VIN
LX
DIM
FS
PGND
IADJ
GND
VCC
* DAP connect to GND
D1
High power LED Array
L1
GND
Iout = 1A
LM3414/14HV
RFS
RIADJ
Vin
GND
4.5V ± 42 VDC (LM3414)
CIN
PWM dimming signal
CVCC
GND
GND
4.5V ± 65 VDC (LM3414HV)
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Design
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LM3414/HV 1-A, 60-W Common Anode-Capable Constant Current Buck LED Driver
Requires No External Current Sensing Resistor
1 Features 3 Description
The LM3414 and LM3414HV are 1-A 60-W(1)
1• Supports LED Power up to 60 W (1): 18x 3-W common anode-capable constant current buck LED
HBLEDs drivers. They are suitable for driving single string of 3-
• Requires No External Current Sensing Resistor W HBLED with up to 96% efficiency. They accept
• ±3% LED Current Accuracy input voltages from 4.5 VDC to 65 VDC and deliver
up to 1-A average LED current with ±3% accuracy.
• Up to 96% Efficiency The integrated low-side N-channel power MOSFET
• High Contrast Ratio (Minimum Dimming Current and current sensing element realize simple and low
Pulse Width <10 µS) component count circuitry, as no bootstrapping
• Integrated Low-Side N-Channel MOSFET capacitor and external current-sensing resistor are
required. An external small-signal resistor to ground
• Adjustable Constant LED Current From 350 mA to provides very fine LED current adjustment, analog
1000 mA dimming, and thermal fold-back functions.
• Support Analog Dimming and Thermal Fold-Back Constant switching frequency operation eases EMI.
• Wide Input Voltage Range: No external loop compensation network is needed.
– 4.5 V to 42 V (LM3414) The proprietary Pulse-Level-Modulation (PLM) control
– 4.5 V to 65 V (LM3414HV) method benefits in high conversion efficiency and true
average LED current regulation. Fast response time
• Constant Switching Frequency Adjustable from realizes fine LED current pulse fulfilling the 240 Hz
250 kHz to 1000 kHz 256-step dimming resolution requirement for general
• Thermal Shutdown Protection lighting.
• Power Enhanced SOIC-8 or 3 mm × 3 mm The LM3414 and LM3414HV are available in SOIC-8
WSON-8 Package and 3 mm × 3 mm WSON-8 packages.
2 Applications Device Information(2)
• High Power LED Drivers PART NUMBER PACKAGE BODY SIZE (NOM)
WSON (8) 3.00 mm × 3.00 mm
• Architectural Lighting, Office Troffers LM3414,
LM3414HV SOIC (8) 3.90 mm × 4.89 mm
• Automotive Lighting
• MR-16 LED Lamps (1) Thermal derating applies according to actual operation
conditions.
(2) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Application Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3414
,
LM3414HV
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 15
1 Features.................................................................. 18 Application and Implementation ........................ 16
2 Applications ........................................................... 18.1 Application Information............................................ 16
3 Description............................................................. 18.2 Typical Applications ................................................ 18
4 Revision History..................................................... 29 Power Supply Recommendations...................... 22
5 Pin Configuration and Functions......................... 310 Layout................................................................... 22
6 Specifications......................................................... 410.1 Layout Guidelines ................................................. 22
6.1 Absolute Maximum Ratings ...................................... 410.2 Layout Example .................................................... 22
6.2 ESD Ratings.............................................................. 411 Device and Documentation Support................. 23
6.3 Recommended Operating Conditions....................... 411.1 Related Links ........................................................ 23
6.4 Thermal Information.................................................. 511.2 Community Resources.......................................... 23
6.5 Electrical Characteristics........................................... 511.3 Trademarks........................................................... 23
6.6 Typical Characteristics.............................................. 611.4 Electrostatic Discharge Caution............................ 23
7 Detailed Description.............................................. 911.5 Glossary................................................................ 23
7.1 Overview................................................................... 912 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram......................................... 9Information........................................................... 23
7.3 Feature Description................................................. 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (May 2013) to Revision F Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
• Removed soldering information.............................................................................................................................................. 4
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 14
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Product Folder Links: LM3414 LM3414HV
VIN
LX
DIM
FS
PGND
IADJ
GND
VCC
2
3
4
1
7
6
5
8
EP
VIN
LX
DIM
FS
PGND
IADJ
GND
VCC 1
2
3
4
8
7
6
5
EP
LM3414
,
LM3414HV
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SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
5 Pin Configuration and Functions
DDA Package NGQ Package
8-Pin SOIC 8-Pin WSON
Top View Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
Internal Regulator Output Pin. This pin should be bypassed to ground by a ceramic capacitor
VCC 1 O with a minimum value of 1 µF.
