EVALUATION KIT AVAILABLE MAX32600 Wellness Measurement Microcontroller General Description The MAX32600 microcontroller is based on the industry-standard ARM(R) Cortex(R)-M3 32-bit RISC core operating at up to 24MHz. It includes 256KB of flash memory, 32KB of SRAM, a 2KB instruction cache, and integrated high-performance analog peripherals. The MAX32600 is available in the following package options: 192-ball, 12mm x 12mm CTBGA; 120-ball, 7mm x 7mm CTBGA; and 108-ball, 5.4mm x 4.3mm WLP. Applications Wearable Medical Devices Pulse Oximetry Measurement Galvanic Skin Response Measurement Blood Glucose Metering Simplified Functional Diagram MAX32600 ANALOG FRONT-END 4 x SPST ANALOG SWITCHES 2 x 12-BIT DACS 4 x COMP/ AMPLIFIERS 16 S/E OR 8 DIFF MUX INPUTS 16-BIT ADC WITH PGA PROGRAMMABLE VOLTAGE REFERENCE 2 x 8-BIT DACS 8 x PROGRAMMABLE LED DRIVERS TEMP SENSOR, CALIBRATION MUX 256KB FLASH NVIC 32KB SRAM 2 ARM CORTEX-M3 24MHz CRC32/16 GENERATOR 2 x WATCHDOG TIMER 3 x SPI MASTER 2 x UART 2 x I2C MASTER I2C SLAVE USB FULL SPEED TRUST PROTECTION UNIT 24MHz INTERNAL OSC AES ENGINE MAA TRNG UNIQUE ID INSTANT ERASE KEY STORAGE 64 GPIOs SUPPLY VOLTAGE MONITORS 4 x 32-BIT TIMER 32-BIT REAL-TIME CLOCK WITH TIME OF DAY ALARM SEE THE SELECTOR GUIDE FOR CONFIGURATION DETAILS. 19-6947; Rev 7; 6/17 LCD CONTROLLER 96/128/160 SEGMENTS JTAG Benefits and Features Integrated AFE Enables Precision Wellness Measurements with Minimal Discretes * 16-Bit ADC with Input Mux and PGA * Up to 500ksps Conversion Rate * PGA with Gain of 1, 2, 4, and 8 and Bypass Mode * Differential 8:1 or Single-Ended 16:1 Input Mux * Internal Mux Inputs for Measuring VDDA3 * Internal or External Voltage Reference * Programmable Buffers for ADC and DACs * Two 12-Bit DACs and Two 8-Bit DACs * Four Operational Amplifiers * Four Low-Power Comparators * Four Uncommitted SPST Analog Switches * Four Ground Switches * Up to Eight 100mA LED Driver Pairs (Sink) * Internal Temperature Sensor Secure Valuable IP and Data with Robust On-Board Trust Protection Unit * Trust Protection Unit for End-to-End Security * AES Hardware Engine * MAA for ECDSA and RSA * True Random Number Generator (TRNG) * Fast-Erase SRAM for Secure Key Storage Industry's Lowest Overall System Power Increases Battery Life * 175A/MHz Active Power Executing Code from Cache * 1.25A Current Consumption with Real-Time Clock Enable in LP0 * 1.8A Current Consumption with Data Retention and Fast 15s Wakeup in LP1 * Peripheral Clock Control * 6-Channel DMA Engine Enables Intelligent Peripheral Operation While Micro is in Sleep Mode Flexible Package Options * 120-Ball CTBGA, 0.5mm Pitch, 7mm x 7mm * 192-Ball CTBGA, 0.65mm Pitch, 12mm x 12mm * 108-Bump WLP, 0.4mm Pitch, 5.4mm x 4.3mm Additional Benefits and Features and Ordering Information appear at end of data sheet. 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MAX32600 Wellness Measurement Microcontroller Absolute Maximum Ratings Voltage Range on VDD and VDDA3 with Respect to GND................................................-0.3V to +3.6V Voltage Range on VBUS..........................................-0.3V to 5.5V Voltage Range on Any Lead with Respect to GND (excluding VBUS)........ -0.3V to (VDD + 0.5V) Voltage Range on Analog Pins with Respect to GND.............................................. -0.3V to VDDA3 Total Current into VDD/VDDA3 Power Lines (Sink)...........100mA Total Current Source VDD Power Lines (Sink)..................100mA Output Current (Sink) by Any I/O Pin..................................25mA Output Current (Source) by Any I/O Pin............................-25mA Output Current (Source) by VDDIO...................................100mA Output Current (Sink) by LED Pins...................................135mA Output Current (Source) by VREG18...................................50mA Operating Temperature Range............................ -40C to +85C Storage Temperature Range............................. -65C to +150C Soldering Temperature (reflow)........................................+260C Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) 108 WLP Junction-to-Ambient Thermal Resistance (JA)......32.99C/W 120 CTBGA Junction-to-Ambient Thermal Resistance (JA)...........32C/W Junction-to-Case Thermal Resistance (JC)..................9C/W 192 CTBGA Junction-to-Ambient Thermal Resistance (JA)......29.50C/W Junction-to-Case Thermal Resistance (JC).............9.40C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Recommended DC Operating Conditions (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER Digital Domain Voltage SYMBOL VDD Analog Domain Voltage VDDA3 1.8V Internal Regulator VREG18 CONDITIONS (Note 3) MIN TYP 1.8 2.3 MAX UNITS 3.6 V 3.6 V 1.8 V Power-Fail Warning Voltage for Supply VPFW Monitors VDD, PFWVSBIT = 0x0016 2.525 V Power-Fail Reset Voltage VRST Monitors VDD 1.765 V Power-On-Reset Release Voltage VSPOR RAM Data Retention Voltage VDRV LP3 Active Current (Note 4) IDDLP3 LP2 Current IDDLP2 LP1 Current IDDLP1 LP0 Current IDDLP0 LP2 Mode Resume Time tONLP2 www.maximintegrated.com Monitors VDD or VDDB 1.8 1.0 Cache disabled, fCK = 24MHz V V 5 mA Cache enabled, execution from cache, 100% hit rate, fCK = 24MHz 6.10 One PMU channel enabled 1.25 mA Each additional PMU channel 200 A RTC enabled, VDD supply current 1.8 RTC disabled, VDD supply current 1.4 RTC enabled, VDD supply current 1250 RTC disabled, VDD supply current 850 One PMU channel active 0 A nA s Maxim Integrated 2 MAX32600 Wellness Measurement Microcontroller Recommended DC Operating Conditions (continued) (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LP1 Mode Resume Time tONLP1 15 s LP0 Mode Resume Time tONLP0 26 s Input Low Voltage for SRSTN and All Port Pins VIL Input High Voltage for SRSTN and All Port Pins VIH Input Hysteresis (Schmitt) 0.7x VDDIO VIHYS Output Low Voltage for All Port Pins VOL Output High Voltage for All Port Pins VOH Input/Output Pin Capacitance for All GPIO Port Pins CIO Pullup Resistance for All GPIO Port Pins 0.3 x VDDIO V 300 mV VDD = 3.6V, IOL = 11mA 0.4 0.5 VDD = 2.3V, IOL = 8mA 0.4 0.5 IOH = -2mA RPU25K Normal drive mode RPU1M Weak pullup enabled V VDDIO - 0.5 V V 5 pF 25 k 1 M Input Leakage Current Low IIL VIN = 0V, internal pullup disabled -100 +100 nA Input Leakage Current High IIH VIN < VDD + 0.6V or 3.6V or whichever is lower, internal pullup disabled -100 +100 nA tME Mass erase 30 tERASE Page erase 30 FLASH MEMORY Flash Erase Time Flash Programming Time per Word tPROG Flash Endurance Data Retention ms 60 s (Note 5) 20 K cycles tRET TA = +25C (Note 5) 100 Years VLCD VLCD output boost voltage; VDD = 2.0V to 3.6V LCD LCD Reference Voltage LCD Segment/Common Bias Voltage 2/3 level VLCDBIAS LCD Adjustment Voltage VADJ LCD Bias Resistor RLCD LCD Adjustment Resistor RLADJ www.maximintegrated.com 3.3 V VADJ + 2/3 (VLCD - VADJ) 1/2 level VADJ + 1/2 (VLCD - VADJ) 1/3 level VADJ + 1/3 (VLCD - VADJ) LCD_LCRA[3:0] = 0 0 LCD_LCRA[3:0] = 15 0.4 x VLCD Static and 1/3 bias 108 1/2 bias 72 LCD_LCRA[3:0] = 15 72 V V k k Maxim Integrated 3 MAX32600 Wellness Measurement Microcontroller Recommended DC Operating Conditions (continued) (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS REAL-TIME CLOCK (RTC) RTC Input Frequency RTC Operating Current RTC Initial Power-Up Time f32KIN 32kHz watch crystal 32.768 kHz IRTC Micro in LP2 or LP3 0.7 A IRTC_LP0 Micro in LP0 or LP1 0.4 A tRTC_ PUP (Note 6) 250 ms RTC transition from low to high power drive, not required in all applications 256 ms RTC Power Mode Transition Time from LP0/LP1 to LP2/LP3 USB Electrical Characteristics (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 5) PARAMETER SYMBOL USB Supply Voltage VBUS USB PHY Supply Voltage VDDB VBUS Supply Current in LP2/3 While Transmitting USB Data (Note 3) VBUS Supply Current in LP2/3 with USB Idle IVBUS_TX CONDITIONS MIN TYP 4.5 VBUS 4.0V MAX UNITS 5.5 V 3.3 V Transmitting on D+ and D- at 12Mbps, CL = 50 pF on D+ and D- to VSS, FRCVDD = 0 3 + IDD mA