AT80602002712AASLBFH - INTEL - Datasheet.Directory

Document Number: 322847-003

Intel® Atom™ Processor N400 &

N500 Series

Datasheet - Volume 1

This is volume 1 of 2. Refer to Document Ref# 322848 for Volume 2.

June 2011

Revision 003

2Specification Update

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Specification Update 3

Contents

1Introduction..............................................................................................................8

1.1 Processor Features ..............................................................................................8

1.2 Interfaces...........................................................................................................9

1.2.1 System Memory Supp ort.......... .......... .. .. ... .......... .. .. ..................... ... .. ........9

1.2.2 Direct Media Interface Features................................................................10

1.2.3 Integrated Graphics Controller ................... ............ .. ............. ............. .. ....10

1.3 Clocking...........................................................................................................11

1.4 Power Manageme nt Sup port ......... ........... .. .. ........... .. .. .......... ... .. .......... .. .. ...........11

1.5 Package...........................................................................................................11

1.6 Terminology .....................................................................................................11

1.7 References .......................................................................................................13

1.8 System Block Diagram................. ........... .. .. ..................... .. .. ... .......... .. .. .............14

2 Signal Desc ription....................................................................................................15

2.1 Processor Legacy Signals....................................................................................16

2.2 System Memory Interface............. ... .. ...................................................... ...........19

2.3 Reset and Miscellaneous Signals..........................................................................20

2.4 DMI - Direct Media Interface...............................................................................21

2.5 PLL Signals.. .. .......... ... .. .......... .. ........... .. .. ........... .. .. .......... .. ... .......... .. .. ........... ..22

2.6 Analog Display Signals .......................................................................................22

2.7 LVDS Signals....................................................................................................23

2.8 TAP Signals ........................ .. .. ........... .. .. .......... ... .......... .. .. ........... .. .. ........... .. .. ..23

2.9 Error and Thermal Protection ..............................................................................24

2.10 Processor Core Power Signals..............................................................................24

2.11 Graphics, DMI and Memory Core Power Signals .....................................................25

2.12 Ground ............................................................................................................25

3 Functional Description.............................................................................................26

3.1 Integrated Memory Co ntroller ........................ .. .. ... .......... .. .. .. ...................... .. .. .. ..26

3.1.1 System Memory Organization Modes.........................................................26

3.1.2 System Memory Technology Supported .....................................................26

3.1.3 Rules for populating SO-DIMM slots ..........................................................27

3.1.4 Intel® Fast Memory Access (Intel® FMA) Technology Enhancements .............28

3.1.5 DRAM Clock Generation...........................................................................29

3.2 Integrated Graphics Controller ........................... ............. ............. ............ ...........29

3.2.1 3D Graphics Pipeline...............................................................................29

3.2.2 Video Engine ................. .. ... .......... .. .. ........... .. .. ........... .. .. .......... .. ...........30

3.2.3 2D Engine .............................................................................................31

3.2.4 Display Pipes .........................................................................................32

3.2.5 Display Ports .........................................................................................32

3.2.6 VESA/VGA Mod e............. ........... .. .......... ... .. .......... .. ........... .. .. ........... .. ....36

3.2.7 Multiple Display Configurations.................................................................36

3.3 Thermal Sensor................. ..................... .. .. ........... .. .. .......... ... .. .......... .. .. ...........36

3.3.1 PCI Device 0, Function 0 .........................................................................36

3.4 Power Manageme nt ............. ........... .. .. .......... .. ........... .. .. ........... .. .. .......... ... .. ......37

3.5 Intel® Hyper-Thre ading Te chnolog y ......... .. .. .. .. .. ............. ....................... .............37

4 Electrical Specifications...........................................................................................38

4.1 Power and Ground Balls .....................................................................................38

4Intel Confidential Specification Update

4.2 Decoupling Guideline s ................. .. .......... .. .. ..................... ... .. .. .......... .. ... ............38

4.2.1 Voltage Rail Decoupling.............. .. ........... .. .. .. ................................ .. .. .. ....38

4.3 Processor Clocking.............................................................................................39

4.3.1 PLL Power Su pp ly ............ .. .......... .. ........... .. .......... ... .. .......... .. ........... .. .. ..39

4.4 Voltage Identification (VID).................. .. .... .........................................................39

4.5 Catastrophic Thermal Protection ..........................................................................41

4.6 Reserved or Unused Signals................................................................................41

4.7 Signal Groups ...................................................................................................41

4.8 Test Access Port (TAP) Connection......................... ....................... .......................42

4.9 Absolute Maximum and Minimum Ratings..............................................................42

4.10 DC Specifications.......................... .. .. .......... .. ... .......... .. .. ........... .. .. .....................43

4.10.1 Voltage and Current Spe cifications.......... ............ ....................... ...............43

4.10.2 Interface DC Spec ifications ......... .. .. .. .. ............. ....................... .................47

5 Power Management .................................................................................................54

5.1 ACPI States Supported .......................................................................................54

5.1.1 System States................. .. .. .......... .. .. ........... .. .. ........... .. .. ........... .. .. ........54

5.1.2 Processor Idle States...............................................................................54

5.1.3 Integrated Graphics Display St ates ........... ....................... ....................... ..55

5.1.4 Integrated Memory Controller States......... .. ....................... .......................55

5.1.5 DMI States ............................................................................................55

5.1.6 Interface State Combinations ................... .. .......... .. ... .. .......... .. .. ...............55

5.2 Processor Core Power Management......................................................................56

5.2.1 Enhanced Intel SpeedStep® Technology....................................................56

5.2.2 Dynamic Cache Sizing .............................................................................57

5.2.3 Low-Power Idle States............................................................................. 57

5.2.4 Thread C-states Description .....................................................................60

5.2.5 Processor Core/Package C-states Description..............................................61

5.3 External Thermal Sensor PM_EXTTS1#: Implementation for Fast C4/C4E Exit............64

6 Thermal Specifications and Design Considerations...................................................66

6.1 Thermal Specifications.......................................... .. .. .. ..................... .. .. ... ............66

6.1.1 Thermal Diode.............. ... .. .......... .. .. ..................... ... .. ..................... .. .. ....67

6.1.2 Intel® Therm a l Monitor........................... .. .. .......... ... .. ..................... .. .. ....69

6.1.3 Digital Therma l Sensor............... .. .. ........... .. .. ..................... .. .. .................71

6.1.4 Out of Specification Detection...................................................................72

6.1.5 PROCHOT# Signal Pi n ... ........... .. .. ..................... .. .. ... .......... .. .. .................72

7 Package Mechanical Specifications and Ball Information..........................................74

7.1 Package Mechanical Specifications .......................................................................74

7.1.1 Package Mechanical Drawings...................................................................74

7.1.2 Package Loading Specifications.................................................................75

7.2 Processor Ballout Assignment..............................................................................75

Specification Update 5

Figures

Figure 1-1 Platform Block Diagram...........................................................................14

Figure 3-2 LVDS Signals and Swing Voltage ..............................................................34

Figure 3-3 LVDS Clock and Data Relationship ............................................................34

Figure 3-4 Panel Power Sequencing..........................................................................35

Figure 4-5 VCC and ICC Processor Loadline.................................................................45

Figure 5-6 I dle Power Management Breakdown of the Processor Thread............ ............58

Figure 5-7 Thread C-state.......................................................................................59

Figure 5-8 Processor Core Low-power States.............................................................59

Figure 5-9 PM_EXTTS1#/DPSLPVR Implementation for Fast C4/C4E Exit.......................65

Figure 7-10 Package Mechanical Drawings ..................................................................74

Figure 7-11 Package Pinmap (Top View, Upper-Left Quadrant) ......................................75

Figure 7-12 Package Pinmap (Top View, Upper-Right Quadrant) ....................................76

Figure 7-13 Package Pinmap (Top View, Lower-Left Quadrant) ......................................77

Figure 7-14 Package Pinmap (Top View, Lower-Right Quadrant) ....................................78

Tables

Table 2-1 Signal Types..........................................................................................15

Table 2-2 Signal Description Buffer Types................................................................15

Table 2-3 Processor Legacy Signals.........................................................................16

Table 2-4 System Memory Interface. .......................................................................19

Table 2-5 Memory Reference and Compensation.......................................................20

Table 2-6 Reset and Miscellaneous Signals...............................................................20

Table 2-7 DMI - Processor to Chipset Serial Interface ................................................21

Table 2-8 PLL Signals............................................................................................22

Table 2-9 Analog Display Signals ............................................................................22

Table 2-10 LVDS Signals.........................................................................................23

Table 2-11 TAP Signals ...........................................................................................23

Table 2-12 Error and Thermal Protection ...................................................................24

Table 2-13 Processor Core Power Signals...................................................................24

Table 2-14 Power Signals ........................................................................................25

Table 2-15 Ground .................................................................................................25

Table 3-16 Supported SO-DIMM Module Configurations ...............................................27

Table 3-17 Supported DDR3 S0-DIMM module Configurations ......................................27

Table 3-18 Analog Port Characteristics ......................................................................33

Table 3-19 Panel Power Sequencing Timing Parameters...............................................35

Table 4-20 Voltage Identification Definition................................................................39

Table 4-21 Processor Absolute Minimum and Maximum Ratings....................................42

Table 4-22 Processor Core Active and Idle Mode DC Voltage and Current Specifications ...44

Table 4-23 Processor I/O Buffer Supply DC Voltage and Curre nt Sp ecif ications ...............46

Table 4-24 Input Clocks (BCLK, HPL_CLKIN, REFCLKIN, EXP_CLKIN) Differential

Specification..........................................................................................47

Table 4-25 DDR2/DDR3 Signal Group DC Specifications...............................................47

Table 4-26 GTL Signal Group DC Specifications ..........................................................48

Table 4-27 Legacy CMOS Signal Group DC Specification ..............................................49

Table 4-28 Open Drain Signal Group DC Specification..................................................50

Table 4-29 PWROK and RSTIN# DC Specification........................................................50

Table 4-30 CPUPWRGOOD DC Specification................................................................50

6Intel Confidential Specification Update

Table 4-31 DDR3_DRAM_PWROK DC Specification ......................................................51

Table 4-32 TAP Signal Group DC Specification ............................................................52

Table 4-33 CRT_DDC_DA TA. CRT_DDC_CLK DC, LDDC_DA TA, LDDC_CLK, LCTLA_CLK, and

LCTLB_DATA Specification .......................................................................52

Table 4-34 CRT_HSYNC and CRT_VSYNC DC Specification............................................53

Table 4-35 LVDS Interface DC Specification (functional operating range,

VCCLVDS = 1.8V +/- 5%) .......................................................................53

Table 4-36 LVDD_EN, LBLKLT_EN and LBKLT_CTL DC Specification ...............................53

Table 5-37 System States........................................................................................54

Table 5-38 Processor Core/Package States Support.....................................................54

Table 5-39 Integrated Graphics Display Device Control................................................55

Table 5-40 Main Memory States................................................................................55

Table 5-41 DMI States ............................................................................................55

Table 5-42 G, S and C State combinations .................................................................55

Table 5-43 D, S and C state Combinations .......... .. ... .. ................................. ...............56

Table 5-44 Coordination of Thread Low-power States at the Package/Core Level......... .. ..60

Table 6-45 Power Specifications for the Processor.......................................................67

Table 6-46 Thermal Diode Interface ..........................................................................68

Table 6-47 Thermal Diode Parameters using Transistor Model.......... .. .. .......... ... .......... ..68

Table 7-48 Processor Ball List by Ball Name ...............................................................79

Specification Update 7

Revision History

Revision

Number Descriptio n Revision Da te

001 • Initial release December 2009

002

• Updated Table 4-22: Added Icc data for Intel® Atom™ Processor N470

series as a new SKU

• Updated Table 6-45: Added TDP data for Intel Atom Processor N470 as a

new SKU

April 2010

003 • Inserted Intel® Atom™ N500 series information to Datasheet June 2011

Introduction

8Datasheet

1 Introduction

The document provides DC electrical specifications, pinout and signal definitions,

interface functional descriptions, and additional feature information pertinent to the

implementation and operation of the processor on its respective platform.

Throughout this document, Intel® Atom™ Processor N400 Series is referred as the

processor and Intel® NM10 Family Express Chipset is referred as the chipset.

The processor is built on 45-nanometer Hi-K process technology. The processor is

designed for a two-chip platform as opposed to the traditional three-chip platforms

(processor, GMCH, and ICH). The two-chip platform consists of a processor and a

chipset which enables better performance, lower cost, easier validation, and improved

x-y footprint. The processor is offered in an BGA559 package.

Included in this family of processors is an integrated memory controller (IMC),

integrated gr aphics processing unit (GPU ) and integrated I/O (IIO) (such as DMI) on a

single silicon die. This single die solution is known as a monolithic processor.

1.1 Processor Features

The following list provides some of the key features on this processor:

•On die, primary 32-kB instructions cache and 24-kB write-back data cache

•Intel® Hyper-Threading Technology (2 threads)

•On die 512-kB, 8-way L2 cache

•Support IA 32-bit and Intel® 64 architecture

•Intel® Streaming SIMD Extensions 2 and 3 (SSE2 and SSE3) and Supplemental

Streaming SIMD Extensions 3 (SSSE3) support

•Micro-FCBGA8 packaging technologies

•Thermal management support via Intel® Thermal Monitor 1 (TM1) and Intel®

Thermal Monitor 1 (TM2)

•Support C-state of C0/C1(E)/C2(E)/C4(E)

•Enhanced Intel® SpeedStep Technology (EIST)

•Support L2 dynamic cache sizing

•Execute Disable Bit support for enhanced security

Datasheet 9

Introduction

1.2 Interfaces

1.2.1 System Memory Support

Support DDr2 SDRAMs (N450 and N470 support DDR2 only)

•One channel of DDR2 memory (consists of 64-bit of data lines):

— Maximum of two SO-DIMMs in Raw Card-A or Raw Card-C format

•Memory DDR2 data transfer rates of 667 MT/s

•I/O Voltage of 1.8 V for DDR2

•Non-ECC, unbuffered DDR2 SO-DIMMs only

•512-Mb, 1-Gb and 2-Gb DDR2 DRAM technologies supported

•Maximum of 2-GB memory capacity supported

— Maximum 1-GB memory capacity on one SO-DIMM or Memory Down

•Memory organizations:

— Two SO-DIMMs

— One SO-DIMM only

— One SO-DIMM and One Memory Down (based on simulations only)

•Up to 32 simultaneous open pages (assuming 4 Ranks of 8 Bank Devices)

•Partial Writes to memory using Data Mask signals (DM)

•On-Die Termination (ODT)

•Intel® Fast Memory Access (Intel FMA)

— Just-in-Time Command Scheduling

— Command Overlap

— Out-of-Order Scheduling

— Opportunistic Writes

•Support memory thermal management scheme to selectively manage reads and/or

writes. Memory thermal management can be triggered by either on-die thermal

sensor, or by preset limits. Management limits are determined by weighted sum of

various commands that are scheduled on the memory interface.

•

Support DDR3 SDRAMs:

•Support for DDR3 at data transfer rate of 667 MT/s

•One channel of DDR3 memory (consists of 64-bit of data lines): Maximum of two

SO-DIMMs in Raw Card-A or Raw Card-B format

•I/O Voltage of 1.5 V for DDR3

Introduction

10 Datasheet

•Maximum of 2-GB system memo ry capacity supported on one SO-DIMM or two SO-

DIMMs

•Memory organizations supported (refer to the Platform Design Guide for more

details - DIMM populating rules and Clock/Control signals ordering):

—Two SO-DIMMs

—One SO-DIMM only

1.2.2 Direct Media Interface Features

•Compliant to Direct Media Interface (DMI)

•Support 2 lanes in each direction, point-to-point DMI interface to the chipset

•Raw bit-rate on the data pins of 2.5Gb/s, resulting in a real bandwidth per pair of

250MB/s given the 8b/10b encoding used to transmit data across this interface.