Power Ground Pin. Ground for power circuitry. Reference point for all stated voltages. Must
PGND 2 — be externally connected to EP and GND.
Average Output Current Adjustment Pin. Connect resistor RIADJ from this pin to ground to
IADJ 3 I adjust the average output current.
Analog Ground Pin. Analog ground connection for internal circuitry, must be connected to
GND 4 — PGND external to the package.
Switching Frequency Setting Pin. Connect resistor RFS from this pin to ground to set the
FS 5 I switching frequency.
PWM Dimming Control Pin. Apply logic level PWM signal to this pin controls the intend
DIM 6 I brightness of the LED string.
Drain of N-MOSFET Switch. Connect this pin to the output inductor and anode of the
LX 7 O schottky diode.
Input Voltage Pin. The input voltage should be in the range of 4.5 V to 42 V (LM3414) or 4.5
VIN 8 I V to 65 V (LM3414HV).
Thermal Pad (Power Ground). Used to dissipate heat from the package during operation.
EP EP — Must be electrically connected to PGND external to the package.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
LM3414 –0.3 42
VIN to GND V
LM3414HV –0.3 65
LM3414 45 (500 ms)
VIN to GND (Transient) V
LM3414HV 67 (500 ms)
LM3414 –0.3 42
LX to PGND V
LM3414HV –0.3 65
LM3414 –3 (2 ns) 45 (500 ms)
LX to PGND (Transient) V
LM3414HV –3 (2 ns) 67 (500 ms)
FS, IADJ to GND –0.3 5 V
DIM to GND –0.3 6 V
Storage Temperature –65 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings VALUE UNIT
WSON PACKAGE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±750
C101(3)
SOIC PACKAGE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±750
C101(3)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100pF capacitor discharged through a 1.5 kΩresistor into each pin.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
LM3414 4.5 42
VIN V
LM3414HV 4.5 65
Junction temperature –40 125 °C
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6.4 Thermal Information LM3414, LM3414HV
THERMAL METRIC(1) NGQ (WSON) DDA (SOIC-8) UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 47.7 50.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.1 55.7 °C/W
RθJB Junction-to-board thermal resistance 22.3 28.6 °C/W
ψJT Junction-to-top characterization parameter 0.4 9.5 °C/W
ψJB Junction-to-board characterization parameter 22.5 28.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4 3.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
MIN and MAX limits apply for TJ= –40°C to 125°C unless specified otherwise. VIN = 24 V unless otherwise indicated.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS - LM3414
4.5 V ≤Vin ≤42 V
IIN-DIM-HIGH Operating Current RIADJ = 3.125 kΩ2.2 3.2 3.5 mA
VDIM = High
4.5 V ≤Vin ≤42 V
IIN-DIM-LOW Standby Current RIADJ = 3.125 kΩ0.8 1.15 1.4 mA
VDIM = Low
Main Switch Turned OFF
ILX-OFF LX Pin Current 6 µA
VLX = VIN = 42 V
SYSTEM PARAMETERS - LM3414HV
4.5 V ≤Vin ≤65 V
IIN-DIM-HIGH Operating Current RIADJ = 3.125 kΩ2.2 3.3 3.6 mA
VDIM = High
4.5 V ≤Vin ≤65 V
IIN-DIM-LOW Standby Current RIADJ = 3.125 kΩ0.8 1.2 1.45 mA
VDIM = Low
Main Switch Turned OFF
ILX-OFF LX Pin Current 6.5 µA
VLX = VIN= 65 V
SYSTEM PARAMETERS - LM3414/3414HV
RIADJ = 3.125 kΩ0.97 1 1.03 A
TA= 25°C
ILED Average LED Current RIADJ = 3.125 kΩ0.95 1 1.05 A
TA= –40°C to 125°C
VCC-UVLO Vcc UVLO Threshold VCC Decreasing, TA= 25°C 3.6 3.75 3.9 V
VCC-UVLO-HYS Vcc UVLO Hysteresis 300 mV
VIADJ IADJ Pin voltage 1.23 1.255 1.280 V
VDIM DIM Pin Threshold VDIM Increasing 1 1.2 V
VDIM-HYS DIM Pin Hysteresis 100 mV
fSW Switching frequency 250 500 1000 kHz
fSW-TOL Switching frequency tolerance RFS = 40 kΩ420 500 580 kHz
tON-MIN Minimum on-time 400 ns
(1) All limits specified at room temperature (TYP) and at temperature extremes (MIN/MAX). All room temperature limits are 100%
production tested. All limits at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical specification represent the most likely parametric norm at 25°C operation.