Transmitting on D+ and D- at 12Mbps, CL = 50 pF on D+ and D- to GND, FRCVDD = 1 3 mA 0.4 + IDD mA IVBUS_IDLE D+ = hi, D- = lo, FRCVDD = 18 Single-Ended Input High Voltage D+, D- VIHD Single-Ended Input Low Voltage D+, D- VILD Output Low Voltage D+, D- VOLD RL = 1.5k from D+ to 3.6V Output High Voltage D+, D- VOHD 2.0 V 0.8 V 0.3 V RL = 15k from D+ and D- to VSS 2.8 V Differential Input Sensitivity D+, D- VDI D+ to D- 0.2 V Common-Mode Voltage Range VCM Includes VDI range 0.8 2.5 V Single-Ended Receiver Threshold VSE 0.8 2.0 V Single-Ended Receiver Hysteresis VSEH Differential Output Signal Cross-Point Voltage VCRS D+, D- Off-State Input Impedance www.maximintegrated.com RLZ CL = 50pF 300 200 mV 1.65 V k Maxim Integrated 4 MAX32600 Wellness Measurement Microcontroller USB Electrical Characteristics PARAMETER Driver Output Impedance D+ Pullup Resistor SYMBOL CONDITIONS RDRV MIN Steady-state drive Idle RPU Receiving TYP MAX UNITS 28 44 0.9 1.575 1.425 3.090 k USB TIMING D+, D- Rise Time (Transmit) tR CL = 50pF 12 ns D+, D- Fall Time (Transmit) tF CL = 50pF 12 ns tR, tF CL = 50pF 100 % Rise/Fall Time Matching (Transmit) Clock Electrical Characteristics (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 24 MHz External Crystal/Clock Input Frequency fHFXIN External Crystal Duty Cycle tHFX_DUTY 50 % External Clock Input Duty Cycle tXCLK_DUTY 50 % System Clock Frequency fCK System Clock Period tCK 1/fCK ns Internal Relaxation Oscillator Frequency fOSC 24 MHz Internal Relaxation Oscillator Variability fOSC_VAR 1 24.2 1% MHz MHz Phase-Locked Loop (PLL) Electrical Characteristics (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER Frequency Frequency Jitter www.maximintegrated.com SYMBOL fPLL CONDITIONS MIN TYP MAX UNITS 8MHz, 12MHz, 24MHz with corresponding clock multiplier 48 MHz Peak-to-peak 1 ns Maxim Integrated 5 MAX32600 Wellness Measurement Microcontroller ADC/PGA Electrical Characteristics (VDD = VRST to 3.6V, VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 0 +VREFADC/ Gain V Bipolar, AIN+ - AIN- PGA gain = 1, 2, 4, 8 range = 0 -VREFADC/ (2 x Gain) +VREFADC/ (2 x Gain) V Bipolar, AIN+ - AIN- PGA gain = 1, 2, 4, 8 range = 1 -VREFADC/ Gain +VREFADC/ Gain V Unipolar, AIN+ - AIN-, PGA bypass 0 +VREFADC V Bipolar, AIN+ - AIN-, PGA bypass, range = 0 -VREFADC /2 +VREFADC/ 2 V Bipolar, AIN+ - AIN-, PGA bypass, range = 1 -VREFADC +VREFADC V ADC ANALOG INPUT Unipolar, AIN+ - AINPGA gain = 1, 2, 4, 8 Input Voltage Range (Note 5) Common-Mode Input Voltage Range ADC/PGA Input Leakage Current (Note 5) www.maximintegrated.com VIN VCM_MIN AIN+, AIN- VCM_MAX AIN+, AIN- IIL 0 V VDDA3 TA = +25C, AIN0, AIN[2:7] VIN = 0V < 2.0V 1 TA = +50C, AIN0, AIN[2:7] VIN = 0V < 2.0V 4 TA = +25C, AIN0, AIN[2:7] VIN = 2.0V to 3.6V 3 TA = +50C, AIN0, AIN[2:7] VIN = 2.0V to 3.6V 8 TA = +25C, AIN1+, AIN1- VIN = 0V < 2.0V 2 TA = +50C AIN1+, AIN1- VIN = 0V < 2.0V 6 TA = +25C, AIN1+, AIN1- VIN = 2.0V to 3.6V 4 TA = +50C, AIN1+, AIN1- VIN = 2.0V to 3.6V 13 TA = -40C to +85C, AIN0, AIN[2:7] VIN = 0V < 2.0V 1 200 TA = -40C to +85C, AIN0, AIN[2:7] VIN = 2.0V to 3.6V 3 350 TA = -40C to +85C, AIN1+, AIN1- VIN = 0V < 2.0V 2 300 TA = -40C to +85C, AIN1+, AIN1- VIN = 2.0V to 3.6V 5 525 pA Maxim Integrated 6 MAX32600 Wellness Measurement Microcontroller ADC/PGA Electrical Characteristics (continued) (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER Input Capacitance SYMBOL CI CONDITIONS MIN TYP PGA bypass, range = 0 7 PGA bypass, range = 1 4 PGA gain = 1 7 PGA gain = 2 13 PGA gain = 4 25 PGA gain = 8 49 MAX UNITS pF DC CHARACTERISTICS Resolution N No Missing Codes (Note 5) 16 Bits -1 LSB Differential Nonlinearity DNL 16-bit resolution 0.5 Integral Nonlinearity (Note 5) INL VREFADC 1.5V 1.5 PGA bypass 3.7 PGA gain = 8 8.1 Transition Noise LSB 4 LSB Gain Error without Firmware Compensation PGA bypass 200 PGA active 225 Gain Error Temperature Coefficient VREF 1.5V, does not include reference drift 0.4 Offset Error without Firmware Compensation OE Offset Error Temperature Coefficient PGA bypass 0 55 PGA active 0 80 LSB LSB/ C LSB 0.1 LSB/ C Channel-to-Channel Offset Matching 0.1 LSB Channel-to-Channel Gain Matching 0.1 LSB 1 LSB Input Common-Mode Rejection VREF 1.5V, does not include reference drift LSB CMR VCM = 0V to VDDA3 CONVERSION RATE Throughput Rate Decimation Rate ADC Conversion Time www.maximintegrated.com FS Nd tCONV PGA bypass 500/Nd PGA gain = 1 470/Nd PGA gain = 2 470/Nd PGA gain = 4 444/Nd PGA gain = 8 421/Nd Powers of 2 (Note 5) 15.5 ADCFCLK cycles; ADCFCLK = 8MHz (Note 7) 1 1.9375 128 ksps Sp s Maxim Integrated 7 MAX32600 Wellness Measurement Microcontroller ADC/PGA Electrical Characteristics (continued) (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER ADC Acquisition Time PGA Acquisition Time Aperture Jitter SYMBOL tACQ_ADC tACQ_PGA tAJ CONDITIONS MIN PGA bypass 187.5 PGA gain = 1 250 PGA gain = 2 250 PGA gain = 4 375 PGA gain = 8 375 Single sample or initial sample 0.63 PGA gain = 1, continuous sample 1.5 PGA gain = 2, continuous sample 1.5 PGA gain = 4, continuous sample 1.5 PGA gain = 8, continuous sample 1.5 TYP MAX UNITS ns s External crystal or clock source 500 Internal relaxation oscillator 500 ps ADC Clock Frequency (Note 5) 8 MHz Transient Response Full-scale step 1 CLK cycle DYNAMIC SPECIFICATIONS (Note 8) -0.5dB below full scale with VDDA3 = 3V internal, VREF = 2.048V, ADC range = 1, ADC bipolar = 1, PGA bypass or PGA gain = 1x, fSAMPLE = 500ksps Signal-to-Noise Ratio (Note 9) Signal-to-Noise and Distortion Spurious-Free Dynamic Range Total Harmonic Distortion Channel-to-Channel Crosstalk www.maximintegrated.com SNR SINAD SFDR THD Bypass mode, decimation filter Nd = 1 72.4 74.8 Decimation filter Nd = 1, PGA enabled 70.8 73.6 Decimation filter Nd = 16 80.3 85.4 Decimation filter Nd = 64 84.6 89.9 Bypass mode, decimation filter Nd = 1 72.2 74.7 Decimation filter Nd = 1, PGA enabled 70.7 73.5 Decimation filter Nd = 16 78.6 84.5 Decimation filter Nd = 64 79.7 87.9 PGA bypass 91 PGA enabled 85 PGA bypass 91 PGA enabled 91 Single-ended, fINPUT < 200kHz 107 dB dB dB dB Maxim Integrated 8 MAX32600 Wellness Measurement Microcontroller ADC/PGA Electrical Characteristics (continued) (VDD = VRST to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES ADC Supply Current Line Rejection LR FS > 333.3ksps, PGA bypass, post trimmed 9.6 FS > 333.3ksps, PGA enabled, post trimmed 11.6 FS 333.3ksps, PGA bypass, post trimmed 32.9 FS 333.3ksps, PGA enabled, post trimmed 40.9 mA nA/sps VDDA3 = 2.3 to 3.6V (Note 5) 10 LSB DAC0/DAC1 Electrical Characteristics (VDDA3 = 2.3V to 3.6V, VDD = VRST to 3.6V, RL = 10k and CL = 100pF, TA = -40C to +85C, VREFDAC = 1.5V, unless otherwise noted.) (Note 2) PARAMETER Resolution SYMBOL DACR CONDITIONS Guaranteed monotonic MIN Differential Nonlinearity DNL Integral Nonlinearity INL Offset Error EO Power mode = 2 or 3, noise filter enabled, TA = -0C to +85C, code 000h to FFFh (Note 5) Power mode = 2 or 3, noise filter enabled, code 073h to F8Dh (Note 5) Using uncommitted op amp (Note 5) -8 EG VREFDAC = 1.5V, power mode = 2 to 3, VDDA3 = 3.0V, trimmed, using firmware compensation VREFDAC = 1.5V, VDDA3 = 3.0V, without firmware compensation -90 Gain Error Gain Error Temperature Compensation Output Voltage Range www.maximintegrated.com EGTC VO MAX UNITS Bits -2 +2 LSB -4 +4 LSB 0.5 4 mV 1 +8 LSB Temperature coefficient compensation disabled, using internal uncommitted op amp, VREFDAC = 1.5V, power mode = 3, VDDA3 = 3.0V Temperature coefficient compensation enabled, using internal uncommitted op amp, VREFDAC = 1.5V, power mode = 3, VDDA3 = 3.0V Min code to max code (Note 5) TYP 12 +90 -60 ppm/ C -20 VSSDAC + EO VDDA3 0.5 + EG V Maxim Integrated 9 MAX32600 Wellness Measurement Microcontroller DAC0/DAC1 Electrical Characteristics (continued) (VDDA3 = 2.3V to 3.6V, VDD = VRST to 3.6V, RL = 10k and CL = 100pF, TA = -40C to +85C, VREFDAC = 1.5V, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS Power mode = 3 Output Impedance Voltage