Does not account for packet overhead and link maintenance

•Maximum theoretical bandwidth on interface of 500MB/s in each direction

simultaneously, for an aggregate of 1GB/s for the interface

•100-MHz reference clock

•64-bit downstream address (only 36-bit addressable from the processor)

•APIC messaging support. Will send Intel-defined “End of Interrupt” broadcast

message when initiated by the processor

•Message Signaled Interrupt (MSI) messages supported

•Power Management state change messages supported

•SMI, SCI and SERR error indication

•Legacy support for IS A regim e protocol (P HOLD/PHOLDA) required for par allel port

DMA, floppy drive, and LPC bus masters

•Hybrid AC-DC coupling solution between the processor and the chipset

•Polarity inversion supported

1.2.3 Integrated Graphics Controller

•The integrated gr aphics controller contains a refresh of the 3rd generation gr aphics

core

•Intel® Dynamic Video Memory Technology 4.0

•Directx* 9 compliant Pixel Shader 2.0

•200-MHz render clock frequency

•Two display ports: LVDS and RGB

— Integrated single LVDS channel support resolution up to 1280*800 or 1366*768

— Analog RGB display output up to resolution 1400x1050 @ 60Hz

•Intel® Clear Video Technology

Datasheet 11

Introduction

— MPEG2 Hardware Acceleration

—ProcAmp

1.3 Clocking

•Differential Core clock of 166 MHz (BCLKP/BCLKN)

•Differential Host clock of 166 MHz (HPL_CLKINP/HPL_CLKINN)

•The differential DMI clock of 100 MHz (EXP_CLKINP/EXP_CLKINN)

•Display timings are generated from display PLLs that use a 96 MHz or 100 MHz

differential clock as reference.

•All of the above clocks are capable of tolerating Spread Spectrum clocking.

•Memory clocks generated from internal Host PLLs

•Host, Memory, DMI, Display PLLs and all associated internal clocks are disabled

until PWROK is asserted.

1.4 Power Management Support

•Processor Core:

— Full support of ACPI C-states as implemented by the following processor C-

states: C0/C1(E)/C2(E)/C4(E)

— Enhanced Intel SpeedStep® Technology

•Thermal Management 1 (TM1) and Thermal Management 2 (TM2)

•System states: S0 , S3, S4 and S5

•DMI: L0s and L1 ASPM power management capability

1.5 Package

•The processor is a Micro-FCBGA8 type of package at 22mmx22mm package size

1.6 Terminology

(Sheet 1 of 3)

Term Description

BGA Ball Grid Array

BLT Block Leve l Transfe r

CRT Cathode Ray Tube

DDR2 Second generation Double Data Rate SDRAM memory technology

DDR3 Third generation Double Data Rate SDRAM memory technology

Introduction

12 Datasheet

DMA Direct Memory Access

DMI Direct Media Interface

DTS Digital Thermal Sensor

ECC Error Correction Code

Enhanced Intel

SpeedStep®

Technology

Technology that provides power management capabilities to laptops.

Execute Disable Bit The Execute Disable bit allows memory to be marked as executable or

non-executable, when combined with a supportin g operating syste m.

If code attempts to run in non-executable memory the processor

raises an error to the operating system. This feature can prevent some

classes of viruses or worms that exploit buffer overrun vulnerabilities

and can thus help improve the overall security of the system. See the

Intel® 64 and IA-32 Architectures Software Developer's Manuals for

more detailed information.

Micro-FBGA Micro Flip Chip Ball Grid Array

(G)MCH Legacy component - Graphics Memory Controller Hub.

GPU Graphics Processing Unit

ICH The legacy I/O Controller Hub component that contains the main PCI

interface, LPC interface, USB2, Serial ATA, and other I/O functions. It

communicates wi th the legacy ( G)MCH over a pr oprietary interconn ect

called DMI.

IMC Integrated Memory Controller

Intel® 64 Technology 64-bit m emory extensions to the IA-32 architecture.

LCD Liquid Crystal Display

LVDS Low Voltage Differential Signaling

A high speed, low power data transmission standard used for display

connections to LCD panels.

NCTF Non-Critical to Function: NCTF locations are typically redundant

ground or non-critical reserved, so the loss of the solder joint

continuity at end of life conditions will not affect the overall product

functionality.

Processor Core The term “processor core” refers to Si licon die itse lf which may cont ain

single or multiple execution cores.

Rank A unit of DRAM corresponding four to eight devices in parallel, ignoring

ECC. These devices are usually, but not always, mounted on a single

side of a SO-DIMM.

SCI System Control Interrupt. Used in ACPI protocol.

TDP Thermal Design Power

TOM Top of Memory

TTM Time-To-Market

VCC Processor core power supply

(Sheet 2 of 3)

Term Description

Datasheet 13

Introduction

1.7 References

Please refer to the following documents which may be beneficial when reading this

document or for additional information:

VSS Processor ground

VCCGFX Graphics core power supply

VCCSM DDR2/DDR3 power rail

(Sheet 3 of 3)

Term Description

Document Document

Number

Intel® 64 and IA-32 Architectures Software Developer's Manuals

Volume 1: Basic Architecture

http://

www.intel.com/

products/processor/

manuals/index.htm

Volume 2A: Instruction Set Reference, A-M

Volume 2B: Instruction Set Reference, N-Z

Volume 3A: System Programming Guide

Volume 3B: System Programming Guide

AP-485, Intel® Processor Identification and CPUID Instruction Application

Note 241618

Intel® Atom™ Processor N400 Series Datasheet - Volume 2 322848

Intel® Atom™ Processor N400 Series Specification Update 322849

Intel® NM10 Express Chipset Datasheet 322896

Introduction

14 Datasheet

1.8 System Block Diagram

Figure 1-1.Platform Block Diagram

DDR2/3

D M I

DDR2/

DDR3

System Memory

CH A

VGA

Anal og

Display

USB 2. 0

8 Ports

GPIO

SATA

2 Ports

Intel®Hi gh

D efinition Audio

CODECs

Firmware

Power

Management

Clock

Generation

SMBus 2.0

LAN

WLAN

PCIe Bus

O ther D evices

PCI Bus P CI Devices

DDR2/

DDR3 : 667 MT/s

Intel®NM10 Express

Chipset

Intel®Atom™

Processor N400/

N500 Series

S P I

Flash

SPI

LPC/FWH

LVDS

LCI

Datasheet 15

Signal Description

2 Signal Description

This chapter describes the processor signals. They are arranged in functional groups

according to their associated interface or category. The following notations are used to

describe the signal type.

The signal description also includes the type of buffer used for the particular signal.

Table 2-1. Signal Types

Notations Signal Type

I Input Pin

OOutput Pin

I/O Bi-directional Input/Output Pin

Table 2-2. Signal Description Buffer Types

Signal Description

CMOS CMOS buffers. 1.05-V tolerant

DMI Direct Media Interface signals. These signals are compatible with PCI Express*

1.0 signalli ng environment AC specifications but are DC coupled. The buffers are

not 3.3-V tolerant.

HVCMOS High Voltage buffers. 3.3-V tolerant

DDR2/DDR3 DDR2/DDR3 buffers: 1.8-V/1.5-V tolerant respectively

TAP Test Access Port signal

Analog Analog reference or output. May be used as a threshold voltage or for buffer

compensation

Ref Voltage reference signal

GTL+ Gunning Transceiver Logic signaling technology. Refer to GTL+ I/O Specificatio n

for complete details.

Asynch This signal is asynch ronous and has no timing relationship with any reference

clock.

LVDS Low Voltage Differential Signalling. A high speed, low power data transmission

standard used for display connections to LCD panels.

SSTL - 1.8/

1.5 Stub Series Termination Logic. Thes e are 1.8-V (DDR2) or 1.5- V (DDR 3) ou tput

capable buffers. 1.8-V or 1.5-V tolerant.

Signal Description

16 Datasheet

2.1 Processor Legacy Signals

Table 2-3. Processor Legacy Signals

Signal Name Description Direction Type

A20M# If A20M# (Address-20 Mask) is asserted, the

processor masks physical address bit-20 (A20#)

before looking up a line in any internal cache and

before driving a read/write transaction on the bus.

Asserting A20M# emulates the 8086 processor's

address wrap-around at the 1-MB boundary.

Assertion of A20M# is only supported in real mode.

ICore

CMOS

BSEL[2:0] BSEL[2:0] (Bus Select) are used to select the

processor input clock frequency. OCore

CMOS

CPUPWRGOOD CPUPWRGOOD (Power Good) is a processor input.

The processor requires this signal to be a clean

indication that the clocks and power supplies are

stable and within their spe cificati ons. ‘Clean’ i mplies

that the signal will remain low (capable of sinking

leakage current), without glitches, from the ti me

that the power supplies are turned on until th ey

come within specification. The signal must then

transition monotonically to a high st ate.

CPUPWRGOOD can be driven inactive at any time,

but clocks and power must again be stable before a

subsequent rising edge of CPUPWRGOOD. It must

also meet the minimum pulse width specification.

The CPUPWRGOOD signal must be supplied to the

processor; it is used to protect internal circuits

against voltage sequencing issues. It should be

driven high throughout boundary scan operation.

ICore

CMOS

DPRSTP# DPRSTP#, when asserted on the platform causes the

processor to tr ansition from the Deep Slee p State to

the Deeper Sleep state . In order to return to the

Deep Sleep State, DPRSTP# must be deasserted.

DPRSTP# is driven by the chipset.

ICore

CMOS

DPSLP# DPRSLP#, when asserte d on the platform causes the

processor to transition from the Sleep State to the

Deep Sleep state. In order to return to the Sleep

State, DPSLP# must be deasserted. DPRSTP# is

driven by the chipset.

ICore

CMOS

EXTBGREF External Bandgap Reference. I Core

Analog

Datasheet 17

Signal Description

FERR# FERR# (Floating-point Error) is a multiplex ed signal

and its meaning is qualified with STPCLK#. When

STPCLK# is not asserted, FERR# indicates a floating

point when the processor detects an unmasked

floating-point error. FE RR# is simil ar to the ERROR#

signal on the Intel 387 coprocessor, and is included

for compatibility with systems using MSDOS*- type

floating-point error reporting. When STPCLK# is

asserted, an assertion of FERR# indicates that the

processor has a pending break event waiting for

service. The assertion of FERR# indicates that the

processor should be returned to the Normal state.

When FERR# is asserted, indicating a break event, it

will remain asserted until STPCLK# is deasserted.

Assertion of PREQ# when STPCLK# is active will also

cause an FERR# break event.

For additional information on the pending break

event functionality, including identification of

support of the feature and enable/disable

information, refer to Volume 3 of the Intel® 64 and

IA-32 Architectures Software Developer's Manuals

and the Intel® Processor Identification and CPUID

Instruction Application Note.

OCore

Open

Drain

GTLREF Reference voltage for BPM* pins. I Core

Analog

IGNNE# IGNNE# (Ignore Numeric Error) is asserted to force

the processor to ignore a numeric error and continue

to execute non-control floating-point instructions. If

IGNNE# is deasserted, the processor generates an

exception on a non-control floating-point i nstruc tion

if a previous floating-point instruction caused an

error. IGNNE# has no effect when the NE bit in

control register 0 (CR0) is set.

ICore

CMOS

INIT# INIT# (Initialization), when asserted, resets integer

registers inside the processor without affecting its

internal caches or floating-point registers. The

processor then begins execution at the power-on

Reset vector configured during power-on

configuration. The processor continues to handle

snoop requests during INIT# assertion.

ICore

CMOS

Table 2-3. Processor Legacy Signals

Signal Name Description Direction Type

Signal Description

18 Datasheet

LINT0, LINT1 LINT[1:0] (Local APIC Interrupt) must connect the

appropriate pins of all APIC Bus agents. When the

APIC is disabled, the LINT0 signal becomes INTR, a

maskable interrupt request signal, and LINT1

becomes NMI, a non-maskable interrupt. INTR and

NMI are backward compatible with the signals of

those names on the Pentium processor.

Both of these signa ls m ust be software configured

via BIOS programming of the APIC register space to

be used either as NMI/INTR or LINT0/LINT1.

Because the APIC is enabled by default after Reset,

operation of these pins as LINT0/LINT1 is the default

configuration.

ICore

CMOS

SMI# SMI# (System Management Interrupt) is asserted

asynchronously by system logi c. On accepting a

System Management Interrupt, the processor saves

the current state and enter System Management

Mode (SMM). An SMI Acknowledge transaction is

issued, and the processor begins program execution

from the SMM handler. If SMI# is asserted during

the deassertion of R ESET# the processor will tristate

its outputs.

ICore

CMOS

STPCLK# Stop clock, when asserted, causes the processor to

enter a low power Stop-Grant state. The processor

issues a Stop-Grant Acknowledge transaction, and

stops providin g internal clock signals to all processor

core units. The processor continues to snoop bus

transactions and service interrupts while in Stop-

Grant state. When STPCLK# is deasserted, the

processor restarts its internal clock to all units and

resumes execution.

ICore

CMOS

THERMDA_1

THERMDC_1 Thermal Diode - Anode & Cathode of the processor. I

OCore

Analog

THERMDA_2/RSVD

THERMDC_2/RSVD Reserved pins of Thermal Diode. I

OCore

Analog

BPM_1#[3:0]

BPM_2#[3:0]/

RSVD

Breakpoint and Performance Monitor Signals: Output

from the processor that indicate the status of

breakpoints and programmable counters use d for

monitoring processor performance.

BPM_2#[3:0]/RSVD are reserved pins.

I/O GTL+

PRDY# PRDY# is a processor output used by debug tools to

determine processor debug readiness. O Asynch

GTL+

PREQ# PREQ# is used by debug tools to request debug

operation of the processor. I Asynch

GTL+

Table 2-3. Processor Legacy Signals

Signal Name Description Direction Type

Datasheet 19

Signal Description

2.2 System Memory Interface

Table 2-4. System Memory Interface

Signal Name Description Direction Type

DDR_A_CK_[1:0] SDRAM Diffe r ential Clock: SDRAM

Differential clock signal pair. OSSTL-1.8

DDR_A_CK#_[1:0] SDRAM Inverted Differential Clock:

SDRAM Differential clock signal-pair

complement.

OSSTL-1.8

DDR_A_CK_[4:3] SDRAM Diffe r ential Clock: SDRAM

Differential clock signal pair. OSSTL-1.8

DDR_A_CK#_[4:3] SDRAM Inverted Differential Clock:

SDRAM Differential clock signal-pair

complement.

OSSTL-1.8

DDR_A_CS#_[3:0] Chip Select: (1 per Rank) used to select

particular SDRAM components during the

active state.

There is one Chip Select for each SDRAM rank.

OSSTL-1.8

DDR_A_CKE_[3:0] Clock Enable: (1 per Rank) used to:

• Initialize the SDRAM duri ng power-up

• Power-down SDRAM ranks

• Place all SDRAM ranks into an d out of self-

refresh during STR

OSSTL-1.8

DDR_A_MA_[14:0] Multiplexed Address: These signals are used

to provide the multiplexed row and column

address to the SDRAM.

OSSTL-1.8

DDR_A_BS_[2:0] Bank Select: These signals define which

banks are selected within each SDRAM rank. OSSTL-1.8

DDR_A_RAS# RAS Control Signal: Used with DDR_A_CAS#

and DDR_A_WE#

(along with DDR_A_CS#) to define the SDRAM

commands.

OSSTL-1.8

DDR_A_CAS# CAS Co ntrol Signal: Used with DDR_A_RAS#

and DDR_A_WE#

(along with DDR_A_CS#) to define the SDRAM

commands.

OSSTL-1.8

DDR_A_WE# Write Enable Control Signal: Used with

DDR_A_RAS# and DDR_A_CAS# (along with

DDR_A_CS#) to define the SDRAM

commands.

OSSTL-1.8

DDR_A_DQ_[63:0] Data Bus: Channel data signal interface to the

SDRAM data bus I/O SSTL-1.8

Signal Description

20 Datasheet

2.3 Reset and Miscellaneous Signals

DDR_A_DM_[7:0] Data Mask: These signals are used to mask

individual bytes of data in the case of a partial

write, and to interrupt burst writes.

When activated during writes, the

corresponding data groups in the SDRAM are

masked. There is one DDR_A_D M_[7:0] for

every data byte lane.

