TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
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DApproximates Human Eye Response
DProgrammable Interrupt Function with
User-Defined Upper and Lower Threshold
Settings
D16-Bit Digital Output with SMBus (TSL2562)
at 100 kHz or I2C (TSL2563) Fast-Mode at
400 kHz
DProgrammable Analog Gain and Integration
Time Supporting 1,000,000-to-1 Dynamic
Range
DAutomatically Rejects 50/60-Hz Lighting
Ripple
DLow 2.5-V Input Voltage and 1.8-V Digital
Output
DLow Active Power (0.6 mW Typical) with
Power Down Mode
DRoHS Compliant
Description
The TSL2562 and TSL2563 are low-voltage
light-to-digital converters that transform light
intensity to a digital signal output capable of direct
I2C (TSL2563) or SMBus (TSL2562) interface.
Each device combines one broadband photo-
diode (visible plus infrared) and one infrared-re-
sponding photodiode on a single CMOS inte-
grated circuit capable of providing a near-photop-
ic response over an effective 20-bit dynamic
range (16-bit resolution). Two integrating ADCs
convert the photodiode currents to a digital output
that represents the irradiance measured on each
channel. This digital output can be input to a
microprocessor where illuminance (ambient light
level) in lux is derived using an empirical formula
to approximate the human eye response. The
TSL2562 device permits an SMB-Alert style
interrupt, and the TSL2563 device supports a
traditional level style interrupt that remains
asserted until the firmware clears it.
While useful for general purpose light sensing applications, the TSL2562/63 devices are designed particularly
for display panels (LCD, OLED, etc.) with the purpose of extending battery life and providing optimum viewing
in diverse lighting conditions. Display panel backlighting, which can account for up to 30 to 40 percent of total
platform power, can be automatically managed. Both devices are also ideal for controlling keyboard illumination
based upon ambient lighting conditions. Illuminance information can further be used to manage exposure
control in digital cameras. The TSL2562/63 devices are ideal in notebook/tablet PCs, LCD monitors, flat-panel
televisions, cell phones, and digital cameras. In addition, other applications include street light control, security
lighting, sunlight harvesting, machine vision, and automotive instrumentation clusters.
r
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) 673-0759
6 SDA
5 INT
4 SCL
PACKAGE T
6-LEAD TMB
(TOP VIEW)
VDD 1
ADDR SEL 2
GND 3
PACKAGE CS
6-LEAD CHIPSCALE
(TOP VIEW)
VDD 1
ADDR SEL 2
GND 3
6 SDA
5 INT
4 SCL
Package Drawings are Not to Scale
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
6 SDA
5 INT
4 SCL
VDD 1
ADDR SEL 2
GND 3
PACKAGE CL
6-LEAD ChipLED
(TOP VIEW)
4 SCL
3 ADDR SEL
2 GND
SDA 5
INT 6
VDD 1
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Functional Block Diagram
Two-Wire Serial Interface
Address Select Interrupt
SDA
VDD = 2.4 V to 2.6 V
Channel 0
Visible and IR
Channel 1
IR Only
Command
Register
ADC
Register INT
SCL
ADDR SEL
Integrating
A/D Converter
Detailed Description
The TSL2562 and TSL2563 are second-generation ambient light sensor devices. Each contains two integrating
analog-to-digital converters (ADC) that integrate currents from two photodiodes. Integration of both channels
occurs simultaneously. Upon completion of the conversion cycle, the conversion result is transferred to the
Channel 0 and Channel 1 data registers, respectively. The transfers are double-buffered to ensure that the
integrity of the data is maintained. After the transfer, the device automatically begins the next integration cycle.
Communication to the device is accomplished through a standard, two-wire SMBus or I2C serial bus.
Consequently, the TSL256x device can be easily connected to a microcontroller or embedded controller. No
external circuitry is required for signal conditioning, thereby saving PCB real estate as well. Since the output
of the TSL256x device is digital, the output is effectively immune to noise when compared to an analog signal.
The TSL256x devices also support an interrupt feature that simplifies and improves system efficiency by
eliminating the need to poll a sensor for a light intensity value. The primary purpose of the interrupt function is
to detect a meaningful change in light intensity. The concept of a meaningful change can be defined by the user
both in terms of light intensity and time, or persistence, of that change in intensity. The TSL256x devices have
the ability to define a threshold above and below the current light level. An interrupt is generated when the value
of a conversion exceeds either of these limits.
Available Options
DEVICE INTERFACE PACKAGE − LEADS PACKAGE DESIGNATOR ORDERING NUMBER
TSL2562 SMBus Chipscale CS TSL2562CS
TSL2562 SMBus TMB-6 T TSL2562T
TSL2562 SMBus Dual Flat No-Lead − 6 FN TSL2562FN
TSL2562 SMBus ChipLED-6 CL TSL2562CL
TSL2563 I2C Chipscale CS TSL2563CS
TSL2563 I2C TMB-6 T TSL2563T
TSL2563 I2CDual Flat No-Lead − 6 FN TSL2563FN
TSL2563 I2C ChipLED-6 CL TSL2563CL
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Terminal Functions
TERMINAL
NAME
CS, T, FN
PKG
NO.
CL
PKG
NO.
TYPE DESCRIPTION
ADDR SEL 2 3 I SMBus device select — three-state
GND 3 2 Power supply ground. All voltages are referenced to GND.
INT 5 6 O Level or SMB Alert interrupt — open drain.
SCL 4 4 I SMBus serial clock input terminal — clock signal for SMBus serial data.
SDA 6 5 I/O SMBus serial data I/O terminal — serial data I/O for SMBus.
VDD 1 1 Supply voltage.