Output Settling Time tSFS Glitch Energy Bias Supply Current Shared Active Current Active Current www.maximintegrated.com IDACx_ON IDAC12 IDAC12 MIN TYP MAX UNITS 6.1 k Power mode = 2 8.9 k Power mode = 1 16.3 k Power mode = 0 97.7 k Noise filter enabled, code 400h to C00h, rising or falling, to 0.5 LSB 4 Noise filter disabled, code 400h to C00h, rising or falling, to 0.5 LSB 0.03 Power mode = 0, 1, or 2 Power mode = 3, code 000h to A5Hh Static VREF = 2.5V Static VREF = 1.5V ms 12 12 V x ns 110 A 82 Static VREF = 2.5V Power mode = 3 438.7 Static VREF = 2.5V Power mode = 2 301.6 Static VREF = 2.5V Power mode = 1 164.5 Static VREF = 2.5V Power mode = 0 27.4 Static VREF = 1.5V Power mode = 3 263.2 Static VREF = 1.5V Power mode = 2 181 Static VREF = 1.5V Power mode = 1 98.7 Static VREF = 1.5V Power mode = 0 16.5 A A Maxim Integrated 10 MAX32600 Wellness Measurement Microcontroller DAC0/DAC1 Electrical Characteristics (continued) (VDDA3 = 2.3V to 3.6V, VDD = VRST to 3.6V, RL = 10k and CL = 100pF, TA = -40C to +85C, VREFDAC = 1.5V, unless otherwise noted.) (Note 2) PARAMETER Active Current Active Current Power-On Time www.maximintegrated.com SYMBOL IDAC12 IDAC12 CONDITIONS MIN TYP Static VREF = 2.048V Power mode = 3 359.3 Static VREF = 2.048V Power mode = 2 247.1 Static VREF = 2.048V Power mode = 1 124.8 Static VREF = 2.048V Power mode = 0 22.5 Static VREF = 1.024V Power mode = 3 179.7 Static VREF = 1.024V Power mode = 2 123.5 Static VREF = 1.024V Power mode = 1 67.3 Static VREF = 1.024V Power mode = 0 11.2 Excluding reference MAX UNITS A A 10 s Maxim Integrated 11 MAX32600 Wellness Measurement Microcontroller DAC2/DAC3 Electrical Characteristics (VDDA3 = 2.3V to 3.6V, VDD = VRST to 3.6V, RL = 10k and CL = 100pF, TA = -40C to +85C, VREFDAC = 1.5V, unless otherwise noted.) (Note 2) PARAMETER Resolution SYMBOL DACR CONDITIONS Guaranteed monotonic MIN TYP MAX 8 UNITS Bits Differential Nonlinearity DNL Code 07h to F9h 0.25 1 LSB Integral Nonlinearity INL Code 07h to F9h 0.25 1 LSB Offset Error EO Internal uncommitted op amp (Note 5) 0.5 4 mV Gain Error EG Internal reference 2 LSB Excludes offset and reference drift, using internal uncommitted op amp 5 ppm of FSR/C Gain-Error Temperature Coefficient Output Voltage Range VO Min code to max code (Note 5) tSFS 40h to C0h code swing rising or falling to 0.5 LSB Output Impedance Voltage Output Settling Time DAC Glitch Impulse Supply Current per DAC Major carry transitions IDAC Power-On Time VDDA3 0.5 VSSDAC Static Excluding Reference V 49 k 3 s 12 nV-s 62.4 A 10 s Operational Amplifier Electrical Characteristics (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Common-Mode Rejection Ratio Input Offset Voltage Input Offset Voltage Drift CMRR 16-bit resolution 75 VOS 0.5 VOSDRIFT IBIAS 15 TA = 0C to +50C, VIN = 0V Large Signal Voltage Gain Input Voltage Range www.maximintegrated.com 15 pA 200 TA = 0C to +50C 300 TA = -40C to +85C 650 AOL VIN+, VIN- V/C 650 TA = +25C IOS mV 200 300 TA = -40C to +85C, VIN = 0V Input Offset Current (Note 5) 8 5 TA = +25C, VIN = 0V Input Bias Current (Note 5) dB 140 pA dB en_nch_opampx = 1, en_pch_opampx = 1 VAGND 50mV VDDA3 + 50mV en_nch_opampx = 0, en_pch_opampx = 1 VAGND 50mV VDDA3 + 1.05 en_nch_opampx = 1, en_pch_opampx = 0 0.95 VDDA3 + 50mV V Maxim Integrated 12 MAX32600 Wellness Measurement Microcontroller Operational Amplifier Electrical Characteristics (continued) (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS Output Voltage Swing High VOH VDDA3 - VOUT, 100k load Output Voltage Swing Low VOL VOUT - VAGND, 100k load Output Short Circuit Current ISC MIN TYP VDDA3 - 10 25 MAX UNITS VDDA3 mV 5 mV 50 mA OP AMP GND SWITCHES (INA+, INB+, INC+,IND+) INx+ Capacitance CINx+ VINx+ = VAGND, f = 1MHz (Note 5) 2 VINx+ = 3.0V, IINx+ = 10mA 20 VINx+ = 3.0V, IINx+ = 50mA 20 pF On-Resistance (Note 5) RON INx+ DC Current IINx+ (Note 5) GBW CL = 100pF Slew Rate SR CL = 100pF 1.6 V/s Input Voltage Noise Density Vn f = 10kHz 20 nV/Hz 0.1Hz f 10Hz 20 VP-P f = 10kHz 10 fA/Hz No sustained oscillations, RSERIES = 0 100 pF f = 10kHz, VOUT = 1VP-P, source follower configuration, (en_nch_ opampx = 0, en_pch_opampx =1) or (en_nch_opampx = 1, en_pch_ opampx = 0) -90 dB en_nch_opampx = 1, en_pch_ opampx = 1 183 en_nch_opampx = 0, en_pch_ opampx = 1 155 en_nch_opampx = 1, en_pch_ opampx = 0 155 30 50 mA AC CHARACTERISTICS Gain-Bandwidth Input Voltage Noise Input Current Noise Density Capacitive Loading Total Harmonic Distortion In CLOAD THD 3 0.85 MHz POWER-SUPPLY CHARACTERISTICS Supply Current IVDDA3 Line Rejection LR Turn-On Time tON Power-Down Output Impedance A 90 1.5 VOUTx = 1V dB 2.1 s 1 G 1 nA RINTSW 30 ROPAGND 20 Power-Down Output Leakage OP AMP FEEDBACK SWITCH Internal Switch On-Resistance Ground Switch Resistance www.maximintegrated.com Maxim Integrated 13 MAX32600 Wellness Measurement Microcontroller Internal Voltage Reference Electrical Characteristics (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, Internal Reference Mode, 4.7F capacitor at REFADC, 4.7F cap at REFDAC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX VDDA3 = 2.3V to 3.6V, TA = +25C -2% 1.024 +2% VDDA3 = 2.3V to 3.6V, REFADC, TA = +25C -1% 1.50 +1% VDDA3 = 2.3V to 3.6V, TA = +25C -2% 2.048 +2% VDDA3 = 2.7V to 3.6V, TA = +25C -2% 2.50 +2% UNITS INTERNAL REFERENCE Output Voltage at REFADC and REFDAC (Note 5) Output Voltage at REFADJ Internal Reference Temperature Coefficient (Note 5) Temperature Coefficient Adder of Buffer with External Reference Turn-On Time Leakage Current with Internal Reference Output Disabled (Note 5) REFADC and REFDAC Line Regulation Load Regulation Reference Supply Current www.maximintegrated.com VREFADC, VREFDAC VREFADJ TCREF TC 1.24 TA = 0C to +70C TA = 0C to +70C 50 5 IREFADC refadc_outen = 0 10 0.1 + (VREF x 1.8) 15 IREFDAC refdac_outen = 0 15 tON TA = -40C to +85C (Note 5) ISOURCE = 0A to 500A, TA = +25C V 30 TA = -40C to +85C V ppm/C ppm/C 10 50 50 ms nA 100 V/V 10 V/A Internal reference only (Note 10) 33 REFADC buffer 270 REFDAC buffer 270 A Maxim Integrated 14 MAX32600 Wellness Measurement Microcontroller External Voltage Reference Electrical Characteristics (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, External reference mode.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS EXTERNAL REFERENCE AT REFADJ Input Voltage Range VREFADJ Input Resistance 1.24 3% V 250 k 1.0 to VDDA3 - 0.5 V EXTERNAL REFERENCE AT REFADC Input Voltage Range VREFADC VDDA3 = 2.3V to 3.0V VDDA3 > 3.0V 1.0 to 2.5 Input Capacitance Dynamic Input Current 500ksps, VREFADC = 2.048V 7 pF 50 A EXTERNAL REFERENCE AT REFDAC Input Voltage Range VREFDAC 1.0 to VDDA3 - 0.5 VDDA3 = 2.3V to 3.0V (typ) V 1.0 to 2.5 VDDA3 > 3.0V (typ) SPST Switches (SNO_, SCM_) (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER Analog Signal Range On-Resistance SNO_ Off-Leakage Current SYMBOL CONDITIONS VSNOX, VSCMX RON ISNO_(OFF) TYP MAX 0 to UNITS V VDDA3 VDDA3 = 3.0V, ISCM_ = 50mA, VSNO_ = 0V to VDDA3 30 50 VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = +25 C (Note 5) 30 100 VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = +70C 60 VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = -40C to +85C www.maximintegrated.com MIN pA 1 nA Maxim Integrated 15 MAX32600 Wellness Measurement Microcontroller SPST Switches (SNO_, SCM_) (continued) (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SCM_ Off-Leakage Current SYMBOL ISCM_(OFF) CONDITIONS MIN TYP MAX VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = +25 C (Note 5) 30 100 VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = +70C 50 pA VDDA3 = 3.0V, VSCM_ = 0V, 2V VSNO_ = 2V, 0V TA = -40C to +85C SCM_ On-Leakage Current ISCM_(ON) UNITS 1 VDDA3 = 3.0V, VSCM_ = 0V, 2V TA = +25 C 0.8 VDDA3 = 3.0V, VSCM_ = 0V, 2V TA = 0C to +70C 1.2 VDDA3 = 3.0V, VSCM_ = 0V, 2V TA = -40C to +85C 2.0 VSCM_ = 2V, RL = 300, CL = 35pF nA nA Turn-On/Off Time tON/tOFF 1 ns Charge Injection Q VGEN = 0V, RGEN = 0, CL = 1.0nF (Note 5) 2 pC SNO_ Off-Capacitance