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Electrical Characteristics (continued)
MIN and MAX limits apply for TJ= –40°C to 125°C unless specified otherwise. VIN = 24 V unless otherwise indicated.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
INTERNAL VOLTAGE REGULATOR
CVCC = 1 µF, No Load to IVCC = 2 4.7 5.4 6 V
mA
VCC VCC regulator output voltage(3)
VIN = 4.5 V, 2-mA Load 3.8 4.2 V
MAIN SWITCH
RLX Resistance across LX and GND Main Switch Turned ON 1.8 Ω
THERMAL PROTECTION
TSD Thermal shutdown temperature TJRising 170 °C
Thermal shutdown temperature
TSD-HYS TJFalling 10 °C
hysteresis
(3) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading to the pin.
6.6 Typical Characteristics
All curves taken at VIN = 48 V with configuration in typical application for driving twelve power LEDs with ILED = 1 A shown in
this data sheet. TA= 25°C, unless otherwise specified.
Figure 1. IOUT vs VIN, (4 - 8 LED), LM3414HV Figure 2. IOUT vs VIN, (10 - 18 LED), LM3414HV
Figure 3. Efficiency vs VIN, (4 - 8 LED), LM3414HV Figure 4. Efficiency vs VIN, (10 - 18 LED), LM3414HV
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Typical Characteristics (continued)
All curves taken at VIN = 48 V with configuration in typical application for driving twelve power LEDs with ILED = 1 A shown in
this data sheet. TA= 25°C, unless otherwise specified.
Figure 5. IOUT vs Temperature (TA) Figure 6. IOUT vs Temperature (TA)
(6 LED, VIN = 24 V), LM3414HV (12 LED, VIN = 48 V), LM3414HV
Figure 7. VCC vs Temperature (TA), LM3414HV Figure 8. VIADJ vs Temperature (TA), LM3414HV
Figure 9. IOUT and VLX, LM3414HV Figure 10. ILX and VDIM, LM3414HV
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Typical Characteristics (continued)
All curves taken at VIN = 48 V with configuration in typical application for driving twelve power LEDs with ILED = 1 A shown in
this data sheet. TA= 25°C, unless otherwise specified.
Figure 11. LED Current With PWM Dimming (VDIM Rising), Figure 12. LED Current With PWM Dimming (VDIM Falling),
LM3414HV LM3414HV
Figure 13. LED Current With PWM Dimming (9-µs dimming pulse), LM3414HV
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7 Detailed Description
7.1 Overview
The LM3414/HV is a high power floating buck LED driver with wide input voltage ranges. The device requires no
external current sensing elements and loop compensation networks. The integrated power N-MOSFET enables
high-output power with up to 1000-mA output current. The combination of Pulse Width Modulation (PWM),
control architecture, and the proprietary Pulse Level Modulation (PLM) ensures accurate current regulation, good
EMI performance, and provides high flexibility on inductor selection. High-speed dimming control input allows
precision and high resolution brightness control for applications require fine brightness adjustment.