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) 3.8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output voltage range, VO −0.5 V to 3.8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output current, IO −1 mA to 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD tolerance, human body model 2000 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage, VDD 2.38 2.5 3 V
Operating free-air temperature, TA−30 70 °C
SCL, SDA input low voltage, VIL −0.5 0.58 V
SCL SDA input high voltage V
2.38 ≤ VDD ≤ 2.62 1.13 3.6 V
SCL, SDA input high voltage, VIH 2.38 ≤ VDD ≤ 3 1.25 3.6 V
Electrical Characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
Supply current
Active 0.24 0.6 mA
IDD Supply current Power down 3.2 15 μA
V
INT SDA output low voltage
3 mA sink current 00.4 V
VOL INT, SDA output low voltage 6 mA sink current 00.6 V
ILEAK Leakage current −5 5 μA
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Operating Characteristics, High Gain (16), VDD = 2.5 V, TA = 25C, (unless otherwise noted) (see
Notes 2, 3, 4, 5)
PARAMETER TEST CONDITIONS CHANNEL
TSL2562T, FN, & CL
TSL2563T, FN, & CL TSL2562CS, TSL2563CS UNIT
PARAMETER
TEST
CONDITIONS
CHANNEL
MIN TYP MAX MIN TYP MAX
UNIT
fosc Oscillator frequency 690 735 780 690 735 780 kHz
Dark ADC count value
E0T 402 ms
Ch0 0 4 0 4
counts
Dark ADC count value Ee = 0, Tint = 402 ms Ch1 0 4 0 4 counts
T 178 ms
Ch0 65535 65535
Tint > 178 ms Ch1 65535 65535
Full scale ADC count
T 101 ms
Ch0 37177 37177
counts
Full
scale
ADC
count
value (Note 6) Tint = 101 ms Ch1 37177 37177 counts
T 13 7 ms
Ch0 5047 5047
Tint = 13.7 ms Ch1 5047 5047
λ
p
= 640 nm, Tin
t
= 101 ms Ch0 750 1000 1250
λp
=
640
nm
,
Tint
=
101
ms
Ee = 36.3 μW/cm2Ch1 200
counts
λ
p
= 940 nm, Tin
t
= 101 ms Ch0 700 1000 1300 counts
ADC count value
λp
=
940
nm
,
Tint
=
101
ms
Ee = 119 μW/cm2Ch1 820
ADC count value λ
p
= 640 nm, Tin
t
= 101 ms Ch0 750 1000 1250
λp
=
640
nm
,
Tint
=
101
ms
Ee = 41 μW/cm2Ch1 190
counts
λ
p
= 940 nm, Tin
t
= 101 ms Ch0 700 1000 1300 counts
λp
=
940
nm
,
Tint
=
101
ms
Ee = 135 μW/cm2Ch1 850
ADC t l ti
λ640 nm T 101 ms
015
020
025
014
019
024
ADC count value ratio: λ
p
= 640 nm, Tint = 101 ms 0.15 0.20 0.25 0.14 0.19 0.24
ADC
count
value
ratio:
Ch1/Ch0
λ940 nm T 101 ms
069
082
095
070
085
1
Ch1/Ch0
λ
p
= 940 nm, Tint = 101 ms 0.69 0.82 0.95 0.70 0.85 1
λ640 nm T 101 ms
Ch0 27.5 24.4
R
Irradiance responsivity
λp = 640 nm, Tint = 101 ms Ch1 5.5 4.6 counts/
(μW/
ReIrradiance responsivity
λ940 nm T 101 ms
Ch0 8.4 7.4 (μW/
c
m2
)
λp = 940 nm, Tint = 101 ms Ch1 6.9 6.3
cm2)
Fluorescent li
g
ht source: Ch0 36 35
R
Illuminance responsivity
Fluorescent
light
source:
Tint = 402 ms Ch1 4 3.8 counts/
RvIlluminance responsivity
Incandescent li
g
ht source: Ch0 144 129
counts/
lux
Incandescent
light
source:
Tint = 402 ms Ch1 72 67
ADC count value ratio:
Fluorescent light source:
Tint = 402 ms 0.11 0.11
ADC
count
value
ratio:
Ch1/Ch0 Incandescent li
g
ht source:
05
052
Ch1/Ch0
Incandescent
light
source:
Tint = 402 ms 0.5 0.52
Fluorescent li
g
ht source: Ch0 2.3 2.2
R
Illuminance responsivit
y
,
Fluorescent
light
source:
Tint = 402 ms Ch1 0.25 0.24 counts/
Rv
Illuminance
responsivity
,
low gain mode (Note 7) Incandescent li
g
ht source: Ch0 9 8.1
counts/
lux
Incandescent
light
source:
Tint = 402 ms Ch1 4.5 4.2
(Sensor Lux) /
(actual Lux) high gain
Fluorescent light source:
Tint = 402 ms 0.65 1 1.35 0.65 1 1.35
(actual Lux), high gain
mode (Note 8) Incandescent light source:
Tint = 402 ms 0.60 1 1.40 0.60 1 1.40
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NOTES: 2. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs
and infrared 940 nm LEDs are used for final product testing for compatibility with high-volume production.
3. The 640 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength
λp = 640 nm and spectral halfwidth Δλ½ = 17 nm.
4. The 940 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength
λp = 940 nm and spectral halfwidth Δλ½ = 40 nm.
5. Integration time Tint, is dependent on internal oscillator frequency (fosc) and on the integration field value in the timing register as
described in the Register Set section. For nominal fosc = 735 kHz, nominal Tint = (number of clock cycles)/fosc.
Field value 00: Tint = (11 × 918)/fosc = 13.7 ms
Field value 01: Tint = (81 × 918)/fosc = 101 ms
Field value 10: Tint = (322 × 918)/fosc = 402 ms
Scaling between integration times vary proportionally as follows: 11/322 = 0.034 (field value 00), 81/322 = 0.252 (field value 01),
and 322/322 = 1 (field value 10).
6. Full scale ADC count value is limited by the fact that there is a maximum of one count per two oscillator frequency periods and also
by a 2-count offset.
Full scale ADC count value = ((number of clock cycles)/2 − 2)
Field value 00: Full scale ADC count value = ((11 × 918)/2 − 2) = 5047
Field value 01: Full scale ADC count value = ((81 × 918)/2 − 2) = 37177
Field value 10: Full scale ADC count value = 65535, which is limited by 16 bit register. This full scale ADC count value is reached
for 131074 clock cycles, which occurs for Tint = 178 ms for nominal fosc = 735 kHz.
7. Low gain mode has 16 lower gain than high gain mode: (1/16 = 0.0625).
8. The sensor Lux is calculated using the empirical formula shown on p. 22 of this data sheet based on measured Ch0 and Ch1 ADC
count values for the light source specified. Actual Lux is obtained with a commercial luxmeter. The range of the (sensor Lux) / (actual
Lux) ratio is estimated based on the variation of the 640 nm and 940 nm optical parameters. Devices are not 100% tested with
fluorescent or incandescent light sources.
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AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER†TEST CONDITIONS MIN TYP MAX UNIT
t(CONV) Conversion time 12 100 400 ms
f
Clock frequency (I2C only) 0 400 kHz
f(SCL) Clock frequency (SMBus only) 10 100 kHz
t(BUF) Bus free time between start and stop condition 1.3 μs
t(HDSTA)
Hold time after (repeated) start condition. After
this period, the first clock is generated. 0.6 μs
t(SUSTA) Repeated start condition setup time 0.6 μs
t(SUSTO) Stop condition setup time 0.6 μs
t(HDDAT) Data hold time 0 0.9 μs
t(SUDAT) Data setup time 100 ns
t(LOW) SCL clock low period 1.3 μs
t(HIGH) SCL clock high period 0.6 μs
t(TIMEOUT) Detect clock/data low timeout (SMBus only) 25 35 ms
tFClock/data fall time 300 ns
tRClock/data rise time 300 ns
CiInput pin capacitance 10 pF
†Specified by design and characterization; not production tested.
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PARAMETER MEASUREMENT INFORMATION
SDA
SCL
StopStart
SCLACK
t(LOWMEXT) t(LOWMEXT)
t(LOWSEXT)
SCLACK
t(LOWMEXT)
Start
Condition
Stop
Condition
P
SDA
t(SUSTO)
t(SUDAT)
t(HDDAT)
t(BUF)
VIH
VIL
SCL
t(SUSTA)
t(HIGH)
t(F)
t(R)
t(HDSTA)
t(LOW)
VIH
VIL
PSS
Figure 1. Timing Diagrams
A0A1A2A3A4A5A6
SCL
Start by
Master
SDA
1919
D1D2D3D4D5D6D7 D0R/W
Frame 1 SMBus Slave Address Byte Frame 2 Command Byte
ACK by
TSL256x
Stop by
Master
ACK by
TSL256x
Figure 2. Example Timing Diagram for SMBus Send Byte Format
A0A1A2A3A4A5A6
SCL
Start by
Master
SDA
1919
D1D2D3D4D5D6D7 D0R/W
Frame 1 SMBus Slave Address Byte Frame 2 Data Byte From TSL256x
ACK by
TSL256x
Stop by
Master
NACK by
Master
Figure 3. Example Timing Diagram for SMBus Receive Byte Format
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TYPICAL CHARACTERISTICS
Figure 4
SPECTRAL RESPONSIVITY
λ − Wavelength − nm
0
400
0.2
0.4
0.6
0.8
1
500 600 700 800 900 1000 1100
Normalized Responsivity
300
Channel 1
Photodiode
Channel 0
Photodiode
Figure 5
NORMALIZED RESPONSIVITY
vs.
ANGULAR DISPLACEMENT — CS PACKAGE
− Angular Displacement − °
Normalized Responsivity
0
0.2
0.4
0.6
0.8
1.0
−90 −60 −30 0 30 60 90
Optical Axis
Figure 6
NORMALIZED RESPONSIVITY
vs.
ANGULAR DISPLACEMENT — T PACKAGE
− Angular Displacement − °
Normalized Responsivity
0
0.2
0.4
0.6
0.8
1.0
−90 −60 −30 0 30 60 90
Optical Axis
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Figure 7
NORMALIZED RESPONSIVITY
vs.
