5962-9082501MYA - ANALOG DEVICES - Datasheet.Directory

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A Technical changes in table I. Changes to figure 1 dimensions. Editorial

changes throughout. 93-08-25 M. A. FRYE

B Changes in accordance with N.O.R. 5962-R063-94. 94-07-15 M. A. FRY E

C Draw ing updated to reflect current requirements. - ro 00-08-29 R. MONNIN

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS REV CCCCCCCCCCCC

OF SHEETS SHEET 123456789101112

PMIC N/A PREPARED BY

RICK C. OFFICER

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

CHARLES E. BESORE COLUMBUS, OHIO 43216

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

MICHAEL A. FRYE MICROCI RCUIT, LINEAR, VOLTAGE

REGULATOR, SWITCHING, MONOLITHIC

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE

92-01-22 SILICON

AMSC N/A REVISION LEVELCSIZE

ACAGE CODE

67268 5962-90825

SHEET 1 OF 12

DSCC FORM 2233

APR 97 5962-E515-00

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

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1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and

M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the

Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the

PIN.

1.2 PIN. The PIN is as shown in the following example:

5962 - 90825 01 M P X

~~ ~~ ~~

Federal RHA Device Device Case Lead

stock class designator type class outline finish

designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5)

\ / (see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and

are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01 LT1070 High power switching regulator with internal 5 A switch

02 LT1071 High power switching regulator with internal 2.5 A switch

03 LT1072 High power switching regulator with internal 1.25 A switch

04 LT1070HV High power switching regulator with internal 5 A switch

05 LT1071HV High power switching regulator with internal 2.5 A switch

06 LT1072HV High power switching regulator with internal 1.25 A switch

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

follows:

Device class Device requirements documentation

M Vendor self-certification to the requirements for MIL-STD-883 compliant,

non-JAN class level B microcircuits in accordance with MIL-PRF-38535,

appendix A

Q or V Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

Y See figure 1 4 Flange mount, similar to TO-3

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

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1.3 Absolute maximum ratings. 1/

Supply voltage (VIN):

Device types 01, 02, and 03 ..........................................................40 V

Device types 04, 05, and 06 ..........................................................60 V

Switch output voltage (VSW):

Device types 01, 02, and 03 ..........................................................65 V

Device types 04, 05, and 06 ..........................................................75 V

Feed back pin voltage (VFB), (transient, 1 ms) .................................

15 V

Junction temperature (TJ) .................................................................+150

Storage temperature range ...............................................................-65

C to +150

Lead temperature (soldering, 10 seconds) .......................................+300

Thermal resistance, junction-to-case (

JC):

Case P ...........................................................................................See MIL-STD-1835

Case Y:

Device types 01 and 04 ..............................................................2

C/W

Device types 02 and 05 ..............................................................4

C/W

Device types 03 and 06 ..............................................................8

C/W

Thermal resistance, junction-to-ambient (

JA):

Case P ...........................................................................................110

C/W

Case Y ...........................................................................................35

C/W

1.4 Recommended operating conditions.

Ambient operating temperature range (TA) .......................................-55

C to +125

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-973 - Configuration Management.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

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HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535

and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

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TABLE I. Electrical performance characteristics.

Test Symbol

Conditions 1/

-55

+125

unless otherwise specified Group A

subgroups Device

type Limits Unit

Min Max

Error amplifier clamp

voltage High clamp, VFB = 1 V,

TA = +25

1All1.82.3V

Low clamp, VFB = 1.5 V,

TA = +25

0.25 0.52

Error amplifier voltage

gain AV0.9 V

VC pin

1.4 V,

TA = +25

1 All 500 V/V

Supply current IQ3 V

VIN

VMAX,

VC pin = 0.6 V,

TA = +25

1All 9mA

Normal/flyback threshold

on feedback pin TA = +25

C1All0.40.54V

Flyback reference

voltage VFB IFB = 50

A1 All 15 17.6 V

2,3 14 18

Change in flyback

reference voltage

VFB 50

IFB

1 mA,

TA = +25

1All4.58.5V

Flyback reference

voltage line regulation

VFB /

VIN

IFB = 50

A, 2/

3 V

VIN

VMAX,

TA = +25

1 All 0.03 %/V

Flyback amplifier

transconductance (gm)

IC =

TA = +25

1 All 150 500

mho

Flyback amplifier source

and sink current Source, VC pin = 0.6 V,

IFB = 50

1,2,3 All 15 70

Sink, VC pin = 0.6 V,

IFB = 50

25 70

Supply current increase

during switch on-time

IIN /

ISW

TA = +25

C1All 35mA/A

Maximum switch duty

cycle DC

(max) TA = +25

C1 All 90 97 %

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test Symbol

Conditions 1/

-55

+125

unless otherwise specified Group A

subgroups Device

type Limits Unit

Min Max

Shutdown mode supply

current 3 V

VIN

VMAX,

VC pin = 0.05 V,

TA = +25

1 All 250

Reference voltage VREF Measured at FEEDBACK 1 All 1.224 1.264 V

(FB) pin, VC pin = 0.8 V 2,3 1.214 1.274

Feedback input current IBVFB = VREF 1 All 750 nA

2,3 1100

Error amplifier

transconductance gm

IC =

A1 All 3000 6000

mho

2,3 2400 7000

Error amplifier source

or sink current VC pin = 1.5 V 1 All 150 350

2,3 120 400

Reference voltage line

regulation 3 V

VIN

VMAX,

VC pin = 0.8 V

1,2,3 All 0.03 %/V

Minimum input voltage 1,2,3 All 3.0 V

Control pin threshold Duty cycle = 0 1 All 0.8 1.08 V

2,3 0.6 1.25

Output switch breakdown

voltage BV 3 V

VIN

VMAX,1,2,3 01,02,

03 65 V

ISW = 1.5 mA 04,05,

06 75

Output switch “On”