CSNOx VSNO_ = AGND, f = 1MHz (Note 5) 2.5 pF Switch On-Capacitance CON VSCM_ = VSNO_, f = 1MHz (Note 5) 5.0 pF MAX UNITS CS Switches (CSA_, CSB_) (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER Output Low Voltage CSA_, CSB_ DC Current www.maximintegrated.com SYMBOL VOL ICSx CONDITIONS MIN TYP VCSBx = 500mV, ICSx = 35mA, VDDA3 > 2.3V 0.7 VCSBx = 350mV, ICSx = 50mA, VDDA3 > 2.5V 0.6 Maximum combined current for up to 4 CSA/CSB pairs (Note 5) V 100 mA Maxim Integrated 16 MAX32600 Wellness Measurement Microcontroller Temperature Sensor (VDDA3 = 2.3V to 3.6V, TA = -40C to +85C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INTERNAL TEMPERATURE SENSOR Temperature Resolution 0.11 C/LSB External voltage reference 3 C IAIN1P0 AinCurrentEn = 1 AinCurrentSel = 00 VAIN1P < (VDDA3 - 0.5V) 4 IAIN1P1 AinCurrentEn = 1 AinCurrentSel = 01 VAIN1P1 < (VDDA3 - 0.5V) 60 IAIN1P2 AinCurrentEn = 1 AinCurrentSel = 10 VAIN1P2 < (VDDA3 - 0.5V) 64 IAIN1P3 AinCurrentEn = 1 AinCurrentSel = 11 VAIN1P3 < (VDDA3 - 0.5V) 120 Internal Sensor Measurement Error EXTERNAL TEMPERATURE SENSOR Current Sourced onto AIN1P (Note 5) A Note 2: Specifications to -40C are guaranteed by design and are not production tested. Typical = 25C, VDD = 3V, unless otherwise specified. Note 3: FRCVDD is 1 when firmware forces all power to be sourced from main battery VDD rather than VBUS. Note 4: Measured on the VDD pin and the part not in reset. All inputs are tied to GND or VDD. Outputs do not source/sink any current. Execution from internal 24MHz relaxation oscillator, cache disabled, internal LDO disabled. Note 5: Guaranteed by design. Note 6: Initial startup of RTC from power up of MAX32600. This does not apply if RTC is running and changing power modes. Note 7: During consecutive samples, conversion time overlaps acquisition time. Note 8: AC electrical specifications are guaranteed by design and are not production tested. Note 9: 10kHz sine-wave input signal. Note 10: In order to perform ADC measurements, the internal reference must be turned on even when using external voltage reference. www.maximintegrated.com Maxim Integrated 17 MAX32600 Wellness Measurement Microcontroller Ball Configurations MAX32600-P85 12mm x 12mm CTBGA TOP VIEW 1 A 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VSSDAC SCM3 VSSDAC INC+ INC- OUTC VSSDAC INB+ INB- OUTB VSSDAC HFXOUT VSS P0.2 P0.5 P0.7 18 A B SCM2 VSSDAC SNO3 VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC HFXIN VSS P0.1 P0.4 P0.6 P1.0 B C SNO2 VSSDAC VSSDAC VSSDAC IND+ IND- OUTD VDDA3DAC INA+ INA- OUTA VSSDAC TAMPERO P0.0 P0.3 VSS P1.1 P1.2 C D SCM0 VSSDAC SCM1 P1.3 P1.4 P1.5 D E SNO0 VSSDAC SNO1 P2.0 P1.6 P1.7 E F VSSADC VSSADC VSSADC P2.1 P2.2 P2.3 F G AIN1+ VSSADC AIN0+ P2.4 P2.5 P2.6 G H AIN1- VSSADC AIN0- VDDA3REF REFADJ VSSUB VDDIO RSTN P3.0 P2.7 H J VSSADC VSSADC VSSADC REFDAC VSS VSS VDDIO VSS P3.2 P3.1 J K AIN3+ VSSADC AIN2+ REFADC VSS VSS VREG18 P3.5 P3.4 P3.3 K L AIN3- VSSADC AIN2- VSSREF VDDA3 VDD VREG18 P4.0 P3.7 P3.6 L M VSSADC VSSADC VDDA3ADC P4.3 P4.2 P4.1 M N AIN5+ VSSADC AIN4+ P4.6 P4.5 P4.4 N P AIN5- VSSADC AIN4- P5.1 P5.0 P4.7 P R VSSADC VSSADC VSSADC P5.4 P5.3 P5.2 R T AIN6+ VSSADC VSSADC VSSADC VADJ D- VBUS VDDB TCK TSEL TAMPERI P7.6 VSS P7.1 P6.6 VSS P5.6 P5.5 T U AIN6- VSSADC AIN7+ VSSADC VLCD2 D+ VSS 32KOUT SRSTN TDO TDI P7.5 P7.3 P7.0 P6.5 P6.3 P6.1 P5.7 U VSSADC AIN7- VSSADC VLCD1 VLCD VSS 32KIN VRTC TMS P7.7 P7.4 P7.2 P6.7 P6.4 P6.2 P6.0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 V 1 www.maximintegrated.com V 18 Maxim Integrated 18 MAX32600 Wellness Measurement Microcontroller Ball Configurations (continued) MAX32600-J85 7mm x 7mm CTBGA TOP VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 A SCM3 VSSUB SCM2 VDDA3DAC IND+ IND- OUTD VSSDAC INB+ INB- OUTB VDDIO_SW1 HFXOUT A B SNO3 VSSDAC SNO2 VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC VSS HFXIN B C VSSDAC VSSDAC VSSDAC VSSDAC INC+ INC- OUTC VSSDAC INA+ INA- OUTA VSS P1.0 C D SNO1 VSSDAC SCM0 TAMPERO RSTN P1.1 D E SCM1 VSSDAC SNO0 P1.2 P1.3 P1.4 E F REFDAC VDDA3REF REFADJ P1.5 P1.6 P1.7 F G VSSREF REFADC AIN1+ TCK TDO VDDIO_SW2 G H VDDA3ADC VSSADC AIN1- VSS TDI P2.0 H J AIN0+ VSSADC VSSADC P0.1 P0.0 P2.1 J K AIN0- VSSADC AIN2+ P0.5 P0.2 P2.2 K L VDDA3 VSSADC AIN2- VDD AIN4+ AIN4- VREG18 TAMPERI P0.7 P0.6 P0.4 P0.3 P2.3 L M AIN5+ VSSADC VBUS VDDB VSS VDDIO VSS VSS SRSTN TSEL TMS P2.4 P2.5 M N AIN5- VSSADC AIN3+ AIN3- VRTC D- D+ VSS 32KIN 32KOUT VSS P2.6 P2.7 N 1 2 3 4 5 6 7 8 9 10 11 12 13 www.maximintegrated.com Maxim Integrated 19 MAX32600 Wellness Measurement Microcontroller Bump Configuration MAX32600-W85 WLP (5.4mm x 4.3mm) TOP VIEW (BUMP SIDE DOWN) 1 2 3 4 5 6 7 8 9 10 11 12 A N.C. D+ D- VDD 32KIN 32KOUT TAMPERI P0.7 P0.5 P0.3 P0.1 N.C. A B VDDA3 VSS VBUS VDDB VRTC VREG18 TMS P0.6 P0.4 P0.2 P0.0 TDO B C AIN2- VDDA3ADC AIN3- AIN3+ VSSUB CFG VDDIO_ SRSTN VDDIO TCK TDI P2.7 C D AIN2+ VSSADC VSSADC VSSADC VSSADC SNO0 VSS SNO1 TSEL P2.6 P2.4 P2.5 D E VSSREF VSSADC AIN1+ AIN1- VSSADC SCM0 VSS SCM1 RSTN P2.0 P2.2 P2.3 E F REF ADC VSSADC VDDA3REF VSS VSS VSS VSS VSS VSS HFXIN P1.2 P2.1 F G REF DAC REFADJ VSS SNO3 SCM3 VSSDAC INA+ INA- VSS HFXOUT P1.3 P1.7 G H N.C. VSS VSSDAC VSSDAC VSSDAC VSSDAC VSSDAC OUTA TAMPERO P1.0 P1.5 P1.6 H J N.C. INC+/- OUTC VDDA3 OUTB INB+/- VSSDAC VREG18 VDDIO_ P1.1 P1.4 N.C. J 1 2 3 4 5 6 7 8 9 10 11 12 + www.maximintegrated.com DAC SW2 SW1 Maxim Integrated 20 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME FUNCTION CLOCK PINS V8 N9 A5 32KIN U8 N10 A6 32KOUT 32kHz Clock Input. Connect to 32kHz crystal. 32kHz Clock Output. Connect to 32kHz crystal. High-Frequency Crystal Input. Connect an external crystal or resonator between HFXIN and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is the input for an external high-frequency clock source when HFXOUT is shorted to ground. High-Frequency Crystal Output. Connect an external crystal or resonator between HFXIN and HFXOUT as the high-frequency system clock. To use an external high-frequency clock source as the system clock, connect HFXOUT to ground and apply clock source to HFXIN. B13 B13 F10 HFXIN A13 A13 G10 HFXOUT G3, H3 J1, K1 -- AIN0+, AIN0- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN0+ acts as input AIN0 and AIN0- acts as input AIN8. G1, H1 G3, H3 E3, E4 AIN1+, AIN1- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN1+ acts as input AIN1 and AIN1- acts as input AIN9. K3, L3 K3, L3 D1, C1 AIN2+, AIN2- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN2+ acts as input AIN2 and AIN2- acts as input AIN10. K1, L1 N3, N4 C4, C3 AIN3+, AIN3- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN3+ acts as input AIN3 and AIN3- acts as input AIN11. N3, P3 L5, L6 -- AIN4+, AIN4- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN4+ acts as input AIN4 and AIN4- acts as input AIN12. N1, P1 M1, N1 -- AIN5+, AIN5- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN5+ acts as input AIN5 and AIN5- acts as input AIN13. T1, U1 -- -- AIN6+, AIN6- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN6+ acts as input AIN6 and AIN6- acts as input AIN14. U3, V3 -- -- AIN7+, AIN7- Analog Input. This pair of analog inputs can function as two singleended inputs or one differential pair. In single-ended mode, AIN7+ acts as input AIN7 and AIN7- acts as input AIN15. ANALOG PINS www.maximintegrated.com Maxim Integrated 21 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME FUNCTION REFERENCE PINS K8 G2 F1 REFADC Internal ADC Reference Pin. If using the internal reference, this pin must be connected to ground through at least a 4.7F ceramic chip capacitor. In an external reference is used, it is input on this pin. H9 F3 G2 REFADJ If an external bandgap input is used to provide the basis for the internal ADC and DAC reference generation, it is input on this pin. J8 F1 G1 REFDAC Internal DAC Reference Pin. If using the internal reference, this pin must be connected to ground through at least a 4.7F ceramic chip capacitor. In an external reference