ANGULAR DISPLACEMENT — FN PACKAGE
− Angular Displacement − °
Normalized Responsivity
0
0.2
0.4
0.6
0.8
1.0
−90 −60 −30 0 30 60 90
Optical Axis
Figure 8
NORMALIZED RESPONSIVITY
vs.
ANGULAR DISPLACEMENT — CL PACKAGE
− Angular Displacement − °
Normalized Responsivity
0
0.2
0.4
0.6
0.8
1.0
−90 −60 −30 0 30 60 90
Optical Axis
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PRINCIPLES OF OPERATION
Analog-to-Digital Converter
The TSL256x contains two integrating analog-to-digital converters (ADC) that integrate the currents from the
channel 0 and channel 1 photodiodes. Integration of both channels occurs simultaneously, and upon completion
of the conversion cycle the conversion result is transferred to the channel 0 and channel 1 data registers,
respectively. The transfers are double buffered to ensure that invalid data is not read during the transfer. After
the transfer, the device automatically begins the next integration cycle.
Digital Interface
Interface and control of the TSL256x is accomplished through a two-wire serial interface to a set of registers
that provide access to device control functions and output data. The serial interface is compatible with System
Management Bus (SMBus) versions 1.1 and 2.0, and I2C bus Fast-Mode. The TSL256x offers three slave
addresses that are selectable via an external pin (ADDR SEL). The slave address options are shown in Table 1.
Table 1. Slave Address Selection
ADDR SEL TERMINAL LEVEL SLAVE ADDRESS SMB ALERT ADDRESS
GND 0101001 0001100
Float 0111001 0001100
VDD 1001001 0001100
NOTE: The Slave and SMB Alert Addresses are 7 bits. Please note the SMBus and I2C protocols on pages 9 through 12. A read/write bit should
be appended to the slave address by the master device to properly communicate with the TSL256X device.
SMBus and I2C Protocols
Each Send and Write protocol is, essentially, a series of bytes. A byte sent to the TSL256x with the most
significant bit (MSB) equal to 1 will be interpreted as a COMMAND byte. The lower four bits of the COMMAND
byte form the register select address (see Table 2), which is used to select the destination for the subsequent
byte(s) received. The TSL256x responds to any Receive Byte requests with the contents of the register
specified by the stored register select address.
The TSL256X implements the following protocols of the SMB 2.0 specification:
DSend Byte Protocol
DReceive Byte Protocol
DWrite Byte Protocol
DWrite Word Protocol
DRead Word Protocol
DBlock Write Protocol
DBlock Read Protocol
The TSL256X implements the following protocols of the Philips Semiconductor I2C specification:
DI2C Write Protocol
DI2C Read (Combined Format) Protocol
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When an SMBus Block Write or Block Read is initiated (see description of COMMAND Register), the byte
following the COMMAND byte is ignored but is a requirement of the SMBus specification. This field contains
the byte count (i.e. the number of bytes to be transferred). The TSL2562 (SMBus) device ignores this field and
extracts this information by counting the actual number of bytes transferred before the Stop condition is
detected.
When an I2C Write or I2C Read (Combined Format) is initiated, the byte count is also ignored but follows the
SMBus protocol specification. Data bytes continue to be transferred from the TSL2563 (I2C) device to Master
until a NACK is sent by the Master.
The data formats supported by the TSL2562 and TSL2563 devices are:
DMaster transmitter transmits to slave receiver (SMBus and I2C):
− The transfer direction in this case is not changed.
DMaster reads slave immediately after the first byte (SMBus only):
− At the moment of the first acknowledgment (provided by the slave receiver) the master transmitter
becomes a master receiver and the slave receiver becomes a slave transmitter.
DCombined format (SMBus and I2C):
− During a change of direction within a transfer, the master repeats both a START condition and the slave
address but with the R/W bit reversed. In this case, the master receiver terminates the transfer by
generating a NACK on the last byte of the transfer and a STOP condition.
For a complete description of SMBus protocols, please review the SMBus Specification at
http://www.smbus.org/specs. For a complete description of I2C protocols, please review the I2C Specification
at http://www.semiconductors.philips.com.
Wr
7
Data ByteSlave AddressS
1
APA
811 11
XX
AAcknowledge (this bit position may be 0 for an ACK or 1 for a NACK)
PStop Condition
Rd Read (bit value of 1)
SStart Condition
Sr Repeated Start Condition
Wr Write (bit value of 0)
XShown under a field indicates that that field is required to have a value of X
... Continuation of protocol
Master-to-Slave
Slave-to-Master
Figure 9. SMBus and I2C Packet Protocol Element Key
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Data ByteSlave AddressS
1
APA
811 11
Figure 10. SMBus Send Byte Protocol
Rd
7
Data ByteSlave AddressS
1
APA
811 11
1
Figure 11. SMBus Receive Byte Protocol
Wr
7
Data ByteSlave AddressS
1
AAA
811 1 8
Command Code
1
P
1
Figure 12. SMBus Write Byte Protocol
Wr
7
Data Byte LowSlave AddressS
1
A A
811 1
Command Code
1
P
811
RdSlave AddressS A A
7 1 1
1
Figure 13. SMBus Read Byte Protocol
Wr
7
Data Byte LowSlave AddressS
1
AAA
811 1 8
Command Code
1
PData Byte High A
811
Figure 14. SMBus Write Word Protocol
Wr
7
Data Byte LowSlave AddressS
1
A A
811 1
Command Code
1
PData Byte High A
811
RdSlave AddressS A A ...
7 1
811
1
Figure 15. SMBus Read Word Protocol
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8
Data Byte 1Slave AddressS
1
A A
811 1
Command Code
P
Data Byte N A
811
Byte Count = N A A ...
7
811
Data Byte 2 A
81
...
Figure 16. SMBus Block Write or I2C Write Protocols
NOTE: The I2C write protocol does not use the Byte Count packet, and the Master will continue sending Data Bytes until the Master initiates a
Stop condition. See the Command Register on page 13 for additional information regarding the Block Read/Write protocol.
Wr
7
Byte Count = NSlave AddressS
1
A A
811 1
Command Code
PData Byte N A
811
Slave Address A A ...
7
811
Data Byte 2 A
81
...
Data Byte 1 A
81
1
Sr
1
Rd
1
Figure 17. SMBus Block Read or I2C Read (Combined Format) Protocols
NOTE: The I2C read protocol does not use the Byte Count packet, and the Master will continue receiving Data Bytes until the Master initiates
a Stop Condition. See the Command Register on page 13 for additional information regarding the Block Read/Write protocol.
Register Set
The TSL256x is controlled and monitored by sixteen registers (three are reserved) and a command register
accessed through the serial interface. These registers provide for a variety of control functions and can be read
to determine results of the ADC conversions. The register set is summarized in Table 2.
Table 2. Register Address
ADDRESS RESISTER NAME REGISTER FUNCTION
−− COMMAND Specifies register address
0h CONTROL Control of basic functions
1h TIMING Integration time/gain control
2h THRESHLOWLOW Low byte of low interrupt threshold
3h THRESHLOWHIGH High byte of low interrupt threshold
4h THRESHHIGHLOW Low byte of high interrupt threshold
5h THRESHHIGHHIGH High byte of high interrupt threshold
6h INTERRUPT Interrupt control
7h −− Reserved
8h CRC Factory test — not a user register
9h −− Reserved
Ah ID Part number/ Rev ID
Bh −− Reserved
Ch DATA0LOW Low byte of ADC channel 0
Dh DATA0HIGH High byte of ADC channel 0
Eh DATA1LOW Low byte of ADC channel 1
Fh DATA1HIGH High byte of ADC channel 1
The mechanics of accessing a specific register depends on the specific SMB protocol used. Refer to the section
on SMBus protocols. In general, the COMMAND register is written first to specify the specific control/status
register for following read/write operations.
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Command Register
The command register specifies the address of the target register for subsequent read and write operations.
The Send Byte protocol is used to configure the COMMAND register. The command register contains eight bits
as described in Table 3. The command register defaults to 00h at power on.
