SCL SRX
VSYS
Coulomb
Bus SDA Counter
GPOUT
BIN
CPU
ADC
PACKP
Li -Ion
Cell
LDO
VDD
VSS
T
PACKN
Protection
IC
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NFET
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BAT
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047 µF
.1 µF
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bq27421-G1
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bq27421-G1 System-Side Impedance Track™ Fuel Gauge With Integrated Sense Resistor
1 Features 3 Description
The Texas Instruments bq27421-G1 fuel gauge is a
1• Single-Cell Li-Ion Battery Fuel Gauge minimally configured microcontroller peripheral that
– Resides on System Board provides system-side fuel gauging for single-cell Li-
– Supports Embedded or Removable Batteries Ion batteries. The device requires very little user
configuration and system microcontroller firmware
– Powered Directly from Battery with Integrated development.
LDO The bq27421-G1 fuel gauge uses the patented
– Low-Value Integrated Sense Resistor Impedance TrackTM algorithm for fuel gauging, and
(7 mΩ, Typical) provides information such as remaining battery
• Easy-to-Configure Fuel Gauging Based on capacity (mAh), state-of-charge (%), and battery
Patented Impedance Track™ Technology voltage (mV).
– Reports Remaining Capacity and State-of- Battery fuel gauging with the bq27421-G1 fuel gauge
Charge (SOC) with Smoothing Filter requires connections only to PACK+ (P+) and PACK–
– Automatically Adjusts for Battery Aging, Self- (P–) for a removable battery pack or embedded
Discharge, Temperature, and Rate Changes battery circuit. The tiny 9-ball, 1.62 mm × 1.58 mm,
0.5-mm pitch NanoFree™ chip scale package
– Battery State-of-Health (Aging) Estimation (DSBGA) is ideal for space-constrained applications.
• Microcontroller Peripheral Supports:
– 400-kHz I2C Serial Interface Device Information(1)
– Configurable SOC Interrupt or PART NUMBER PACKAGE BODY SIZE (NOM)
Battery Low Digital Output Warning bq27421-G1 YZF (9) 1.62 mm × 1.58 mm
– Internal Temperature Sensor or (1) For all available packages, see the orderable addendum at
Host-Reported Temperature the end of the data sheet.
2 Applications
• Smartphones, Feature Phones, and Tablets
• Digital Still and Video Cameras
• Handheld Terminals
• MP3 or Multimedia Players
Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.13 Typical Characteristics............................................ 8
1 Features.................................................................. 18 Detailed Description.............................................. 9
2 Applications ........................................................... 18.1 Overview................................................................... 9
3 Description............................................................. 18.2 Functional Block Diagram......................................... 9
4 Revision History..................................................... 28.3 Feature Description................................................... 9
5 Device Comparison Table..................................... 38.4 Device Functional Modes........................................ 10
6 Pin Configuration and Functions......................... 38.5 Programming........................................................... 10
7 Specifications......................................................... 49 Applications and Implementation ...................... 14
7.1 Absolute Maximum Ratings ...................................... 49.1 Application Information............................................ 14
7.2 ESD Ratings ............................................................ 49.2 Typical Applications ................................................ 15
7.3 Recommended Operating Conditions....................... 410 Power Supply Recommendation ....................... 18
7.4 Thermal Information.................................................. 510.1 Power Supply Decoupling..................................... 18
7.5 Supply Current.......................................................... 511 Layout................................................................... 19
7.6 Digital Input and Output DC Characteristics............. 511.1 Layout Guidelines ................................................. 19
7.7 LDO Regulator, Wake-Up, and Auto-Shutdown DC 11.2 Layout Example .................................................... 19
Characteristics ........................................................... 5
7.8 ADC (Temperature and Cell Measurement) 12 Device and Documentation Support................. 20
Characteristics ........................................................... 612.1 Documentation Support ........................................ 20
7.9 Integrating ADC (Coulomb Counter) Characteristics 12.2 Community Resources.......................................... 20
................................................................................... 612.3 Trademarks........................................................... 20
