Ver 201208 Chip Bead For EMI Suppression CIB/CIM31 Series (3216/ EIA 1206) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering Monolithic inorganic material construction for high reliability Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 1.2~2.0mm 0.6~1.5mm 0.6~1.5mm DIMENSION Type 31 Dimension [mm] L W t d 3.20.2 1.60.2 1.10.2 0.5+0.2 -0.3 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) ()25%@100MHz () Max. (mA) Max. CIB31P260 1.10.2 26 0.05 2000 CIB31P310 1.10.2 31 0.05 2000 CIB31P500 1.10.2 50 0.05 2000 CIB31P600 1.10.2 60 0.05 1500 CIB31P700 1.10.2 70 0.10 1500 CIM31U101 1.10.2 100 0.15 500 CIM31U601 1.10.2 600 0.30 400 CIM31J151 1.10.2 150 0.20 600 CIM31J221 1.10.2 220 0.20 600 CIM31J301 1.10.2 300 0.25 600 CIM31J601 1.10.2 600 0.30 600 CIM31J801 1.10.2 800 0.40 500 CIM31J102 1.10.2 1000 0.45 500 CIM31J152 1.10.2 1500(at 70MHz) 0.55 300 Part no. Ver 201208 CHARACTERISTIC DATA Ver 201208 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) M (2) 31 (3) J (4) 221 (5) N (6) E (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (700:70, 221:220 ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 3,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.