Table 3. Command Register
6754
ADDRESS
2310
0000 0000Reset Value:
COMMAND
CLEARCMD WORD BLOCK
FIELD BIT DESCRIPTION
CMD 7 Select command register. Must write as 1.
CLEAR 6 Interrupt clear. Clears any pending interrupt. This bit is a write-one-to-clear bit. It is self clearing.
WORD 5 SMB Write/Read Word Protocol. 1 indicates that this SMB transaction is using either the SMB Write Word or
Read Word protocol.
BLOCK 4 Block Write/Read Protocol. 1 indicates that this transaction is using either the Block Write or the Block Read
protocol. See Note below.
ADDRESS 3:0 Register Address. This field selects the specific control or status register for following write and read
commands according to Table 2.
NOTE: An I2C block transaction will continue until the Master sends a stop condition. See Figure 16 and Figure 17. Unlike the I2C protocol, the
SMBus read/write protocol requires a Byte Count. All four ADC Channel Data Registers (Ch through Fh) can be read simultaneously in
a single SMBus transaction. This is the only 32-bit data block supported by the TSL2562 SMBus protocol. The BLOCK bit must be set
to 1, and a read condition should be initiated with a COMMAND CODE of 9Bh. By using a COMMAND CODE of 9Bh during an SMBus
Block Read Protocol, the TSL2562 device will automatically insert the appropriate Byte Count (Byte Count = 4) as illustrated in Figure 17.
A write condition should not be used in conjunction with the Bh register.
Control Register (0h)
The CONTROL register contains two bits and is primarily used to power the TSL256x device up and down as
shown in Table 4.
Table 4. Control Register
6754
POWER
2310
0000 0000Reset Value:
CONTROL
ResvResv ResvResv Resv Resv
0h
FIELD BIT DESCRIPTION
Resv 7:2 Reserved. Write as 0.
POWER 1:0
Power up/power down. By writing a 03h to this register, the device is powered up. By writing a 00h to this
register, the device is powered down.
NOTE: If a value of 03h is written, the value returned during a read cycle will be 03h. This feature can be
used to verify that the device is communicating properly.
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Timing Register (1h)
The TIMING register controls both the integration time and the gain of the ADC channels. A common set of
control bits is provided that controls both ADC channels. The TIMING register defaults to 02h at power on.
Table 5. Timing Register
6754
INTEG
2310
0000 0010Reset Value:
TIMING
ManualResvResv GAIN ResvResv1h
FIELD BIT DESCRIPTION
Resv 7−5 Reserved. Write as 0.
GAIN 4 Switches gain between low gain and high gain modes. Writing a 0 selects low gain (1×); writing a 1 selects
high gain (16×).
Manual 3 Manual timing control. Writing a 1 begins an integration cycle. Writing a 0 stops an integration cycle.
NOTE: This field only has meaning when INTEG = 11. It is ignored at all other times.
Resv 2 Reserved. Write as 0.
INTEG 1:0 Integrate time. This field selects the integration time for each conversion.
Integration time is dependent on the INTEG FIELD VALUE and the internal clock frequency. Nominal integration
times and respective scaling between integration times scale proportionally as shown in Table 6. See Note 5
and Note 6 on page 5 for detailed information regarding how the scale values were obtained; see page 22 for
further information on how to calculate lux.
Table 6. Integration Time
INTEG FIELD VALUE SCALE NOMINAL INTEGRATION TIME
00 0.034 13.7 ms
01 0.252 101 ms
10 1 402 ms
11 −− N/A
The manual timing control feature is used to manually start and stop the integration time period. If a particular
integration time period is required that is not listed in Table 6, then this feature can be used. For example, the
manual timing control can be used to synchronize the TSL256x device with an external light source (e.g. LED).
A start command to begin integration can be initiated by writing a 1 to this bit field. Correspondingly, the
integration can be stopped by simply writing a 0 to the same bit field.
Interrupt Threshold Register (2h − 5h)
The interrupt threshold registers store the values to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by channel 0 crosses below or is equal to the low
threshold specified, an interrupt is asserted on the interrupt pin. If the value generated by channel 0 crosses
above the high threshold specified, an interrupt is asserted on the interrupt pin. Registers THRESHLOWLOW
and THRESHLOWHIGH provide the low byte and high byte, respectively, of the lower interrupt threshold.
Registers THRESHHIGHLOW and THRESHHIGHHIGH provide the low and high bytes, respectively, of the
upper interrupt threshold. The high and low bytes from each set of registers are combined to form a 16-bit
threshold value. The interrupt threshold registers default to 00h on power up.
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Table 7. Interrupt Threshold Register
REGISTER ADDRESS BITS DESCRIPTION
THRESHLOWLOW 2h 7:0 ADC channel 0 lower byte of the low threshold
THRESHLOWHIGH 3h 7:0 ADC channel 0 upper byte of the low threshold
THRESHHIGHLOW 4h 7:0 ADC channel 0 lower byte of the high threshold
THRESHHIGHHIGH 5h 7:0 ADC channel 0 upper byte of the high threshold
NOTE: Since two 8-bit values are combined for a single 16-bit value for each of the high and low interrupt thresholds, the Send Byte protocol should
not be used to write to these registers. Any values transferred by the Send Byte protocol with the MSB set would be interpreted as the
COMMAND field and stored as an address for subsequent read/write operations and not as the interrupt threshold information as desired.
The Write Word protocol should be used to write byte-paired registers. For example, the THRESHLOWLOW and THRESHLOWHIGH
registers (as well as the THRESHHIGHLOW and THRESHHIGHHIGH registers) can be written together to set the 16-bit ADC value in
a single transaction.
Interrupt Control Register (6h)
The INTERRUPT register controls the extensive interrupt capabilities of the TSL256x. The TSL256x permits
both SMB-Alert style interrupts as well as traditional level-style interrupts. The interrupt persist bit field
(PERSIST) provides control over when interrupts occur. A value of 0 causes an interrupt to occur after every
integration cycle regardless of the threshold settings. A value of 1 results in an interrupt after one integration
time period outside the threshold window. A value of N (where N is 2 through15) results in an interrupt only if
the value remains outside the threshold window for N consecutive integration cycles. For example, if N is equal
to 10 and the integration time is 402 ms, then the total time is approximately 4 seconds.
When a level Interrupt is selected, an interrupt is generated whenever the last conversion results in a value
outside of the programmed threshold window. The interrupt is active-low and remains asserted until cleared by
writing the COMMAND register with the CLEAR bit set.
In SMBAlert mode, the interrupt is similar to the traditional level style and the interrupt line is asserted low. To
clear the interrupt, the host responds to the SMBAlert by performing a modified Receive Byte operation, in which
the Alert Response Address (ARA) is placed in the slave address field, and the TSL256x that generated the
interrupt responds by returning its own address in the seven most significant bits of the receive data byte. If more
than one device connected on the bus has pulled the SMBAlert line low, the highest priority (lowest address)
device will win communication rights via standard arbitration during the slave address transfer. If the device
loses this arbitration, the interrupt will not be cleared. The Alert Response Address is 0Ch.
When INTR = 11, the interrupt is generated immediately following the SMBus write operation. Operation then
behaves in an SMBAlert mode, and the software set interrupt may be cleared by an SMBAlert cycle.
NOTE: Interrupts are based on the value of Channel 0 only.
Table 8. Interrupt Control Register
6754
PERSIST
2310
0000 0000Reset Value:
INTERRUPT
ResvResv INTR6h
FIELD BITS DESCRIPTION
Resv 7:6 Reserved. Write as 0.
INTR 5:4 INTR Control Select. This field determines mode of interrupt logic according to Table 9, below.
PERSIST 3:0 Interrupt persistence. Controls rate of interrupts to the host processor as shown in Table 10, below.