OSSTL-1.8

DDR_A_DQS_[7:0] Data Strobes: DDR_A_DQS_[7:0] and its

complement signal group make up a

differential strobe pair. The data is captured at

the crossing point of DDR_A_DQS_[7:0] and

its DDR_A_DQS#_[7:0] durin g re ad and wri te

transactions.

I/O SSTL-1.8

DDR_A_DQS#_[7:0] Data Strobe Complements: These are the

complementary strobe si gnals. I/O SSTL-1.8

DDR_A_ODT_[3:0] On-Die-Termination: Active Termination

Control OSSTL-1.8

Table 2-5. Memory Refere nce and Compensation

Signal

Name Description Direction Type

DDR_RPD System Memory RCOMP signal. I/O Analog

DDR_RPU System Memory RCOMP signal. I/O Analog

DDR_VREF SDRAM Reference Voltage I Analog

Table 2-6. Reset and Miscellaneous Signals (Sheet 1 of 2)

Signal Name Description Direction Type

RSTIN# Reset In: When asserted, this signal will

asynchronously reset the CPU logic. The signal is

connected to the PLTRST# output of the south

bridge.

This input should have a Schmitt trigger to avoid

spurious resets.

This signal is required to be 3.3-V tolerant.

IHVCMOS

PWROK Power OK: When asserted, PWROK is an

indication to the processor that core power has

been stable.

This input should have a Schmitt trigger to avoid

spurious resets. This signal is required to be 3.3-

V tolerant.

IHVCMOS

Table 2-4. System Memo ry Interface

Signal Name Description Direction Type

Datasheet 21

Signal Description

2.4 DMI - Direct Media Interface

PM_EXTTS[1:0]# External Thermal Sensor Input:

If the system temperatu re reaches a dangerously

high value then this signal can be used to trigger

the start of system memory throttling.

EXTTS1# can alternately be used to implement

fast C4/C4E exit. See Section 5.3 for details. This

functionality is not available on EXTTS0#.

IHVCMOS

DDR3_DRAM_PWR

OK DDR3 Power Good Monitor. Driven by

platform logic for DDR3. Reserved pin for

DDR2 design.

ICMOS-

1.5

DDR3_DRAMRST# DDR3 DRAM Reset. Reset signal from IMC

to DRAM devices; one for all SO-DIMMs. Used

only in DDR3 mode; reserved pin for DDR2

design.

O SSTL-

1.5

RSVD Reserved. Must be left unconnected on the

board. Intel does not recomme nd a te st point on

the board for this ball.

N/A N/A

RSVD_NCTF Reserved/non-critical to function. Pin for

package mechanical reliability. A test point may

be placed on the board for this ball.

N/A N/A

RSVD_TP Reserved-test-point. A test point may be

placed on the board for this ball. N/A N/A

XDP_RSVD_[17:0] Reserved XDP debug signals. Connect to XDP

connector; or just left as Not-Connected except

for XDP_RSVD_9 - pull this pin to low for normal

operation.

N/A N/A

Table 2-7. DMI - Processor to Chipset Serial Interface

Signal Name Description Direction Type

DMI_RXP[1:0]

DMI_RXN[1:0] DMI input from south bridge: Direct Media Interface

receive differential pair. IDMI

DMI_TXP[1:0]

DMI_TXN[1:0] DMI output to south bridge: Direct Media Interface

transmit differential pair. ODMI

EXP_ICOMPI PCI-Express-G Input Current Compensation. Connect

to EXP_RCOMPO and then to Ground via one 50 Ohm

serial resistor.

IAnalog

EXP_RCOMPO PCI-Express-G Resistance Compensation. Connect to

EXP_ICOMPI and then to Ground via one 50 Ohm

serial resistor.

I/O Analog

EXP_RBIAS PCI-Express CML Bias control: Connect to a 750 Ohm

resistor to ground. I/O Analog

Table 2-6. Reset and Miscellaneous Signals (Sheet 2 of 2)

Signal Name Description Direction Type

Signal Description

22 Datasheet

2.5 PLL Signals

2.6 Analog Display Signals

Table 2-8. PLL Signals

Signal Name Description Direction Type

BCLKP[0]

BCLKN[0] Differential Core Clock In I Diff Clk CMOS

HPL_CLKINP

HPL_CLKINN Differential Host Clock In I Diff Clk CMOS

EXP_CLKINP

EXP_CLKINN Differential DMI Clock In I Diff Clk CMOS

REFCLKINN

REFCLKINP Differential PLL Clock In I Diff Clk CMOS

REFSSCLKINN

REFSSCLKINP Differential Spread Spectrum Clock In I Diff Clk CMOS

Table 2-9. Analog Display Signals

Signal Name Description Direction Type

CRT_RED RED Analog Video Output: This signal is a CRT

analog video output from the internal color palette

DAC.

OAnalog

CRT_GREEN GREEN Analog Video O utput: This signal is a CRT

analog video output from the internal color palette

DAC.

OAnalog

CRT_BLUE BLUE Analog Video Output: This signal is a CRT

analog video output from the internal color palette

DAC.

OAnalog

CRT_IRTN Current return path. Shorted to ground O Analog

DAC_IREF Resistor Set: Set point resistor for the internal

color palette DAC. A 665-Ohm ±1% resistor is

required between DAC_IREF and motherboard

ground.

I/O Analog

CRT_HSYNC CRT Ho rizontal Synchronization: This signal is

used as the v ertical sync (polarit y is programmable)

or “sync interval”. 3.3-V output.

OHVCMOS

CRT_VSYNC CRT Vertical Synchronizati on: This signal is used

as the vertical sync (polarity is programmable). 3.3-

V output.

OHVCMOS

CRT_DDC_CLK CRT DDC Clock for monitor control I/O COD

CRT_DDC_DATA CRT DDC Data for monitor control I/O COD

Datasheet 23

Signal Description

2.7 LVDS Signals

2.8 TAP Signals

Table 2-10.LVDS Signals

Signal Name Description Direction Type

LA_DATAP_[2:0] Differential data output - positive O LVDS

LA_DATAN_[2:0] Differential data output - negative O LVDS

LA_CLKP Differential clock output - positive O LVDS

LA_CLKN Differential clock output - negative O LVDS

LIBG LVDS Reference Current. Need 2.37-KOhm pull-

down resistor I/O Ref

LVBG Reserved. No connect. O Analog

LVREFH Reserved. Can be connected to VSS or left as No

Connect. IRef

LVREFL Reserved. Can be connected to VSS or left as No

Connect. IRef

LVDD_EN LVDS Panel Power Enable: Panel power control

enable control. OHVCMOS

LBKLT_EN LVDS Backlight Enable: Panel backlight enable

control. OHVCMOS

LBKLT_CTL Panel Backlight Brightness Control: Panel

brightness control.

The accuracy of the PWM duty cycle of LBKLT_CTL

signal for any given value will be within ±20 ns.

OHVCMOS

LCTLA_CLK I2C based control signal (Clock) for External SSC

clock chip control - optional

I/O COD

LCTLB_DATA I2C based control signal (Data) for External SSC

clock chip control - optional I/O COD

LDDC_CLK EDID support for flat panel display I/O COD

LDDC_DATA EDID support for flat panel display I/O COD

Table 2-11.TAP Signals (Sheet 1 of 2)

Signal

Name Description Direction Type

TCK TCK (Test Clock) provides the clock input for the

processor Test Bus (als o known as the Test Access Port). ITAP

TDI TDI (Test Data In) transfers serial test data into the

processor. TDI provides the serial input needed for JTAG

specification suppo r t.

ITAP

Signal Description

24 Datasheet

2.9 Error and Thermal Protection

2.10 Processor Core Power Signals

TDO TDO (Test Data Out) transfers serial test data out of

the processor. TDO provides the serial output needed for

JTAG specification support.

OTAP

TMS TMS (Test Mode Select) is a JT AG specification support

signal used by debug tools. ITAP

TRST# TRST# (Test Reset) resets the Test Access Port (TAP)

logic. TRST# must be driven low during power on Reset. ITAP

Table 2-12.Error and Thermal Protection

Signal

Name Description Direction Type

PROCHOT# Processor Hot#: This will go active when the

processor temperature monitoring sensor(s) detects

that the processor has reached its maximum safe

operation temperature

Output: This indicates that the processor Thermal

Control Circuit (TCC) has been activated, if enabled.

Input: This signal can also be driven to the processor to

activate the TCC.

I/O I: CMOS

O: OD

THERMTRIP# Thermal Trip: The processor protects itself from

catastrophic overheating by use of an internal thermal

sensor. This sensor is set well above the normal

operating temperature to ensure that there are no false

trips. The processor will stop all execution when the

junction temperature exceeds approximately 125°C.

This is signaled to the system by the THERMTRIP# pin.

OOpen

Drain

Table 2-13.Processor Core Power Signals

Signal Name Description Direction Type

VCC Processor-core power supply. The voltage supplied to

these pins is determined by the VID pins. PWR

VCC_SENSE VCC_SENSE and VSS_SENSE provide an isolated, low

impedance connection to the processor core voltage

and ground. They can be used to sense or measure

voltage near the silicon.

Analog

Table 2-11.TAP Signals (S heet 2 of 2)

Datasheet 25

Signal Description

2.11 Graphics, DMI and Memory Core Power Signals

2.12 Ground

VID[6:0] VID[6:0] (Voltage ID) are used to support automatic

selection of power supply voltages (VCC). I/O CMOS

VSS_SENSE VCC_SENSE and VSS_SENSE provide an isolated, low

impedance connection to the processor core voltage

and ground. They can be used to sense or measure

voltage near the silicon.

Analog

VCCA Processor PLL power supply. PWR

Table 2-14.Power Signals

Signal Name Description Voltage Level (V) Type

VCCP LGI power supply 1.05 PWR

VCCGFX Graphics core power supply 0.89 PWR

VCCSM DDR2/DDR3 power supply 1.8/ 1.5 PWR

VCCA_DMI DMI power supply 1.05 PWR

VCCACRTDAC CRT DAC power supply 1.8 PWR

VCC_GIO Graphics I/O power supply 3.3 PWR

VCC_LGI LGIO VID power supply 1.05 PWR

VCCA_DDR DDR2 power supply 1.05 PWR

VCCD_HMPLL HMPLL power supply 1.05 PWR

VCCDLVDS LVDS power supply 1.8 PWR

VCCSFR_DMIHMPLL DMI, HPLL, MPLL power supply 1.8 PWR

VCCACK_DDR DDR2 power supply 1.05 PWR

VCCD_AB_DPL DPLL power supply 1.05 PWR

VCCSFR_AB_DPL DPLL power supply 1.8 PWR

VCCRING_EAST GIO, LVDS power supply 1.05 PWR

VCCRING_WEST LGIO power supply 1.05 PWR

VCCCK_DDR DDR2/DDR3 clock power supply 1.8/1.5 PWR

Table 2-15.Ground

Signal

Name Description Direction Type

VSS VSS are the ground pins for the processor and should be

connected to the syst em ground plane. GND

Table 2-13.Processor Core Power Signals

Functional Description

26 Datasheet

3 Functional Description

3.1 Integrated Memory Controller

The integrated memory controller supports DDR2 or DDR3 protocols with one 64 bit

wide channel accessing two SO-DIMMs. The controller supports a maximum of two un-

buffered, non-ECC DDR2 or DDR3 SO-DIMMs; thus allowing up to four device ranks.

3.1.1 System Memory Organization Modes

The integrated memory controller supports only one memory organization mode: single

channel. In this mode, all memory cycles are directed to a single channel.

3.1.2 System Memory Technology Supported

3.1.2.1 DDR2 Memory

The system memory controller supports the following DDR2 Data Transfer Rates, SO-

DIMM Modules and DRAM Device Technologies:

•DDR2 Data Transfer Rate: 667MT/s (PC2-5300)

•DDR2 SO-DIMM Modules (unbuffered, non-ECC):

— Raw Card A = 2 Ranks of x16 SDRAMs (Double-sided)

— Raw Card C = 1 Rank of x16 SDRAMs (Single-sided)

“Single sided” above is a logical term referring to the number of Chip Selects attached

to the SO-DIMM. A real SO-DIMM may put the components on both sides of the

substrate, but be logically indistinguishable from single sided SO-DIMM if all

components on the SO-DIMM are attached to the same Chip Select signal.

Note: x16 means that each SDRAM component has 16 data lines.

•DDR2 DRAM Device Technology:

— Standard 512Mb, 1Gb and 2Gb technologies and addressing are supported for

x16 devices. There is no support for SO-DIMMs with different technologies or

capacities on opposite sides of the same SO-DIMM. If one side of a SO-DIMM is

populated, the other side is either identical or empty.

Datasheet 27

Functional Description

3.1.2.2 DDR3 Memory

The system memory controller supports the following DDR3 Data Transfer Rates,

SO-DIMM Modules and DRAM Device Technologies:

•DDR3 Data Transfer Rate: 667MT/s

•DDR3 SO-DIMM Modules (unbuffered, non-ECC):

— Raw Card A = 2 Ranks of x16 SDRAMs (Double-sided)

— Raw Card B = 1 Rank of x8 SDRAMs (Double-sided)

NOTE: x16/x8 means that each SDRAM component has 16/8 data lines.

•DDR3 DRAM Device Technology:

— Standard 1Gb and 2Gb technologies and addressing are support ed for x16/x8

devices. There is no support for SO-DIMMs with different technologies or

capacities on opposite sides of the same SO-DIMM. If one side of a SO-DIMM is

populated, the other side is either identical or empty.

Table 3-17.Supported DDR3 S0-DIMM module Configurations

3.1.3 Rul es for popula ting SO-DIMM slots

The frequency of system memory will be the lowest frequency of all SO-DIMMs in the

system, as determined through the SPD registers on the SO-DIMMs. Timing

parameters [CAS latency (or CL + AL for DDR2), tRAS, tRCD, tRP] must be

programmed to match within a channel.

Table 3-16.Supported SO-DIMM Module Configurations

Raw Card

Type DIMM

Capacity

DRAM

Device

Tech.

DRAM

Organization # of DRAM

Devices # of

Ranks Page

Size

A 512MB 512Mb 32M x 16 8 2 8K

A 1GB 1Gb 64M x16 8 2 8K

C 256MB 512Mb 32M x 16 4 1 8K

C 512MB 1Gb 64M x 16 4 1 8K

C 1GB 2Gb 128M x 16 4 1 8K

Raw Card

Type DIMM

Capacity

DRAM

Device

Tech.

DRAM

Organization # of DRAM

Devices # of

Ranks Page

Size

A 1GB 1Gb 64M x 16 8 2 8K

A 2GB 2Gb 128M x16 8 2 8K

B 1GB 1Gb 128M x 8 8 1 8K

B 2GB 2Gb 256M x 8 8 1 8K

Functional Description

28 Datasheet

T o take advantage of enhanced addressing, it should be populating both SO-DIMM slots

with the identical Raw Card type. If one SO-DIMM is used only, it should be populating

the second slot (the further slot to the processor’s Integrated Memory Controller) to

get the best signal quality.

3.1.4 Intel® Fast Memory Access (Intel® FMA) Technology

Enhancements

The following sections outline and explain the technology enhancements: Just-in-Time

Command Scheduling, Command Overlap, Out-of-Order Scheduling and Opportunistic

Writes.

3.1.4.1 Just-in-Time Command Scheduling

The memory controller has an advanced command scheduler where all pending

requests are examined simultaneously to determine the most efficient request to be

issued next. The most efficient request is picked from all pending requests and issued

to system memory Just-in-Time to make optimal use of Command Overlapping. Thus,

instead of having all memory access requests go individually through an arbitration

mechanism forcing requests to be executed one at a time, they can be started without

interfering with the current request allowing for concurrent issuing of requests. This

allows for optimized bandwidth and reduced latency while maintaining appropriate

command spacing to meet system memory protocol.

3.1.4.2 Command Overlap

Command Overlap allows the insertion of the DRAM commands between the Activate,

Precharge, and R ead/Write commands normally used, as long as the inserted

commands do not affect the currently executing command. Multiple commands can be

issued in an overlapping manner, increasing the efficiency of system memory protocol.

