VI(OUT)
VI(ISET)
Sense FET
SleepVI(BAT)
VI(SLP)
VI(OUT)
VI(OUT)
V(ISET1)
V(ISET2)
V(ISET2)
VO(REG)
9VSS
VI(AC)
500 mA/ 100 mA
USB Charge
AC/USB
500 mA/ 100 mA
Reference
and
Bias
Deglitch
Deglitch
Deglitch
Suspend
Deglitch
15 CE
VO(REG)
2 FB
VI(FB)
DC−DC
Controller
VCC
4EN
20FPWM 19 SW
17 BAT/OUT
3VSS
18VSS
UDG−04072
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
FUNCTIONAL BLOCK DIAGRAM
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Product Folder Link(s): bq25010 bq25011 bq25012
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FUNCTIONAL DESCRIPTIONS
BATTERY CHARGER
5
4
6
AC
EN
SW
13
12
ISET2
ISET1
bq25010RHL
PACK+
PACK−
VDC
GND
VBUS
GND
D+
D −
USBPort
AC Adapter
2FB
16BAT/OUT
+
SYSTEM
Battery
Pack
10 µH
17BAT/OUT
USB
STAT2
7
8
STAT1
3
9
VSS
VSS
VSS18 14
UDG_04095_lus615
19
15
CE
PG
R1
C
10 µF
OUT
C
0.1 µF
CHG
R2
RSET
LOUT
Controland
StatusSignals
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
The bq2501x supports a precision Li-Ion or Li-Pol charging system suitable for single-cell battery packs and alow-power DC-DC converter for providing power to system processor. See a typical charge profile, applicationcircuit and an operational flow chart in Figure 3 through Figure 5 respectively.
Figure 3. Typical Charger Profile
Figure 4. Typical Application Circuit
Copyright © 2004 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): bq25010 bq25011 bq25012
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Vcc > VI(BAT)
checked at all times
VI(BAT)<V(LOWV) Yes
No
t(PRECHG)
Expired? No
Yes
Indicate Fault
Yes
No
Yes
t(CHG)Expired?
No
Indicate Charge−
In−Progress
Regulate
IO(PRECHG)
Indicate Charge−
In−Progress
Regulate Current
or Voltage
No
Reset and Start
t(PRECHG)timer
POR
Yes
Reset all timers,
Start t(CHG) timer
I(TERM)
detection?
No
Yes
VI(BAT) < V(RCH)?
No
VI(BAT)<V(LOWV)
No
Fault Condition
Yes
Yes
Indicate DONE
Turn off charge
Indicate SLEEP
MODE
SLEEP MODE
VI(BAT)<V(LOWV)
Tj < T(SHTDWN)
Tj < T(SHTDWN)
Suspend charge
No
No
Yes
Indicate CHARGE
SUSPEND
I(TAPER)
detection?
t(TAPER)
Expired?
No
No
Yes
Yes No
VI(BAT) > V(RCH)?
Enable I(FAULT)
current
VI(BAT) > V(RCH)?
No
Yes
Yes
Disable I(FAULT)
current
Yes
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
Figure 5. Operational Flow Chart
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Product Folder Link(s): bq25010 bq25011 bq25012
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Autonomous Power Source Selection
Battery Pre-Conditioning
IO (PRECHG) +V(PRECHG) K(SET)
RSET
(1)
Battery Charge Current
IO (OUT) +V(SET) K(SET)
RSET
(2)
Battery Voltage Regulation
Charge Taper Detection, Termination and Recharge
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
As default, the bq2501x attempts to charge the battery from the AC input. If AC input is not present, the USBinput is selected. If both inputs are available, the AC adapter has the priority. Refer to Figure 6 for details.
Figure 6. Power Source Selection
During a charge cycle if the battery voltage is below the V
(LOWV)
threshold, the bq2501x applies a prechargecurrent, I
O(PRECHG)
, to the battery. This feature revives deeply discharged cells. The resistor connected betweenthe ISET1 and VSS pins, R
SET
, determines the precharge rate. The V
(PRECHG)
and K
(SET)
parameters arespecified in the specifications table.
The bq2501x activates a safety timer, t
(PRECHG)
, during the conditioning phase. If V
(LOWV)
threshold is not reachedwithin the timer period, the bq2501x turns off the charger and enunciates FAULT on the STAT1 and STAT2 pins.Please refer to Timer Fault Recovery section for additional details.