7.10 Integrated Sense Resistor Characteristics, –40°C to 12.4 Electrostatic Discharge Caution............................ 20
85°C .......................................................................... 612.5 Glossary................................................................ 20
7.11 Integrated Sense Resistor Characteristics, –40°C to 13 Mechanical, Packaging, and Orderable
70°C .......................................................................... 6Information........................................................... 20
7.12 I2C-Compatible Interface Communication Timing
Characteristics ........................................................... 6
4 Revision History
Changes from Revision D (July 2015) to Revision E Page
• Changed Pin Configuration and Functions............................................................................................................................. 3
• Changed Mechanical, Packaging, and Orderable Information ............................................................................................ 20
Changes from Revision C (December 2014) to Revision D Page
• Changed the Integrated Sense Resistor Characteristics, –40°C to 85°C specifications ...................................................... 6
• Changed the Integrated LDO Capacitor section ................................................................................................................. 16
• Added Community Resources ............................................................................................................................................. 20
Changes from Revision B (November 2014) to Revision C Page
• Changed simplified schematic by adding 1-µF capacitor....................................................................................................... 1
• Added description for connecting a 1-µF capacitor................................................................................................................ 3
• Added information for connecting GPOUT............................................................................................................................. 3
• Changed connection description for BAT pin....................................................................................................................... 18
• Changed "recommend" to "required".................................................................................................................................... 19
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(TOP VIEW)
A1
B1
C1
A2
B2
C2
A3
B3
C3
(BOTTOM VIEW)
Pin A 1
Index Area
A1
B1
C1
A2
B2
C2
A3
B3
C3
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5 Device Comparison Table
PART NUMBER BATTERY TYPE CHEM_ID (1) PACKAGE (2) COMMUNICATION FORMAT
bq27421YZFR-G1A LiCoO20x128
(4.2 V maximum charge)
bq27421YZFT-G1A
bq27421YZFR-G1B LiCoO20x312 CSP-9 I2C
(4.3 V to 4.35 V maximum charge)
bq27421YZFT-G1B
bq27421YZFR-G1D LiCoO20x3142
(4.3 V to 4.4 V maximum charge)
bq27421YZFT-G1D
(1) See the CHEM_ID subcommand to confirm the battery chemistry type.
(2) For the most current package and ordering information see the Package Option Addendum at the end of this document or see the TI
website at www.ti.com.
6 Pin Configuration and Functions
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NUMBER
LDO regulator input, battery voltage input, and coulomb counter input typically connected to the
BAT C3 PI, AI PACK+ terminal. Connect a capacitor (1 µF) between BAT and VSS. Place the capacitor close to the
gauge.
Battery insertion detection input. If Operation Configuration bit [BIE] = 1 (default), a logic low on
the pin is detected as battery insertion. For a removable pack, the BIN pin can be connected to VSS
through a pulldown resistor on the pack, typically the 10-kΩthermistor; the system board should use
a 1.8-MΩpullup resistor to VDD to ensure the BIN pin is high when a battery is removed. If the
battery is embedded in the system, it is recommended to leave [BIE] = 1 and use a 10-kΩpulldown
BIN B1 DI resistor from BIN to VSS. If [BIE] = 0, then the host must inform the gauge of battery insertion and
removal with the BAT_INSERT and BAT_REMOVE subcommands. A 10-kΩpulldown resistor
should be placed between BIN and VSS, even if this pin is unused.
NOTE: The BIN pin must not be shorted directly to VCC or VSS and any pullup resistor on the BIN
pin must be connected only to VDD and not an external voltage rail.
This open-drain output can be configured to indicate BAT_LOW when the Operation Configuration
[BATLOWEN] bit is set. By default [BATLOWEN] is cleared and this pin performs an interrupt
function (SOC_INT) by pulsing for specific events, such as a change in State of Charge. Signal
GPOUT A1 DO polarity for these functions is controlled by the [GPIOPOL] configuration bit. This pin should not be
left floating, even if unused, so a 10-kΩpullup resistor is recommended. If the device is in
SHUTDOWN mode, then toggling GPOUT will make the gauge exit SHUTDOWN. Therefore, it is
recommended to connect GPOUT to a GPIO of the host MCU.