3.1.4.3 Out-of-Order Scheduling

While leveraging the Just-in-Time Scheduling and Command Overlap enhancements,

the IMC continuously monitors pending requests to system memory for the best use of

bandwidth and reduction of latency. If there are multiple requests to the same open

page, these requests would be launched in a back to back manner to make optimum

use of the open memory page. This ability to reorder requests on the fly allows the IMC

to further reduce latency and increase bandwidth efficiency.

3.1.4.4 Opportunistic Writes

Processor requests for memory reads usually are weighted more heavily than writes to

memory to avoid cases of starving th e processor of data to process while the writes are

issued to system memory. Instead of having writes issued to a pending queue to be

flushed to memory when certain watermarks are reached, which could starve the

processor of data while it waits for the write flush to finish, the IMC monitors system

memory requests and issues pending write requests to memory at times when they will

Datasheet 29

Functional Description

not impact memory read requests. This allows for an almost continuous flow of data to

the processor for processing.

3.1.5 DRAM Clock Generation

Every supported SO-DIMM has two differential clock pairs. There are total of fou r clock

pairs driven directly by the processor to two SO-DIMMs.

3.2 Integrated Graphics Controller

This section details the integrated graphics engines (3D, 2D and video), 3D pipeline,

and the respective capabilities.

The processor’s graphics proce ssing unit (GPU) contains several types of components.

The major components in the GPU are the engines, planes, pipes and ports. The GPU

has a 3D/2D instruction processing unit to control the 3D and 2D engin es respectively.

The processor’s 3D and 2D engines are fed with data through the memory controller.

The outputs of the engines are surfaces sent to the memory, which are then retrieved

and processed by the processor planes.

3.2.1 3D Graphics Pipeline

This GPU runs the graphics engine at 200 MHz and has two pixel pipelines.

The 3D graphics pipeline has a deep pipeline architecture in which each stage can

simultaneously operate on different primitives or on different portions of the same

primitive. The 3D graphics pipeline is broken up into four major stages: geometry

processing, setup (vertex processing), texture application and rasterization.

The graphics is optimized by using the processor for adv ance software based tr ansform

and lighting (geometry processing) as defined by Microsoft DirectX*. The other three

stages of 3D processing are handled on the GPU. The setup stage is responsible for

vertex processing - converting vertices to pixels. The texture application stage applies

textures to pixels. The rasterization engine takes textured pixels and applies lighting

and other environment affects to produce the final pixel value. From the rasterization

stage, the final pixel value is written to the frame buffer in memory so it can be

displayed.

3.2.1.1 3D Engine

The 3D engine on the GPU has been designed with a deep pipeline architecture, where

performance is maximized by allowing each stage of the pipeline to simultaneously

operate on different primitive or portions of the same primitive. The GPU supports

P erspective-Correct Texture Mapping, Multitextures, Bump-Mapping, Cubic

Environment Maps, Bilinear, Trilinear and Anisotropic MIP mapped filtering, Gouraud

shading, Alpha-blending, Vertex and Per Pixel Fog and Z/W Buffering.

Functional Description

30 Datasheet

The 3D pipeline subsystem performs the 3D rendering acceleration. The main blocks of

the pipeline are the setup engine, scan converter, texture pipeline, and r aster pip eline.

A typical programming sequence would be to send instructions to set the state of the

pipeline followed by rending instructions containing 3D primitive vertex data.

The engines’ performance is dependent on the memory bandwidth available. Systems

that have more bandwidth available will outperform systems with less bandwidth. The

engines’ performance is also dependent on the core clock frequency. The higher the

frequency, the more data is processed.

3.2.1.2 Texture Engine

The GPU allows an image, pattern, or video to be placed on the surface of the 3D

polygon. The texture processor receives the texture coordinate information from the

setup engine and the texture blend information from the scan converter. The texture

processor performs texture color or ChromaKey matching, texture filtering (anisotropic,

trilinear, bilinear interoplation), and YUV-to-RGB conversions.

3.2.2 Video Engine

The Video Engine handles the non-3D (media/video) applications. It includes support

for VLD and MPEG2 decode in Hardware. The CGPU engine includes a number of

encompassments over the previous generation capabilities, which have been listed

above.

3.2.2.1 Hardware Motion Compensation

The Motion Compensation (MC) process consists of reconstructing a new picture by

predicting (either forward, backward or bidirectionally) the resulting pixel colors from

one or more reference pictures. The GPU receives the video stream and implements

Motion Compensation and subsequent steps in hardware. Performing Motion

Compensation in hardware reduces the processor demand of software-based MPEG-2

decoding, and thus improves system performance.

The Motion Compensation functionality is overloaded onto the texture cache and

texture filter. The texture cache is used to typically access the data in the

reconstruction of the frames and the filter is used in the actual motion compensation

process. To support this overloaded functionality the texture cache additionally

supports the following input format: YUV420 planar.

3.2.2.2 Sub-Picture Support

Sub-picture is used for two purposes, one is subtitles for movie captions, etc. (which

are superimposed on a main picture), and “menus” used to provide some visual

operation environments the user of a content player.

DVD allows movie subtitles to be recorded as Sub-pictures. On a DVD disc, it is called

“subtitle” because it has been prepared for storing captions. Since the disc can have a

maximum of 32 tracks for subtitles, they can be used for various applications, for

example, as subtitles in different languages or other information to be displayed.

Datasheet 31

Functional Description

There are two kinds of Menus, the System Menus and other In-Title Menus. First, the

System Menus are displayed and operated at startup of or during the playback of the

disc or from the stop state. Second, In-Title menus can be programmed as a

combination of Sub-picture and Highlight commands to be displayed during playback of

the disc.

The GMC H su pp or ts su b-p ic tu re for DVD and DBS by mixing the two video streams via

alpha blending. Unlike color keying, alpha blending provides a softer effect and each

pixel that is displayed is a composite between the two video stream pixels. The GPU

can utilize four methods when dealing with sub-pictures. The flexibility enables the GPU

to work with all sub-picture formats.

3.2.3 2D Engine

3.2.3.1 VGA Registers

The 2D registers are a combination of registers defined for the original Video Graphics

Array (VGA) and others that Intel has added to support graphics modes that have color

depths, resolutions, and hardware acceleration features that go beyond the original

VGA standard.

3.2.3.2 Logical 128-Bit Fixed BLT and 256 Fill Engine

Use of this BLT engine accelerates the Gr aphical User Interface (GUI) of Microsoft

Windows* operating systems. The 128-bit BLT Engine provides hardware acceleration

of block transfers of pixel data for many common Windows operations. The term BLT

refers to a block transfer of pixel data between memory locations. The BLT engine can

be used for the following:

•Move rectangular blocks of data between memory locations

•Data Alignment

•Perform logical operations (raster ops)

The rectangular block of data does not change as it is transferred between memory

locations. The allowable memory transfers are between: cacheable system memory

and frame buffer memory, frame buffer memory and frame buffer memory, and within

system memory. Data to be transferred can consist of regions of memory, patterns, or

solid color fills. A pattern will always be 8x8 pixels wide and may be 8, 16, or 32 bits

per pixel.

The BLT engine has the ability to expand monochrome data into a color depth of 8, 16,

or 32 bits. BLTs can be either opaque or transparent. Opaque transfers move the data

specified to the destination. Transparent transfers compare destination color to source

color and write according to the mode of transparency selected.

Functional Description

32 Datasheet

Data is horizontally and vertically aligned at the destination. If the destination for the

BLT overlaps with the source memory location, the graphics controller can specify

which area in memory to begin the BLT transfer. Hardware is included for all 256 raster

operations (Source, Pattern, and Destination) defined by Microsoft, including

transparent BLT.

The graphics controller has instructions to invoke BLT and stretch BLT operations,

permitting software to set up instruction buffers and use batch processing. The

graphics controller can perform hardware clipping during BLTs.

3.2.4 Display Pipes

The display consists of two pipes:

•Display Pipe A (VGA)

•Display Pipe B (VGA or LVDS)

A pipe consists of a set of combined planes and a timing generator. The timing

generators provide the basic timing information for each of the display pipes. The GPU

has two display pipes, allowing for support of two independent display streams. A port

is the destination for the result of the pipe.

3.2.4.1 Clock Generator Units (DPLLs)

The clock generator units provide a stable frequency for driving disp la y de vices. It

operates by converting an input reference frequency into an output frequency. The

timing generators tak e their input from internal DPLL devices that are programm able to

generate pixel clocks in the range of 20 MHz–200 MHz. Accuracy for VESA timing

modes is required to be within ±0.5%.

The DPLL can take a reference frequency from the external reference inputs

(REFCLKINN/P, REFSSCLKINN/P).

3.2.5 Display Ports

Display ports are the destination for the display pipes. These are the places where the

data finally appears to devices outside the graphics device. the GPU has one CRT

display port (Analog) and one dedicated LVDS port (Digital).

3.2.5.1 Analog Display Port Characteristics

The analog display port provides a RGB signal output along with a HSYNC and VSYNC

signal. There is an associated DDC signal pair that is implemented using GPIO pins

dedicated to the analog port. The intended target device is for a CRT based monitor

with a VGA connector. Display devices such as LCD panels with analog inputs may work

satisfactory but no functionality added to the signals to enhance that capability.

Datasheet 33

Functional Description

3.2.5.1.1 Integrated RAMDAC

The display function contains a RAM-based Digital-to-Analog Con verter (RAMDAC) that

transforms the digital data from the graphics and video subsystems to analog data for

the CRT monitor. GPU’s integrated RAMDAC supports resolutions up to 1400 x 1050

@ 60 Hz. Three 8-bit DACs provide the R, G, and B signals to the monitor.

3.2.5.1.2 Sync Signals

HSYNC and VSYNC signals are digital and conform to T TL signal levels at the connector.

These signals can be polarity adjusted and individually disabled in one of the two

possible states. The sync signals should power up disabled in the high state. No

composite sync or special flat panel sync support will be included.

3.2.5.2 Single Channel LVDS Port

The processor has an integrated single channel LVDS (Low Voltage Differential

Signaling) port that supports 1x18 data format. There is one LVDS transmitter channel

in the LVDS port; this channel consists of 3 data pairs and a clock pair. The channel

supports transmit clock frequency ranges from 25 MHz to 112 MHz which provides a

throughput of up to 784Mbps on each data output and up to 112 MP/s on the input.

3.2.5.2.1 LVDS Data Pairs and Clock Pairs

The L VDS data and clock pairs are identical buffers and differ only in the use defined for

that pair. The LVDS data pair is used to transfer pixel data as well as the LC D timing

control signals. A single clock pair is used to transfer clocking information to the LVDS

receiver. A serial pattern of 1100011 represents one cycle of the clock.

Table 3-18.Analog Port Characteristics

Signal Port Characteristics Support

RGB

Vo ltage Range 0.7 Vp-p only

Monitor Sense Analog Compare

Analog Copy Protection No

Sync on Green No

HSYNC

VSYNC

Voltage 3.3V

Enable/Disable Port control

Polarity Adjust VGA or port control

Composite Sync Support No

Special Flat Panel Sync No

Stereo Sync No

DDC Voltage External buffered to

Control Through GPIO

interface

Functional Description

34 Datasheet

There is one LVDS transmitter channel in the LVDS interface. It contains 1-clock pair

and 3-data pair of low voltage differential swing signals. Figure 3-2 shows a pair of

LVDS signals and swing voltage.

1’s and 0’s are represented the differential voltage between the pair of signals.

3.2.5.2.2 LVDS Pair States

The LVDS pairs can be put into one of five states, powered down tri-state, powered

down 0 V, common mode, send 0’s, or active. When in powered down state, the circuit

enters a low power state and drives out 0 V or tri-states on both the output pins for the

entire channel. The common mode tri-state is both pins of the pair set to the common

mode voltage. When in the send 0’s state, the circuit is powered up but sends only 0 for

the pixel color data regardless what the actual data is with the clock lines and timing

signals sending the normal clock and timing data.

Figure 3-2.LVDS Signals and Swing Voltage

Figure 3-3. LVDS Clock and Data Relationship

Datasheet 35

Functional Description

3.2.5.2.3 Panel Power Sequencing

This section provides details for the power sequence timing relationship of the panel

power, the backli ght enable and the LVDS data timing delivery. In order to meet the

panel power timing specification requirements, two signals, L VDD_EN and BKLT_EN are

provided to control the timing sequencing function of the panel and the backlight power

supplies.

Panel Power Sequence States

A defined power sequence is recommended when enabling the panel or disabling the

panel. The set of timing parameters can vary from panel to panel v endor, provided that

they stay within a predefined range of values. The panel VDD power, the backlight on/

off state and the LVDS clock and data lines are all managed by an internal power

sequencer.

A requested power-up sequence is only allowed to begin after the power cycle delay

time requirement T4 is met.

Figure 3-4. Panel Power Seque ncing

Table 3-19. Panel Power Sequencing Timing Parameters

Panel Power Sequence Timing Parameters Min Max Name Units

Spec Name From To

Vdd On 0.1 Vdd 0.9 Vdd 010 T1 ms

LVDS Active Vdd Stable On LVDS Active 050 T2 ms

Backlight LVDS Active Backlight on 200 T5 ms

Backlight State Backlight Off LVDS off X X TX ms

LVDS State LVDS Off Start power off 050 T3 ms

Power cycle Delay Power Off Power On

Sequence Start 0400 T4 ms

Pow er O n S eque nce from off state and

P o we r Off Se q u e n c e after fu ll On

Panel VD D

Enable

Panel

BackLight

Enable

Clock/Data Lines

T1+T2 T5 T3

Valid

Panel

Off Off

Functional Description

36 Datasheet

3.2.6 VESA/VGA Mode

VESA/VGA mode provides compatibility for pre-existing software that set the display

mode using the VGA CR TC registers. Timings are generated based on the VGA register

values and the timing generator registers are not used.

3.2.6.1 DDC (Display Data Channel)

DDC is a standard defined by VESA. Its purpose is to allow communication between the

host system and display. Both configuration and control information can be exchanged

allowing plug-and-play systems to be realized. Support for DDC 1 and DDC 2 is

implemented. The GPU use s the CRT_DDC_CLK and CRT_DDC_DATA signals to

communicate with the analog monitor. The GPU will generate these signals at 3.3V.

External pull-up resistors and level shifting circuitry should be implemented on the

board.

The GPU implements a hardware GMBus controller that can be used to control these

signals allowing for transactions speeds up to 100 kHz.

3.2.7 Multiple Display Configurations

Since the GPU has two display ports av ailable for its two pipes, it can support up to two

different images on different display devices. The GPU integrated in this processor

supports two display modes: Dual Display Clo ne and Extend ed De sktop (LVDS + VGA).

3.3 Thermal Sensor

There are several registers that need to be configured to support the uncore thermal

sensor functionality and SMI# generation. Customers must enable the Catastrophic

Trip Point as protection for the processor. If the Catastrophic Trip P oint is crossed, then

the processor will instantly turn off all clocks inside the device. Customers may

optionally enable the Hot Trip Point to generate SMI#. Customers will be required to

then write their own SMI# handler in BIOS that will speed up the processor (or system)

fan to cool the part.

3.3.1 PCI Device 0, Function 0

The SMICMD register requires that a bit be set to generate an SMI# when the Hot Trip

point is crossed. The ERRSTS register can be inspected for the SMI alert.

Address Register

Symbol Register Name Default

Value Access

C8-C9 ERRST Error Status 0000h RWC/S, RO

CC-CDh SMICMD SMI Command 0000h RO, R/W

Datasheet 37

Functional Description

3.4 Power Management

The processor has many permutations of possibly concurrently operating modes. Care

should be taken (Hardware and Software) to disable unused sections of the silicon

when this can be done with sufficiently low performance impact. Refer to Chapter 5 and

the ACPI Specification, Rev3.0 for more details.

3.5 Intel® Hyper-Threading Technology

The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology),

which allows an execution core to function as two logical processors. While some

execution resources such as caches, execution units, and buses are shared, each

logical processor has its own architectural state with its own set of general-purpose

registers and control registers. This feature must be enabled via the BIOS and requires

operating system support.