7.2 Functional Block Diagram
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VLED
VIN 400 nS x fSW
t
ILED
ILX
IL1
1/fSW tON
Time
ILED = IL(AVERAGE) = Mid-point of ILX during tON
LM3414
,
LM3414HV
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
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7.3 Feature Description
7.3.1 Pulse-Level-Modulation (PLM) Operation Principles
The main control circuitry of the LM3414/HV is generally a Pulse-Width-Modulated (PWM) controller with the
incorporation of the Pulse-Level-Modulation (PLM) technology. PLM is a technology that facilitates true output
average current control without the need to sense the output current directly. In the LM3414/LM3414HV, the PLM
circuit senses the current of the internal switch through integrated current sensing circuitry to realize average
output current control. The use of PLM reduces the current sensing power losses as it needs current information
only when the switch is turned ON. For proper operation of this control scheme, the converter must operate in
CCM (continuous conduction mode), so the switching frequency and inductor value must be chosen to prevent
the inductor current reaching 0 A during the switch OFF time each cycle.
In general, for the LED drivers with current sensing resistor at the output, the power dissipation on the current
sensing resistor is ILED2× RISNS, where ILED is the average output current and RISNS is the resistance of the
current sensing resistor. In the LM3414/LM3414HV, power dissipates on the internal RISNS only during ON period
of the internal power switch. The power loss on RISNS(internal) becomes ILED2× RISNS × D, where D is the
switching duty cycle. For example, when the switching duty cycle, D of a converter is 0.5, the power loss on
RISNS with PLM is half of those with conventional output current sensing resulting in increased efficiency.
The Pulse-Level-Modulation is a patented method to ensure accurate average output current regulation without
the need of direct output current sensing. Figure 14 shows the current waveforms of a typical buck converter
under steady state, where, IL1 is the inductor current and ILX is the main switch current flowing into the LX pin.
For a buck converter operating in steady state, the mid-point of the RAMP section of the main switch current is
equal to the average level of the inductor current–hence the average output current. In short, by regulating the
mid-point of the RAMP section of the main switch current with respect to a precise reference level, PLM achieves
output current regulation by sensing the main switch current solely.
Figure 14. Waveforms of a Floating Buck LED Driver With PLM
7.3.2 Minimum Switch ON-time
As the LM3414 features a 400 ns minimum ON time, it is essential to make sure the ON time of the internal
switch is not shorter than 400 ns when setting the LED driving current. If the switching ON time is shorter than
400 ns, the accuracy of the LED current may not maintain and exceed the rated current of the LEDs. The ratio of
the LED forward voltage to input voltage is restricted by the following restriction, as shown in Equation 1.
(1)
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LED dimmed OFF
LED current slews up
ILED slew up time
Time
ILED
0
ILED regulated
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,
LM3414HV
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SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
Feature Description (continued)
7.3.3 Peak Switch Current Limit
The LM3414/HV features an integrated switch current limiting mechanism that protects the LEDs from being
overdriven. The switch current limiter triggers when the switch current exceeds three times the current level set
by RIADJ. Once the current limiter is triggered, the internal power switch turns OFF for 3.6 µs to allow the inductor
to discharge and cycles repetitively until the overcurrent condition is removed. The current limiting feature is
exceptionally important to avoid permanent damage of the LM3414/HV application circuit due to short circuit of
LED string.
7.3.4 PWM Dimming Control
The DIM pin of the LM3414/HV is an input with internal pullup that accepts logic signals for average LED current
control. Applying a logic high (greater than 1.2 V) signal to the DIM pin or leaving the DIM pin open will enable
the device. Applying a logic low signal (less than 0.9 V) to the DIM pin will disable the switching activity of the
device but maintain VCC regulator active. The LM3414/HV allows the inductor current to slew up to the preset
regulated level at full speed instead of charging the inductor with multiple restrained switching duty cycles. This
enables the LM3414/HV to achieve high-speed dimming and very fine dimming control as shown in Figure 15
and Figure 16.
Figure 15. LED Current Slew Up With Multiple Switching Cycle
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LED dimmed OFF
LED current slews up
ILED slew
up time
Time
ILED
0
ILED regulated
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,
LM3414HV
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Feature Description (continued)
Figure 16. Shortened Current Slew Up Time of the LM3414/HV
To ensure normal operation of the LM3414/HV, TI recommends setting the dimming frequency not higher than
1/10 of the switching frequency. The minimum dimming duty cycle is limited by the 400 ns minimum ON time. In
applications that require high dimming contrast ratio, low dimming frequency should be used.