SCL A3 DIO Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external
10-kΩpullup resistors (typical) for each pin. If the external pullup resistors will be disconnected from
these pins during normal operation, it is recommended to use external 1-MΩpulldown resistors to
SDA A2 DIO VSS at each pin to avoid floating inputs.
Integrated high-side sense resistor and coulomb counter input typically connected to system power
SRX C2 AI rail VSYS.
(1) IO = Digital input-output, AI = Analog input, P = Power connection
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Pin Functions (continued)
PIN TYPE(1) DESCRIPTION
NAME NUMBER
1.8-V Regulator Output. Decouple with 0.47-μF ceramic capacitor to VSS. This pin is not intended to
VDD B3 PO provide power for other devices in the system.
Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and
therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via
VSS B2, C1 PI under the device package. It is recommended to route the center pin B2 to the corner pin C1 using
a top-layer metal trace on the board. Then route the corner pin C1 to the board ground plane.
7 Specifications
7.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VBAT BAT pin input voltage range –0.3 6 V
VSRX SRX pin input voltage range VBAT – 0.3 VBAT + 0.3 V
VDD VDD pin supply voltage range (LDO output) –0.3 2 V
VIOD Open-drain IO pins (SDA, SCL, GPOUT) –0.3 6 V
VIOPP Push-pull IO pins (BIN) –0.3 VDD + 0.3 V
TAOperating free-air temperature range –40 85 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
TA= 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) MIN NOM MAX UNIT
External input capacitor for internal
CBAT(1) 0.1 μF
Nominal capacitor values specified. A 5%
LDO between BAT and VSS ceramic X5R-type capacitor located close to
External output capacitor for the device is recommended.
CLDO18(1) 0.47 μF
internal LDO between VDD and VSS
External pull-up voltage for open-
VPU(1) 1.62 3.6 V
drain pins (SDA, SCL, GPOUT)
(1) Specified by design. Not production tested.
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7.4 Thermal Information bq27421-G1
THERMAL METRIC(1) YZF (DSBGA) UNIT
9 PINS
RθJA Junction-to-ambient thermal resistance 107.8 °C/W
RθJCtop Junction-to-case (top) thermal resistance 0.7 °C/W
RθJB Junction-to-board thermal resistance 60.4 °C/W
ψJT Junction-to-top characterization parameter 3.5 °C/W
ψJB Junction-to-board characterization parameter 60.4 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Supply Current
TA= 30°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC(1) NORMAL mode current ILOAD >Sleep Current (2) 93 μA
ISLP(1) SLEEP mode current ILOAD <Sleep Current (2) 21 μA
IHIB(1) HIBERNATE mode current ILOAD <Hibernate Current (2) 9μA
Fuel gauge in host commanded
ISD(1) SHUTDOWN mode current SHUTDOWN mode 0.6 μA
(LDO regulator output disabled)
(1) Specified by design. Not production tested.
(2) Wake Comparator Disabled.
7.6 Digital Input and Output DC Characteristics
TA= –40°C to 85°C, typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH(OD) Input voltage, high(2) External pullup resistor to VPU VPU × 0.7 V
VIL Input voltage, low(2) (3) 0.6 V
VOL Output voltage, low(2) 0.6 V
IOH Output source current, high(2) (3) 0.5 mA
IOL(OD) Output sink current, low(2) –3 mA
CIN(1) Input capacitance(2) (3) 5 pF
Input leakage current 0.1
(SCL, SDA, BIN)
Ilkg μA
Input leakage current (GPOUT) 1
(1) Specified by design. Not production tested.
