CPDQC24VE-HF
Page 1
QW-G7089
REV:C
Features
- Bi-directional ESD protection.
- Surface mount package.
- Ultra small SMD package: 0402C
- High component density.
Mechanical data
- Case: 0402C/SOD-923F package,
molded plastic.
- Terminals: Gold plated, solderable per
MIL-STD-750,method 2026.
- Mounting position: Any.
- Weight: 0.001 grams(approx.).
Comchip Technology CO., LTD.
RoHS Device
Halogen Free
Company reserves the right to improve product design , functions and reliability without notice.
Circuit Diagram
Maximum Rating (at TA=25°C unless otherwise noted)
Symbol
Parameter Value Unit
Conditions
Peak pulse power PPP W
138
Operation temperature range Tj°C
Storage temperature range TSTG -55~+150 °C
ESD kV
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
ESD capability
-55~+125
Symbol Typ
Parameter Min Unit
Conditions
Breakdown voltage VBR V
IT = 1mA
26.5
Reverse leakage current IRnA
VRWM = 24V 100
Clamping voltage VCV
36
IPP = 1A, TP = 8/20us
IPP = 3A, TP = 8/20us 46
32
V
Working peak reverse voltage VRWM
24
Peak pulse current IPP A
TP = 8/20us 3
TP = 8/20us
±30
Junction capacitance 20
CJpF
VR = 0V, f = 1MHz
Electrical Characteristics (at TA=25°C unless otherwise noted)
29
13
32
38
- IEC 61000-4-2 (ESD) ; ±30KV(contact)
SMD ESD Protection Diode
Dimensions in inches and (millimeter)
0402C/SOD-923F
0.022(0.55)
0.018(0.45)
0.001(0.02)
Max.
0.041(1.05)
0.037(0.95)
0.026(0.65)
BSC.
0.012(0.30)
0.008(0.20)
0.022(0.55)
0.018(0.45)
0.026(0.65)
0.022(0.55)
Max
Page 2
QW-G7089
REV:C
Comchip Technology CO., LTD.
Capacitance Between Terminals, (PF) Power Rating, (%)
Fig.4 - Capacitance Between
Terminals Characteristics
Fig.2 - Power rating derating curve
Reverse Voltage, (V)
Ambient Temperature, ( °C )
0
5
10
15
20
0 6 18
20
40
60
80
100
RATING AND CHARACTERISTIC CURVES (CPDQC24VE-HF)
Time, (us)
0%
20%
40%
60%
80%
100%
0515 25 30
10 20
120%
Percentage Of Ipp
e
-t
td= t Ipp/2
Ta=25°C
Peak Valur Ipp
Test Waveform
parameters
tf=8us
td=20us
0
Company reserves the right to improve product design , functions and reliability without notice.
12 24
Fig.1 - 8/20us Peak Pulse Current
Wave Form ACC. IEC 61000-4-5
Mounting on glass epoxy PCBs
0 25 50 75 100 125
Clamping Voltage, VC (V)
Fig. 3 - Clamping Voltage Vs.
Peak Pulse Current
Peak Pulse Current, IPP (A)
10
40
20
30
50
60
1.0 2.0 3.0
SMD ESD Protection Diode
Page 3
REV:C
Comchip Technology CO., LTD.
QW-G7089
Company reserves the right to improve product design , functions and reliability without notice.
Reel Taping Specification
D1
D2
D
W1
T
C
o
120
Index hole
d
E
F
B W
P
P0
P1
A
B C dD D2
D1
E F P P0P1T
SYMBOL
A
W W1
(mm)
(inch) 0.030 ± 0.002 0.046 ± 0.002 0.026 ± 0.002 7.008 ± 0.039 0.531 ± 0.008
SYMBOL
(mm)
(inch) 0.069 ± 0.004 0.138 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.315 ± 0.008
0.75 ± 0.05 1.17 ± 0.05
4.00 ± 0.103.50 ± 0.101.75 ± 0.10
13.50 ± 0.200.65 ± 0.05
4.00 ± 0.10 2.00 ± 0.10 8.00 ± 0.20
178.00 ± 1.00
0402C
(SOD-923F)
0402C
(SOD-923F)
0.20 + 0.02
- 0.05
0.008 + 0.001
- 0.002
1.50 + 0.10
- 0 60.00 ± 0.50
0.059 + 0.004
- 0 2.362 ± 0.002
12.00 + 0.50
- 0
0.472 + 0.020
- 0
Trailer Device Leader
400mm (min)160mm (min)
.......
.......
....... ..............
....... ..............
End Start
Direction of Feed
SMD ESD Protection Diode
Page 4
REV:C
Comchip Technology CO., LTD.
QW-G7089
Company reserves the right to improve product design , functions and reliability without notice.
Marking Code
E4
Standard Packaging
Case Type
5,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
0402C/SOD-923F
Part Number
CPDQC24VE-HF
Marking Code
E4
Suggested PAD Layout
SIZE
(inch)
0.028
(mm)
0.70
0.40
0.60
0.016
0.024
0402C/SOD-923F
1.10 0.043
E0.30 0.012
A
B
C
D
A
C
B
E
D
SMD ESD Protection Diode