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Table 9. Interrupt Control Select
INTR FIELD VALUE READ VALUE
00 Interrupt output disabled
01 Level Interrupt
10 SMBAlert compliant
11 Test Mode: Sets interrupt and functions as mode 10
NOTE: Field value of 11 may be used to test interrupt connectivity in a system or to assist in debugging interrupt service routine software.
Table 10. Interrupt Persistence Select
PERSIST FIELD VALUE INTERRUPT PERSIST FUNCTION
0000 Every ADC cycle generates interrupt
0001 Any value outside of threshold range
0010 2 integration time periods out of range
0011 3 integration time periods out of range
0100 4 integration time periods out of range
0101 5 integration time periods out of range
0110 6 integration time periods out of range
0111 7 integration time periods out of range
1000 8 integration time periods out of range
1001 9 integration time periods out of range
1010 10 integration time periods out of range
1011 11 integration time periods out of range
1100 12 integration time periods out of range
1101 13 integration time periods out of range
1110 14 integration time periods out of range
1111 15 integration time periods out of range
ID Register (Ah)
The ID register provides the value for both the part number and silicon revision number for that part number.
It is a read-only register, whose value never changes.
Table 11. ID Register
6754
REVNO
2310
−−−− −−−−Reset Value:
ID
PARTNOAh
FIELD BITS DESCRIPTION
PARTNO 7:4 Part Number Identification: field value 0010 = TSL2562, field value 0011 = TSL2563
REVNO 3:0 Revision number identification
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ADC Channel Data Registers (Ch − Fh)
The ADC channel data are expressed as 16-bit values spread across two registers. The ADC channel 0 data
registers, DATA0LOW and DATA0HIGH provide the lower and upper bytes, respectively, of the ADC value of
channel 0. Registers DATA1LOW and DATA1HIGH provide the lower and upper bytes, respectively, of the ADC
value of channel 1. All channel data registers are read-only and default to 00h on power up.
Table 12. ADC Channel Data Registers
REGISTER ADDRESS BITS DESCRIPTION
DATA0LOW Ch 7:0 ADC channel 0 lower byte
DATA0HIGH Dh 7:0 ADC channel 0 upper byte
DATA1LOW Eh 7:0 ADC channel 1 lower byte
DATA1HIGH Fh 7:0 ADC channel 1 upper byte
The upper byte data registers can only be read following a read to the corresponding lower byte register. When
the lower byte register is read, the upper eight bits are strobed into a shadow register, which is read by a
subsequent read to the upper byte. The upper register will read the correct value even if additional ADC
integration cycles end between the reading of the lower and upper registers.
NOTE: The Read Word protocol can be used to read byte-paired registers. For example, the DATA0LOW and DATA0HIGH registers (as well as
the DATA1LOW and DATA1HIGH registers) may be read together to obtain the 16-bit ADC value in a single transaction
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APPLICATION INFORMATION: SOFTWARE
Basic Operation
After applying VDD, the device will initially be in the power-down state. To operate the device, issue a command
to access the CONTROL register followed by the data value 03h to power up the device. At this point, both ADC
channels will begin a conversion at the default integration time of 400 ms. After 400 ms, the conversion results
will be available in the DATA0 and DATA1 registers. Use the following pseudo code to read the data registers:
// Read ADC Channels Using Read Word Protocol − RECOMMENDED
Address = 0x39 //Slave addr – also 0x29 or 0x49
//Address the Ch0 lower data register and configure for Read Word
Command = 0xAC //Set Command bit and Word bit
//Reads two bytes from sequential registers 0x0C and 0x0D
//Results are returned in DataLow and DataHigh variables
ReadWord (Address, Command, DataLow, DataHigh)
Channel0 = 256 * DataHigh + DataLow
//Address the Ch1 lower data register and configure for Read Word
Command = 0xAE //Set bit fields 7 and 5
//Reads two bytes from sequential registers 0x0E and 0x0F
//Results are returned in DataLow and DataHigh variables
ReadWord (Address, Command, DataLow, DataHigh)
Channel1 = 256 * DataHigh + DataLow //Shift DataHigh to upper byte
// Read ADC Channels Using Read Byte Protocol
Address = 0x39 //Slave addr − also 0x29 or 0x49
Command = 0x8C //Address the Ch0 lower data register
ReadByte (Address, Command, DataLow) //Result returned in DataLow
Command = 0x8D //Address the Ch0 upper data register
ReadByte (Address, Command, DataHigh) //Result returned in DataHigh
Channel0 = 256 * DataHigh + DataLow //Shift DataHigh to upper byte
Command = 0x8E //Address the Ch1 lower data register
ReadByte (Address, Command, DataLow) //Result returned in DataLow
Command = 0x8F //Address the Ch1 upper data register
ReadByte (Address, Command, DataHigh) //Result returned in DataHigh
Channel1 = 256 * DataHigh + DataLow //Shift DataHigh to upper byte
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APPLICATION INFORMATION: SOFTWARE
Configuring the Timing Register
The command, timing, and control registers are initialized to default values on power up. Setting these registers
to the desired values would be part of a normal initialization or setup procedure. In addition, to maximize the
performance of the device under various conditions, the integration time and gain may be changed often during
operation. The following pseudo code illustrates a procedure for setting up the timing register for various
options:
// Set up Timing Register
//Low Gain (1x), integration time of 402ms (default value)
Address = 0x39
Command = 0x81
Data = 0x02
WriteByte(Address, Command, Data)
//Low Gain (1x), integration time of 101ms
Data = 0x01
WriteByte(Address, Command, Data)
//Low Gain (1x), integration time of 13.7ms
Data = 0x00
WriteByte(Address, Command, Data)
//High Gain (16x), integration time of 101ms
Data = 0x11
WriteByte(Address, Command, Data)
//Read data registers (see Basic Operation example)
//Perform Manual Integration
//Set up for manual integration with Gain of 1x
Data = 0x03
//Set manual integration mode – device stops converting
WriteByte(Address, Command, Data)
//Begin integration period
Data = 0x0B
WriteByte(Address, Command, Data)
//Integrate for 50ms
Sleep (50) //Wait for 50ms
//Stop integrating
Data = 0x03
WriteByte(Address, Command, Data)
//Read data registers (see Basic Operation example)
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APPLICATION INFORMATION: SOFTWARE
Interrupts
The interrupt feature of the TSL256x device simplifies and improves system efficiency by eliminating the need
to poll the sensor for a light intensity value. Interrupt styles are determined by the INTR field in the Interrupt
Register. The interrupt feature may be disabled by writing a field value of 00h to the Interrupt Control Register
so that polling can be performed.
The versatility of the interrupt feature provides many options for interrupt configuration and usage. The primary
purpose of the interrupt function is to provide a meaningful change in light intensity. However, it also be used
as an end-of-conversion signal. The concept of a meaningful change can be defined by the user both in terms
of light intensity and time, or persistence, of that change in intensity. The TSL256x device implements two
16-bit-wide interrupt threshold registers that allow the user to define a threshold above and below the current
light level. An interrupt will then be generated when the value of a conversion exceeds either of these limits. For
simplicity of programming, the threshold comparison is accomplished only with Channel 0. This simplifies
calculation of thresholds that are based, for example, on a percent of the current light level. It is adequate to
use only one channel when calculating light intensity differences since, for a given light source, the channel 0
and channel 1 values are linearly proportional to each other and thus both values scale linearly with light
intensity.
To further control when an interrupt occurs, the TSL256x device provides an interrupt persistence feature. This
feature allows the user to specify a number of conversion cycles for which a light intensity exceeding either
interrupt threshold must persist before actually generating an interrupt. This can be used to prevent transient
changes in light intensity from generating an unwanted interrupt. With a value of 1, an interrupt occurs
immediately whenever either threshold is exceeded. With values of N, where N can range from 2 to 15, N
consecutive conversions must result in values outside the interrupt window for an interrupt to be generated. For
example, if N is equal to 10 and the integration time is 402 ms, then an interrupt will not be generated unless
the light level persists for more than 4 seconds outside the threshold.