7.3.5 Analog Dimming Control
The IADJ pin can be used as an analog dimming signal input. As the average output current of the LM3414
depends on the current being drawn from the IADJ pin, thus the LED current can be increased or decreased by
applying external bias current to the IADJ pin. The simplified circuit diagram for facilitating analog dimming is as
shown in Figure 17. The minimum LED current for analog dimming is 100 mA and the converter must remain in
continuous conduction mode (CCM). The switching frequency and inductor value must be sized accordingly.
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RIADJ
IEXT < 1.255
x 2490 x 103
RIADJ
ILED = 1.255 mA
- IEXT
Current Mirror
IADJ
-
+
+
-
VCC
To LED current
setting circuitry
LM3414/14HV
1.255V
IEXT
VEXT
RIADJ
IIADJ
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,
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Feature Description (continued)
Figure 17. Analog LED Current Control Circuit
When external bias current IEXT is applied to the IADJ pin, the reduction of LED current follows Equation 2
through Equation 3.
(2)
Provided that
(3)
ILED decreases linearly as IEXT increases.
This feature is exceptionally useful for the applications with analog dimming control signals such as those from
analog temperature sensors and ambient light sensors.
Figure 18 shows an example circuit for analog dimming control using simple external biasing circuitry with a
variable resistor.
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VIN
LX
DIM
FS
PGND
IADJ
GND
VCC
* DAP connect to GND
D1
High power LED Array
L1
GND
LM3414 / LM3414HV
RFS
Vin
GND
CIN
PWM
dimming signal
CVCC
GND
GND
RIADJ
VCC
R1
GND
GND
R2
Q1
Analog
temperature
sensor
U1
mA
R2
IEXT = VCC ± 1.955 + 1
VR1
R1
+ 1
VR1
R1
IADJ
GND
VCC
LM3414
GND
RIADJ
R1
GND
Q1
VCC
R2
VR1
IEXT
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,
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Feature Description (continued)
Figure 18. Example Analog Dimming Control Circuit
In Figure 18, the variable resistor VR1 controls the base voltage of Q1 and eventually adjusts the bias voltage of
current to the IADJ pin (IEXT). As the resistance of VR1 increases and the voltage across VR1 exceeds 1.255 V +
0.7 V, the LED current starts to decrease as IEXT increases.
Where
(4)
The analog dimming begins only when IEXT > 0.
Figure 19. Application Circuit of LM3414/HV With Temperature Fold-Back Circuitry and PWM Dimming
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Feature Description (continued)
7.3.6 Internal VCC Regulator
The LM3414/HV features a 5.4-V internal voltage regulator that connects between the VIN and VCC pins for
powering internal circuitry and provide biases to external components. The VCC pin must be bypassed to the
GND pin with a 1-µF ceramic capacitor, CVCC that connected to the pins as close as possible. When the input
voltage falls to less than 6 V, the VCC voltage will drop to less than 5.4 V and decrease proportionally as Vin
decreases. The device will shutdown as the VCC voltage falls to less than 3.9 V. When the internal regulator is
used to provide bias to external circuitry, it is essential to ensure the current sinks from VCC pin does not exceed
2 mA to maintain correct voltage regulation.
7.4 Device Functional Modes
There are no additional functional modes for this device.
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ILED = 3125 x 103
RIADJ mA
1000
800
600
400
200
20 40 60 80
R (k
FS Ω)
ƒ(k
SW Hz)
fSW = 20 x 106
RFS kHz
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,
LM3414HV
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Setting the Switching Frequency
Both the LM3414 and LM3414HV are PWM LED drivers that contain a clock generator to generate constant
switching frequency for the device. The switching frequency is determined by the resistance of an external
resistor RFS in the range of 250 kHz to 1 MHz. Lower resistance of RFS results in higher switching frequency. The
switching frequency of the LM3414/HV is governed using Equation 5.
(5)
Figure 20. Switching Frequency vs RFS
Table 1. Examples for fSW Settings
fSW (kHz) RFS (kΩ)
250 80
500 40
1000 20
To ensure accurate current regulation, the LM3414/HV should be operated in continuous conduction mode
(CCM) and the ON time should not be shorter than 400 ns under all operation condition.
