CHIP
RESISTORS
www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61024
76 Revision: 12-Mar-08
CTN
Vishay Electro-Films
Nichrome Thin Film, Center Tapped Resistors
The CTN series is a center tapped nichrome resistor chip
providing excellent stability at 250 mW power levels. The
CTN offers the designer flexibility in use as either a single
value resistor or as two resistors with a center tap feature.
The CTNs six bonding pads allows the user increased layout
flexibility.
The CTNs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The CTNs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
Wire bondable
Center tap feature
Chip size: 0.030 inches square
Resistance range total: 10 Ω to 1 MΩ
Ratio tolerances to: 0.1 %
Resistor material: Nichrome
Oxidized silicon substrate for good power dissipation
APPLICATIONS
The CTN center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, high power and
tracking between two resistors is critical.
Recommended for Hermetic environment where die is not exposed to moisture.
For low values, the resistance of the six bonding-pad configurations can vary, depending on the method of measurement used.
Vishay EFI measures low-value resistors by the four wire Kelvin technique.
* 20 ppm/°C for R < 20
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
203 263
202 262
200 260
201 261
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
0.1 %
1 MΩ200 Ω10 Ω100 Ω
0.5 %
Tightest Standard Tolerance Available
± 10 ppm/°C
± 100 ppm/°C
± 50 ppm/°C
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
TCR Tracking Between Halves (RA/RB)± 2 ppm/°C *
Center Tap Ratio, RA/RB Tolerance 1 ± 1 % standard
Noise, MIL-STD-202, Method 308, 100 Ω - 250 kΩ- 35 dB typ.
Stability, 1000 h, + 125 °C, 125 mW ± 0.1 % ΔR/R
Operating Temperature Range- 55 °C to + 125 °C
Dielectric Voltage Breakdown 200 V
Insulation Resistance 1012 min.
Operating Voltage100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 250 mW
CHIP
RESISTORS
Document Number: 61024 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 12-Mar-08 77
CTN
Nichrome Thin Film, Center Tapped Vishay Electro-Films
CONFIGURATIONS in inches
SCHEMATIC
Options: Alphanumeric part marking, up to six characters
Gold backing for eutectic die attach
Center tap ratio tolerances to 0.01 %
Consult Applications Engineer
0.030
0.026 0.030
RARB
STANDARD CONFIGURATION
Six locations. All pads 0.005 x 0.005 inch
TYPICAL RANGE
10 Ω - 49 Ω
TYPICAL RANGE
50 Ω - 199 Ω
TYPICAL RANGE
100 Ω - 1 MΩ
RARB
RT = RA + RB
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material Nichrome
Bonding Pad Size 0.005 x 0.005 (0.127 x 0.127 mm) minimum
Number of Pads 6
Pad Material 15 kÅ minimum gold standard
Backing None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION/
PACK AGING
W = 100 % visually inspected
parts in matrix trays per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrixtrays (4 % AQL)
CTN
PRODUCT
FAMILY
201
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 significant
digits of resistance (RT)
1
MULTIPLIER
CODE
C = 0.001
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
4 = 10 000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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All product specifications and data are subject to change without notice.
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therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
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