© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3492 / 1102015728 Rev No: V.6B Date: 07/09/2018 Page 1 / 5
DESCRIPTIONS
zThe Super Bright Red source color devices are made
with Gallium Aluminum Arsenide Red Light Emitting
Diode
zElectrostatic discharge and power surge could
damage the LEDs
zIt is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
zAll devices, equipments and machineries must be
electrically grounded
FEATURES
zSurface mount type
zCompatible with automatic placement equipment
zCompatible with infrared and vapor phase solder
processes
zBlack case enhances contrast ratio
zHousing material meets UL94V-0 flammability rating
zLens material meets UL94-HB flammability rating
zMoisture sensitivity level: 3
zRoHS compliant
APPLICATIONS
zUsed as indicators of indicating the Degree, Functions,
Positions etc
zElectronic Test & Measurement Instruments
zCommunications Testing Equipment
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
PACKAGE DIMENSIONS
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
Part Number Emitting Color
(Material) Lens Type
Iv (mcd) @ 10mA [2] Viewing Angle [1]
Min. Typ. 2θ1/2
AA3528AVU/ASRS ■ Super Bright Red
(GaAlAs)
Water Clear 8 18 60°
AA3528AVU/ASRS
Single Level Surface Mount CBI
RECOMMENDED SOLDERING PATTERN
(units : mm; tolerance : ± 0.1)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3492 / 1102015728 Rev No: V.6B Date: 07/09/2018 Page 2 / 5
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
AA3528AVU/ASRS
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission IF = 10mA λpeak Super Bright Red 655 - nm
Dominant Wavelength IF = 10mA λdom [1] Super Bright Red 640 - nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 10mA Δλ Super Bright Red 20 - nm
Capacitance C Super Bright Red 45 - pF
Forward Voltage IF = 10mA VF [2] Super Bright Red 1.8 2.3 V
Reverse Current (VR = 5V) IR Super Bright Red - 10 uA
Parameter Symbol Value Unit
Power Dissipation PD 75 mW
Reverse Voltage VR 5 V
Junction Temperature Tj 115 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +100 °C
DC Forward Current IF 30 mA
Peak Forward Current IFM [1] 155 mA
Electrostatic Discharge Threshold (HBM) - 3000 V
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3492 / 1102015728 Rev No: V.6B Date: 07/09/2018 Page 3 / 5
TECHNICAL DATA
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Red
Wavelength (nm)
Relative Intensity (a. u.)
RELATIVE INTENSITY vs. WAVELENGTH
SUPER BRIGHT RED
TAPE SPECIFICATIONS (units : mm)
REEL DIMENSION (units : mm)
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
0° 15°
90°
1.0 1.0
T
a
= 25 °C
SPATIAL DISTRIBUTION
0
4
8
12
16
20
1.3 1.5 1.7 1.9 2.1 2.3
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
048121620
Ta = 25 °C
Forward current (mA)
Luminous intensity normalised
at 10mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at Ta = 25 °C
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
AA3528AVU/ASRS
Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3492 / 1102015728 Rev No: V.6B Date: 07/09/2018 Page 4 / 5
AA3528AVU/ASRS
APPLICATION NOTES
Introduction
Kingbright AA3528AVU series are surface-mounted right-angle light-emitting diode (LED) circuit-board indicators. It offers the
convenience of surface-mount production while offering the right-angle height profile of circuit-board indicator lamps. The part is
suitable for automated SMT and lead-free reflow soldering production. The clear silicone lens extends out to provide broad viewing
angles. When installed on customer’s circuit board, it can provide illuminated indication or backlight panel indicators.
Transport and Storage
Surface mount devices (SMD) are moisture sensitive components. Atmospheric moisture will seep into the component package,
so when placed on the circuit board for 160-200°C reflow soldering, the high temperatures cause the absorbed moisture to vaporize
and rapidly expand, creating vapor pressure that could damage the LED component by causing cracks in the lens, delamination
of the chip and wire bonds, or other reliability issues.