(2) Open Drain pins: (SCL, SDA, GPOUT)
(3) Push-pull pin: (BIN)
7.7 LDO Regulator, Wake-Up, and Auto-Shutdown DC Characteristics
TA= –40°C to 85°C, typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VBAT BAT pin regulator input 2.45 4.5 V
VDD Regulator output voltage 1.8 V
VBAT undervoltage lockout
UVLOIT+ 2 V
LDO wake-up rising threshold
VBAT undervoltage lockout
UVLOIT– 1.95 V
LDO auto-shutdown falling threshold
(1) Specified by design. Not production tested.
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7.8 ADC (Temperature and Cell Measurement) Characteristics
TA= –40°C to 85°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BAT pin voltage measurement
VIN(BAT) Voltage divider enabled. 2.45 4.5 V
range.
Conversion time 125 ms
tADC_CONV Effective resolution 15 bits
(1) Specified by design. Not tested in production.
7.9 Integrating ADC (Coulomb Counter) Characteristics
TA= –40°C to 85°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VSR Input voltage range from BAT to BAT ± 25 mV
SRX pins
tSR_CONV Conversion time Single conversion 1 s
Effective Resolution Single conversion 16 bits
(1) Assured by design. Not tested in production.
7.10 Integrated Sense Resistor Characteristics, –40°C to 85°C
TA= –40°C to 85°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resistance of Integrated Sense
SRXRES(1) TA= 30°C 7 mΩ
Resistor from SRX to BAT Long term RMS, average device 2000 mA
utilization
Recommended Sense Resistor input Peak RMS current, 10% device
ISRX(2) 2500 mA
current utilization(3)
Peak pulsed current, 250 ms 3500 mA
maximum, 1% device utilization,(3)
(1) Firmware compensation applied for temperature coefficient of resistor.
(2) Specified by design. Not tested in production.
(3) Device utilization is the long-term usage profile at a specific condition compared to the average condition.
7.11 Integrated Sense Resistor Characteristics, –40°C to 70°C
TA= –40°C to 70°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resistance of Integrated Sense
SRXRES(1) TA= 30°C 7 mΩ
Resistor from SRX to BAT Long term RMS, average device 2000 mA
utilization
Recommended Sense Resistor input Peak RMS current, 10% device
ISRX(2) 3500 mA
current utilization(3)
Peak pulsed current, 250 ms 4500 mA
maximum, 1% device utilization,(3)
(1) Firmware compensation applied for temperature coefficient of resistor.
(2) Specified by design. Not tested in production.
(3) Device utilization is the long-term usage profile at a specific condition compared to the average condition.
7.12 I2C-Compatible Interface Communication Timing Characteristics
TA= –40°C to 85°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1)
MIN NOM MAX UNIT
STANDARD Mode (100 kHz)
(1) Specified by design. Not production tested.
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tSU(STA)
SCL
SDA
tw(H) tw(L) tftrt(BUF)
tr
td(STA)
REPEATED
START
th(DAT) tsu(DAT)
tftsu(STOP)
STOP START
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I2C-Compatible Interface Communication Timing Characteristics (continued)
TA= –40°C to 85°C; typical values at TA= 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1)
MIN NOM MAX UNIT
td(STA) Start to first falling edge of SCL 4 μs
tw(L) SCL pulse duration (low) 4.7 μs
tw(H) SCL pulse duration (high) 4 μs
tsu(STA) Setup for repeated start 4.7 μs
tsu(DAT) Data setup time Host drives SDA 250 ns
th(DAT) Data hold time Host drives SDA 0 ns
tsu(STOP) Setup time for stop 4 μs
t(BUF) Bus free time between stop and start Includes Command Waiting Time 66 μs
tfSCL or SDA fall time (1) 300 ns
trSCL or SDA rise time (1) 300 ns
fSCL Clock frequency(2) 100 kHz
FAST Mode (400 kHz)
td(STA) Start to first falling edge of SCL 600 ns
tw(L) SCL pulse duration (low) 1300 ns
tw(H) SCL pulse duration (high) 600 ns
tsu(STA) Setup for repeated start 600 ns
tsu(DAT) Data setup time Host drives SDA 100 ns
th(DAT) Data hold time Host drives SDA 0 ns
tsu(STOP) Setup time for stop 600 ns
t(BUF) Bus free time between stop and start Includes Command Waiting Time 66 μs
tfSCL or SDA fall time (1) 300 ns
trSCL or SDA rise time (1) 300 ns
fSCL Clock frequency(2) 400 kHz
(2) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (See and )
Figure 1. I2C-Compatible Interface Timing Diagrams
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Temperature (°C)
Current Accuracy Error (%)
-40 -20 0 20 40 60 80 100
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
Temperature (°C)
Voltage Accuracy Error (%)
-40 -20 0 20 40 60 80 100
0.02
0.04
0.06
0.08
0.1
0.12
0.14
Temperature (°C)
Temperature Accuracy Error(%)
-40 -20 0 20 40 60 80 100
-15
-10
-5
0
5
10
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7.13 Typical Characteristics
Figure 2. Voltage Accuracy Figure 3. Temperature Accuracy
Figure 4. Current Accuracy
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SCL SRX
VSYS
Coulomb
Bus SDA Counter
GPOUT
BIN
CPU
ADC
PACKP
Li -Ion
Cell
LDO
VDD
VSS
T
PACKN
Protection
IC
NFET
NFET
1.8 V
BAT
BatteryPack
I2C
047 µF
.1 µF
Integrated
Sense
Resistor
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SLUSB85E –MAY 2013–REVISED JANUARY 2016
8 Detailed Description
8.1 Overview
The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based
rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-of-
charge (SOC).
NOTE
The following formatting conventions are used in this document:
Commands:italics with parentheses() and no breaking spaces, for example, Control()
Data Flash:italics,bold, and breaking spaces, for example, Design Capacity
Register bits and flags:italics with brackets [ ], for example, [TDA]
Data Flash bits:italics,bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode
8.2 Functional Block Diagram
8.3 Feature Description
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command(), are used to read and write information contained within the control and status registers, as well as
its data locations. Commands are sent from system to gauge using the I2C serial communications engine, and
can be executed during application development, system manufacture, or end-equipment operation.
The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve high-accuracy across a wide variety of operating conditions and over the lifetime of
the battery.
The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-
value sense resistor. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell
current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.
The fuel gauge uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host
processor can provide temperature data for the fuel gauge.
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Feature Description (continued)
The bq27421-G1 Technical Reference Manual (SLUUAC5) provides more details.
8.4 Device Functional Modes
To minimize power consumption, the fuel gauge has several power modes: INITIALIZATION, NORMAL, SLEEP,
HIBERNATE, and SHUTDOWN. The fuel gauge passes automatically between these modes, depending upon
the occurrence of specific events, though a system processor can initiate some of these modes directly. See the
bq27421-G1 Technical Reference Manual (SLUUAC5) for more details.
8.5 Programming
8.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. See the bq27421-G1
Technical Reference Manual (SLUUAC5) for more details.
Table 1. Standard Commands
COMMAND
NAME UNIT SEALED ACCESS
CODE
Control() CNTL 0x00 and 0x01 NA RW
Temperature() TEMP 0x02 and 0x03 0.1°K RW
Voltage() VOLT 0x04 and 0x05 mV R
Flags() FLAGS 0x06 and 0x07 NA R
NominalAvailableCapacity() 0x08 and 0x09 mAh R
FullAvailableCapacity() 0x0A and 0x0B mAh R
RemainingCapacity() RM 0x0C and 0x0D mAh R
FullChargeCapacity() FCC 0x0E and 0x0F mAh R
AverageCurrent() 0x10 and 0x11 mA R
StandbyCurrent() 0x12 and 0x13 mA R
MaxLoadCurrent() 0x14 and 0x15 mA R
AveragePower() 0x18 and 0x19 mW R
StateOfCharge() SOC 0x1C and 0x1D % R
InternalTemperature() 0x1E and 0x1F 0.1°K R
StateOfHealth() SOH 0x20 and 0x21 num/% R
RemainingCapacityUnfiltered() 0x28 and 0x29 mAh R
RemainingCapacityFiltered() 0x2A and 0x2B mAh R
FullChargeCapacityUnfiltered() 0x2C and 0x2D mAh R
FullChargeCapacityFiltered() 0x2E and 0x2F mAh R
StateOfChargeUnfiltered() 0x30 and 0x31 % R
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8.5.2 Control(): 0x00 and 0x01
Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control() command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the device is in different access modes, as
described in Table 2. See the bq27421-G1 Technical Reference Manual (SLUUAC5) for more details.
Table 2. Control() Subcommands
SEALED
CNTL FUNCTION CNTL DATA DESCRIPTION
ACCESS
CONTROL_STATUS 0x0000 Yes Reports the status of device
DEVICE_TYPE 0x0001 Yes Reports the device type (0x0421)
FW_VERSION 0x0002 Yes Reports the firmware version of the device
DM_CODE 0x0004 Yes Reports the Data Memory Code number stored in NVM
PREV_MACWRITE 0x0007 Yes Returns previous MAC command code
CHEM_ID 0x0008 Yes Reports the chemical identifier of the battery profile used by the fuel gauge
BAT_INSERT 0x000C Yes Forces the Flags() [BAT_DET] bit set when the OpConfig [BIE] bit is 0
BAT_REMOVE 0x000D Yes Forces the Flags() [BAT_DET] bit clear when the OpConfig [BIE] bit is 0
SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1
CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0
Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters
SET_CFGUPDATE 0x0013 No CONFIG UPDATE mode
SHUTDOWN_ENABLE 0x001B No Enables device SHUTDOWN mode
SHUTDOWN 0x001C No Commands the device to enter SHUTDOWN mode
SEALED 0x0020 No Places the device in SEALED ACCESS mode
TOGGLE_GPOUT 0x0023 Yes Commands the device to toggle the GPOUT pin for 1 ms
RESET 0x0041 No Performs a full device reset
SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode
Exits CONFIG UPDATE mode without an OCV measurement and without
EXIT_CFGUPDATE 0x0043 No resimulating to update StateOfCharge()
Exits CONFIG UPDATE mode without an OCV measurement and
EXIT_RESIM 0x0044 No resimulates with the updated configuration data to update StateOfCharge()
8.5.3 Extended Data Commands
Extended data commands offer additional functionality beyond the standard set of commands. They are used in
the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words.
The number of command bytes for a given extended command ranges in size from single to multiple bytes, as
specified in Table 3.
Table 3. Extended Commands
Name Command Code Unit SEALED UNSEALED
Access(1) (2) Access(1) (2)
OpConfig() 0x3A and 0x3B NA R R
DesignCapacity() 0x3C and 0x3D mAh R R
DataClass() (2) 0x3E NA NA RW
DataBlock() (2) 0x3F NA RW RW
BlockData() 0x40 through 0x5F NA R RW
BlockDataCheckSum() 0x60 NA RW RW
BlockDataControl() 0x61 NA NA RW
Reserved 0x62 through 0x7F NA R R
(1) SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01
(2) In SEALED mode, data cannot be accessed through commands 0x3E and 0x3F.
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8.5.4 Communications
8.5.4.1 I2C Interface
The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Figure 5. I2C Format
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Figure 6. Attempt To Write a Read-only Address (Nack After Data Sent By Master)
Figure 7. Attempt To Read an Address Above 0x6B (Nack Command)
8.5.4.2 I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding
the lines, releasing them frees them for the master to drive the lines.
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A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] PN
A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] DATA [7:0] A 66 sm
A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] A
DATA [7:0] A DATA [7:0] PN
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for 100 kHz)fSCL £
Waiting time inserted after incremental read
66 sm
66 sm
A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] PN
A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] 66 sm
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < f 400 kHz)
SCL £
66 sm
A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] 66 sm
bq27421-G1
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SLUSB85E –MAY 2013–REVISED JANUARY 2016
8.5.4.3 I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥66 μs bus-free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-
byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host must not issue any standard command more than two times per
second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
Figure 8. I2C Command Wait Time
8.5.4.4 I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short ≤
100-µs clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other
modes (INITIALIZATION, NORMAL) a ≤4-ms clock stretching period may occur within packets addressed for the
fuel gauge as the I2C interface performs normal data flow control.
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9 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The Texas Instruments bq27421-G1 fuel gauge is a microcontroller peripheral that provides system-side fuel
gauging for single-cell Li-Ion batteries. The device requires minimal user configuration and system
microcontroller firmware. Battery fuel gauging with the bq27421-G1 fuel gauge requires connections only to
PACK+ (P+) and PACK– for a removable battery pack or embedded battery circuit.
NOTE
To allow for optimal performance in the end application, special considerations must be
taken to ensure minimization of measurement error through proper printed circuit board
(PCB) board layout. These requirements are detailed in Design Requirements.
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9.2 Typical Applications
Figure 9. Application Schematic
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Typical Applications (continued)
9.2.1 Design Requirements
As shipped from the Texas Instruments factory, many bq27421-G1 parameters in OTP NVM are left in the
unprogrammed state (zero) while some parameters directly associated with the CHEMID are preprogrammed.
This partially programmed configuration facilitates customization for each end application. Upon device reset, the
contents of OTP are copied to associated volatile RAM-based Data Memory blocks. For proper operation, all
parameters in RAM-based Data Memory require initialization — either by updating Data Memory parameters in a
lab/evaluation situation or by programming the OTP for customer production. The bq27421-G1 Technical
Reference Manual (SLUUAC5) shows the default value that is present.
9.2.2 Detailed Design Procedure
9.2.2.1 BAT Voltage Sense Input
A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to
reduce noise on this sensitive high-impedance measurement node.
9.2.2.2 Integrated LDO Capacitor
The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of
value at least 0.47 μF should be connected between the VDD pin and VSS. The capacitor should be placed
close to the gauge IC and have short traces to both the VDD pin and VSS. This regulator should not be used to
provide power for other devices in the system.
9.2.2.3 Sense Resistor Selection
Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 50 ppm drift
sense resistor with a 1-W power rating.
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Temperature (°C)
Current Accuracy Error (%)
-40 -20 0 20 40 60 80 100
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
Temperature (°C)
Voltage Accuracy Error (%)
-40 -20 0 20 40 60 80 100
0.02
0.04
0.06
0.08
0.1
0.12
0.14
Temperature (°C)
Temperature Accuracy Error(%)
-40 -20 0 20 40 60 80 100
-15
-10
-5
0
5
10
bq27421-G1
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Typical Applications (continued)
9.2.3 Application Curves
Figure 10. Voltage Accuracy Figure 11. Temperature Accuracy
Figure 12. Current Accuracy
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10 Power Supply Recommendation
10.1 Power Supply Decoupling
The battery connection on the BAT pin is used for two purposes:
• To supply power to the fuel gauge
• As an input for voltage measurement of the battery
A capacitor of value of at least 1 µF should be connected between BAT and VSS. The capacitor should be placed
close to the gauge IC and have short traces to both the BAT pin and VSS.
The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value
at least 0.47 μF should be connected between the VDD pin and VSS. The capacitor should be placed close to the
gauge IC and have short traces to both the VDD pin and VSS.
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11 Layout
11.1 Layout Guidelines
• A capacitor, of value at least 0.47 µF, is connected between the VDD pin and VSS. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
• It is required to have a capacitor, at least 1.0 µF, connected between the BAT pin and VSS if the connection
between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
• If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power
operation, it is recommended to use external 1-MΩpulldown resistors to VSS to avoid floating inputs to the I2C
engine.
• The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus
capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 4.
Table 4. Recommended Values for SCL and SDA Pullup Resistors
VPU 1.8 V 3.3 V
Range Typical Range Typical
RPU 400 Ω ≤ RPU ≤37.6 kΩ10 kΩ900 Ω ≤ RPU ≤29.2 kΩ5.1 kΩ
• If the GPOUT pin is not used by the host, the pin should still be pulled up to VDD with a 4.7-kΩor 10-kΩ
resistor.
• If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to VSS with a
10-kΩresistor.
• The BIN pin should not be shorted directly to VDD or VSS.
• The actual device ground is the center pin (B2). The C1 pin is floating internally and can be used as a bridge
to connect the board ground plane to the device ground (B2).
11.2 Layout Example
Figure 13. bq27421-G1 Board Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
•bq27421-G1 Technical Reference Manual (SLUUAC5)
•bq27421 EVM: Single-Cell Technology User's Guide (SLUUA63)
•Quickstart Guide for bq27421-G1 (SLUUAH7)
•Single Cell Gas Gauge Circuit Design (SLUA456)
•Key Design Considerations for the bq27500 and bq27501 (SLUA439)
•Single Cell Impedance Track Printed-Circuit Board Layout Guide (SLUA457)
•ESD and RF Mitigation in Handheld Battery Electronics (SLUA460)
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
C
0.625 MAX
0.35
0.15
1
TYP
0.5 TYP
9X 0.35
0.25
0.5
TYP
1 TYP
B1.65
1.59 A
1.61
1.55
4222180/A 07/2015
DSBGA - 0.625 mm max height
YZF0009-C01
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFree package configuration.
TM
NanoFree Is a trademark of Texas Instruments.
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
B
A
13
0.015 C A B
SYMM
SYMM
C
2
SCALE 9.000
bq27421-G1
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SLUSB85E –MAY 2013–REVISED JANUARY 2016
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EXAMPLE BOARD LAYOUT
9X ( )0.245
(0.5) TYP
(0.5) TYP
( )
METAL
0.245 0.05 MAX
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
( )
SOLDER MASK
OPENING
0.245
0.05 MIN
4222180/A 07/2015
DSBGA - 0.625 mm max height
YZF0009-C01
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
12
A
B
C
3
NON-SOLDER MASK
DEFINED
(PREFERRED)
NOT TO SCALE
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
bq27421-G1
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EXAMPLE STENCIL DESIGN
(0.5)
TYP
(0.5) TYP
9X ( 0.25) (R ) TYP0.05
METAL
TYP
4222180/A 07/2015
DSBGA - 0.625 mm max height
YZF0009-C01
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
12
A
B
C
3
bq27421-G1
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SLUSB85E –MAY 2013–REVISED JANUARY 2016
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PACKAGE OPTION ADDENDUM
www.ti.com 3-Jan-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
BQ27421YZFR-G1A ACTIVE DSBGA YZF 9 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1A
BQ27421YZFR-G1B ACTIVE DSBGA YZF 9 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1B
BQ27421YZFR-G1D ACTIVE DSBGA YZF 9 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1D
BQ27421YZFT-G1A ACTIVE DSBGA YZF 9 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1A
BQ27421YZFT-G1B ACTIVE DSBGA YZF 9 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1B
BQ27421YZFT-G1D ACTIVE DSBGA YZF 9 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421
G1D
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 3-Jan-2016
Addendum-Page 2
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ27421YZFR-G1A DSBGA YZF 9 3000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
BQ27421YZFR-G1B DSBGA YZF 9 3000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
BQ27421YZFR-G1D DSBGA YZF 9 3000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
BQ27421YZFT-G1A DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
BQ27421YZFT-G1B DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
BQ27421YZFT-G1D DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Mar-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ27421YZFR-G1A DSBGA YZF 9 3000 182.0 182.0 20.0
BQ27421YZFR-G1B DSBGA YZF 9 3000 182.0 182.0 20.0
BQ27421YZFR-G1D DSBGA YZF 9 3000 182.0 182.0 20.0
BQ27421YZFT-G1A DSBGA YZF 9 250 182.0 182.0 20.0
BQ27421YZFT-G1B DSBGA YZF 9 250 182.0 182.0 20.0
BQ27421YZFT-G1D DSBGA YZF 9 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Mar-2018
Pack Materials-Page 2
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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