The bq2501x offers on-chip current regulation with programmable set point. The resistor connected between theISET1 and VSS pins, R
SET
, determines the charge rate. The V
(SET)
and K
(SET)
parameters are specified in thespecifications table.
When charging from a USB port, the host controller has the option of selecting either 100 mA or 500 mA chargerate using the ISET2 pin. A low-level signal sets the current at 100 mA and a high-level signal sets the current at500 mA. A high-Z input disables USB charging.
The voltage regulation feedback is through the BAT/OUT pin. This input is tied directly to the positive side of thebattery pack. The bq2501x monitors the battery-pack voltage between the BAT/OUT and VSS pins. When thebattery voltage rises to V
O(REG)
threshold, the voltage regulation phase begins and the charging current begins totaper down.
As a safety backup, the bq2501x also monitors the charge time in the charge mode. If taper threshold is notdetected within this time period, t
(CHG)
, the bq2501x turns off the charger and enunciates FAULT on the STAT1and STAT2 pins. Please refer to section titled Timer Fault Recoverysection for additional details.
The bq2501x monitors the charging current during the voltage regulation phase. Once the taper threshold,I
(TAPER)
, is detected the bq2501x initiates the taper timer, t
(TAPER)
. Charge is terminated after the timer expires.The resistor connected between the ISET1 and VSS pins, R
SET
, determines the taper detection level. TheV
(TAPER)
and K
(SET)
parameters are specified in the specifications table. Note that this applies to both AC andUSB charging.
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I(TAPER) +V(TAPER) K(SET)
RSET
(3)
I(TERM) +V(TERM) K(SET)
RSET
(4)
Sleep Mode for Charger
Operation Modes
Status Outputs
PG Output (Power Good)
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
The bq2501x resets the taper timer in the event that the charge current returns above the taper threshold,I
(TAPER)
.
In addition to the taper current detection, the bq2501x terminates charge in the event that the charge current fallsbelow the I
(TERM)
threshold. This feature allows for quick recognition of a battery removal condition or insertion ofa fully charged battery. Note that taper timer is not activated. The resistor connected between the ISET1 andVSS pins, R
SET
, determines the taper detection level. The V
(TERM)
and K
(SET)
parameters are specified in thespecifications table. Note that this applies to both AC and USB charging.
After charge termination, the bq2501x restarts the charge once the voltage on the BAT/OUT pin falls below theV
(RCH)
threshold. This feature keeps the battery at full capacity at all times.
The bq2501x enters the low-power sleep mode if both AC and USB are removed from the circuit. This featureprevents draining the battery during the absence of V
CC
.
Operational modes of the bq2501x are summarized in Table 1 . Operation of DC-DC is not recommended whilecharger is in precharge mode.
Table 1. Operation Modes
BATTERY VOLTAGE AC or USB ADAPTER STATUS CHARGER STATUS DC-DC STATUS
V
I(BAT)
> V
(LOWV)
Present Fast EN0 V < V
I(BAT)
< V
(LOWV)
Present Precharge ENV
I(BAT)
< V
(UVLO)
Both absent Off Off
The STAT1 and STAT2 open-drain outputs indicate various charger and battery conditions as shown in Table 2 .These status pins can be used to communicate to the host processor. Note that OFF indicates the open-draintransistor is turned off.
Table 2. Status Pins Summary
CHARGE STATE INPUT POWER STATE STAT1 STAT2
Precharge in progress Present ON ONFast charge in progress Present ON OFFCharge done Not reported OFF ONTimer fault Not reported OFF OFFSpeel mode Absent OFF OFF
The open-drain PG output indicates when the AC adapter is present. The output turns ON when a valid voltageis detected. This output is turned off in the sleep mode. The PG pin can be used to drive an LED or communicateto the host processor.
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CE Input (Charge Enable)
Thermal Shutdown and Protection
Timer Fault Recovery
DC-DC CONVERTER
Power Save Mode Operation
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
The CE digital input is used to enable or disable the charge process. A low-level signal on this pin enables thecharge and a high-level signal disables the charge and places the device into a low-power mode. A high-to-lowtransition on this pin also resets all timers and timer fault conditions. Note that this applies to both AC and USBcharging.
