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FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A
B
C
G2A
G2B
G1
Y7
GND
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW) RGY PACKAGE
(TOP VIEW)
1 16
8 9
2
3
4
5
6
7
15
14
13
12
11
10
Y0
Y1
Y2
Y3
Y4
Y5
B
C
G2A
G2B
G1
Y7
A
Y6 V
GND
CC
DESCRIPTION/ORDERING INFORMATION
SN74LV138AT3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
•Inputs Are TTL-Voltage Compatible •I
off
Supports Partial-Power Down ModeOperation•4.5-V to 5.5-V V
CC
Operation
•Latch-Up Performance Exceeds 250 mA Per•Max t
pd
of 7.6 ns at 5 V
JESD 17•Typical V
OLP
(Output Ground Bounce)
•ESD Protection Exceeds JESD 22<0.8 V at V
CC
= 5 V, T
A
= 25 °C
– 2000-V Human-Body Model (A114-A)•Typical V
OHV
(Output V
OH
Undershoot)>2.3 V at V
CC
= 5 V, T
A
= 25 °C – 200-V Machine Model (A115-A)•Support Mixed-Mode Voltage Operation on All – 1000-V Charged-Device Model (C101)Ports
The SN74LV138AT is a 3-line to 8-line decoder/demultiplexer, designed for high-performance memory-decodingor data-routing applications requiring very short propagation delay times. In high-performance memory systems,this decoder can be used to minimize the effects of system decoding. When employed with high-speed memoriesutilizing a fast enable circuit, the delay times of the decoder and the enable time of the memory usually are lessthan the typical access time of the memory. This means that the effective system delay introduced by thedecoder is negligible.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 SN74LV138ATRGYR VV138ATTube of 40 SN74LV138ATDSOIC – D LV138ATReel fo 2500 SN74LV138ATDRSOP – NS Reel of 2000 SN74LV138ATNSR 74LV138AT–40 °C to 125 °C SSOP – DB Reel of 2000 SN74LV138ATDBR LV138ATTVSOP – DGV Reel of 2000 SN74LV138ATDGVR LV138ATTube of 90 SN74LV138ATPWTSSOP – PW Reel of 2000 SN74LV138ATPWR LV138ATReel of 250 SN74LV138ATPWT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
The conditions at the binary-select inputs (A, B, C) and the three enable inputs (G1, G2A, G2B) select one ofeight output lines. The two active-low (G2A, G2B) and one active-high (G1) enable inputs reduce the need forexternal gates or inverters when expanding. A 24-line decoder can be implemented without external invertersand a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexingapplications.
This device is fully specified for partial-power-down application susing I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
ENABLE INPUTS SELECT INPUTS OUTPUTS
G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X H X X X X H H H H H H H HX X H X X X H H H H H H H HL X X X X X H H H H H H H HH L L L L L L H H H H H H HH L L L L H H L H H H H H HH L L L H L H H L H H H H HH L L L H H H H H L H H H HH L L H L L H H H H L H H HH L L H L H H H H H H L H HH L L H H L H H H H H H L HHLLHHHHHHHHHHL
2
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G2B
G2A
G1
C
B
A
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Data
Outputs
Select
Inputs
Enable
Inputs
1
2
3
6
4
5
15
14
13
12
11
10
9
7
SN74LV138AT3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
3
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
(1)
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 VV
I
Input voltage range
(2)
–0.5 7 VV
O
Output voltage range
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –20 mAI
OK
Output clamp current V
O
< 0 or V
O
> V
CC
±50 mAI
O
Continuous output current V
O
= 0 to V
CC
±25 mAContinuous current through V
CC
or GND ±50 mAD package
(4)
73DB package
(4)
82DGV package
(4)
120θ
JA
Package thermal impedance °C/WNS package
(4)
64PW package
(4)
108RGY package
(5)
39T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) This value is limited of 5.5 V maximum.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.