8.1.2 Setting LED Current
The LM3414/HV requires no external current sensing resistor for LED current regulation. The average output
current of the LM3414/HV is adjustable by varying the resistance of the resistor, RIADJ that connects across the
IADJ and GND pins. The IADJ pin is internally biased to 1.255 V. The LED current is then governed by
Equation 6.
where
• 350 mA < ILED < 1A (6)
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(VIN -VLED)
2L x VIN x fSW
VLED
'IL = + ILED(AVG)
VIN -VLED
1.2 x ILED x
LMIN = VLED
VIN x1
fSW
VIN - VLED
Lx D x T
'IL =
0 1 2 3 4 5 6 7 8 9
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
ILED(A)
RIADJ(k)
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,
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SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
Figure 21. LED Current vs RIADJ
Table 2. Examples for IOUT Settings
IOUT (mA) RIADJ (kΩ)
350 8.93
500 6.25
700 4.46
1000 3.13
The LED current can be set to any level in the range from 350 mA to 1A. To provide accurate LED current, RIADJ
should be a resistor with no more than 0.5% tolerance. If the IADJ pin is accidentally shorted to GND (RIADJ = 0),
the output current is limited to avoid damaging the circuit. When the overcurrent protection is activated, current
regulation cannot be maintained until the overcurrent condition is cleared.
8.1.3 Inductor Selection
To ensure proper output current regulation, the LM3414/HV must operate in Continuous Conduction Mode
(CCM). With the incorporation of PLM, the peak-to-peak inductor current ripple can be set as high as ±60% of
the defined average output current. The minimum inductance of the inductor is decided by the defined average
LED current and allowable inductor current ripple. The minimum inductance can be found by the equations
shown in Equation 7 through Equation 8.
Because:
(7)
Thus:
(8)
The LM3414/HV can maintain LED current regulation without output filter capacitor. This is because the inductor
of the floating buck structure provides continuous current to the LED throughout the entire switching cycle. When
LEDs are driven without filter capacitor, the LED peak current must not set exceeding the rated current of the
LED. The peak LED current is governed by Equation 9.
(9)
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM3414 LM3414HV
RFS = 20 × 109
fSW
RIADJ = 3125
ILED
D = VLED
VIN
VIN
LX
DIM
FS
PGND
IADJ
GND
VCC
* DAP connect to GND
D1
High power LED Array
L1
GND
Iout = 1A
LM3414/14HV
RFS
RIADJ
Vin
GND
4.5V ± 42 VDC (LM3414)
CIN
PWM dimming signal
CVCC
GND
GND
4.5V ± 65 VDC (LM3414HV)
LM3414
,
LM3414HV
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
www.ti.com
8.2 Typical Applications
8.2.1 LM3414/HV Design Example
Figure 22. LM3414/HV Design Example Schematic
8.2.1.1 Design Requirements
• Input Voltage: VIN
• LED String Voltage: VLED
• LED Current: ILED
• Switching Frequency: fSW
• Maximum LED Current Ripple: ΔiL-PP
• Maximum Input Voltage Ripple: ΔVIN
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Calculate Operating Parameters
To calculate component values the operating duty cycle (D) must be calculated using Equation 10.
(10)
8.2.1.2.2 Calculate RIADJ
To get the desired LED current calculate the value for RIADJ using Equation 11.
(11)
8.2.1.2.3 Calculate RFS
Calculate the value of RFS for the desired switching frequency using Equation 12.
(12)
18 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: LM3414 LM3414HV
D = VLED
VIN = 35V
48V = 0.73
VIN
LX
DIM
FS
PGND
IADJ
GND
VCC
* DAP connect to GND
D1
LED x 6
L1
GND
Iout = 1000 mA (nom.)
LM3414 / LM3414HV
RFS
RIADJ
Vin
GND
24V ± 42 VDC (LM3414)
CIN
CVCC
GND
GND
100V
2A
47 PH
100V
2.2 PF
16V 1 PF
3.24k 40.2k
U1
24V - 65 VDC (LM3414HV)
CIN-MIN = D × :1 -D; × ILED
fSW × ¨VIN
LMIN = :VIN - VLED; × VLED
fSW × VIN × ¨iL-PP
LM3414
,
LM3414HV
www.ti.com
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
Typical Applications (continued)
8.2.1.2.4 Calculate LMIN
Calculate the minimum inductor value required for the desired LED current ripple using Equation 13.