The bq2501x monitors the junction temperature, T
J
, of the die and suspends charging if T
J
exceeds T
(SHTDWN)
.Charging resumes when T
J
falls below T
(SHTDWN)
by approximately 15 °C.
As shown in Figure 5 , bq2501x provides a recovery method to deal with timer fault conditions. The followingsummarizes this method:
Condition 1: Charge voltage above recharge threshold (V
(RCH)
) and timeout fault occurs.
Recovery method: bq2501x waits for the battery voltage to fall below the recharge threshold. This could happenas a result of a load on the battery, self-discharge or battery removal. Once the battery falls below the rechargethreshold, the bq2501x clears the fault and starts a new charge cycle. A POR or CE toggle also clears the fault.
Condition 2: Charge voltage below recharge threshold (V
(RCH)
) and timeout fault occurs.
Recovery method: Under this scenario, the bq2501x applies the I
(FAULT)
current. This small current is used todetect a battery removal condition and remains on as long as the battery voltage stays below the rechargethreshold. If the battery voltage goes above the recharge threshold, then the bq2501x disables the I
(FAULT)
currentand executes the recovery method described for Condition 1. Once the battery falls below the rechargethreshold, the bq2501x clears the fault and starts a new charge cycle. A POR or CE toggle also clears the fault.
The bq2501x provides a low quiescent-current synchronous DC-DC converter. The internally compensatedconverter is designed to operate over the entire voltage range of a single-cell Li-Ion or Li-Pol battery. Undernominal load current, the device operates with a fixed PWM switching frequency of typically 1 MHz. At light loadcurrents, the device enters the power save mode of operation; the switching frequency is reduced and thequiescent current drawn by the converter from the BAT/OUT pin is typically only 15 μA.
During PWM operation the converter uses a unique fast-response voltage mode controller scheme with inputvoltage feedforward to achieve good line and load regulation allowing the use of small ceramic input and outputcapacitors. At the beginning of each clock cycle initiated by the clock signal (S), the P-channel MOSFET switchis turned on and the inductor current ramps up until the comparator trips and the control logic turns off the switch.The current limit comparator also turns off the switch in case the current limit of the P-channel switch isexceeded. After the dead time preventing current shoot through the N-cannel MOSFET rectifier is turned on andthe inductor current ramps down. The next cycle is initiated by the clock signal again turning off the N-channelrectifier and turning on the on the P-channel switch. The g
M
amplifier as well as the input voltage determines therise time of the saw-tooth generator and therefore any change in input voltage or output voltage directly controlsthe duty cycle of the converter giving a very good line and load transient regulation.
As the load current decreases, the converter enters the power save mode operation. During power save mode,the converter operates with reduced switching frequency in PFM mode and with a minimum quiescent current tomaintain high efficiency.
Two conditions allow the converter to enter the power save mode operation. One is the detection ofdiscontinuous conduction mode. The other is when the peak switch current in the P-channel switch goes belowthe skip current limit. The typical skip current limit can be calculated as:
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ISKIP +66 mA )VIN
160 W
(5)
IPEAK +66 mA )VIN
80 W
(6)
PFM Mode at Light Load Comparator High
Comparator Low
Comparator Low 2
PWM Mode at Medium to Full Load
1.6%
0.8%
VOUT
Dynamic Voltage Positioning
Soft-Start
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
During the power save mode, the output voltage is monitored with the comparator by the thresholds comp lowand comp high. As the output voltage falls below the comp low threshold (set to typically 0.8% above VOUTnominal), the P-channel switch turns on. The P-channel switch is turned off as the peak switch current isreached. The typical peak switch current can be calculated as:
The N-channel rectifier is turned on and the inductor current ramps down. As the inductor current approacheszero, the N-channel rectifier is turned off, and the P-channel switch is turned on starting the next pulse. Theconverter continues these pulses until the comp high threshold (set to typically 1.6% above VOUT nominal) isreached. The converter enters a sleep mode, reducing the quiescent current to a minimum. The converter wakesup again as the output voltage falls below the comp low threshold again. This control method reduces thequiescent current to typically to 15 μA and the switching frequency to a minimum; thereby, achieving highconverter efficiency. Setting the skip current thresholds to typically 0.8% and 1.6% above the nominal outputvoltage at light load current results in a dynamic output voltage achieving lower absolute voltage drops duringheavy load transient changes. This allows the converter to operate with a small output capacitor of only 10 μFand still have a low absolute voltage drop during heavy load transient changes. Refer to Figure 7 as well fordetailed operation of the power save mode.