Two different interrupt styles are available: Level and SMBus Alert. The difference between these two interrupt
styles is how they are cleared. Both result in the interrupt line going active low and remaining low until the
interrupt is cleared. A level style interrupt is cleared by setting the CLEAR bit (bit 6) in the COMMAND register.
The SMBus Alert style interrupt is cleared by an Alert Response as described in the Interrupt Control Register
section and SMBus specification.
To configure the interrupt as an end-of-conversion signal, the interrupt PERSIST field is set to 0. Either Level
or SMBus Alert style can be used. An interrupt will be generated upon completion of each conversion. The
interrupt threshold registers are ignored. The following example illustrates the configuration of a level interrupt:
// Set up end−of−conversion interrupt, Level style
Address = 0x39 //Slave addr also 0x29 or 0x49
Command = 0x86 //Address Interrupt Register
Data = 0x10 //Level style, every ADC cycle
WriteByte(Address, Command, Data)
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APPLICATION INFORMATION: SOFTWARE
The following example pseudo code illustrates the configuration of an SMB Alert style interrupt when the light
intensity changes 20% from the current value, and persists for 3 conversion cycles:
// Read current light level
Address = 0x39 //Slave addr also 0x29 or 0x49
Command = 0xAC //Set Command bit and Word bit
ReadWord (Address, Command, DataLow, DataHigh)
Channel0 = (256 * DataHigh) + DataLow
//Calculate upper and lower thresholds
T_Upper = Channel0 + (0.2 * Channel0)
T_Lower = Channel0 – (0.2 * Channel0)
//Write the lower threshold register
Command = 0xA2 //Addr lower threshold reg, set Word Bit
WriteWord (Address, Command, T_Lower.LoByte, T_Lower.HiByte)
//Write the upper threshold register
Command = 0xA4 //Addr upper threshold reg, set Word bit
WriteWord (Address, Command, T_Upper.LoByte, T_Upper.HiByte)
//Enable interrupt
Command = 0x86 //Address interrupt register
Data = 0x23 //SMBAlert style, PERSIST = 3
WriteByte(Address, Command, Data)
In order to generate an interrupt on demand during system test or debug, a test mode (INTR = 11) can be used.
The following example illustrates how to generate an interrupt on demand:
// Generate an interrupt
Address = 0x39 //Slave addr also 0x29 or 0x49
Command = 0x86 //Address Interrupt register
Data = 0x30 //Test interrupt
WriteByte(Address, Command, Data)
//Interrupt line should now be low
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APPLICATION INFORMATION: SOFTWARE
Calculating Lux
The TSL256x is intended for use in ambient light detection applications such as display backlight control, where
adjustments are made to display brightness or contrast based on the brightness of the ambient light, as
perceived by the human eye. Conventional silicon detectors respond strongly to infrared light, which the human
eye does not see. This can lead to significant error when the infrared content of the ambient light is high, such
as with incandescent lighting, due to the difference between the silicon detector response and the brightness
perceived by the human eye.
This problem is overcome in the TSL256x through the use of two photodiodes. One of the photodiodes
(channel 0) is sensitive to both visible and infrared light, while the second photodiode (channel 1) is sensitive
primarily to infrared light. An integrating ADC converts the photodiode currents to digital outputs. Channel 1
digital output is used to compensate for the effect of the infrared component of light on the channel 0 digital
output. The ADC digital outputs from the two channels are used in a formula to obtain a value that approximates
the human eye response in the commonly used Illuminance unit of Lux:
CS Package
For 0 < CH1/CH0 0.52 Lux = 0.0315 CH0 − 0.0593 CH0 ((CH1/CH0)1.4)
For 0.52 < CH1/CH0 0.65 Lux = 0.0229 CH0 − 0.0291 CH1
For 0.65 < CH1/CH0 0.80 Lux = 0.0157 CH0 − 0.0180 CH1
For 0.80 < CH1/CH0 1.30 Lux = 0.00338 CH0 − 0.00260 CH1
For CH1/CH0 > 1.30 Lux = 0
T, FN, and CL Package
For 0 < CH1/CH0 0.50 Lux = 0.0304 CH0 − 0.062 CH0 ((CH1/CH0)1.4)
For 0.50 < CH1/CH0 0.61 Lux = 0.0224 CH0 − 0.031 CH1
For 0.61 < CH1/CH0 0.80 Lux = 0.0128 CH0 − 0.0153 CH1
For 0.80 < CH1/CH0 1.30 Lux = 0.00146 CH0 − 0.00112 CH1
For CH1/CH0 > 1.30 Lux = 0
The formulas shown above were obtained by optical testing with fluorescent and incandescent light sources,
and apply only to open-air applications. Optical apertures (e.g. light pipes) will affect the incident light on the
device.
Simplified Lux Calculation
Below is the argument and return value including source code (shown on following page) for calculating lux.
The source code is intended for embedded and/or microcontroller applications. Two individual code sets are
provided, one for the T, FN, and CL packages, and one for the CS package. All floating point arithmetic
operations have been eliminated since embedded controllers and microcontrollers generally do not support
these types of operations. Since floating point has been removed, scaling must be performed prior to calculating
illuminance if the integration time is not 402 ms and/or if the gain is not 16 as denoted in the source code on
the following pages. This sequence scales first to mitigate rounding errors induced by decimal math.
extern unsigned int CalculateLux(unsigned int iGain, unsigned int tInt, unsigned int
ch0, unsigned int ch1, int iType)
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//****************************************************************************
//
// Copyright E 2004−2005 TAOS, Inc.
//
// THIS CODE AND INFORMATION IS PROVIDED ”AS IS” WITHOUT WARRANTY OF ANY
// KIND, EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE
// IMPLIED WARRANTIES OF MERCHANTABILITY AND/OR FITNESS FOR A PARTICULAR
// PURPOSE.