is used, it is input on this pin. INA+ Op Amp A Positive Input Op Amp A Negative Input OP AMP/COMPARATOR PINS C9 C9 G7 C10 C10 G8 INA- C11 C11 H8 OUTA Op Amp A Output A9 A9 -- INB+ Op Amp B Positive Input A10 A10 -- INB- Op Amp B Negative Input -- -- J6 INB+/- Op Amp B Positive/Negative Input. INB+ and INB- are both bonded out to bump J6. A11 A11 J5 OUTB Op Amp B Output A5 C5 -- INC+ Op Amp C Positive Input A6 C6 -- INC- Op Amp C Negative Input -- -- J2 INC+/- Op Amp C Positive/Negative Input. INC+ and INC- are both bonded out to bump J2. A7 C7 J3 OUTC Op Amp C Output C5 A5 -- IND+ Op Amp D Positive Input C6 A6 -- IND- Op Amp D Negative Input C7 A7 -- OUTD U6 N7 A2 D+ USB D+ Signal. This bidirectional pin carries the positive differential data or single-ended data. Connect this pin to a USB "B" connector. This pin is weakly pulled high internally when the USB is disabled. T6 N6 A3 D- USB D- Signal. This bidirectional pin carries the negative differential data or single-ended data. Connect this pin to a USB "B" connector. This pin is weakly pulled high internally when the USB is disabled. T7 M3 B3 VBUS USB VBUS Supply Voltage. Connect VBUS to a positive 5.0V power supply. Bypass VBUS to ground with a 1.0F ceramic capacitor as close as possible to the VBUS pin. T8 M4 B4 VDDB 3.3V Regulated VBUS Output. This pin must be connected to ground with a 4.7F ceramic capacitor as close as possible to the VDDB pin. Op Amp D Output USB FUNCTION PINS www.maximintegrated.com Maxim Integrated 22 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME FUNCTION RESET PINS H16 D12 E9 RSTN U9 M9 C8 SRSTN ANALOG SPST SWITCHES Hardware Reset (Active Low) Input. Entire chip is reset (POR) except for RTC circuitry. Software Reset (Active Low) Input. Resets ARM core and digital peripherals/registers that are normally cleared by a system reset. Does not affect the RTC or POR-reset-only settings; does not reset the ARM debug engine or JTAG debugger state. After sampling SRSTN as a logic 0, SRSTN is driven low for 6 clock cycles. Additionally, SRSTN is driven low for at least 6 clock cycles due to a watchdog reset, firmware reboot, ARM reset request, ARM lockup, or power-fail event. D1 D3 E6 SCM0 Analog Switch 0 Common Terminal E1 E3 D6 SNO0 Analog Switch 0 Normally Open Terminal D3 E1 E8 SCM1 Analog Switch 1 Common Terminal E3 D1 D8 SNO1 Analog Switch 1 Normally Open Terminal B1 A3 -- SCM2 Analog Switch 2 Common Terminal C1 B3 -- SNO2 Analog Switch 2 Normally Open Terminal A3 A1 G5 SCM3 Analog Switch 3 Common Terminal B3 B1 G4 SNO3 Analog Switch 3 Normally Open Terminal TAMPER DETECTION PINS T11 L8 A7 Connect to TAMPERO through a PCB trace that is uninterrupted. Used by trust protection unit (TPU) to prevent external tampering of TAMPERI the system. If the TAMPERO signal is interrupted, TAMPERI causes a tamper event to the device. C13 D11 H9 Connect to TAMPERI through a PCB trace that is uninterrupted. Used TAMPERO by TPU to prevent external tampering of the system. If the TAMPERO signal is interrupted, TAMPERI causes a tamper event to the device. T9 G11 C10 TCK JTAG TCK Pin, Weak Pullup U11 H12 C11 TDI JTAG TDI Pin, Weak Pullup U10 G12 B12 TDO JTAG TDO Pin V10 M11 B7 TMS JTAG TMS Pin, Weak Pullup T10 M10 D9 TSEL JTAG TSEL Pin, Weak Pullup L4 A4 VDD Digital Supply Voltage. This pin must be connected to ground through at least a 4.7F external ceramic chip capacitor. JTAG PINS POWER PINS L10 www.maximintegrated.com Maxim Integrated 23 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME FUNCTION Regulator Capacitor. This pin must be connected to ground through at least a 1.0F external ceramic-chip capacitor. The capacitor must be placed as close to this pin as possible. No external devices other than the capacitor should be connected to this pin. Note: On the WLP package, the capacitor should be placed as close as possible to bump B6. K11, L11 L7 B6, J8 VREG18 V9 N5 B5 VRTC A14, B14, C16, B12, C12, H11, H2, G3, G9, J9, J10, J16, M5, M7, M8, F4-F9, E7, D7, K9, K10, T13, B2 N8, N11 T16, U7, V7 F1, F2, F3, G2, H2, J1, J2, J3, K2, L2, M1, H2, J2, J3, K2, M2, N2, P2, L2, M2, N2 R1, R2, R3, T2, T3, T4, U2, U4, V2, V4 VSS 3V Nominal Backup Supply Input Voltage. Connect to 3V nominal power supply. This pin must be connected to ground through a 1.0F external ceramic chip capacitor. Digital Ground D2-D5, E2, E5, F2 VSSADC ADC Ground A2, A4, A8, A12, B2, B4-B12, C2, C3, C4, C12, D2, E2 A8, B2, B4- B11, C1-C4, C8, D2, E2 G6, H3-H7, J7 VSSDAC DAC Ground L8 G1 E1 VSSREF Reference Ground H10 A2 C5 VSSUB Substrate Ground. Connect to VSS. L9 L1 B1 VDDA3 Analog Supply Voltage. This pin must be connected to ground through a 1.0F external ceramic chip capacitor. M3 H1 C2 VDD A3ADC ADC Analog Supply Voltage. This pin must be connected to ground through a 10F external ceramic chip capacitor. C8 A4 J4 VDD A3DAC DAC Analog Supply Voltage. This pin must be connected to ground through a 1.0F external ceramic chip capacitor. H8 F2 F3 VDD A3REF Analog Reference Supply Voltage. This pin must be connected to ground through a 1.0F external ceramic chip capacitor. H11, J11 M6 C9 VDDIO I/O Supply Voltage. This pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. VDDIO_ SW1 Switchable I/O Supply Voltage 1. Connect to either the VREG18 (1.8V) or VDDIO (3V) supply to set the I/O supply rail for ports P0 and P1. This pin must be connected to ground through at least at 1.0F external ceramic chip capacitor. Note: Port P6 and P7 are always powered from VDDIO. -- A12 www.maximintegrated.com J9 Maxim Integrated 24 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) -- NAME FUNCTION G13 C7 VDDIO_ SW2 Switchable I/O Supply Voltage 2. Connect to either the VREG18 (1.8V) or VDDIO (3V) supply to set the I/O supply rail for ports P2, P3, P4, and P5. This pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. Note: Port P6 and P7 are always powered from VDDIO. -- -- VLCD LCD Bias Control Voltage. Highest LCD drive voltage used with static bias. If using LCD functionality, this pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. VLCD1 LCD Bias Voltage 1. LCD drive voltage used with 1/2 and 1/3 LCD bias. An internal resistor-divider sets the voltage. External resistors and capacitors can be used to change the LCD voltage or drive capability at this pin. If using LCD functionality, this pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. VLCD2 LCD Bias Voltage 2. LCD drive voltage used with 1/3 LCD bias. An internal resistor-divider sets the voltage. External resistors and capacitors can be used to change LCD voltage or drive capability at this pin. If using LCD functionality, this pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. LCD PINS V6 V5 U5 T5 -- -- -- -- -- -- VADJ B11 P0.0 LCD Adjustment Voltage. Connect to an external resistor to provide external control of the LCD contrast. Leave disconnected for internal contrast adjustment. If using LCD functionality, this pin must be connected to ground through at least a 1.0F external ceramic chip capacitor. GENERAL-PURPOSE I/O C14 J12 B15 J11 A11 P0.1 A15 K12 B10 P0.2 C15 L12 A10 P0.3 B16 L11 B9 P0.4 A16 K11 A9 P0.5 B17 L10 B8 P0.6 A17 L9 A8 P0.7 www.maximintegrated.com General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. Maxim Integrated 25 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME H10 P1.0 B18 C13 C17 D13 J10 P1.1 C18 E11 F11 P1.2 D16 E12 G11 P1.3 D17 E13 J11 P1.4 D18 F11 H11 P1.5 E17 F12 H12 P1.6 E18 F13 G12 P1.7 E16 H13 E10 P2.0 F16 J13 F12 P2.1 F17 K13 E11 P2.2 F18 L13 E12 P2.3 G16 M12 D11 P2.4 G17 M13 D12 P2.5 G18 N12 D10 P2.6 H18 N13 C12 P2.7 H17 -- -- P3.0 J18 -- -- P3.1 J17 -- -- P3.2 K18 -- -- P3.3 K17 -- -- P3.4 K16 -- -- P3.5 L18 -- -- P3.6 L17 -- -- P3.7 L16 -- -- P4.0 M18 -- -- P4.1 M17 -- -- P4.2 M16 -- -- P4.3 N18 -- -- P4.4 N17 -- -- P4.5 N16 -- -- P4.6 P18 -- -- P4.7 www.maximintegrated.com FUNCTION General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. Maxim Integrated 26 MAX32600 Wellness