Figure 7. Power Save Mode Thresholds and Dynamic Voltage Positioning
The converter enters the fixed-frequency PWM mode again as soon as the output voltage drops below the complow 2 threshold.
As described in the power save mode operation section and as detailed in Figure 7 , the output voltage is typically0.8% above the nominal output voltage at light load currents as the device is in power save mode. This givesadditional headroom for the voltage drop during a load transient from light load to full load. During a loadtransient from full load to light load the voltage overshoot is also minimized due to active regulation turning on theN-Channel rectifier switch.
The bq2501x has an internal soft-start circuit that limits the inrush current during startup. This soft-start isimplemented as a digital circuit increasing the switch current in steps of typically 30 mA, 60 mA, 120 mA andthen the typical switch current limit of 230 mA. Therefore the startup time depends mainly on the output capacitorand load current. Typical startup time with a 10- μF output capacitor and a 100-mA load current is 1.6 ms.
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100% Duty Cycle Low Dropout Operation
VIN(min) +VOUT(max) )IOUT(max) ǒRDS(on)MAX )RLǓ
(7)
Enable
Undervoltage Lockout
Forced PWM Mode
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
The bq2501x offers a low input-to-output voltage difference while still maintaining operation with the use of the100% duty cycle mode. In this mode the P-channel switch is constantly turned on. This is particularly useful inbattery-powered applications to achieve longest operation time by taking full advantage of the whole batteryvoltage range. The minimum input voltage to maintain regulation depends on the load current and output voltageand can be calculated as:
where
I
OUT(max)
= maximum output current plus indicator ripple currentR
DS(on)MAX
= maximum P-channel switch R
DS(on)R
L
= DC resistance of the inductorV
OUT(max)
= nominal output voltage plus maximum output voltage tolerance
Pulling the enable pin ( EN) low forces the DC-DC converter into shutdown mode, with a shutdown quiescentcurrent of typically 0.1 μA. In this mode the P-channel switch and N-channel rectifier are turned off, the internalresistor feedback divider is disconnected, and the converter enters shutdown mode. If an output voltage, whichcould be an external voltage source or a super capacitor, is present during shut down, the reverse leakagecurrent is specified under electrical characteristics. For proper operation the EN pin must be terminated andshould not be left floating.
Pulling the EN pin high starts up the DC-DC converter with the soft-start as previously described.
The undervoltage lockout circuit prevents the converter from turning on the switch or rectifier MOSFET at lowinput voltages or under undefined conditions.
The FPWM input pin allows the host system to override the power save mode by driving the FPWM pin high. Inthis state, the DC-DC converter remains in the PWM mode of operation with continuous current conductionregardless of the load conditions. Tying the FPWM pin low allows the device to enter power save modeautomatically as previously described.
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APPLICATION INFORMATION
ADJUSTABLE OUTPUT VOLTAGE VERSION (bq25010)
VOUT +0.5 V ǒ1)R1
R2Ǔ
(8)
C1 +1
2p 10 kHz R1
(9)
C2 +R1
R2 C1
(10)
FIXED OUTPUT VOLTAGE VERSION (bq25011, bq25012)
INPUT CAPACITOR SELECTION
CHARGER OUTPUT CAPACITOR (DC-DC CONVERTER INPUT CAPACITOR) SELECTION
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
When the adjustable output voltage version of the bq2501x is being used (bq25010), the output is set by theexternal resistor divider, as shown in Figure 4 .
The output voltage can be calculated as:
where
R1 + R2 ≤1 M Ω
Internal reference voltage V
REF(typ)
= 0.5 V
C1 and C2 should be selected as:
where
R1 = upper resistor of the voltage dividerC1 = upper capacitor of the voltage divider
For C1, a value should be chosen that comes closest to the calculated result.
where
R2 = lower resistor of the voltage dividerC2 = lower capacitor of the voltage divider
For C2, the selected capacitor value should always be selected larger than the calculated result. For example, inFigure 4 , a 100-pF capacitor is selected for a calculated result of C2 = 86.17 pF.