//
// Module Name:
// lux.cpp
//
//****************************************************************************
#define LUX_SCALE 14 // scale by 2^14
#define RATIO_SCALE 9 // scale ratio by 2^9
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// Integration time scaling factors
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
#define CH_SCALE 10 // scale channel values by 2^10
#define CHSCALE_TINT0 0x7517 // 322/11 * 2^CH_SCALE
#define CHSCALE_TINT1 0x0fe7 // 322/81 * 2^CH_SCALE
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// T, FN, and CL Package coefficients
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// For Ch1/Ch0=0.00 to 0.50
// Lux/Ch0=0.0304−0.062*((Ch1/Ch0)^1.4)
// piecewise approximation
// For Ch1/Ch0=0.00 to 0.125:
// Lux/Ch0=0.0304−0.0272*(Ch1/Ch0)
//
// For Ch1/Ch0=0.125 to 0.250:
// Lux/Ch0=0.0325−0.0440*(Ch1/Ch0)
//
// For Ch1/Ch0=0.250 to 0.375:
// Lux/Ch0=0.0351−0.0544*(Ch1/Ch0)
//
// For Ch1/Ch0=0.375 to 0.50:
// Lux/Ch0=0.0381−0.0624*(Ch1/Ch0)
//
// For Ch1/Ch0=0.50 to 0.61:
// Lux/Ch0=0.0224−0.031*(Ch1/Ch0)
//
// For Ch1/Ch0=0.61 to 0.80:
// Lux/Ch0=0.0128−0.0153*(Ch1/Ch0)
//
// For Ch1/Ch0=0.80 to 1.30:
// Lux/Ch0=0.00146−0.00112*(Ch1/Ch0)
//
// For Ch1/Ch0>1.3:
// Lux/Ch0=0
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
#define K1T 0x0040 // 0.125 * 2^RATIO_SCALE
#define B1T 0x01f2 // 0.0304 * 2^LUX_SCALE
#define M1T 0x01be // 0.0272 * 2^LUX_SCALE
#define K2T 0x0080 // 0.250 * 2^RATIO_SCALE
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#define B2T 0x0214 // 0.0325 * 2^LUX_SCALE
#define M2T 0x02d1 // 0.0440 * 2^LUX_SCALE
#define K3T 0x00c0 // 0.375 * 2^RATIO_SCALE
#define B3T 0x023f // 0.0351 * 2^LUX_SCALE
#define M3T 0x037b // 0.0544 * 2^LUX_SCALE
#define K4T 0x0100 // 0.50 * 2^RATIO_SCALE
#define B4T 0x0270 // 0.0381 * 2^LUX_SCALE
#define M4T 0x03fe // 0.0624 * 2^LUX_SCALE
#define K5T 0x0138 // 0.61 * 2^RATIO_SCALE
#define B5T 0x016f // 0.0224 * 2^LUX_SCALE
#define M5T 0x01fc // 0.0310 * 2^LUX_SCALE
#define K6T 0x019a // 0.80 * 2^RATIO_SCALE
#define B6T 0x00d2 // 0.0128 * 2^LUX_SCALE
#define M6T 0x00fb // 0.0153 * 2^LUX_SCALE
#define K7T 0x029a // 1.3 * 2^RATIO_SCALE
#define B7T 0x0018 // 0.00146 * 2^LUX_SCALE
#define M7T 0x0012 // 0.00112 * 2^LUX_SCALE
#define K8T 0x029a // 1.3 * 2^RATIO_SCALE
#define B8T 0x0000 // 0.000 * 2^LUX_SCALE
#define M8T 0x0000 // 0.000 * 2^LUX_SCALE
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// CS package coefficients
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// For 0 <= Ch1/Ch0 <= 0.52
// Lux/Ch0 = 0.0315−0.0593*((Ch1/Ch0)^1.4)
// piecewise approximation
// For 0 <= Ch1/Ch0 <= 0.13
// Lux/Ch0 = 0.0315−0.0262*(Ch1/Ch0)
// For 0.13 <= Ch1/Ch0 <= 0.26
// Lux/Ch0 = 0.0337−0.0430*(Ch1/Ch0)
// For 0.26 <= Ch1/Ch0 <= 0.39
// Lux/Ch0 = 0.0363−0.0529*(Ch1/Ch0)
// For 0.39 <= Ch1/Ch0 <= 0.52
// Lux/Ch0 = 0.0392−0.0605*(Ch1/Ch0)
// For 0.52 < Ch1/Ch0 <= 0.65
// Lux/Ch0 = 0.0229−0.0291*(Ch1/Ch0)
// For 0.65 < Ch1/Ch0 <= 0.80
// Lux/Ch0 = 0.00157−0.00180*(Ch1/Ch0)
// For 0.80 < Ch1/Ch0 <= 1.30
// Lux/Ch0 = 0.00338−0.00260*(Ch1/Ch0)
// For Ch1/Ch0 > 1.30
// Lux = 0
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
#define K1C 0x0043 // 0.130 * 2^RATIO_SCALE
#define B1C 0x0204 // 0.0315 * 2^LUX_SCALE
#define M1C 0x01ad // 0.0262 * 2^LUX_SCALE
#define K2C 0x0085 // 0.260 * 2^RATIO_SCALE
#define B2C 0x0228 // 0.0337 * 2^LUX_SCALE
#define M2C 0x02c1 // 0.0430 * 2^LUX_SCALE
#define K3C 0x00c8 // 0.390 * 2^RATIO_SCALE
#define B3C 0x0253 // 0.0363 * 2^LUX_SCALE
#define M3C 0x0363 // 0.0529 * 2^LUX_SCALE
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#define K4C 0x010a // 0.520 * 2^RATIO_SCALE
#define B4C 0x0282 // 0.0392 * 2^LUX_SCALE
#define M4C 0x03df // 0.0605 * 2^LUX_SCALE
#define K5C 0x014d // 0.65 * 2^RATIO_SCALE
#define B5C 0x0177 // 0.0229 * 2^LUX_SCALE
#define M5C 0x01dd // 0.0291 * 2^LUX_SCALE
#define K6C 0x019a // 0.80 * 2^RATIO_SCALE
#define B6C 0x0101 // 0.0157 * 2^LUX_SCALE
#define M6C 0x0127 // 0.0180 * 2^LUX_SCALE
#define K7C 0x029a // 1.3 * 2^RATIO_SCALE
#define B7C 0x0037 // 0.00338 * 2^LUX_SCALE
#define M7C 0x002b // 0.00260 * 2^LUX_SCALE
#define K8C 0x029a // 1.3 * 2^RATIO_SCALE
#define B8C 0x0000 // 0.000 * 2^LUX_SCALE
#define M8C 0x0000 // 0.000 * 2^LUX_SCALE
// lux equation approximation without floating point calculations
//////////////////////////////////////////////////////////////////////////////
// Routine: unsigned int CalculateLux(unsigned int ch0, unsigned int ch0, int iType)
//
// Description: Calculate the approximate illuminance (lux) given the raw
// channel values of the TSL2562. The equation if implemented
// as a piece−wise linear approximation.
//
// Arguments: unsigned int iGain − gain, where 0:1X, 1:16X
// unsigned int tInt − integration time, where 0:13.7mS, 1:100mS, 2:402mS,
// 3:Manual
// unsigned int ch0 − raw channel value from channel 0 of TSL2562
// unsigned int ch1 − raw channel value from channel 1 of TSL2562
// unsigned int iType − package type (T or CS)
//
// Return: unsigned int − the approximate illuminance (lux)
//
//////////////////////////////////////////////////////////////////////////////
unsigned int CalculateLux(unsigned int iGain, unsigned int tInt, unsigned int ch0,
unsigned int ch1, int iType)
{
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// first, scale the channel values depending on the gain and integration time
// 16X, 402mS is nominal.
// scale if integration time is NOT 402 msec
unsigned long chScale;
unsigned long channel1;
unsigned long channel0;
switch (tInt)
{
case 0: // 13.7 msec
chScale = CHSCALE_TINT0;
break;
case 1: // 101 msec
chScale = CHSCALE_TINT1;
break;
default: // assume no scaling
chScale = (1 << CH_SCALE);
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break;
}
// scale if gain is NOT 16X
if (!iGain) chScale = chScale << 4; // scale 1X to 16X
// scale the channel values
channel0 = (ch0 * chScale) >> CH_SCALE;
channel1 = (ch1 * chScale) >> CH_SCALE;
//−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
// find the ratio of the channel values (Channel1/Channel0)
// protect against divide by zero
unsigned long ratio1 = 0;
if (channel0 != 0) ratio1 = (channel1 << (RATIO_SCALE+1)) / channel0;
// round the ratio value
unsigned long ratio = (ratio1 + 1) >> 1;
// is ratio <= eachBreak ?
unsigned int b, m;
switch (iType)
{
case 0: // T, FN, CL package
if ((ratio >= 0) && (ratio <= K1T))
{b=B1T; m=M1T;}
else if (ratio <= K2T)
{b=B2T; m=M2T;}
else if (ratio <= K3T)
{b=B3T; m=M3T;}
else if (ratio <= K4T)
{b=B4T; m=M4T;}
else if (ratio <= K5T)
{b=B5T; m=M5T;}
else if (ratio <= K6T)
{b=B6T; m=M6T;}
else if (ratio <= K7T)
{b=B7T; m=M7T;}
else if (ratio > K8T)
{b=B8T; m=M8T;}
break;
case 1:// CS package
if ((ratio >= 0) && (ratio <= K1C))
{b=B1C; m=M1C;}
else if (ratio <= K2C)
{b=B2C; m=M2C;}
else if (ratio <= K3C)
{b=B3C; m=M3C;}
else if (ratio <= K4C)
{b=B4C; m=M4C;}
else if (ratio <= K5C)
{b=B5C; m=M5C;}
else if (ratio <= K6C)
{b=B6C; m=M6C;}
else if (ratio <= K7C)
{b=B7C; m=M7C;}
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else if (ratio > K8C)
{b=B8C; m=M8C;}
break;
}
unsigned long temp;
temp = ((channel0 * b) − (channel1 * m));
// do not allow negative lux value
if (temp < 0) temp = 0;
// round lsb (2^(LUX_SCALE−1))
temp += (1 << (LUX_SCALE−1));
// strip off fractional portion
unsigned long lux = temp >> LUX_SCALE;
return(lux);
}
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APPLICATION INFORMATION: HARDWARE
Power Supply Decoupling and Application Hardware Circuit
The power supply lines must be decoupled with a 0.1 μF capacitor placed as close to the device package as
possible (Figure 18). The bypass capacitor should have low effective series resistance (ESR) and low effective
series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground
at high frequencies to handle transient currents caused by internal logic switching.