Intel recommends enabling Hyper-Threading Technology with Microsoft Windows

Vista*, Microsoft Windows* XP Professional/Windows* XP Home, and disabling Hyper-

Threading Technology via the BIOS for all previous versions of Windows operating

systems. For more information on Hyper-Threading Technology, see http://

www.intel.com/products/ht/hyperthreading_more.htm.

Electrical Specifications

38 Datasheet

4 Electrical Specifications

This chapter contains signal group descriptions, absolute maximum ratings, voltage

identification and power sequencing. The chapter also includes DC specifications.

Please note that all data or specifications for processors supporting DDR3 and/or Dual

core processors in this chapter are based on pre-silicon estimates and simulations or

empirical data; these specifications will be updated with characterized data from silicon

measurements at a later date.

4.1 Power and Ground Balls

The processor has VCC and VSS (ground) inputs for on-chip power distribution. All

power balls must be connected to their respective processor power planes, while all VSS

balls must be connected to the system ground plane. Use of multiple power and ground

planes is recommended to reduce I*R drop. The VCC balls must be supplied with the

voltage determined by the proces sor Voltage IDentification (VID) signals.

4.2 Decoupling Guidelines

Due to large number of transistors and high internal clock speeds, the processor is

capable of generating large current swings between low- and full-power states. This

may cause voltages on power planes to sag below their minimum values, if bulk

decoupling is not adequate. Larger bulk storage (CBULK), such as electrolytic capacitors,

supply current during longer lasting changes in current demand (for example, coming

out of an idle condition). Similarly, capacitors act as a storage well for current when

entering an idle condition from a running condition. To keep voltages within

specification, output decoupling must be properly designed.

Caution: Design the board to ensure that the voltage provided to the processor remains within

the specifications. Failure to do so can result in timing violations or reduced lifetime of

the processor.

4.2.1 Voltage Rail Decoupling

The voltage regulator solution needs to provide:

•Bulk capacitance with low effective series resistance (ESR).

•A low path impedance from the regulator to the processor.

•Bulk decoupling to compensate for large current swings generated during power-

on, or low-power idle state entry/exit.

The power delivery solution must ensure that the v oltage and current specifications are

met, as defined in Table 4-23.

Datasheet 39

Electrical Specifications

4.3 Processor Clocking

BCLKP, BCLKN, HPL_CLKINP, HPL_CLKINN, EXP_CLKINP, EXP_CLKINN, REFCLKINP,

REFCLKINN

The processor utilizes differential clocks to generate the processor core(s) and memory

controller frequency, and other internal clocks. The processor core frequency is

determined by multiplying the processor core ratio by 166MHz. Clock multiplying within

the processor is provided by an internal phase locked loop (PLL), which requires a

constant frequency input, with exceptions for Spread Spectrum Clocking (SSC).

4.3.1 PLL Power Supply

An on-die PLL filter solution is implemented on the processor. Refer to Table 4-23 for

DC specifications.

4.4 Voltage Identification (VID)

The processor uses sev en voltage identification signals, VID[6:0], to support automatic

selection of voltages. Table 4-20 specifies the voltage level corresponding to the state

of VID[6:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to a low

voltage level. If the processor is not soldered on board (VID[6:0] = 1111111), or the

voltage regulation circuit cannot supply the voltage that is requested, the voltage

regulator must disable itself.

VID signals are CMOS push/pull drivers. Refer to Table 4-25 for the DC specifications

for these signals. Individual processor VID values may be set during manufacturing so

that two devices at the same core frequency may have different VID settings.

The VR utilized must be capable of regulating its output to the value defined by the VID

values issued. DC specifications are included in Table 4-25 and Table 4-26.

Table 4-20.Voltage Identification Definition

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

00110001.2000

00110011.1875

00110101.1750

00110111.1625

00111001.1500

00111011.1375

00111101.1250

00111111.1125

01000001.1000

01000011.0875

01000101.0750

01000111.0625

Electrical Specifications

40 Datasheet

01001001.0500

01001011.0375

01001101.0250

01001111.0125

01010001.0000

01010010.9875

01010100.9750

01010110.9625

01011000.9500

01011010.9375

01011100.9250

01011110.9125

01100000.9000

01100010.8875

01100100.8750

01100110.8625

01101000.8500

01101010.8375

01101100.8250

01101110.8125

01110000.8000

01110010.7875

01110100.7750

01110110.7625

01111000.7500

01111010.7375

01111100.7250

01111110.7125

10000000.7000

Table 4-20.Voltage Identification Definition

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

Datasheet 41

Electrical Specifications

4.5 Catastrophic Thermal Protection

The processor supports the THERMTRIP# signal for catastrophic thermal protection. An

external thermal sensor should also be used to protect the processor and the system

against excessive temperatures. Even with the activation of THERMTRIP#, which halts

all processor internal clocks and activity, leakage current can be high enough such that

the processor cannot be protected in all conditions without the remov al of power to the

processor. If the external thermal sensor detects a catastrophic processor temperature

of 125°C (maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the

processor must be turned off within 500 ms to prevent permanent silicon damage due

to thermal runaway of the processor. THERMTRIP# functionality is not ensured if the

PWRGOOD signal is not asserted.

4.6 Reserved or Unused Signals

The following are the general types of reserved (RSVD) signals and connection

guidelines:

•RSVD - these signals should not be connected

•RSVD_TP - these signals should be routed to a test point

•RSVD_NCTF - these signals are non-critical to function and may be left un-

connected

Arbitrary connection of these signals to VCC*, VSS*, or to any other signal (i ncluding

each other) may result in component malfunction. See Chapter 5 for a land listing of

the processor and the location of all reserved signals.

For reliable operation, always connect unused inputs or bi-directional signals to an

appropriate signal level. Unused active high inputs should be connected through a

resistor to ground (VSS). Unused outputs maybe left unconnected; however, this may

interfere with some Test Access Port (TAP) functions, complicate debug probing, and

prevent boundary scan testing. A resistor must be used when tying bi-directional

signals to power or ground. When tying any signal to power or ground, a resistor will

also allow for system testability. Resistor values should be within ±20% of the

impedance of the baseboard trace.

4.7 Signal Groups

Signals are grouped by buffer type and similar characteristics as listed in Chapter 2.

The buffer type indicates which signaling technology and specifications apply to the

signals. All the differential signals, and selected DDR2 and Control Sideband signals

have On-Die Termination (ODT) resistors. There are some signals that do not have OD T

and need to be terminated on the board.

All Control Sideband Asynchronous signals are required to be asserted/deasserted for

at least eight BCLKs in order for the processor to recognize the proper signal state. See

Section 4.10 for the DC and AC specifications.

Electrical Specifications

42 Datasheet

4.8 Test Access Port (TAP) Connection

Due to the voltage levels supported by other components in the Test Access Port (TAP)

logic, Intel recommends the processor be first in the TAP chain, followed by any other

components within the system. A translation buffer should be used to connect to the

rest of the chain unless one of the other components is capable of accepting an input of

the appropriate voltage. Two copies of each signal may be required with each driving a

different voltage level.

4.9 Absolute Maximum and Minimum Ratings

Table 4-21 specifie s absolute maximum and minimum ratings. At conditions outside

functional operation condition limits, but within absolute maximum and minimum

ratings, neither functionality nor long-term reliability can be expected. If a device is

returned to conditions within functional operation limits after having been subjected to

conditions outside these limits (but within the absolute maximum and minimum

ratings) the device may be functional, but with its lifetime degraded depending on

exposure to conditions exceeding the functional operation condition limits.

Although the processor contains protective circuitry to resist damage from Electro-

Static Discharge (ESD), precautions should always be taken to avoid high static

voltages or electric fields

Table 4-21.Processor Absolute Minimum and Maximum Ratings (Sheet 1 of 2)

Symbol Parameter Min Max Unit Notes1, 2

VCC, VCCP Processor Core, LGI voltages

with respect to VSS

-0.3 1.45 V 6

VCCSM, VCCCK_DDR Processor DDR voltage with

respect to VSS

-0.3 2.25 V

VCCA Processor PLL voltage with

respect to VSS

-0.3 2.25 V

VCCGFX Proces sor GFX voltage with

respect to VSS

-0.3 1.55 V

VCCLVDS Processor LVDS voltage with

respect to VSS

-0.3 2.25 V

VCCA_DDR,

VCCACK_DDR

Processor DDR PLL voltage

with respect to VSS

-0.3 1.45 V

VCCRING_EAST,

VCCRING_WEST,

VCC_LGI_VID,

Processor DAC, LGIO, L VDS, &

LGIO voltage with respect to

VSS

-0.3 1.45 V

VCCD_AB_DPL,

VCCD_HMPLL

Processor DPLL, & HMPLL

voltage with respect to VSS

-0.3 1.45 V

VCCSFR_AB_DPL, Processor SFR DPLL voltage

with respect to VSS

-0.3 2.25 V

VCCACRTDAC Processor CRT DAC voltage

with respect to VSS

-0.3 2.25 V

Datasheet 43

Electrical Specifications

NOTES:

1. For functional operation, all processor electrical, signal quality, mechanical and thermal

specifications must be satisfied.

2. Exce ssiv e ov ershoot or undersh oot on any signal will likely result in permanent damage to

the processor.

3. Storage temperature is applicable to storage conditions only. In this scenario, the

processor must not receive a clock, and no lands can be connected to a voltage bias.

Storage within these limits will not affect the long-term reliability of the device. For

functional operation, please refer to the processor case temperature specificatio ns.

4. This rating applies to the processor and does not include any tray or packaging.

5. Failure to adhere to this specification can affect the long-term reliability of the processor.

6. VCC is a VID based rail.

Possible damage to the processor may occur if the processor temperature exceeds 150 °C. Intel

does not ensure functionality for parts that have exceeded temperature above 150 °C due to

specification violation.

4.10 DC Specifications

Section 4.10 lists the DC specifications for the processor and are valid only while

meeting the thermal specifications, clock frequency, and input voltages.

4.10.1 Voltage and Current Specifications

Table 4-23 and Table 4-23 list the DC specifications for the processor core and I/O

buffer; they are valid only while meeting specifications for junction temperature, clock

frequency, and input voltages. The Highest Frequency Mode (HFM) and Lowest

Frequency Mode (LFM) refer to the highest and lowest core operating frequencies

supported on the processor. Active mode load line specifications apply in all states

except in the Deeper Sleep state. VCC,BOOT is the default voltage driven by the voltage

regulator at power up in order to set the VID values. Unless specified otherwise, all

specifications for the processor are at TJ = 100°C. Care should be taken to read all

notes associated with each parameter.

VCCSFR_DMIHMPLL Processor DMI SFR voltage

with respect to VSS

-0.3 2.25 V

VCC_GIO Processor GIO voltage with

respect to VSS

3.135 3.465 V

TSTORAGE Storage temperature -40 85 °C3, 4, 5

VinLGIO LGIO Buffer DC Input Voltage

with Re spect to VSS,

-0.1 1.45 V

VinAsynch_CMOS CMOS Buffer DC Input Voltage

with Re spect to VSS

-0.1 1.45 V

Table 4-21.Processor Absolute Minimum and Maximum Ratings (Sheet 2 of 2)

Symbol Parameter Min Max Unit Notes1, 2

Electrical Specifications

44 Datasheet

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Each processor is programmed with voltage identification value (VID), which is set at

manufacturing and cannot be altered. Individual VID values are calibrated during

manufacturing such that two processors at the same frequency may have different

settings within the VID range. Please note this differs from the VID employed by the

processor during a power management event.

3. The voltage specifications are assumed to be measured across VCC_SENSE and

VSS_SENSE pins at socket with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum

probe capacitance, and 1-MΩ minimum impedance. The maximum length of ground wire

on the probe should be less than 5 mm. Ensure external noise from the system is not

coupled in the scope probe.

Table 4-22.Processor Core Active and Idle Mode DC Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Note1

VID VID Range 0.8 1.175 V

VCC_HFM VCC at Highest Frequency Mode

(HFM) 0.9625 1.17 5 V 2, 3

VCC_LFM VCC at Lowest Frequency Mode

(LFM) 0.8 0.95 V 2, 3

VCCDPRSLP VCC at Deeper Sleep (C4) 0.8 0.95 V

VCC,BOOT Default VCC voltage for initial

power up 1.045 1.20 1.26 V

ICC ICC for processor core

— N450/N455

— N470/N475

— N550

— N570

5.77

6.04

11.54

IAH ICC Auto-Halt

— N400 series

— N500 series

3.06

6.12 A

ISGNT ICC Stop-Grant

— N400 series

— N500 series

3.03

6.06 A

IDPRSLP ICC Deeper Sleep (C4)

— N400 series

— N500 series

2.04

4.08

SLOPELL Processor Core Supply Loadline -5.9 mΩFigure 4-

Datasheet 45

Electrical Specifications

The I/O buffer supply voltage should be measured at the processor package pins. The

tolerances shown in Table 4-23 are inclusive of all noise from DC up to 20 MHz. The

voltage rails should be measured with a bandwidth limited oscilloscope with a roll-off of

3 dB/decade above 20 MHz under all operating conditions. Table 4-23 indicates which

supplies are connected directly to a voltage regulator or to a filtered voltage rail. For

voltage r ails that are connected to a filter, they should be measured at the input of the

filter. If the recommended platform decoup ling guidelines cannot be met, the system

designer will have to make trade-offs between the voltage regulator out DC tolerance

and the decoupling performances of the capacitor network to stay within the voltage

tolerances listed below.

Figure 4-5.VCC and ICC Processor Loadline

ICC max

VCC [V]

VCC nom

±V

CC Tolerance = ± [VID*1.5%]

VCC, DC min

VCC, DC max

VCC max

VCC min

10m V= RIPPLE

ICC [A]

Slop e = -5 .9 m V/A a t pa cka ge

VCC_SENSE, VSS_SENSE pins.

D if fe r e n tia l Re mo te S e nse r e q u ir e d .

Electrical Specifications

46 Datasheet

Table 4-23.Processor I/O Buffer Supply DC Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Note

VCCA Processor Core analog supply voltage (DC +

AC specification) 1.425 1.5 1.575 V

ICCA Processor Core analog supply current 0.080 A

VCCGFX GFX supply voltage 0.8455 0.89 0.9345 V

ICCGFX GFX supply current 2.64 A

VCCALVDS,

VCCDLVDS,

VCCACRTDAC

LVDS supply voltage

CRT DAC supply vo ltage

1.71 1.8 1.89 V

ICCALVDS,

ICCDLVDS,

ICCACRTDAC

LVDS and CRT DAC supply current 0.15 A

VCCSFR_DMIHMPLL,

VCCSFR_AB_DPL

DMIHMPLL supply voltage and Display PLL

supply voltage 1.71 1.8 1.89 V

ICCSFR_DMIHMPLL,

ICCSFR_AB_DPL

DMIHMPLL supply current and Display PLL

supply current 0.18 A

VCCSM,

VCCCK_DDR

DDR I/O supply voltage and DDR Clock

power supply voltage

DDR2

DDR3 1.71

1.425 1.8

1.5 1.89

1.575

ICCSM,

ICCCK_DDR

DDR I/O supply current (DDR2/DDR3)

DDR Clock power supply current (DDR2/

DDR3)

2.00

0.27 A

VCCA_DMI,

VCCD_HMPLL

DMI analog supply voltage and PLL supply

voltage 0.9975 1.05 1.1025 V

ICCA_DMI,

ICCD_HMPLL

DMI analog supply current and PLL supply

current 0.54 A

VCCD_AB_DPL,

VCC_LGI

Display PLL supply voltage and LGI supply

voltage 0.9975 1.05 1.1025 V

ICCD_AB_DPL,

ICC_LGI

Display PLL supply current and LGI supply

current 0.06 A

VCCA_DDR,

VCCACK_DDR

DDR analog supply voltage 0.9975 1.05 1.1025 V

ICCA_DDR,

ICCACK_DDR

DDR analog supply current

DDR2

DDR3 1.32

1.882

VCCP Legacy I/O supply voltage 0.9975 1.05 1.1025 V

ICCP Legacy I/O supply current 0.42 A

VCCRING_EAST,

VCCRING_WEST

DAC, GIO, LVDS supply voltage and LGIO

supply voltage 0.9975 1.05 1.1025 V

Datasheet 47

Electrical Specifications

4.10.2 Interface DC Specifications

Platform reference voltages at the top of Table 4-23 are specified at DC only. VREF

measurements should be made with respect to the supply voltage.