resistance VSAT ISW = 4 A 3/ 1,2,3 01,04 0.24

ISW = 2 A 3/ 02,05 0.5

ISW = 1 A 3/ 03,06 1.0

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test Symbol

Conditions 1/

-55

+125

unless otherwise specified Group A

subgroups Device

type Limits Unit

Min Max

Switch current limit ILIM Duty cycle = 50 % 1,2,3 01,04 5 11 A

Duty cycle = 80 % 4 10

Duty cycle = 50 % 02,05 2.5 5.5

Duty cycle = 80 % 2 5

Duty cycle = 50 % 03,06 1.25 3.5

Duty cycle = 80 % 1 2.5

Shutdown mode

threshold voltage 3 V

VIN

VMAX 1 All 100 250 mV

2,3 50 300

Switching frequency 4 All 35 45 kHz

5,6 33 47

1/ Unless otherwise specified, VIN = 15 V, VC pin = 0.5 V, output pin open, and VFB = VREF. For device types 01, 02, and

03, VMAX = 40 V. For device types 04, 05, and 06, VMAX = 60 V.

2/ VMAX = 55 V for device types 04, 05, and 06 to avoid switch breakdown.

3/ Measured with VC pin in high clamp, VFB = 0.8 V.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain

the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 52 (see MIL-PRF-38535, appendix A).

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Case Y

Symbol Inches Millimeters

Min Max Min Max

A .320 .350 8.128 8.890

b.038 .043 0.965 1.092

D.760 .775 19.30 19.69

e .445 .465 11.30 11.81

e1 .220 .235 5.588 5.969

F .060 .135 1.52 3.43

L .420 .480 10.67 12.19

P.151 .161 3.84 4.09

q 1.177 1.197 29.90 30.40

R1 .167 .177 4.241 4.495

NOTE:

The U.S. government preferred system of measurement is the metric SI system. However, since this item was

originally designed using inch-pound units of measurement, in the event of conflict between the metric and

inch-pound units, the inch-pound units shall take precedence.

FIGURE 1. Case outline.

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Device types 03 01, 02, 03,

04, 05, 06

Case outlines P Y

Terminal

number Terminal symbol

1GND V

2VCVC

3 FEEDBACK (FB) FEEDBACK (FB)

4NC V

5VIN ---

6 E1 ---

7VSW ---

8 E2 ---

NOTES:

NC = No connection

For case outline Y, case is ground

FIGURE 2. Terminal connections.

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4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision level control

and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015.

(2) TA = +125

C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under

document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for

groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of

MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in

accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be

those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

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TABLE II. Electrical test requirements.

Test requirements Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M Device

class Q Device

class V

Interim electrical

parameters (see 4.2) --- --- ---

Final electrical

parameters (see 4.2) 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/

Group A test

requirements (see 4.4) 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3,4,5,6

Group C end-point electrical

parameters (see 4.4) 111

Group D end-point electrical

parameters (see 4.4) 111

Group E end-point electrical

parameters (see 4.4) 1,4 1,4 1,4

1/ PDA applies to subgroup 1.

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition C. The test circuit shall be maintained by the manufacturer under document revision level control and

shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,

outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of

MIL-STD-883.

b. TA = +125

C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,

or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The

test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of

MIL-STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.

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4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness

assured (see 3.5 herein).

a. End-point electrical parameters shall be as specified in table II herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All

device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at

TA = +25

C, after exposure, to the subgroups specified in table II herein.

c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device

classes Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor

prepared specification or drawing.

6.1.2 Substitutability. Device class Q devices will replace device class M devices.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,

Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering

microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone

(614) 692-0674.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 00-08-29

Approved sources of supply for SMD 5962-90825 are listed below for immediate acquisition information only and

shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be

revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a

certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-9082501MYA 64155 LT1070MK/883

5962-9082502MYA 64155 LT1071MK/883

5962-9082503MPA 64155 LT1072MJ8/883

5962-9082503MYA 64155 LT1072MK/883

5962-9082504MYA 64155 LT1070HVMK/883

5962-9082505MYA 64155 LT1071HVMK/883

5962-9082506MYA 64155 LT1072HVMK/883

1/ The lead finish shown for each PIN representing a

hermetic package is the most readily available from the

manufacturer listed for that part. If the desired lead finish

is not listed contact the vendor to determine its availability.

2/ Caution. Do not use this number for item acquisition.

Items acquired to this number may not satisfy the

performance requirements of this drawing.

Vendor CAGE Vendor name

number and address

64155 Linear Technology Corporation

720 Sycamore Drive

Milpitas, CA 95035-7487

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.