1.Transportation
The product is packed in anti-static, moisture-proof mylar bags. The package should be carefully handled to avoid external pressure
and accidental puncture during transport. Proper anti-static practices should be in place. If package leakage or damage is found
before opening, suggest customer take the damaged package off-line for additional testing and bake to dry before use.
2.Storage Conditions (Before Opening)
To prevent moisture-absorption reliability issues, the parts must be properly stored. Suggest do not open the moisture-proof package
until immediately before usage (except for sample inspection purposes). The opened package must be re-sealed with fresh desiccant
and humidity indicator and Stored in a dry box (<30°C/60%RH).
3.Humidity Control (After Opening)
After opening the moisture-proof packaging, immediately check the humidity indicator card contained inside to confirm the parts have
been exposed to excess moisture. The production environment should follow IPC/JEDEC J-STD-020 standards for temperature,
humidity, and exposure time. SMD environmental exposure time accumulates as long as the parts are outside the packaging, unless
they are being baked dry.
Table 1: IPC/JEDEC J-STD-020 Moisture Sensitivity Levels (MSL)
PACKING & LABEL SPECIFICATIONS
© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3492 / 1102015728 Rev No: V.6B Date: 07/09/2018 Page 5 / 5
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes
AA3528AVU/ASRS
4. Storage of Unused and Remaining Parts
If the full reel was not consumed during production, the production environment was within limits (<30°C/60%RH), and the exposure
time did not exceed the limits in Table 1, then the remaining parts may be stored as below:
zRe-sealed with desiccant.
zStored within a dry box (5% RH). The dry box storage time would not count against the total exposure time. When the
stored parts are taken out, the exposure time is accu-mulated from the previous production run.
5. Humidity Control of PCB-Mounted Parts
If the moisture-sensitive SMD parts will not undergo further reflow or other high-temperature processes, then no special treatment is
required. However, if the PCB assembly requires further reflow or other high-temperature process, including rework, then the mounted
SMD’s exposure time should continue to accumulate against the MSL limit, unless the board is kept in a dry environ ment (<5% RH).
If the exposure time exceeds the MSL limit, the board and part must be baked dry to reset the exposure time before undergoing further
reflow.
Installation and Usage
If the part’s silicone lens extends beyond the board’s edge after installation, proper protection Should be made (such as covers) to
prevent accidental impact or stress on the exposed lens that would cause damage or detachment. The silicone lens may withstand
up to 1.5-newton in shear force when properly mounted. If external protection is not available, strongly suggest following these handling
procedures to prevent damage:
1. When the PCB assembly is handled or transported after reflow soldering, care must be taken to
prevent accidental contact or impact on the exposed silicone lens.
2. When the PCB assembly is installed into the casing or panel, care must be taken to maintain
sufficient clearance for the lens.
3. Do not subject the silicone lens to outside impact or friction.
Cleaning
1. Do not use unknown chemicals or acidic solvents to clean the part. Please check to insure the cleaning solvent will notcorode
epoxy resin, silicone resin, silver plating, and other component materials before using.
2. Kingbright suggests ethanol as a safe solvent for use with the surface mount devices. Softly wipe away any surface parcles,
avoiding excessive force scratching the surface or damaging the structures. Then place down and allow to naturally dry under
room temperature conditions before further use. Do not soak the component in the solvent.
MSL
Allowed Exposure After Opening
Time Conditions
LEVEL 1 No Limit ≤ 30°C/85%RH
LEVEL 2 1 Year ≤30°C/60%RH
LEVEL 2a 4 Weeks ≤30°C/60%RH
LEVEL 3 168 Hours ≤30°C/60%RH
LEVEL 4 72 Hours ≤30°C/60%RH
LEVEL 5 48 Hours ≤30°C/60%RH
LEVEL 5a 24 Hours ≤30°C/60%RH
LEVEL 6 Immediately upon open ≤30°C/60%RH