MIN MAX UNIT
V
CC
Supply voltage 4.5 5.5 VV
IH
High-level input voltage V
CC
= 4.5 V to 5.5 V 2 VV
IL
Low-level input voltage V
CC
= 4.5 V to 5.5 V 0.8 VV
I
Input voltage 0 5.5 VV
O
Output voltage 0 V
CC
VI
OH
High-level output current V
CC
= 4.5 V to 5.5 V –12 mAI
OL
Low-level output current V
CC
= 4.5 V to 5.5 V 12 mA∆t/ ∆v Input transition rise or fall rate V
CC
= 4.5 V to 5.5 V 20 ns/VT
A
Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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Electrical Characteristics
Switching Characteristics
Operating Characteristics
SN74LV138AT3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
over operating free-air temperature range (unless otherwise noted)
T
A
= –40 °C T
A
= –40 °CT
A
= 25 °C
to 85 °C to 125 °CPARAMETER TEST CONDITIONS V
CC
UNITMIN TYP MAX MIN MAX MIN MAX
I
OH
= –50 µA 4.5 V 4.4 4.5 4.4 4.4V
OH
VI
OH
= –12 mA 4.5 V 3.8 3.8 3.8I
OL
= 50 µA 4.5 V 0 0.1 0.1 0.1V
OL
VI
OL
= 12 mA 4.5 V 0.55 0.55 0.55I
I
V
I
= 5.5 V or GND 0 to 5.5 V ±0.1 ±1±1µAI
CC
V
I
= V
CC
or GND, I
O
= 0 5.5 V 2 20 20 µAOne input at 3.4 V,∆I
CC
(1)
5.5 V 1.35 1.5 1.5 mAOther inputs at V
CC
or GNDI
off
V
I
or V
O
= 0 to 5.5 V 0 0.5 5 5 µAC
i
V
I
= V
CC
or GND 4 10 10 10 pF
(1) This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V ot V
CC
.
over recommended operating free-air temperature range, V
CC
= 5 V ±0.5 V (unless otherwise noted) (see Figure 1 )
T
A
= –40 °C T
A
= –40 °CT
A
= 25 °CFROM TO LOAD
to 85 °C to 125 °CPARAMETER UNIT(INPUT) (OUTPUT) CAPACITANCE
MIN TYP MAX MIN MAX MIN MAX
A, B, or C 2.7 7.6 10.4 1 12 1 13t
pd
G1 Y C
L
= 15 pF 2.5 6.6 9.1 1 10.5 1 12 nsG2A or G2B 2.8 7 9.6 1 11 1 12A, B, or C 3.9 8.1 11.4 1 13 1 14t
pd
G1 Y C
L
= 50 pF 3.7 7.1 10.1 1 11.5 1 12 nsG2A or G2B 4 7.5 10.6 1 12 1 13
V
CC
= 5 V, T
A
= 25 °C
PARAMETER TEST CONDITIONS TYP UNIT
C
pd
Power dissipation capacitance C
L
= 50 pF, f = 10 MHz 79 pF
5
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PARAMETER MEASUREMENT INFORMATION
50% VCC
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
3 V
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC ≈0 V
3 V
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
3 V
0 V
tw
VOLTAGE WA VEFORMS
PULSE DURATION
Input
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1 VCC
RL = 1 kΩGND
From Output
Under Test CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
VOH − 0.3 V
1.5 V 1.5 V
1.5 V
1.5 V 1.5 V
1.5 V 1.5 V1.5 V 1.5 V
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
SCLS691 – AUGUST 2005
Figure 1. Load Circuits and Voltage Waveforms
6
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LV138ATD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATPWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV138ATRGYR ACTIVE VQFN RGY 16 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LV138ATRGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LV138ATDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LV138ATDGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LV138ATDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LV138ATNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LV138ATPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LV138ATPWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LV138ATRGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LV138ATDBR SSOP DB 16 2000 367.0 367.0 38.0
SN74LV138ATDGVR TVSOP DGV 16 2000 367.0 367.0 35.0
SN74LV138ATDR SOIC D 16 2500 367.0 367.0 38.0
SN74LV138ATNSR SO NS 16 2000 367.0 367.0 38.0
SN74LV138ATPWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74LV138ATPWT TSSOP PW 16 250 367.0 367.0 35.0
SN74LV138ATRGYR VQFN RGY 16 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