TSL2562/
TSL2563
VBUS VDD
0.1 F
RPRP
SCL
SDA
RPI
INT
Figure 18. Bus Pull-Up Resistors
Pull-up resistors (Rp) maintain the SDAH and SCLH lines at a high level when the bus is free and ensure the
signals are pulled up from a low to a high level within the required rise time. For a complete description of the
SMBus maximum and minimum Rp values, please review the SMBus Specification at
http://www.smbus.org/specs. For a complete description of I2C maximum and minimum Rp values, please
review the I2C Specification at http://www.semiconductors.philips.com.
A pull-up resistor (RPI) is also required for the interrupt (INT), which functions as a wired-AND signal in a similar
fashion to the SCL and SDA lines. A typical impedance value between 10 kΩ and 100 kΩ can be used. Please
note that while Figure 18 shows INT being pulled up to VDD, the interrupt can optionally be pulled up to VBUS.
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APPLICATION INFORMATION: HARDWARE
PCB Pad Layout
Suggested PCB pad layout guidelines for the TMB-6 (T) surface mount package, chipscale (CS) package, Dual
Flat No-Lead (FN) surface mount package, and ChipLED−6 (CL) surface mount package are shown in
Figure 19, Figure 20, Figure 21, and Figure 22.
0.70
0.90
3.80
2.60 0.70
0.70
0.90
0.25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 19. Suggested T Package PCB Layout
0.50
6 0.25
0.50
0.50
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 20. Suggested CS Package PCB Layout
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0.40
2.90
0.40
1.30
1.70
0.65
1.30
0.65
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 21. Suggested FN Package PCB Layout
0.40
0.70
0.65
0.40
0.43
1.30
0.70
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 22. Suggested CL Package PCB Layout
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MECHANICAL DATA
PACKAGE CS Six-Lead Chipscale Device
171
1398
465 203
1250
6 100
400 50
700 55
TYP 30
500
500
375 30
500
375 30
1750
TOP VIEW
SIDE VIEW
BOTTOM VIEW
END VIEW
6 250 30
1
2
3
6
5
4
PIN OUT
BOTTOM VIEW
Lead Free
Pb
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The top of the photodiode active area is 410 μm below the top surface of the package.
D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
E. This drawing is subject to change without notice.
Figure 23. Package CS — Six-Lead Chipscale Packaging Configuration
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MECHANICAL DATA
PACKAGE TMB-6 Six-Lead Surface Mount Device
PIN 1
0.311.90
2.60
3.80
1.35
0.90 TYP
0.90
TYP
0.30
TYP
0.60
TYP
0.30
TYP
T
OP VIEW
BOTTOM VIEW
END VIEW
R 0.20
6 Pls
PIN 4
Lead Free
Pb
Photo-Active Area
TOP VIEW
0.50
0.88
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.5 μm minimum of soft gold plated over a 18 μm thick copper foil pattern with a 5 μm to 9 μm nickel barrier.
E. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,
exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 24. Package T — Six-Lead TMB Plastic Surface Mount Packaging Configuration
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MECHANICAL DATA
PACKAGE FN Dual Flat No-Lead
203 8
6 DATA
5 INT
4 CLK
VDD 1
ADR 2
GND 3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Lead Free
Pb
300
50
650
2000
75
2000 75
PIN 1
PIN 1
END VIEW
650 50
Seating Plane
PIN OUT
TOP VIEW
Photo-Active Area
750 150
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 25. Package FN — Dual Flat No-Lead Packaging Configuration
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MECHANICAL DATA
PACKAGE CL-6 Six-Lead Surface Mount Device
6 0.65
0.30
2.60
0.25 0.25
6 R 0.18
0.18
0.35
1.05
2.20
4 0.35
T
OP VIEW
BOTTOM VIEW
S
IDE VIEW
Lead Free
Pb
Photo-Active Area
0.70
0.35
Pin 1 Marker
TOP VIEW
1
5
6
2
4
3
0.55
0.55
2
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.1 μm (minimum) to 1.0 μm (maximum) of soft gold plated over a 15 μm (minimum) to 30 μm (maximum) thick
copper foil pattern with a 3 μm (minimum) to 15 μm (maximum) nickel barrier.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 26. Package CL — Six-Lead ChipLED Plastic Surface Mount Packaging Configuration
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MECHANICAL DATA
TOP VIEW
DETAIL B
DETAIL A
1.35 0.05
Ao
1.85 0.05
Bo
0.97 0.05
Ko
0.250
0.02
5 Max 5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
0.60
0.05
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 27. TSL2562/TSL2563 Chipscale Carrier Tape
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MECHANICAL DATA
0.30 0.050 2.10
4 0.100
2 0.100
8 Typ
1.75 0.100
5.50
0.100
AA
B
B
12 0.100
R 0.20 TYP
1.50
1.50
SIDE VIEW
TOP VIEW
END VIEW
3.09 MAX
2.90 0.100 Ao
R 0.20 TYP
1.80 Ko
4.29 MAX
4.10 0.100 Bo
DETAIL B
DETAIL A
R 0.20 TYP
NOTES: A. All linear dimensions are in millimeters.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 1000 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 28. TSL2562/TSL2563 TMB Carrier Tape
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MECHANICAL DATA
TOP VIEW
DETAIL A
2.18 0.05
Ao
0.254
0.02
5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
1.00
0.25
DETAIL B
2.18 0.05
Bo
5 Max
0.83 0.05
Ko
NOTES: H. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
I. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
J. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
K. Each reel is 178 millimeters in diameter and contains 3500 parts.
L. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
M. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
N. This drawing is subject to change without notice.
Figure 29. TSL2562/TSL2563 FN Carrier Tape
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MECHANICAL DATA
TOP VIEW
DETAIL B
DETAIL A
2.4
Ao
2.9
Bo
0.7
Ko
0.20
0.05
5 Max 5 Max
4.00
8.0 0.2
3.50 0.05
1.50
+ 0.10
4.00
2.00 0.05 1.75
B
B
AA
1.00
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 2500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 30. TSL2562/TSL2563 CL Carrier Tape
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MANUFACTURING INFORMATION
The CS, T, FN, and CL packages have been tested and have demonstrated an ability to be reflow soldered to
a PCB substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. TSL2562/63 Solder Reflow Profile
PARAMETER REFERENCE TSL2562/63
Average temperature gradient in preheating 2.5°C/sec
Soak time tsoak 2 to 3 minutes
Time above 217°C t1Max 60 sec
Time above 230°C t2Max 50 sec
Time above Tpeak −10°C t3Max 10 sec
Peak temperature in reflow Tpeak 260° C (−0°C/+5°C)
Temperature gradient in cooling Max −5°C/sec
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 31. TSL2562/TSL2563 Solder Reflow Profile Graph
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MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the
package molding compound contains the smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica
gel to protect them from ambient moisture during shipping, handling, and storage before use.
The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under
the following conditions:
Temperature Range 5°C to 50°C
Relative Humidity 60% maximum
Floor Life 1 year out of bag at ambient < 30°C / 60% RH
Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,
it should be done at 90°C for 3 hours.
The T, FN, and CL packages have been assigned a moisture sensitivity level of MSL 3 and the devices should
be stored under the following conditions:
Temperature Range 5°C to 50°C
Relative Humidity 60% maximum
Total Time 6 months from the date code on the aluminized envelope — if unopened
Opened Time 168 hours or fewer
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours.
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PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