4.10.2.1 Input Clock DC Specification

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Crossing voltage defined as instantaneous voltage when rising e dge of CLKN equalise

CLKP. The crossing point must meet the absolute and relative crossing point specification

simultaneously.

4.10.2.2 DDR2/DDR3 DC Specifications

ICCRING_EAST,

ICCRING_WEST

DAC, GIO, LVDS supply voltage and LGIO

supply current 0.19 A

VCC_GIO GIO supply voltage 3.135 3.3 3.465 V

ICC_GIO GIO supply current 0.01 A

Table 4-23.Processor I/O Buffer Supply DC Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Note

Table 4-24.Input Clocks (BCLK, HPL_CLKIN, REFCLKIN, EXP_CLKIN) Differential

Specification

Symbol Parameter Min Typ Max Units Notes1

VIL Input Low Voltage -0.30 0 V

VIH Input High Voltage 1.15 V

VCROSS Absolute crossing

voltage 0.3 0.550 V 2

dVCROSS Ra nge of crossing points 0.14 V

CIN Input Capacitance 1.0 3.0 pF

Table 4-25.DDR2/DDR3 Signal Group DC Specifications

Symbol Parameter Min (V) Typ (V) Max (V)

Units

Notes1

VIL(DC) Input Low Voltage DDR_VREF - 0.2 V 2,4,9

VIH(DC) Input High Voltage DDR_VREF + 0.2 V 3,9

VIL(AC) Input Low Voltage DDR_VREF - 0.25 V 2,4,9

VIH(AC) Input High Voltage DDR_VREF + 0.25 V 3,9

Electrical Specifications

48 Datasheet

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. VIL is defined as the maxi mum voltage lev el at a recei ving agent that will be interpreted as

a logical low value.

3. VIH is defined as th e minimum v oltage lev el at a receiving agent that will be interpreted as

a logical high value.

4. VIH and VOH may experience excursions above VCCSM. However, input signal drivers must

comply with the signal quality specifications.

5. Measured at VCCSM(MIN).

6. The minimum and maximum values for these signals are programmable by BIOS

7. VCCSM varies with typical/min/max cases. Refer Table 4-23 for details.

8. 2x Buffer Strength Settings is equal to a 20Ohm buffer setting.

9. DDR_VREF could either be from external or internal reference voltage.

4.10.2.3 LGIO Signal DC Specification

VOL Output Low Voltage

DDR2

DDR3 0.27

0.20

VOH Output High Voltage

DDR2

DDR3 1.47

1.22

V4,5

ILI Input Leakage

Current 10 μA

VREF DDR Reference

Voltage VCCSM / 2 7

CI/O DQ/DQS/DQS#

DDR2 I/O Pin

Capacitance

3.5 3.5 3.6 pF

Table 4-25.DDR2/ DDR3 Signal Group DC Specifications

Symbol Parameter Min (V) Typ (V) Max (V)

Units

Notes1

Table 4-26.GTL Signal Group DC Specifications

Symbol Parameter Min Typ Max Units Notes1

VCCP I/O Voltage 1 1.05 1.1 V

GTLREF GTL

Reference

Voltage

2/3 VCCP 2/3 VCCP V6

RODT On Die

Termination 55 Ohm 10

VIH Input High

Voltage GTLREF + 0.1 VCCP + 0.1 V 3,6

VIL Input Low

Voltage -0.1 GTLREF - 0.1 V 2,4

VOH Output High

Voltage VCCP - 0.1 VCCP V6

Datasheet 49

Electrical Specifications

NOTES:

1. Unless otherwise note d, all specifications in this table apply to all processor frequencies.

2. VIL is defined as the maximum voltage l evel at a receiving agent that will be i nterpreted as

a logical low value.

3. VIH is defined as the maximum voltage level at a receiving agent that will be interpreted

as a logical high value.

4. VIH and VOH may experience excursions above VCCP.. However, input signal drivers must

comply with the signal quality specifications.

5. This is th e pull-down driver re sistance. Measured at 0.31 * VCCP

. RON(min) = 0.4 * RTT,

RON(typ) = 0.455 * RTT, RON(max) = 0.51 * RTT. RTT typical value of 55 Ohm is used for RON

typ/min/max calculations.

6. GTLREF is the on-die termination resistance measured at VOL of the output driver.

Measured at 0.31 * VCCP. The VCCP

. referred to in these specifications is the in stantaneous

VCCP.

7. RTT is the on-die terminat ion resi stanc e measured at VOL of the output driver. Measured at

0.31 * VCCP

. RTT i s co nnected to VCCP on die.

8. Specified with on-die RON and RTT are turned off. Vin between 0 and VCCP.

9. CPAD includes die capacitance only. No package parasitic are included.

10. On die termination resistance, measured at 0.33 * VCCP.

NOTES:

1. Unless otherwise note d, all specifications in this table apply to all processor frequencies.

2. The VCCP referred to in these specifications is the instantaneous VCCP.

3. Refer to the processor I/O Buffer Models for I/V characteristics.

4. Measured at Iout = -1.1 mA.

RTT Termination

Resistance 20 55 70 Ohm 7

RON Buffer on

Resistance 14 25 40 Ω5

ILI Input

Leakage

Current

-100 100 μA8

CPAD Pad

Capacitance 2.35 2.5 2.6 pF 9

Table 4-26.GTL Signal Group DC Specifications

Symbol Parameter Min Typ Max Units Notes1

Table 4-27.Legacy CMOS Signal Group DC Specification

Symbol Parameter Min Typ Max Units Notes1

VCCP I/O Voltage 1.00 1.05 1.10 V

VIH Input High Vo ltage 0.7 * VCCP VCCP + 0.1 V 2

VIL Input Low Voltage -0.1 0 0.3 * VCCP V2, 3

VOH Output High Voltage 0.9 * VCCP VCCP VCCP + 0.1 V 2, 4

VOL Output Low Voltage -0.1 0.1 * VCCP V2, 5

ILI Input Leakage Current -100 100 uA 6

CPAD1 Pad Capacitance 2.35 2.5 2.6 pF 7

CPAD2 Pad Capacitance for

CMOS Input 0.85 1.0 1.05 pF 8

Electrical Specifications

50 Datasheet

5. Measured at Iout = 1.1 mA.

6. For VIN between 0V and VCCP. Measured when driver is tri-stated.

7. CPAD1 includes die capacitance only for CPUPWRGOOD. No package parasitic are included.

8. CPAD2 includes die capacitance for all other CMOS input signals. No package parasitics are

included.

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Measured at 0.2V

3. VOH is determined by value of the external pull-up resistor to VCCP.

4. For VIN between 0V and VCCP.

5. CPAD includes die capacitance only. No package parasitic are included.

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. VIH may experi ence excursion s above VCCP.. However, input signal drivers must comply with

the signal quality specifications.

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. VIH may experi ence excursion s above VCCP.. However, input signal drivers must comply with

the signal quality specifications.

Table 4-28.Open Drain Signal Group DC Specification

Symbol Parameter Min Typ Max Units Notes1

VOH Output High Voltage VCCP - 5% VCCP + 5% V 3

VOL Output Low Voltage -- 0.20 V

IOL Output Low Curren t 16 60 mA 2

ILI Input Leakage Current -200 200 uA 4

CPAD Pad Capacitance 1.8 2.1 2.6 pF 5

Table 4-29.PWROK and RSTIN# DC Specification

Symbol Parameter Min Typ Max Units Notes1,2

VIL Input Low Voltage -0.3 0.8 V 2

VIH Input High Voltage 2.7 VCC3.3*(1+

5%) V2

LIInput Leakage Current 100 uA

CPAD1 Pad Capacitance 1.5 pF

Table 4-30.CPUPWRGOOD DC Specification

Symbol Parameter Min Max Units Notes1

VIL Input Low Voltage -0.1 0.3 * VCCP V

VIH Input High Voltage 0.7 * VCCP VCCP + 0.1 V 2

VHYS Hysteresis of Schmitt Trigger

Inputs 100 -- mV

LIInput Current of Each I/O Pin -10 10 uA

CICapacitance of Each I/O Pin -- 1.5 pF

Datasheet 51

Electrical Specifications

Table 4-31.DDR3_DRAM_PWROK DC Specification

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor

frequencies.

2. VIH may experience excursions above VCCSM. However, input signal drivers must

comply with the signal quality specifications.

Symbol Parameter Min Max Units Notes1

VIL Input Low Voltage 0.29 V

VIH Input High Voltage 1.25PV2

IIL Inputs leakage current 20 uA

Electrical Specifications

52 Datasheet

4.10.2.4 JTAG DC Specification

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

4.10.2.5 Display DC Specification

The Analog Video Signal DC Specifications are referred to the VESA Video Signal

Standard Version 1, Revision 2.

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. 3mA sink current.

3. 0.1 VCC_GIO < VIN < 0.9 VCC_GIO(MAX)

Table 4-32.TAP Signal Group DC Specification

Symbol Parameter Min Typ Max Units

Notes1

RPDGTL GTL mode pull-down

impedance (JTAG mode) 25 Ohm

VT- Input fall transition threshold

voltage 0.54* VCCP - 0.66* VCCP V

VT+ Input rise tr ansition threshold

voltage 0.74* VCCP - 0.86* VCCP V

ILI Input Leakage Current 50 uA

Table 4-33.CRT_DDC_DATA. CRT_DDC_CLK DC, LDDC_DATA, LDDC_CLK, LCTLA_CLK, and

LCTLB_DATA Specification

Symbol Parameter

Standard mode

100 kbits/s Units Notes1

Min Max

VIL Input Low Voltage -0.5 0.3 VCC_GIO V

VIH Input High Voltage 0.7 VCC_GIO 0.5 +

VCC_GIO

VOL1 Output Low Voltage - 1 0 0.4 V 2

LIInput Leakage Current -50 50 uA 3

CICapacitance -- 10 pF

Datasheet 53

Electrical Specifications

NOTES:

1. Unless otherwise note d, all specifications in this table apply to all processor frequencies.

NOTES:

1. Unless otherwise note d, all specifications in this table apply to all processor frequencies.

2. All LVDS active lanes must be terminated with 100 Ohm resistor for correct VOS

performance and measurement.

NOTES:

1. Unless otherwise note d, all specifications in this table apply to all processor frequencies.

2. ICL=6mA, IOH=2mA

3. For power and unpowered devices.

Table 4-34.CRT_HSYNC and CRT_VSYNC DC Specification

Symbol Parameter Min Typ Max Units Notes1

VOH Output High Voltage 2. 4 -- VCC_GIO V

VOL Output Low Voltage 0 -- 0.5 V

IOH Output High Current -- -- 8 mA

IOL Output Low Current -- -- 8 mA

Table 4-35.LVDS Interface DC Specification (functional operating range,

VCCLVDS = 1.8V +/- 5%)

Symbol Parameter Min Typ Max Units Notes1

VOD Differential Output Voltage 250 350 450 mV 2

ΔVOD Change in VOD between

Complementary Output States 50 mV 2

VOS Offset Voltage 1.125 1.25 1.375 V 2

ΔVOS Change in VOS between

Complementary Output States 50 mV 2

IOS Output Short Circuit Current -3.5 -10 mA 2

IOZ Output TRI-STATE Current ±1 ±10 uA 2

Table 4-36.LVDD_EN, LBLKLT_EN and LBKLT_CTL DC Specification

Symbol Parameter Min Typ Max Units Notes1

VOL Output Low Voltage 0 -- 0.4 V 2

VOH Output High Voltage VCC_GIO

- 0.5 -- VCC_GIO V2

ILInput Leakage -50 -- 5 0 uA 3

Power Management

54 Datasheet

5 Power Management

This chapter provides information on power management capabilities of the processor:

•ACPI States

•Processor Core States

•IGD (Integrated Graphics Devices) States

•IMC (Integrated Memory Controller) States

•DMI (Direct Media Interface) States

5.1 ACPI States Supported

The ACPI states supported by the processor are described in this section.

5.1.1 System States

5.1.2 Processor Idle States

Table 5-37.Syste m States

State Description

G0/S0 Full On

G1/S3-Cold Suspend-to-RAM (STR). Context saved to memory.

G1/S4 Suspend-to-Disk (STD). All power lost (except wakeup on chipset)

G2/S5 Soft off. All power lost (except wakeup on chipset)

G3 Mechanical/hard off. All power (AC and battery) removed from system

Table 5-38.Processor Core/Package States Support

State Description

C0 Active mode, processor executing code

C1 AutoHALT state

C2 Stop Clock. Clock to processor is still running. Clock stopped to processor core

C4 Deeper Sleep. Clock to processor stopped with reduced voltage on the processor

C1E,

C2E, C4E Extended C-states; C1/C2/C4 states work together with Enhanced Intel®

SpeedStep Techn ology

Datasheet 55

Power Management

5.1.3 Integrated Graphics Display States

5.1.4 Integrated Memory Controller States

5.1.5 DMI States

5.1.6 Interf ace Stat e Combinations

Table 5-39.Integrated Graphics Display Device Control

State Description

D0 Display active

D3 Display power off

Table 5-40.Main Memory States

States Description

Power-up CKE asserted. Active mode

Precharge Powerdown CKE de-asserted (not self-refresh) with all banks closed

Active Powerdown CKE de-asserted (not self-refresh) with at least one bank active

Self-Refresh CKE de-asserted using device self-refresh

Table 5-41.DMI States

States Description

L0 Full on – Active transfer state

L0s First Active Power Management low power state – Low exit latency

L1 Lowest Active Power Management - Longer exit latency

Table 5-42.G, S and C State combinations

Global

(G) State Sleep

(S) State

Processor

Core

Processor

State System Clocks Description

G0 S0 C0 Full On On Full On

G0 S0 C1/C1E Auto-Halt On Auto-Halt

G0 S0 C2/C2E Stop-Grant On Stop-Grant

G0 S0 C4/C4E Deeper

Sleep On Deeper Sleep

G1 S3 Power off Off except RTC Suspend to RAM

Power Management

56 Datasheet

5.2 Processor Core Power Management

While executing code, Enhanced Intel® SpeedStep Technology optimizes the

processor’s frequency and core voltage based on workload. Each frequency and voltage

operating point is defined by ACPI as a P-state. When the processor is not executing

code, it is idle. A low-power idle state is defined by ACPI as a C -state. In general, lower

power C-states have longer entry and exit latencies.

5.2.1 Enhanced Intel SpeedStep® Technology

The following are the key features of Enhanced Intel SpeedStep Technology:

•Multiple frequency and voltage points for optimal performance and power

efficiency. These operating points are known as P-states.

•Frequency selection is software controlled by writing to processor MSRs. The

voltage is optimized based on the selected frequency:

— If the target frequency is higher than the current frequency, VCC is ramped up in

steps to an optimized voltage. This voltage is signaled by the VID pins to the

voltage regulator. Once the voltage is established, the PLL locks on to the target

frequency.

— If the target frequency is lower than the current frequency, the PLL locks to the

target frequency, then transitions to a lower voltage by signaling the target

voltage on the VID pins.

G1 S4 Power off Power off Off except RTC Suspend to Disk

G2 S5 Power off Power off Off except RTC Soft Off

G3 NA Power Off Power off Power off Hard Off

Table 5-43.D, S and C state Combinations

Graphics Adapter

(D) State Sleep (S)

State Package (C)

State Description

D0 S0 C0 Full On, Displ aying

D0 S0 C1 Auto-Halt, Displaying

D0 S0 C2/C4 Stop Grant/Deeper Sleep, Displaying

D3 S0 Any Not Displaying

D3 S3 --- Not Displaying, host core power off.

