F-208 HLE-116-02-G-DV HLE-110-02-G-DV-A HLE-130-02-G-DV .025"SQ SOCKET HLE SERIES SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HLE Insulator Material: Black Liquid Crystal Polymer Contact Material: BeCu Plating: Au over 50" (1,27m) Ni Current Rating: 2.5A @ 80C ambient Operating Temp Range: -55C to +125C Insertion Depth: (1,78mm) .070" to (3,43mm) .135", pass-through, or (2,59mm) .102" min for bottom entry Insertion Force: (Single contact only) 2oz (0,56N) avg. Withdrawal Force: (Single contact only) 1.6oz (0,44N) avg. RoHS Compliant: Yes HLE NO. PINS 1 PER ROW PLATING OPTION 02 TAIL OPTION DV OTHER OPTION -BE Mates With: TSW, MTSW, DW, EW, ZW, TLW, TSM, MTLW, HW -G = 10" (0,25m) Gold Leave blank for Surface Mount = Bottom Entry (Requires Surface Mount or -PE) -A -S = 30" (0,76m) Gold on contact, Matte Tin on tail = Alignment Pin (4 positions min.) Metal or plastic at Samtec discretion (3,66) .144 (6,60) .260 02 thru 50 (1,27) .050 (Requires -BE for Bottom Entry) (1,60) .063 DIA -LC -TE Processing: = Through-Hole Top Entry Max Processing Temp: 230C for 60 seconds, or 260C for 20 seconds 3x Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (02-20) (0,15mm) .006" max (21-50) = Locking Clip (2 positions min.) (1,27) .050 No. of Positions x (2,54) .100 (1,42) .056 (2,54) .100 02 (3,05) .120 (5,08) .200 (2,54) .100 01 -PE (3,51) .138 = Through-hole Pass Through Entry -P = Metal Pick & Place Pad (3 positions min.) (0,51) .020 -PE -K = (6,50mm) .256" DIA Polyimide Film Pick & Place Pad (3 positions min.) Not available with -TE or -PE tail option (2,54) .100 -TE (7,11) .280 x (5,71) .225 (3,86) .152 (2,30) .090 (7,62) .300 (Requires -BE for Bottom Entry) -TR = Tape & Reel Packaging (29 positions max.) Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM