CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 1/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification
Small Signal Schottky (double) diodes
BAT54N3/BAT54AN3
BAT54CN3/BAT54SN3
Description
Planar silicon Schottky barrier diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Very small conduction losses
•Low forward voltage drop
•Small plastic SMD package
Applications
•Ultra high-speed switching
•Voltage clamping
•Protection circuits
•Blocking diodes
Pinning Outline
Description Pin
BAT54 BAT54A BAT54C BAT54S
1 A K1 A1 A1
2 NC K2 A2 K2
3 K A1,A2 K1,K2 K1,A1
2
3
1
N.C.
12
3
12
33
21
SOT-23
1 2
3
(1) BAT54
(3)BAT54C
(2)BAT54A
(4)BAT54S
Diode configuration and symbol
Marking:
Type Marking Code
BAT54 N3 L4
BAT54AN3 L42
BAT54CN3 L43
BAT54SN3 L44
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 2/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150 °C
Junction Temperature Tj .............................................................................................................. +125°C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) Ptot (Note) ......................................................................... 230 mW
• Maximum Voltages and Currents (Ta=25°C)
Repetitive Peak Reverse Voltage VRRM .............................................................................................. 30 V
Continuous Forward Current IF................................................................................................... 200 mA
Repetitive Peak Forward Current(tp≤1s,duty cycle≤0.5)………………………………………… 300mA
Non-repetitive Peak Forward Current (tp<10ms, sinusoidal) IFSM ............................................... 600 mA
Note:for double diodes, Ptot is the total power dissipation of both diodes.
Characteristics (Ta=25°C)
Characteristic Symbol Condition Min. Max. Unit
Reverse Breakdown Voltage VBR I
R=100µA 30 - V
VF(1) IF=0.1mA - 240 mV
VF(2) IF=1mA - 320 mV
VF(3) IF=10mA - 400 mV
VF(4) IF=30mA - 500 mV
Forward Voltage (Note 1)
VF(5) IF=100mA - 800 mV
Reverse Leakage Current (Note 2) IR VR=25V,Tj=25℃ - 2 µA
Diode Capacitance CD V
R=1V, f=1MHz - 10 pF
Reverse Recovery Time trr IF=IR=10mA RL=100Ω
measured at IR=1mA - 5 ns
Notes: 1.pulse test, tp=380µs,duty cycle<2%.
2.pulse test, tp=5ms,duty cycle<2%.
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 3/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification
Characteristic Curves
Forward Current & Forward Voltage
0
50
100
150
200
250
0 200 400 600 800 1000
Forward Voltage-V
F
(mV)
Forward Current-I
F
(mA)
Diode Capacitance & Reverse-Biased Voltage
1
10
100
0.1 1 10 100
Reverse Biased Voltage-VR (V)
Diode Capacitance-Cd (pF)
CYStech Electronics Corp.
Spec. No. : C302N3-H
Issued Date : 2003.04.14
Revised Date :
Page No. : 4/4
BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification
SOT-23 Dimension
• BAT54 N3: Single Diode (Marking Code L4)
• BAT54AN3: Common Anode. (Marking Code L42)
• BAT54CN3: Common Cathode. (Marking Code L43)
• BAT54SN3: Series Connected. (Marking Code L44)
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.85 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HJ
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
L4_
Diagram:
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
L4X