Measurement Microcontroller Ball/Bump Descriptions (continued) BALL BUMP MAX32600-P85 MAX32600-J85 (192 BALL) (120 BALL) MAX32600-W85 (WLP) NAME P17 -- -- P5.0 P16 -- -- P5.1 R18 -- -- P5.2 R17 -- -- P5.3 R16 -- -- P5.4 T18 -- -- P5.5 T17 -- -- P5.6 U18 -- -- P5.7 V17 -- -- P6.0 U17 -- -- P6.1 V16 -- -- P6.2 U16 -- -- P6.3 V15 -- -- P6.4 U15 -- -- P6.5 T15 -- -- P6.6 V14 -- -- P6.7 U14 -- -- P7.0 T14 -- -- P7.1 FUNCTION General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. V13 -- -- P7.2 U13 -- -- P7.3 V12 -- -- P7.4 U12 -- -- P7.5 T12 -- -- P7.6 V11 -- -- P7.7 -- -- A1, A12, H1, J1, J12 N.C. Not Connected. Leave unconnected. -- -- C6 CFG Must Be Tied to VDDIO. www.maximintegrated.com General-Purpose, Digital, I/O and Alternate Functions. These port pins function as bidirectional I/O pins. All port pins default to highimpedance mode with weak pullups after a reset. All alternate functions must be enabled from software. Maxim Integrated 27 MAX32600 Wellness Measurement Microcontroller Functional Diagram SNO1 TEMP. SENSOR SNO3 SRSTN RSTN VRTC VDDIO VDDIO_SW1 VDDIO_SW1 VDD VDDA3 External Filtering VDDA3ADC VDDA3DAC VDDA3REF 16-Bit ADC AV = 1,2,4,8 M U X REFDAC M POWER ON RESET, BROWNOUT MONITOR, SUPPLY VOLTAGE MONITORS ARM CortexTM-M3 32-Bit CORE NVIC VDAC3 USB FULL SPEED TRANSCEIVER USB 2.0 FS CONTROLLER CRC & ID JTAG CLOCK GENERATOR DYNAMIC TAMPER SENSOR AES MAA TRNG INSTANT ERASE KEY INCIND+ OpAmp/Comparator D VDAC2 VDAC3 4 x 32-bit TIMER 2 x I2C MASTER I2C SLAVE 2 x UART 3 x SPI MASTER RTC & ALARMS TRUST PROTECTION UNIT Low Power Comp C VDAC1 VDAC3 SPECIAL FUNCTION MUXING 256KB FLASH OUTC SWA 96, 128, 160 SEGMENT LCD OUTD SWD Low Power Comp D IND- P7[0:7] EXTERNAL INTS, WAKEUP 2KB CACHE 2 x WATCHDOG TIMER OpAmp/Comparator C GPIO PULSE TRAIN LED DRIVE 32KB SRAM 3.3V USB LDO REG REFDAC INC+ VDAC0 DAC3 SW3 REFADJ VDAC2 REFADC 8-Bit DAC INBREFADC VDAC1 VDAC2 REF SW2 Low Power Comp B VDAC0 DAC2 VUSB VDDB TAMPERI TAMPERO REFADC 8-Bit DAC OUTB SWB 1.24V BANDGAP N REF M PERIPHERAL MANAGEMENT UNIT 32KIN 32KOUT HFXIN HFXOUT VDAC3 REFDAC OpAmp/Comparator B VDAC2 REF CORE LDO REG TSEL TCK TDI TMS TDO VDAC1 REFADC PGA INAINB+ VDAC1 12-Bit DAC OUTA SWA Low Power Comp A VDAC0 DAC1 VREG18 D+ D- REFADC REF M U X SNO2 SCM3 VDAC3 DAC0 M OpAmp/Comparator A VDAC2 VDAC0 REFDAC PROG. CURRENT AIN0+ AIN1+ 12-Bit DAC M to ADC SW1 AIN0+ AIN1+ AIN2+ AIN3+ AIN4+ AIN5+ AIN6+ AIN7+ AIN0-/AIN8+ AIN1-/AIN9+ AIN2-/AIN10+ AIN3-/AIN11+ AIN4-/AIN12+ AIN5-/AIN13+ AIN6-/AIN14+ AIN7-/AIN15+ SCM2 VDAC1 REF SW0 BUS MATRIX - AHB, APB, IBUS, DBUS... SCM0 SCM1 INA+ VDAC0 REFADC P6[0:7] SHARED PAD FUNCTIONS (PRIORITY MUXING) LCD COM LCD SEG LED DRIVE UART I2C SPI PULSE TRAIN, SQUARE WAVE, 32-BIT TIMERS GPIO EXTERNAL INTERRUPTS SUPPORTED ON ALL GPIO PINS P5[0:7] P4[0:7] P3[0:7] P2[0:7] P1[0:7] See MAX32600 User's Guide for details on the Special Functions and the Pin Configuration Matrix. REFDAC SNO0 P0[0:7] BIAS, MUX, & FRAME GENERATION VLCD VLCD[2:1] VADJ www.maximintegrated.com Maxim Integrated 28 MAX32600 Wellness Measurement Microcontroller Detailed Description 32-bit byte address data pointers for a maximum addressable 4GB memory space, shared by code memory, data memory, ARM core peripherals and device-specific peripherals Low-power, highly energy efficient core reduces power consumption Built-in debug functionality with JTAG port (connects to internal debug access port) Power-saving sleep and deep sleep modes with fast wake-up The MAX32600 microcontroller is based on the industrystandard ARM Cortex-M3 32-bit RISC core and includes 256KB of flash memory, 32KB of SRAM, and a 2KB 2-way set associative cache. The device includes three SPI master interfaces, two UARTs, two I2C master interfaces and one I2C slave interface, four 32-bit timers (each of which can be optionally split into dual 16-bit timers), a real-time clock (RTC) with three programmable alarms, dual independent windowed watchdog timers, and four supply voltage monitors with multiple user-selectable, low-voltage detection levels. For system security and integrity checking, a trust protection unit (TPU) is optionally available that includes all necessary features to secure communications and protect internal data and firmware. Integrated high-performance analog peripherals include a 16-bit ADC with input buffer, programmable gain amplifier, and a dual 8:1 differential (or 16:1 singleended) input mux, two 12-bit DACs, two 8-bit DACs, four operational amplifiers with comparator mode, four lowpower comparators, an internal temperature sensor, a high-precision internal programmable reference, and four SPST analog switches. A multichannel PMU (peripheral management unit) interface, with operation during run mode and low-power sleep mode, can be used to configure and transfer data to and from peripherals including the ADC, DACs, communications ports, USB, TPU, and the CRC hardware module. ARM Cortex-M3 Core The device is based on the ARM Cortex M3 32-bit RISC core, which implements the ARMv7-M architectural profile. The implementation of the Cortex M3 core used in the device is targeted for a maximum operating frequency of 24MHz and provides the following features: 32-bit data path with mixed 16-bit and 32-bit instructions (Thumb(R)-2 instruction set) Single-cycle multiplication and hardware-based division operations Nested vectored interrupt controller (NVIC) with multiple interrupt priority levels and nested interrupt support Interrupt Sources The devices include the ARM Nested Vector Interrupt Controller (NVIC) providing high-speed, deterministic response, interrupt masking, and multiple interrupt sources. Each peripheral is connected to the NVIC and can have multiple interrupt flags indicating the specific source of the interrupt within the peripheral. The device supports up to 64 distinct interrupt sources (including internal and external interrupts), with eight priority levels. Low Power Modes The MAX32600 has multiple operating modes with many user-configurable options offering significant flexibility in total power consumption. These options are stored in the data retention power domain registers and are continuously powered across all modes of operation. The registers dictate which analog and digital peripherals are intended to remain enabled during low power modes. Likewise, there are dedicated system registers that dictate the configuration of features during run modes. The MAX32600 supports four power modes: LP0: STOP, LP1: STANDBY, LP2: PMU,and LP3: RUN. The low power modes (LP0: STOP and LP1: STANDBY) are under the control of the Power Sequencer, while LP2: PMU is controlled by the PMU, and the LP3: RUN mode is controlled by the ARM core. The VRTC power pin (powered by battery or super cap) ensures that this domain is always on during battery change or other loss-of-power events on the main supply. Thumb is a registered trademark of ARM Ltd. www.maximintegrated.com Maxim Integrated 29 MAX32600 Wellness Measurement Microcontroller PMU Programmable prescaler for timer input clock External I/O pin option allows selectable input or output function for each timer instance using GPIO pin Output mode can be used for PWM output generation or timer rollover output Input mode can be used for timer input (counter mode), clock gating or capture, limited to an input frequency of one-fourth the peripheral clock frequency Timer interrupt The device's peripheral management unit (PMU) is a DMA-based linked list processing engine. The PMU can perform operations and data transfers involving memory and/or peripherals in the Advanced Peripheral Bus (APB) and Advanced High-performance Bus (AHB) peripheral memory space while the main CPU is in a sleep state. This allows low-overhead peripheral operations (for which intensive CPU resources are not required) to be performed without the CPU, significantly reducing overall power consumption. Additionally, for certain analog and digital operations, switching the CPU off and handling