(13)
8.2.1.2.5 Calculate CIN-MIN
Calculate the minimum input capacitor value for the desired input voltage ripple using Equation 14.
(14)
8.2.2 LM3414/HV Design Example (IOUT = 1 A)
Figure 23. LM3414/HV Design Example (IOUT = 1 A) Schematic
8.2.2.1 Design Requirements
• Input Voltage: VIN = 48 V ±10%
• LED String Voltage: VLED = 35 V
• LED Current: ILED =1A
• Switching Frequency: fSW = 500 kHz
• Maximum LED Current Ripple: ΔiL-PP ≤500 mA
• Maximum Input Voltage Ripple: ΔVIN ≤200 mV
8.2.2.2 Detailed Design Procedure
8.2.2.2.1 Calculate Operating Parameters
To calculate component values the operating duty cycle (D) for this application can be calculated be calculated
using Equation 15.
(15)
8.2.2.2.2 Calculate RIADJ
For 1A LED current calculate the value for RIADJ using Equation 16.
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LM3414 LM3414HV
CIN-MIN = D × :1 -D; × ILED
fSW × ¨VIN = 0.73 × :1 - 0.73; × 1A
500kHz × 200mV F
LMIN = :VIN - VLED; × VLED
fSW × VIN × ¨iL-PP = :48V - 35V; × 35V
500kHz × 35V × 500mA H
RFS = 20 × 109
fSW = 20 × 109
500kHz = 40k
RIADJ = 3125
ILED = 3125
1A = 3.125k
LM3414
,
LM3414HV
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
www.ti.com
Typical Applications (continued)
(16)
Choose a standard value of RIADJ = 3.24kΩ.
8.2.2.2.3 Calculate RFS
Calculate the value of RFS for 500-kHz switching frequency using Equation 17.
(17)
Choose a standard value of RFS = 40.2kΩ.
8.2.2.2.4 Calculate LMIN
Calculate the minimum inductor value required for 500 mA or less peak-to-peak LED current ripple using
Equation 18.
(18)
Choose a higher standard value of L = 47µH.
8.2.2.2.5 Calculate CIN-MIN
Calculate the minimum input capacitor value for 200 mV or less input voltage ripple using Equation 19.
(19)
Choose a higher standard value of CIN = 2.2µF.
Table 3. Bill of Materials
DESIGNATION DESCRIPTION PACKAGE MANUFACTURE PART NO. VENDOR
LED Driver IC
U1 SOIC-8 LM3414 / LM3414HV TI
LM3414 / LM3414HV
L1Inductor 47 µH 8 × 8 × 4.9 (mm) MMD-08EZ-470M-SI Mag.Layers
D1Schottky Diode 100 V, 2 A SMP SS2PH10-M3 Vishay
CIN Cap MLCC 100V 2.2 µF X7R 1210 GRM32ER72A225KA35L Murata
CVCC Cap MLCC 16V 1 µF X5R 603 GRM39X5R105K16D52K Murata
RIADJ Chip Resistor 3.24 kΩ1% 603 CRCW06033241F Vishay
RFS Chip Resistor 40.2 kΩ1% 603 CRCW06034022F Vishay
20 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: LM3414 LM3414HV
VCC
PGND
IADJ
GND
VIN
LX
DIM
FS
THERMAL/POWER VIA
GND
L1
D1
+
-
RFS
RIADJ
CIN
CVCC
VIN/LED+
LED-
LM3414
,
LM3414HV
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
www.ti.com
9 Power Supply Recommendations
Use any DC output power supply with a maximum voltage high enough for the application. The power supply
should have a minimum current limit of at least 1 A.
10 Layout
10.1 Layout Guidelines
Discontinuous currents are the most likely to generate EMI; therefore, take care when routing these paths. The
main path for discontinuous current in the LM3414/HV buck converter contains the input capacitor (CIN), the
recirculating diode (D1), and the switch node (LX). This loop should be kept as small as possible and the
connections between all three components should be short and thick to minimize parasitic inductance. In
particular, the switch node (where L1, D1 and LX connect) should be just large enough to connect the
components without excessive heating from the current it carries.