D3 S4 --- Not Di splaying Suspend to disk Host

core power off

Table 5-42.G, S and C State combinations

Global

(G) State Sleep

(S) State

Processor

Core

Processor

State System Clocks Description

Datasheet 57

Power Management

— Software-requested tr ansitions are accepted at any time. If a previous transition

is in progress, the new transition is deferred until the previous transition is

completed.

•The processor controls voltage ramp rates internally to ensure glitch-free

transitions.

•Because there is low transition latency between P-states, a significant number of

transitions per second are possible.

•Improved Thermal Monitor mode.

— When the on-die thermal sensor indicates that the die temperature is too high,

the processor can automatically perform a transition to a lower frequency and

voltage specified in a software programmable MSR.

— The processor waits for a fixed time period. If the die temperature is down to

acceptable levels, an up transition to the previous frequency and voltage point

occurs.

— An interrupt is generated for the up and down Intel Thermal Monitor transitions

enabling better system level thermal management.

5.2.2 Dynamic Cache Sizing

Dynamic Cache Sizing allows the processor to flush and disable a programmable

number of L2 cache ways upon each Deeper Sleep entry under the following condition:

•The C0 timer that tracks continuous residency in the Normal package state, has not

expired. This timer is cleared during the first entry into Deeper Sleep to allow

consecutive Deeper Sleep entries to shrink the L2 cache as needed.

•The predefined L2 shrink threshold is triggered.

The number of L2 cache ways disabled upon each Deeper Sleep entry is configured in

the BBL_CR_CTL3 MSR. The C0 timer is referenced through the

CLOCK_CORE_CST_CONTROL_STT MSR. The shrink threshold under which the L2

cache size is reduced is configured in the PMG_CST_CONFIG_CONTROL MSR. If the

ratio is zero, then the ratio will not be taken into account for Dynamic Cache Sizing

decisions.

5.2.3 Low-Power Idle States

When the processor core is idle, low-power idle states (C-states) are used to save

power. More power savings actions are taken for numerically higher C -states. However,

higher C -states have longer exit and entry latencies. Resolution of C -states occur at the

thread, processor core, and processor core package level. Thread level C-states are

available if Hyper-Threading Technology is enabled.

Power Management

58 Datasheet

5.2.3.1 Clock Control and Low-Power States

The processor core supports low power states at the thread level and core/package

level. Thread states (TCx) loosely correspond to ACPI processor core power states (Cx).

A thread may independently enter TC1/AutoHALT, TC1/MWAIT, TC2, TC3 and T C4 lower

power states, but this does not always cause a power state transition. Only when both

threads request a low-power state (TCx) greater than the current processor core state

will a transition occur. The central power management logic ensures the entire

processor core enters the new common processor core power state. For processor core

power states higher than C1, this would be done by initiating a P_LVLx (P_LVL2,

P_LVL3, P_LVL4) I/O read to both threads. Package states are states that require

external intervention and typically map back to processor core power states. Package

states for processor core include Normal (C0, C1), and Stop Grant, Stop Grant Snoop

(C2), and Deeper Sleep (C4).

The processor core implements two software interfaces for requesting low power

states: MWAIT instruction extensions with sub-state hints and P_LV Lx reads to the

ACPI P_BLK register block mapped in the processor core’s I/O address space. The

P_LVLx I/O reads are converted to equivalent MWAIT C-state requests inside the

processor core and do not directly result in I/O reads on the processor core bus. The

monitor address does not need to be setup before usin g the P_LVLx I/O read interface.

The sub-state hints used for each P_LVLx read can be configured in a software

programmable MSR by BIOS. If a thread encounters a chipset break even while

STPCLK# is asserted, then it asserts the PBE# output signal. Assertion of PBE#

(multifunction of FERR#) when STPCLK# is asserted indicates to system logic that

individual threads should return to the C0 state and the processor core should return to

the Normal state.

Entry and exit of C-states at the thread and core level are show in Figure 5-7

Figure 5-6.Idle Power Management Breakdown of the Processor Thread

Processor Core/Package State

Thread 1 StateThread 0 State

Datasheet 59

Power Management

NOTES:

1. halt break = A20M# transition, INIT#, INTR, NMI, PREQ#, SMI# or APIC interrupt.

2. core state break = (halt break OR Monitor event) AND STPCLK# high (not asserted)

3. STPCLK# assertion and de-assertion have no effect if a thread is in C2 state.

Figure 5-7.Thread C-state

C2†

Stop

Grant

Core state

break

P_LVL2 or

MWAIT(C2)

C1/

MWAIT Core state

break

MWAIT(C1)

C1/Auto

Halt

Halt break

H L T ins tr u c tio n

C4†

Core State

break

P_LV L4 o r

MWAIT(C4)

STPCLK#

de-asserted

STPCLK#

asserted

STPCLK#

de-asserted

STPCLK#

asserted

STPCLK#

de-asserted

STPCLK#

asserted

Figure 5-8.Processor Core Low-power States

Stop Grant

Snoop

Normal Stop

Grant Deep

Sleep

STPCLK# asserted

Snoop

serviced Snoop

occurs

Deeper

Sleep

DPSLP# asserted

DPSLP# de-asserted DPR S TP# de -ass erted

DPRSTP# asserted

STPCLK# de -asserted

Power Management

60 Datasheet

NOTES:

1. AutoHALT or MWAIT/C1

2. To enter a package state, both threads must be in a common low power state. If the

threads are not in a common low power state, the package state will resolve to the highest

power C state.

5.2.4 Thread C-states Description

5.2.4.1 Thread C0 State

This is the normal operating state for threads in the processor core.

5.2.4.2 Thread C1/AutoHALT Po werdown State

C1/AutoHALT is a low-power state entered when one thread executes the HALT

instruction while the other is in the TC1 or greater thread state. The processor core will

transition to the C0 state upon occurrence of SMI#, INIT#, LINT00/LINT10 (NMI,

INTR), or internal bus interrupt messages. RSTINB will cause the processor core to

immediately initialize itself.

A System Management Interrupt (SMI) handler will return execution to either Normal

state or the AutoHALT power down state. See the Intel® 64 and IA-32 Arc h it ec tu res

Software Developer’s Manuals, Volume 3A/3B: System Programmer’s Guide for more

information.

The system can generate STPCLK# while the processor core is in the AutoHALT power

down state. When the system de-asserts the STPCLK# interrupt, the processor core

will return to the HALT state.

While in AutoHalt power down state, the processor core will process bus snoops. The

processor core will enter an internal snoopable sub-state to process the snoop and then

return to the AutoHALT power down state.

Table 5-44. Coordination of Thread Low-power States at the Package/Core Level

Processor Core

C-State

Thread 1

C0 C1 C2 C4

Thread 0

C0 C0 C0 C0 C0

C1 C0 C11C11C11

C2 C0 C11C2 C2

C4 C0 C11C2 C4

Datasheet 61

Power Management

5.2.4.3 Thread C1/MWAIT Power-down State

C1/MWAIT is a low-power state entered when one thread executes the MWAIT (C1)

instruction while the other thread is in the TC1 or greater thread state. processor core

behavior in the MWAIT state is identical to the AutoHALT state except that Monitor

events can cause the processor core to return to the C0 state. See the Intel® 64 and

IA-32 Architectures Software Developer’s Manuals, Volume 2A: Instruction Set

Reference, A-M and Volume 2B: Instruction Set Reference, N-Z, for more information.

5.2.4.4 Thread C2 State

Individual threads of the dual-threaded processor can enter the C2 state by initiating a

P_LVL2 I/O read to the P_BLK or an MWAIT(C2) instruction, but the processor will not

issue a Stop-Grant Acknowledge special bus cycle unless the STPCLK# pin is also

asserted.

While in the C2 state, the processor will process bus snoops and snoops from the other

thread. The processor thread will enter a snoopable sub-state to process the snoop and

then return to the C2 state.

5.2.4.5 Thread C4 State

Individual threads of the processor can enter the C4 state by initiating a P_LVL4 I/O

read to the P_BLK or an MWAIT(C4) instruction. If both processor threads are in C4,

the central power management logic will request that the entire processor enter the

Deeper Sleep package low-power state.

To enable the package level Intel Enhanced Deeper Sleep state, Dynamic Cache Sizing

and Intel Enhanced Deeper Sleep state fields must be configured in the

PMG_CST_CONFIG_CONTROL MSR.

5.2.5 Processor Core/Package C-states Description

The following state descriptions assume that both threads are in a common low power

state. For cases when only one thread is in a low power state, no change in Core/

Package power state will occur (see Section 5.2.3).

5.2.5.1 Normal State (C0, C1)

This is the normal oper ating state for the processor core. The processor core remains in

the Normal state when the processor core is in the C0, C1/AutoHALT, or C1/MWAIT

state. C0 is the active execution state.

5.2.5.2 C2 State

Individual threads of the dual-threaded processor core can enter TC2 state by initiating

a P_LVL2 I/O read to the P_BLK or an MW AIT (C2) instruction. Once both threads hav e

C2 as a common state, the processor core will transition to the C2 state; however, the

processor core will not issue a Stop-Grant Acknowledge special bus cycle unless the

STPCLK# pin is also asserted by the chipset.

Power Management

62 Datasheet

While in the C2 state, the processor core will process bus snoops. The processor core

will enter a snoopable sub-state described in the following section (and shown in Figure

31), to process the snoop and return to the C2 state.

5.2.5.2.1 S top-G rant Stat e

When STPCLK# pin is asserted, each thread of the processor cores enter the Stop-

Grant state within 1384 bus clocks after the response phase of the processor-issued

Stop-Grant Acknowledge special bus cycle. When the STPCLK# pin is deasserted, the

core returns to its previous low-power state.

RSTIN# causes the processor core to imme diately initialize itself, but the processor

core will stay in Stop-Grant state. When RSTIN# is asserted by the system, the

STPCLK#, DPSLP#, and DPRSTP# pins must be de-asserted prior to RSTIN# de-

assertion.

While in Stop-Grant state, the processor core will service snoops and latch interrupts

delivered on the internal bus. The processor core will latch SMI#, INIT# and LINT[1:0]

interrupts and will service only one of each upon return to the Normal state.

The PBE# (FERR#) signal may be driven when the processor core is in Stop-Grant

state. PBE# will be asserted if there is any pending interrupt or Monitor event latched

within the processor core. Pending interrupts that are blocked by the EFLAGS. IF bit

being clear will still cause assertion of PBE#. Assertion of PBE# indicates to system

logic that the entire processor core should return to the Normal state.

A transition to the Stop-Grant Snoop state occurs when the processor core detects a

snoop on the internal bus.

5.2.5.2.2 S top-G rant Sn oop State

The processor core responds to snoop or interrupt transactions on the internal bus

while in Stop-Grant state by entering the Stop-Grant Snoop state. The processor core

will stay in this state until the snoop on the internal bus has been serviced (whether by

the processor core or another agent on the internal bus) or the interrupt has been

latched. The processor core returns to the Stop-Grant state once the snoop has been

serviced or the interrupt has been latched.

5.2.5.3 Deep Sleep State

The Deep Sl eep state is entere d through assertion of the DP SLP# pin while i n the Sleep

state. BCLK may be stopped during the Deep Sleep state for additional platform level

power savings. Deep Sleep S t ate is mapped into the Deeper Sleep State for this

processor.

BCLK stop/restart timings on appropriate chipset-based platforms with the clock chip

are as follows:

•Deep Sleep entry: the system clock chip may stop/tri-state BCLK within 2 BCLKs

of DPSLP# assertion. It is permissible to leave BCLK running during Deep Sleep.

Datasheet 63

Power Management

•Deep Sleep exit: the system clock chip must start toggling BCLK within 10 BCLK

periods within DPSLP# de-assertion.

5.2.5.4 Deeper Sleep State

The Deeper Sleep state is similar to the Deep Sleep state but further reduces core

voltage levels. One of the potential lower core voltage levels is achieved by entering the

base Deeper Sleep state. The Deeper Sleep state is entered through assertion of the

DPRSTP# pin while in the Deep Sleep state.

In response to entering Deeper Sleep, the processor drives the VID code corresponding

to the Deeper Sleep core voltage on the VID [6:0] pins.

Exit from Deeper Sleep is initiated by DPRSTP# de-assertion when the core requests a

package state other than C4 or the core requests a processor performance state other

than the lowest operating point.

5.2.5.5 Extended Low-Power States

Extended low-power states (C1E, C2E, C4E) optimize for power by forcibly reducing the

performance state of the processor when it enters a package low-power state. In stead

of directly transitioning into the package low-power state, the extended low-power

state first reduces the performance state of the processor by performing an Enhanced

Intel® SpeedStep Technology transition down to the lowest operating point. Upon

receiving a break event from the package low-power state, control will be returned to

software while an Enhanced Intel® SpeedStep Technology transition up to the initial

operating poin t occurs. The advantage of this feature is that it significantly reduces

leakage while in the package low power states. Also, long-term reliability may not

be assured if the Extended Low-Power States are not enabled.

The processor implements two software interfaces for requesting extended package

low-power states: MWAIT instruction extensions with sub-state hints and via BIOS by

configuring IA32_MISC_ENABLES MSR bits to automatically promote package low-

power states to extended package low-power states.

Extended Stop-Grant and Extended Deeper Sleep must be enabled via the

BIOS for the processor to remain within specification. Not complying to this

guideline may affect the long-term reliability of the processor.

Enhanced Intel® SpeedStep Technology transitions are multi-step processes that

require clocked control. These transitions cannot occur when the processor is in the

Sleep or Deep Sleep package low-power states since processor clocks are not active in

these states. Extended Deeper Sleep is an exception to this rule when the Hard C4E

configuration is enabled in the IA32_MISC_ENABLES MSR. This Extended Deeper Sleep

state configuration will lower core voltage to the Deeper Sleep level while in Deeper

Sleep and, upon exit, will automatically transition to the lowest operating voltage and

frequency to reduce snoop service latency.

Power Management

64 Datasheet

The transition to the lowest operating point or back to the original software requested

point may not be instantaneous. Furthermore, upon very frequent transitions between

active and idle states, the transitions may lag behind the idle state entry resulting in

the processor either executing for a longer time at the lowest operating point or

running idle at a high operating point. Observations and analyses show this behavior

should not significantly impact total power savings or performance score while

providing power benefits in most other cases.

5.3 External Thermal Sensor PM_EXTTS1#:

Implementation for Fast C4/C4E Exit

Being used as DPRSLPVR is an alternate functionality for the PM_EXTTS1# signal. This

implementation enables power savings by speeding up the C4 exit latency. To enable

power savings, the PM_EXTTS1#/DPRSLPVR of the processor and the DPSLPVR signal

of the chipset should be connected as shown in Figure 5-9 below . The DPRSLPVR signal

of the chipset needs to be connected to the DPRSLPVR signal of the IMVP6 via a

500ohm series isolation resistor. The pull-up on the PM_EXTTS1# signal should be

removed in this particular implementation.

This implementation enables power-savings by increasing average C-state residency of

the processor (The probability of the CPU going into C4/C4E state increases if the exit

latency is reduced).

With this implementation, PM_EXTTS1# cannot be used for thermal throttling of

Memory. If this implementation is chosen, system designers shall need to ensure that

the memory Auto-refresh rate programmed on their systems is the most appropriate

for their thermal solution and choice of memory.

Intel strongly recommends the implementation described above, to enable greater

power savings on the processor. For details of the recommended routing topologies and

guidelines, please contact your Intel Field Representative.

Note: PM_EXTTS0# cannot be used in this manner.

Datasheet 65

Power Management

Figure 5-9.PM_EXTTS1#/DPSLPVR Implementation for Fast C4/ C4E Exit

Thermal Specifications and Design Considerations

66 Datasheet

6 Thermal Specifications and

Design Considerations

The processor requires a thermal solution to maintain temperatures within operating

limits as set forth in Section Thermal Specifications. Any attempt to operate the

processor outside these operating limits may result in permanent damage to the

processor and potentially other components in the system. As processor technology

changes, thermal management becomes increasingly crucial when building computer

systems. Maintaining the proper thermal environment is key to reliable, long-term

system operation.