the operations using the PMU provides a lower-noise environment that is critical for obtaining optimum analogto-digital converter (ADC) and digital-to-analog converter (DAC) performance. CRC Module A CRC hardware module is included to provide fast calculations and data integrity checks by application software. The CRC module supports both the CRC-16CCITT and CRC-32 polynomials. The CRC-16 and CRC32 calculation engines operate independently in parallel; each CRC engine has a programmable start seed and can be used to calculate checksums of arbitrarily long data sequences. Data can be loaded either directly or using the PMU; the CRC-16-CCITT completes in two clock cycles and the CRC-32 completes in four clock cycles for each data input calculated. Watchdog Timers The device provides two independent watchdog timers (WDT) with window support. The watchdog timers are independent and have multiple clock source options to ensure system security. The watchdog uses a 32-bit timer with prescaler to generate the watchdog reset. When enabled, the watchdog timers must be fed prior to timeout or within a window of time if window mode is enabled. Failure to feed the watchdog timer during the programmed timing window results in a watchdog timeout. 32-Bit/16-Bit Timers The device includes four 32-bit timers that are usable for timing, capture/compare, or generation of pulsewidth modulated (PWM) signals. Each 32-bit timer can optionally be split into a pair of 16-bit timers. The capture/ compare, input/output, and PWM options are available on the 32-bit timers only. Features of the 32-bit timers include the following: 32-bit counter with one-shot and continuous autoreload modes www.maximintegrated.com Real-Time Clock A binary real-time clock (RTC) keeps the time of day in a 32-bit timer with resolution programmable from 244s to 1 second. With a 1-second tick frequency, the RTC can count up to 139 years before rolling over. Two time-ofday alarms can be used to trigger an interrupt or wake up the devices from low-power mode when the RTC timer reaches a specified value; a separate sub-second alarm can be set to trigger on a programmable subdivide of the RTC tick period. For example, with a 1-second RTC resolution, the sub-second alarm can be triggered every second, every 500ms, every 250ms, every 125ms, and so on down to a minimum of 244s. USB Device Controller The integrated USB controller is compliant with the USB 2.0 specification, providing full-speed operation as a USB peripheral device. Integrating the USB physical interface (PHY) allows direct connection to the USB cable, reducing board space and overall system cost. An integrated voltage regulator enables smart switching between the main supply and VBUS when connected to a USB host controller. The USB controller includes a dedicated DMA engine (separate from the PMU) that is used to transfer data to and from the endpoint buffers located in SRAM. A total of seven endpoint buffers are supported with configurable selection of IN or OUT, in addition to Endpoint 0, which is used for control purposes only. I2C Master/Slave Interfaces Two I2C master interfaces and one I2C slave interface are available for communication with a wide variety of other I2C-enabled peripherals. The I2C bus is a 2-wire, bidirectional bus using a ground line and two bus lines, the serial data line (SDA) and the serial clock line (SCL). Both the SDA and SCL lines must be driven as open-collector/ drain outputs. External resistors (RP) are required pull the lines to a logic-high state. Maxim Integrated 30 MAX32600 Wellness Measurement Microcontroller The device supports both the master and slave protocols. In the master mode, the interfaces have ownership of the I2C bus, drive the clock, and generate the START and STOP signals. This allows them to send data to a slave or receive data from a slave as required. In slave mode, the interfaces rely on an externally generated clock to drive SCL and respond to data and commands only when requested by the I2C master device. more expensive LCD module. Every character in an LCD glass is composed of one or more segments, each of which is activated by selecting the appropriate segment and common signal. SPI Master Interfaces The device has three SPI master interface ports. Each SPI controller provides an independent master-mode serial communication channel that communicates synchronously with peripheral SPI devices in a single or multiple slave system. The third SPI instance is intended for future Bluetooth module communication. The SPI controllers support half- or full-duplex communications with single, dual, or quad data transmission modes, and can be operated in master mode only. Multiple slave select lines are available with configurable polarity, and optional slave ready (SR) inputs can be used for hardware flow control for SPI devices that support this function. UART Interfaces The device has two serial communication interfaces. The universal asynchronous receiver-transmitter (UART) interface ports support full-duplex asynchronous communications. The two UARTs implemented on the devices are identical in behavior and can be configured independently. UART features include the following: The LCD controller can multiplex combinations of up to 40 segment outputs (SEG0 to SEG39) and four common signal outputs (COM0 to COM3). Unused segment outputs can be used as standard GPIO port pins. The segments are easily addressed by writing to dedicated display memory. Once the LCD controller settings and display memory have been initialized, the 21-byte display memory is periodically scanned, and the segment and common signals are generated automatically at the selected display frequency, with no additional CPU intervention required. The design is further simplified and cost reduced by the inclusion of software-adjustable internal voltage-dividers to control display contrast, using either VDDIO or an external voltage. If desired, contrast can also be controlled with an external resistor network. Features of the LCD controller include the following: Automatic LCD segment and common-drive signal generation Integrated boost regulator ensures LCD operation over entire digital operating range Flexible LCD clock source selection with adjustable frame frequency Internal voltage-divider resistors eliminate requirement for external components Internal adjustable resistor allows contrast adjustment without external components Four display modes are supported by the LCD controller: 2-wire interface Programmable transmit and receive interrupts Independent baud-rate generators Static (COM0) Programmable even/odd/no parity modes Programmable start/stop bit options 1/2 duty multiplexed with 1/2 bias voltages (COM[0:1]) Character lengths of 5/6/7/8 bits supported Optional hardware flow control (RTS/CTS) 1/3 duty multiplexed with 1/3 bias voltages (COM[0:2]) 1/4 duty multiplexed with 1/3 bias voltages (COM[0:3]) LCD Controller The 192-ball MAX32600 include an LCD controller with a boost regulator that interfaces directly to common lowvoltage liquid crystal displays. By integrating the LCD controller in hardware, the device allows designs that require only an LCD glass rather than a considerably www.maximintegrated.com The voltages available for driving the LCD are VLCD, VLCD x 2/3, VLCD x 1/3, and VADJ. The 1/2-bias mode, which uses an output level of VLCD x 1/2, requires two of the LCD voltage supply pins (VLCD2 and VLCD1) to be shunted together externally. Maxim Integrated 31 MAX32600 Wellness Measurement Microcontroller 16-Bit ADC with PGA 8-Bit Voltage Output DACs The front end PGA allows programmable gain settings of x1, x2, x4, and x8 before the input sample is converted. An anti-aliasing filter is included between the output of the PGA and the ADC sample conversion stage. Uncommitted Op Amps with Comparator Mode The devices include a 16-bit analog-to-digital converter (ADC) with a 16-channel analog input multiplexer, to allow selection of an analog input from one of 16 input lines (single-ended mode) or one pair of eight input pairs (differential mode). The differential mode supports fully differential signal inputs. The ADC reference voltage is selectable between VDDA3 and the dedicated ADC reference level. The ADC reference level can be set by software to one of four output levels--1.024V, 1.5V, 2.048V, and 2.5V--based on the 1.24V reference bandgap. ADC/DAC Internal/External Reference and Programmable Output Buffers Two programmable reference levels (one used by the ADC, one used by the DACs) are included, and each can be individually set to one of four output levels. An external reference can also be provided at the REFADJ pin; if this feature is used, the external reference voltage is used in place of the 1.24V bandgap output, and the programmable output levels for the ADC and DAC references shift accordingly. 