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DO's and DON'Ts of ESD Testing
1)DO USE STANDARD TEST EQUIPMENT. Repeatability in ESD testing is difficult enough as it is,
without introducing additional unknowns through home-built setups. For IEC 801-2 testing, Maxim uses an
NSG 435 ESD gun by Schaffner. For testing to MIL-STD-883 Method 3015.7, Maxim uses a Model 4000
tester by IMCS.
2) DO PERFORM A COMPLETE SET OF PARAMETRIC TESTS ON THE DEVICE UNDER TEST,
BEFORE AND AFTER THE ESD TESTING. ESD usually causes catastrophic failures, but it can also
introduce subtle and latent damage that appears later as a field failure. Leakage currents in particular should
be closely monitored to detect this damage.
3) DO TEST THE ENTIRE RANGE OF ESD VOLTAGES (not just the upper limit). Many ESD-
protection structures can withstand the highest ESD voltage for which they are guaranteed, but fail at a
lower level. Maxim tests each device pin, starting at 200V and progressing in 200V increments until failure
occurs or the ESD tester's limit is reached.
4) DO REQUIRE PERFORMANCE TO ALL RELEVANT STANDARDS. MIL-STD-883, for example,
simulates the ESD encountered by an IC during assembly and distribution (shipping). IEC 801-2, which
applies only to pins that connect outside the local system, simulates ESD events that might occur in the end
equipment.
5) DO PERFORM IEC 801-2 TESTING WITH POWER ON AS WELL AS OFF. Some competing ICs,
both bipolar and CMOS, exhibit SCR latchup when subjected to an ESD event while the power is on. SCR
latchup can cause destructive supply currents. Even if not destructive, latchup usually prevents normal
operation until removed by turning off the IC's power.
1) DON'T MISAPPLY THE STANDARDS. Some standards address the survival of all pins during
distribution and manufacturing; others address only the survival of pins that are externally accessible in the
end equipment.
2) DON'T TRUST UNSUBSTANTIATED CLAIMS that give no information regarding the test equipment
or procedures used.
3) DON'T ASSUME that bipolar ICs are inherently better than CMOS ICs, or vice-versa. What counts is
the actual performance in an application.
™TransZorb is a trademark of General Semiconductor Industries, Inc.
™Laplink is a trademark of Traveling Software.
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