If quiescent current is not a key design parameter, C1 and C2 can be omitted and a low-impedance feedbackdivider must be used with R1 + R2 < 100 k Ω. This design reduces the noise available on the feedback pin (FB)as well, but increases the overall quiescent current during operation.
When a fixed output voltage version of the device is being used, no external resistive divider network isnecessary. In this case, the output of the inductor should be connected directly the FB pin, as shown in Figure 4 .
In most applications, all that is needed is a high-frequency decoupling capacitor. A 0.1- μF ceramic, placed inclose proximity to AC/USB and VSS pins, works fine. The bq2501x is designed to work with both regulated andunregulated external DC supplies. If a non-regulated supply is chosen, the supply unit should have enoughcapacitance to hold up the supply voltage to the minimum required input voltage at maximum load. If not, morecapacitance has to be added to the input of the charger.
Because the buck converter has a pulsating input current, a low ESR input capacitor is required. This results inthe best input voltage filtering and minimizes the interference with other circuits caused by high input voltagespikes. Also, the input capacitor must be sufficiently large to stabilize the input voltage during heavy loadtransients.
For good input voltage filtering, a 4.7- μF input capacitor is normally sufficient, and can be increased without anylimit for better input voltage filtering.
If ceramic output capacitors are used, the capacitor RMS ripple current rating ensures the applicationrequirements. For completeness, the RMS ripple current is calculated as:
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IRMS +IOUT(max) VOUT
VIN ǒ1*VOUT
VIN Ǔ
Ǹ
(11)
IRMS +IOUT
2
(12)
DC-DC CONVERTER OUTPUT CAPACITOR SELECTION
IRMS(Cout) +VOUT ǒ1*VOUT
VIN Ǔ
L f 1
2 3
Ǹ
(13)
DVOUT +VOUT ǒ1*VOUT
VIN Ǔ
L f ǒ1
8 COUT f)ESRǓ
(14)
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
The worst case RMS ripple current occurs at D = 0.5 and is calculated as:
Ceramic capacitors perform well because of the low ESR value, and they are less sensitive to voltage transientsand spikes compared to tantalum capacitors. The input capacitor should be placed as close as possible to theBAT/OUT pin of the device for best performance. Refer to Table 1 for recommended components.
The advanced fast response voltage mode control scheme of the bq2501x allows the use of tiny ceramiccapacitors without having large output voltage under and overshoots during heavy load transients. Ceramiccapacitors having low ESR values have the lowest output voltage ripple and are therefore recommended. Ifrequired, tantalum capacitors may be used as well (refer to Table 1 for recommended components). If ceramicoutput capacitors are used, the capacitor RMS ripple current rating always meets the application requirements.For completeness, the RMS ripple current is calculated as:
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of thevoltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging theoutput capacitor:
where the output voltage ripple occurs at the highest input voltage V
IN
.
At light load currents, the device operates in power save mode, and the output voltage ripple is independent ofthe output capacitor value. The output voltage ripple is set by the internal comparator thresholds. The typicaloutput voltage ripple is 1% of the output voltage V
OUT
.
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DC-DC CONVERTER OUTPUT INDUCTOR SELECTION
DIL+VOUT ǒ1*VOUT
VIN Ǔ
L f
(15)
CHARGING WHILE UNDER LOAD
THERMAL CONSIDERATIONS
qJA +TJ*TA
P
(16)
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Although theinductor core material has less effect on efficiency than its dc resistance, an appropriate inductor core materialmust be used. The inductor value determines the inductor ripple current. The larger the inductor value, thesmaller the inductor ripple current, and the lower the conduction losses of the converter. On the other hand,larger inductor values causes a slower load transient response. Usually the inductor ripple current, as calculatedbelow, should be around 30% of the average output current.
In order to avoid saturation of the inductor, the inductor should be rated at least for the maximum output currentof the converter plus the inductor ripple current that is calculated as:
where
f= switching frequency (1 MHz typical, 650 kHz minimal)L = inductor valueΔI
L
= peak-to-peak inductor ripple currentI
L(max)
= maximum inductor current
The highest inductor current occurs at maximum V
IN
. A more conservative approach is to select the inductorcurrent rating just for the maximum switch current of 350 mA. The internal compensator is designed in such away that the optimized resonant frequency of the output inductor and capacitor is approximately 16 kHz. Therecommended inductor and capacitor values for various output current are given in Table 3 .
Table 3. Recommended Inductor and Capacitor Values
TYPICAL OUTPUT CURRENT INDUCTOR VALUE CAPACITOR VALUE APPLICATION(mA) ( μH) ( μF)
30 100 1 For low current, smallest capacitor60 47 2.2 For low current, small capacitor80 33 3.3 For medium current, small capacitor120 22 4.7 For medium current150 10 10 For highest current, smallest inductor
The bq2501x is designed such that maximum charging safety and efficiency can be obtained by suspendingnormal operation while the device is actively charging the battery. In this mode of operation, the timeout functionprevents a defective battery from being charged indefinitely. If charging does not terminate normally within fivehours, the device annunciates a fault condition on the STAT1 and STAT2 pins as indicated in Table 2 .
If a load is applied to the device while it is being used to charge a battery, a false fault condition may result dueto a slower rate of charge being applied to the battery. For this reason, it is recommended that the load bedisconnected from the bq2501x while it is charging a battery.
The bq2501x is packaged in a thermally enhanced MLP package. The package includes a thermal pad toprovide an effective thermal contact between the device and the printed circuit board (PCB). Full PCB designguidelines for this package are provided in the application note QFN/SON PCB Attachment (SLUA271). Themost common measure of package thermal performance is thermal impedance ( θ
JA
) measured (or modeled)from the chip junction to the air surrounding the package surface (ambient). The mathematical expression for θ
JAis:
where
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P+ǒVIN *VIN(BAT)Ǔ IOUT(OUT)
(17)
PCB LAYOUT CONSIDERATIONS
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
T
J
= chip junction temperatureT
A
= ambient temperatureP = device power dissipation
Factors that can greatly influence the measurement and calculation of θ
JA
include:•Whether or not the device is board mounted•Trace size, composition, thickness, and geometry•Orientation of the device (horizontal or vertical)•Volume of the ambient air surrounding the device under test and airflow•Whether other surfaces are in close proximity to the device being tested
The device power dissipation (P) is a function of the charge rate and the voltage drop across the internal powerFET. It can be calculated from the following equation:
Due to the charge profile of Li-xx batteries, the maximum power dissipation is typically seen at the beginning ofthe charge cycle when the battery voltage is at its lowest.
For all switching power supplies, the layout is an important step in the design, especially at high peak currentsand switching frequencies. If the layout is not carefully done the regulator could exhibit stability problems as wellas EMI problems. With this in mind, one should lay out the PCB using wide, short traces for the main currentpaths. The input capacitor, as well as the inductor and output capacitors, should be placed as close as possibleto the IC pins.
The feedback resistor network (bq25010) must be routed away from the inductor and switch node to minimizenoise and magnetic interference. To further minimize noise from coupling into the feedback network andfeedback pin, the ground plane or ground traces must be used for shielding. This becomes important especiallyat high switching frequencies.
The following are some additional guidelines that should be observed:•To obtain optimal performance, the decoupling capacitor from AC to VSS (and from USB to VSS) and theoutput filter capacitors from BAT/OUT to VSS should be placed as close as possible to the bq2501x, withshort trace runs to both signal and VSS pins.•All low-current VSS connections should be kept separate from the high-current charge or discharge pathsfrom the battery. Use a single-point ground technique incorporating both the small signal ground path and thepower ground path.•The BAT/OUT pin provides voltage feedback to the IC for the charging function and should be connectedwith its trace as close to the battery pack as possible.•The high current charge paths into AC and USB and from the BAT/OUT and SW pins must be sizedappropriately for the maximum charge or output current in order to avoid voltage drops in these traces.•The bq2501x is packaged in a thermally enhanced MLP package. The package includes a thermal pad toprovide an effective thermal contact between the IC and the printed circuit board (PCB). Full PCB designguidelines for this package are provided in the application note QFN/SON PCB Attachment (SLUA271 ).
Copyright © 2004 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 19
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
BQ25010RHLR ACTIVE QFN RHL 20 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
BQ25010RHLRG4 ACTIVE QFN RHL 20 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
BQ25012RHLR ACTIVE QFN RHL 20 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
BQ25012RHLRG4 ACTIVE QFN RHL 20 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ25010RHLR QFN RHL 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
BQ25012RHLR QFN RHL 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ25010RHLR QFN RHL 20 3000 367.0 367.0 35.0
BQ25012RHLR QFN RHL 20 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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