12-Bit Voltage Output DACs The device includes two 12-bit voltage output DACs that output single-ended voltages. The reference used by these DACs is selectable between the DAC reference level and the ADC reference level. Each DAC instance includes PMU channel access to allow output values to be loaded to the DAC directly from memory. www.maximintegrated.com The device includes two 8-bit voltage output DACs that output single-ended voltages. The reference used by these DACs is selectable between the DAC reference level and the ADC reference level. Each DAC instance includes PMU channel access to allow output values to be loaded to the DAC directly from memory. The device contains four uncommitted operational amplifiers. Any unused op amp should be connected with its positive input pin grounded and the negative input pin and output pin shorted together. Each op amp can be switched between amplifier and comparator mode under software control. Each op amp contains an integrated internal switch that can be used to short the negative/inverting input pin to the output pin of the op amp under software control, putting the op amp in a voltage follower mode. In this configuration, the op amp can be used as an output buffer for any of the four DAC outputs. Any of the four DAC outputs may optionally be internally connected to the noninverting inputs of one or more of the four op amps, under software control. Uncommitted SPST Analog Switches The device contains four uncommitted SPST analog switches that can be opened and closed under software control. All SPST switches are open by default following any reset or power-on reset. The SPST switches support input voltages from ground to VDDA3. Temperature Sensor The device includes an internal temperature sensor that can be read using the ADC, and additionally supports a mode for an external temperature sensor, which is connected to the same ADC input pair. Maxim Integrated 32 MAX32600 Wellness Measurement Microcontroller Additional Benefits and Features Industry-Standard Core and Flexible Peripherals Enable Rapid Prototyping for Improved Time to Market * ARM Cortex-M3 32-Bit RISC Core Single-Cycle Multiplication Nested Vectored Interrupt Controller * Memory 256KB Flash Memory with 2KB Instruction Cache 32KB SRAM * Supply Voltage 1.8V to 3.6V Digital Supply Voltage 2.3V to 3.6V Analog Supply Voltage * Tool Chains Supported Include GNU, Eclipse, and IAR * Low Power Wakeup (LP0/LP1) RTC Timeout 244s Resolution Multiple Timer Wakeup Options All 64 GPIO Level Sensitive USB Power Detection * Peripheral Management Unit (PMU) PMU Services Peripherals While CPU is in Sleep Mode Saves Power when ARM Cortex-M3 Core is Inactive 6 PMU Channels, Each with Read/Write Access to All AHB and APB Devices * Digital and Communication Peripherals 4 x 32-Bit Timers, Configurable to 8 x 16-Bit 32-Bit Real-Time Clock with Subsecond Alarm and Two Time-of-Day Alarms Dedicated Backup Supply Pin and Trickle Charge Four Programmable Supply Voltage Detectors Power-On-Reset/Brownout Reset Two Programmable Windowed Watchdog Timers Three SPI Masters, Two UARTs, Two I2C Masters, and One I2C Slave Port Up to 64 GPIO Pins with External Interrupt and Wake from Low-Power Mode Support www.maximintegrated.com * USB Device Interface 2.0 Full-Speed Compliant USB Integrated Transceiver with Regulator, On-Chip Termination and Pullup Resistors 5V to 3.3V Regulation with Integrated Supply Management to Enable USB-Compliant Switching Dedicated USB DMA Engine Allows Automatic Transfer of Endpoint Data to/from SRAM * Pulse Train Engine with Eight Digital Output Channels and 5 Analog Control Outputs * Clock Sources 32kHz Crystal Oscillator for Accurate RTC External High-Frequency Crystal Oscillator PLL Generates 48MHz USB Clock (2x/4x/6x HFX) Internal 24MHz 1% Relaxation Oscillator * LCD Controller 96, 128, or 160 Segments 4 x 24, 4 x 32, 4 x 40 Static, 1/2, 1/3, and 1/4 Duty Cycle Boost Converter for 3.3V VLCD Operation Adjustment Resistor for Contrast Control Eliminates Requirement for External Components Maxim Integrated 33 MAX32600 Wellness Measurement Microcontroller Ordering Information Package Information PART TEMP RANGE PIN-PACKAGE MAX32600-P85A+ -40C to +85C 192 CTBGA MAX32600-P85B+ -40C to +85C 192 CTBGA MAX32600-J85A+ -40C to +85C 120 CTBGA MAX32600-J85B+ -40C to +85C 120 CTBGA MAX32600-W85A+ -40C to +85C 108 WLP MAX32600-W85B+ -40C to +85C 108 WLP +Denotes a lead(Pb)-free/RoHS-compliant package. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. LAND PACKAGE PACKAGE OUTLINE PATTERN TYPE CODE NO. NO. 192 CTBGA X19222+1C 21-0712 -- 120 CTBGA X12077+1C 21-0899 -- 108 WLP W1084A5+1 21-1075 -- Selector Table TRUST PROTECTION UNIT (TPU) LCD 16 x 1, 8 x 2 No 160-segment 12mm x 12mm CTBGA 16 x 1, 8 x 2 Yes 160-segment 12mm x 12mm CTBGA 12 x 1, 6 x 2 No No LCD 7mm x 7mm CTBGA 12 x 1, 6 x 2 Yes No LCD 7mm x 7mm CTBGA 32 6 x 1, 3 x 2 No No LCD 5.4mm x 4.3mm WLP 32 6 x 1, 3 x 2 Yes No LCD 5.4mm x 4.3mm WLP FLASH (KB) SRAM (KB) ADC CHANNELS MAX32600-P85A+ 256 32 MAX32600-P85B+ 256 32 MAX32600-J85A+ 256 32 MAX32600-J85B+ 256 32 MAX32600-W85A+ 256 MAX32600-W85B+ 256 PART PIN-PACKAGE Package/Feature Details 5.4mm x 4.3mm WLP 7mm x 7mm CTBGA 12mm x 12mm CTBGA LCD -- -- 160-segment GPIO (8-bit ports) 3 3 8 6 single/ 6 differential 12 single/ 6 differential 16 single/ 8 differential Internal only op amp 1 0 0 External input, external output op amp 2 0 0 Fully external op amp control 1 4 4 Two-pad switches 3 4 4 Shared-pad switches 1 0 0 FEATURE ADC inputs www.maximintegrated.com Maxim Integrated 34 MAX32600 Wellness Measurement Microcontroller Revision History REVISION NUMBER REVISION DATE PAGES CHANGED 0 6/14 Initial release 1 10/14 Added WLP package and updated specifications in the Electrical Characteristics table 2 11/14 Revised Benefits and Features section 3 12/14 Updated Simplified Functional Diagram, Electrical Characteristics table notes, Ball/Bump Descriptions, Detailed Description, and USB Device Controller sections, Package/Feature Details table, and replaced ball configurations 4 6/15 Replaced the Simplified Functional Diagram; updated the electrical characteristics tables; updated the SRSTN bump description; added the Low Power Modes and PMU sections; added LP0/LP1 information to Additional Benefits and Features section 5 7/15 Added Note 5 to two DC Characteristics parameters (No Missing Codes and Integral Nonlinearity) 6 2/16 Updated Package Thermal Characteristics, ADC/PGA Electrical Characteristics, Internal Voltage Reference Electrical Characteristics, Ball/Bump Description, Detailed Description, Low Power Modes, I2C Master/Slave Interfaces sections 7 6/17 Changed PRNG to TRNG DESCRIPTION -- 1-3, 5-7, 11-13, 15-24, 29, 30 1, 30 1-18, 20-34 1-17, 23, 29, 33 7 2, 8, 14, 21, 22, 27, 29, 30 1, 28 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated's website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. (c) 2017 Maxim Integrated Products, Inc. 35 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Maxim Integrated: MAX32600-KIT#