The IADJ, FS, and DIM pins are all high-impedance control inputs which couple external noise easily, therefore
the loops containing these high impedance nodes should be minimized. The frequency setting resistor (RFS) and
current setting resistor (RIADJ) should be placed close to the FS and IADJ pins as possible.
10.2 Layout Example
Figure 25. Layout Recommendation
22 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: LM3414 LM3414HV
LM3414
,
LM3414HV
www.ti.com
SNVS678F –JUNE 2010–REVISED NOVEMBER 2015
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
TECHNICAL TOOLS AND SUPPORT AND
PARTS PRODUCT FOLDER SAMPLE AND BUY DOCUMENTS SOFTWARE COMMUNITY
LM3414 Click here Click here Click here Click here Click here
LM3414HV Click here Click here Click here Click here Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Links: LM3414 LM3414HV
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3414HVMR/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3414
HVMR
LM3414HVMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3414
HVMR
LM3414HVSD/NOPB ACTIVE WSON NGQ 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L249B
LM3414HVSDX/NOPB ACTIVE WSON NGQ 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L249B
LM3414MR/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3414
MR
LM3414MRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3414
MR
LM3414SD/NOPB ACTIVE WSON NGQ 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L248B
LM3414SDX/NOPB ACTIVE WSON NGQ 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L248B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3414HVMRX/NOPB SO
Power
PAD
DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM3414HVSD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM3414HVSDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM3414MRX/NOPB SO
Power
PAD
DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM3414SD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM3414SDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jun-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3414HVMRX/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0
LM3414HVSD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0
LM3414HVSDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0
LM3414MRX/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0
LM3414SD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0
LM3414SDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jun-2015
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
6.2
5.8
1.7 MAX
6X 1.27
8X 0.51
0.31
2X
3.81
TYP
0.25
0.10
0 - 8
0.15
0.00
2.34
2.24
2.34
2.24
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
5.0
4.8
B4.0
3.8
4218825/A 05/2016
PowerPAD SOIC - 1.7 mm max heightDDA0008A
PLASTIC SMALL OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MS-012.
PowerPAD is a trademark of Texas Instruments.
TM
18
0.25 C A B
5
4
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.400
EXPOSED
THERMAL PAD
4
1
5
8
www.ti.com
EXAMPLE BOARD LAYOUT
(5.4)
(1.3) TYP
( ) TYP
VIA
0.2
(R ) TYP0.05
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
8X (1.55)
8X (0.6)
6X (1.27)
(2.95)
NOTE 9
(4.9)
NOTE 9
(2.34)
(2.34)
SOLDER MASK
OPENING
(1.3)
TYP
4218825/A 05/2016
PowerPAD SOIC - 1.7 mm max heightDDA0008A
PLASTIC SMALL OUTLINE
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
SCALE:10X
1
45
8
SOLDER MASK
OPENING
METAL COVERED
BY SOLDER MASK
SOLDER MASK
DEFINED PAD
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
TM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(R ) TYP0.05
8X (1.55)
8X (0.6)
6X (1.27)
(5.4)
(2.34)
(2.34)
BASED ON
0.125 THICK
STENCIL
4218825/A 05/2016
PowerPAD SOIC - 1.7 mm max heightDDA0008A
PLASTIC SMALL OUTLINE
1.98 X 1.980.175
2.14 X 2.140.150
2.34 X 2.34 (SHOWN)0.125
2.62 X 2.620.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
SYMM
SYMM
1
45
8
BASED ON
0.125 THICK
STENCIL
BY SOLDER MASK
METAL COVERED SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
www.ti.com
PACKAGE OUTLINE
C
8X 0.3
0.2
2 0.1
8X 0.5
0.3
2X
1.5
1.6 0.1
6X 0.5
0.8
0.7
0.05
0.00
B3.1
2.9 A
3.1
2.9
(0.1) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
45
8
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
9
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1.6)
6X (0.5)
(2.8)
8X (0.25)
8X (0.6)
(2)
(R0.05) TYP ( 0.2) VIA
TYP
(0.75)
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
SYMM
1
45
8
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
9
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
8X (0.25)
8X (0.6)
6X (0.5)
(1.79)
(1.47)
(2.8)
(R0.05) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 9:
82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
45
8
SYMM
METAL
TYP
9
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