A complete thermal solution includes both component and system level thermal

management features. Component level thermal solutions include active or passive

heatsink attached to the exposed processor die. The solution should make firm contact

to the die while maintaining processor mechanical specifications such as pressure. A

typical system level thermal solution may consist of a system fan used to evacuate or

pull air through the system. Alternatively, the processor may be in a fan-less system,

but would likely still use a multi-component heat spreader. Note that trading of thermal

solutions also involves trading performance.

6.1 Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based

systems, the system/processor thermal solution should be designed such that the

processor remains within the mi nimum and maximum junction te mperature (Tj)

specifications at the corresponding thermal design power (TDP) value listed in Table 6-

45. Thermal solutions not designed to provide this level of thermal capability may affect

the long-term reliability of the processor and system.

The maximum junction temperature is defined by an activation of the processor

Thermal Monitor. Refer to Section 6.1.2 for more details. Analysis indicates that real

applications are unlikely to cause the processor to consume the theoretical maximum

power dissipation for sustained time periods. Intel recommends that complete thermal

solution designs target the TDP indicated in Table 6-45 instead of the maximum

processor power consumption. The Intel Thermal Monitor feature is designed to help

protect the processor in the unlikely event that an application exceeds the TDP

recommendation for a sustained period of time. For more details on the usage of this

feature, refer to Section Section 6.1.2. In all cases the Intel Thermal Monitor feature

must be enabled for the processor to remain within specification.

Datasheet 67

Thermal Specifications and Design Considerations

NOTES:

1. The TDP specification should be used to design the processor thermal solution. The TDP is

not the maximum theoretical power the pro cessor can generate.

2. Not 100% tested. These power specifications are determined by characterization of the

processor currents at higher temperatures and extrapolating the values for the

temperature indicated.

3. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate

within specifications.

The processor incorporates 3 methods of monitoring die temperature: Digital Thermal

Sensor, Intel Thermal Monitor, and the Thermal Diode. The Intel Thermal Monitor

(detailed in Section Section 6.1.2) must be used to determine when the maximum

specified processor junction temperature has been reached.

6.1.1 Thermal Diode

The processor incorporates an on-die PNP transistor whose base emitter junction is

used as a thermal “diode”, with its collector shorted to ground. The thermal diode can

be read by an off-die analog/digital converter (a thermal sensor) located on the

motherboard or a stand-alone measurement kit. The thermal diode may be used to

monitor the die temperature of the processor for thermal management or

instrumentation purposes but is not a reliable indication that the maximum operating

temperature of the processor has been reached. See Section 6.1.2 for more details and

thermal diode usage recommendation when the PROCHOT# signal is not asserted.

The reading of the external thermal sensor (on the motherboard) connected to the

processor thermal diode signals will not necessarily reflect the temperature of the

hottest location on the die. This is due to inaccuracies in the external thermal sensor,

on-die temperature gr adients between the location of the thermal diode and the hottest

location on the die, and time based variations in the die temperature measurement.

Time based variations can occur when the sampling rate of the thermal diode (by the

thermal sensor) is slower than the rate at which the TJ temperature can change.

Table 6-45.Power Specifications for the Processor

Symbol Processor

Number Core

Frequency Thermal Design

Power Unit Notes

TDP N450/N455

N470/N475 1.66 GHz

1.83 GHz 5.5/6.5

6.5 W1, 2, 3

N550

N570 1.5 GHz

1.66 GHz 6.5

6.5

Symbol Parameter Min Typ Max Unit

Tj 0 100 (°C)

Thermal Specifications and Design Considerations

68 Datasheet

Offset between the thermal diode based temperature reading and the Intel Thermal

Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic

mode activation of the thermal control circuit. This temperature offset must be taken

into account when using the processor thermal diode to implement power management

events.

Table 6-46 and Table 6-47 provide the diode interface and specifications. Transistor

model parameters shown in Table 6-47 providing more accurate temperature

measurements when the diode ideality factor is closer to the maximum or minimum

limits. Contact your external sensor supplier for their recommendation. The thermal

diode is separate from the Thermal Monitor’s thermal sensor and cannot be used to

predict the behavior of the Thermal Monitor.

NOTES:

1. Intel does not support or recommend operation of the thermal diode under revers e bias.

2. Characterized across a temperature range of 50–100°C.

3. Not 100% tested. Specified by design characterization.

4. The ideality factor, nQ, represents the deviation from ideal transistor model behavior as

exemplified by the equation for the collector current:

IC = IS * (e qVBE/nQkT –1)

where IS = saturation current, q = electronic charge, VBE = voltage across the transistor

base emitter junction (same nodes as VD), k = Boltzmann Constant, and T = absolute

temperature (Kelvin).

5. The series resistance, RT, provided in the Diode Model Table (Table 6-47) can be used for

more accurate readings as needed.

When calculating a temperature based on the thermal diode measurements, a number

of parameters must be either measured or assumed. Most devices measure the diode

ideality and assume a series resistance and ideality trim value, although are capable of

also measuring the series resistance. Calculating the temperature is then accomplished

using the equations listed under Table 6-47. In most sensing devices, an expected

value for the diode ideality is designed-in to the temperature calculation equation. If

the designer of the temperature sensing device assumes a perfect diode, the ideality

Table 6-46.Thermal Diode Interface

Signal Name Pin/Ball Number Signal Description

THRMDA_1 D30 Thermal diode anode

THRMDC_1 E30 Thermal diode cathode

Table 6-47.Thermal Diod e Parameters using Transistor Model

Symbol Parameter Min Typ Max Unit Notes

IFW Forward Bias Current 5 200 μA1

IE Emitter Current 5 200 μA1

nQ Transistor Ideality 0.997 1.001 1.015 2,3,4

Beta 0.25 0.65 2,3

RT Series Resistance 2.79 4.52 6.24 Ω2,5

Datasheet 69

Thermal Specifications and Design Considerations

value (also called ntrim) will be 1.000. Given that most diodes are not perfect, the

designers usually select an ntrim value that more closely matches the behavior of the

diodes in the processor. If the processor diode ideality deviates from that of the ntrim,

each calculated temperature will be offset by a fixed amount. This temperature offset

can be calculated with the equation:

Terror(nf) = Tmeasured * (1 - nactual/ntrim)

where Terror(nf) is the offset in degrees C, Tmeasured is in Kelvin, nactual is the

measured ideality of the diode, and ntrim is the diode ideality assumed by the

temperature sensing device.

6.1.2 Intel® Thermal Monitor

The Intel Thermal Monitor helps control the processor temperature by activating the

TCC (Thermal Control Circuit) when the processor silicon reaches its maximum

operating temperature. The temperature at which the Intel Thermal Monitor activates

the TCC is not user configur able. Bus traffic is snooped in the normal manner and

interrupt requests are latched (and serviced during the time that the clocks are on)

while the TCC is active.

With a properly designed and characterized thermal solution, it is anticipated that the

TCC would only be activated for very short periods of time when running the most

power intensive applications. The processor performance impact due to these brief

periods of TCC activation is expected to be minor and hence not detectable. An under-

designed thermal solution that is not able to prevent ex cessive activation of the TCC in

the anticipated ambient environment may cause a noticeable performance loss and

may affect the long-term reliability of the processor. In addition, a thermal solution that

is significantly under designed may not be capable of cooling the processor even when

the TCC is activ e continuously.

The Intel Thermal Monitor controls the processor temperature by modulating (starting

and stopping) the processor core clocks when the processor silicon reaches its

maximum operating temperature. The Intel Thermal Monitor uses two modes to

activate the TCC: automatic mode and on-demand mode. If both modes are activated,

automatic mode takes precedence.

There are two automatic modes called Intel Thermal Monitor-1 and Intel Thermal

Monitor-2. These modes are selected by writing values to the MSRs of the processor.

After automatic mode is enabled, the TCC will activate only when the internal die

temperature reaches the maximu m allowed value for operation.

The Intel Thermal Monitor automatic mode must be enabled throug h BIOS for

the processor to be operating within specifications. Intel recommends TM1

and TM2 be enabled on the processors.

When TM1 is enabled and a high temperature situation exists, the clocks will be

modulated by alternately turning the clocks off and on at a 50% duty cycle. Cy cle times

are processor speed dependent and will decrease linearly as processor core frequencies

increase. Once the temperature has returned to a non-critical lev el, modulation ceases

Thermal Specifications and Design Considerations

70 Datasheet

and TCC goes inactiv e. A small amount of hysteresis has been included to prevent rapid

active/inactive transitions of the TC C when th e processor temper ature is near the trip

point. The duty cycle is factory configured and cannot be modified. Also, automatic

mode does not require any additional hardware, software drivers, or interrupt handling

routines. Processor performance will be decreased by the same amount as the duty

cycle when the TCC is active.

When Intel Thermal Monitor-2 is enabled and a high temperature situation exists, the

processor will perform an Enhanced Intel® SpeedStep Technology transition to the LFM.

When the processor temperature drops below the critical level, the processor will make

an Enhanced Intel® SpeedStep Technology transition to the last requested operating

point.

Intel Thermal Monitor-1 and Intel Thermal Monitor -2 can co-exist within the processor.

If both Intel Thermal Monitor-1 and Intel Thermal Monitor-2 bits are enabled in the

auto-throttle MSR, Intel Thermal Monitor-2 will take precedence over Intel Thermal

Monitor-1.

However, if Force Intel Thermal Monitor-1 over Intel Thermal Monitor-2 is enabled in

MSRs via BIOS and Intel Thermal Monitor-2 is not sufficient to cool the processor below

the maximum operating temper ature, then Intel Thermal Monitor-1 will also activate to

help cool down the processor. If a processor load based Enhanced Intel® SpeedStep

Technology transition (through MSR write) is initiated when a Intel Thermal Monitor-2

period is active, there are two possible results:

•If the processor load based Enhanced Intel® SpeedStep technology transition

target frequency is higher th an the Intel Thermal Monitor-2 transition based target

frequency, the processor load-based transition will be deferred until the Intel

Thermal Monitor-2 event has been completed.

•If the processor load-based Enhanced Intel® SpeedStep technology transition

target frequency is lower than the Intel Thermal Monitor-2 tr ansition based target

frequency, the processor will transition to the processor load-based Enhanced

Intel® SpeedStep technology target freque ncy point.

The TCC m ay also be activ ated via on-demand mode. If bit 4 of the ACPI Intel Thermal

Monitor control register is written to a 1, the TCC will be activated immediately

independent of the proc e ss or temp erature. When using on-demand mode to activate

the TCC, the duty cycle of the clock modulation is programmable via bits 3:1 of the

same ACPI Intel Thermal Monitor control register. In automatic mode, the duty cycle is

fixed at 50% on, 50% off, however in on-demand mode, the duty cycle can be

programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments.

On-demand mode may be used at the same time automatic mode is enabled, ho wever,

if the system tries to enable the TCC via on-demand mode at the same time automatic

mode is enabled and a high temperature condition exists, automatic mode will take

precedence.

An external signal, PROCHOT# (processor hot) is asserted when the processor detects

that its temperature is above the thermal trip point. Bus snooping and interrupt

latching are also active while the TCC is active.

Datasheet 71

Thermal Specifications and Design Considerations

Besides the thermal sensor and thermal control circuit, the Intel Thermal Monitor also

includes one ACPI register, one performance counter register, three MSR, and one I/O

pin (PROCHOT #). All are available to monitor and control the state of the Intel Thermal

Monitor feature. The Intel Thermal Monitor can be configured to generate an interrupt

upon the assertion or deassertion of PROCHOT#.

PROCHOT# will not be asserted when the processor is in the low power states like Stop

Grant and Deeper Sleep; hence, the thermal diode reading must be used as a

safeguard to maintain the processor junction temperature within maximum

specification. If the platform thermal solution is not able to maintain the processor

junction temperature within the maximum specification, the system must initiate an

orderly shutdown to prevent damage. If the processor enters one of the above power

states with PROCHOT# already asserted, PROCHOT# will remain asserted until the

processor exits the low power state and the processor junction temperature drops

below the thermal trip point.

If Intel Thermal Monitor automatic mode is disabled, the processor will be operating out

of specification. Regardless of enabling the automatic or on-demand modes, in the

event of a catastrophic cooling failure, the processor will automatically shut down when

the silicon has reached a temperature of approximately 125°C. At this point the

THERMTRIP# signal will go active. THERMTRIP# activation is independent of processor

activity and does not generate any bus cycles. When THERMTRIP# is asserted, the

processor core voltage must be shut down within the time specified.

6.1.3 Digital Thermal Sensor

The processor also contains an on die Digital Thermal Sensor (DTS) that can be read

via an MSR (no I/O interface). The DTS is only v alid while the processor is in the normal

operating state (the Normal package level low power state).

Unlike traditional thermal devices, the DTS will output a temperature relative to the

maximum supported operating temperature of the processor (TJ_max). It is the

responsibility of software to convert the relative temperature to an absolute

temperature. The temperature returned by the DTS will always be at or below TJ_max.

Catastrophic temperature conditions are detectable via an Out Of Spec status bit. This

bit is also part of the DTS MSR. When this bit is set, the processor is operating out of

specification and immediate shutdown of the system should occur. The processor

operation and code execution is not ensured once the activation of the Out of Spec

status bit is set.

The DT S-relative temperature readout corresponds to the Thermal Monitor 1(TM1) and

Thermal Monitor 2 (TM2) trigger points. When the DTS indicates maximum processor

core temperature has been reached, the TM1 or TM2 hardware thermal control

mechanism will activate. The DTS and TM1/TM2 temperature may not correspond to

the thermal diode reading since the thermal diode is located in a separate portion of

the die and thermal gr adient between the DTS. Additionally, the thermal gradient from

DTS to thermal diode can vary substantially due to changes in processor power,

Thermal Specifications and Design Considerations

72 Datasheet

mechanical and thermal attach, and software application. The system designer is

required to use the DTS to ensure proper operation of the processor within its

temperature operating specifications.

Changes to the temperature can be detected via two progr amm able thresholds located

in the processor MSRs. These thresholds have the capability of generating interrupts

via the core's local APIC. Refer to the Intel® 64 and IA-32 Architectures Software

Developer's Manuals for specific register and programming details.

6.1.4 Out of Specification Detection

Overheat detection is performed by monitoring the processor temperature and

temperature gradient. This feature is intended for graceful shut down before the

THERMTRIP# is activated. If the processor’s TM1 is triggered and the temperature

remains high, an “Out Of Spec” status and sticky bit are latched in the status MSR

6.1.5 PROCHOT# Signal Pin

An external signal, PROCHOT# (processor hot), is asserted when the processor die

temperature has reached its maximu m operating temperature. If TM1 is enabled, then

the TCC will be active when PROCHO T# is asserted. The processor can be configured to

generate an interrupt upon the assertion or deassertion of PROCHOT#.

The processor implements a bi-directional PROCHOT# capability to allow system

designs to protect various components from overheating situations. The PROCHOT#

signal is bi-directional in that it can either signal when the processor has reached its

maximum operating temperature or be driven from an external source to activate the

TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal

protection of system components.

Only a single PROCHOT# pin exists at a package level of the processor. When the core's

thermal sensor trips, PROCHOT# signal will be driven by the processor package. If TM1

is enabled, PROCHOT# will be asserted and only the core that is above TC C

temperature trip point will have its core clock modulated. If TM2 is enabled and the

core is above TCC temperature trip point, it will enter the lowest programmed TM2

performance state. It is important to note that Intel recommends both TM1 and TM2 to

be enabled.

When PROCHOT# is driven by an external agent and if only TM1 is enabled on the core,

then the processor core will have the clocks modulated. If TM2 is enabled, then the

processor core will enter the lowest progr ammed Intel Thermal Monitor -2 performance

state. It should be noted that Force TM1 on TM2, enabled via BIOS, does not have any

effect on external PROCHO T#. If PROCHOT# is driven by an external agent when TM1,

TM2, and Force TM1 on TM2 are all enabled, then the processor will still apply only

TM2.

Datasheet 73

Thermal Specifications and Design Considerations

PROCHOT# may be used for thermal protection of voltage regulators (VR). System

designers can create a circuit to monitor the VR temperature and activate the TCC

when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low)

and activating the TCC, the VR will cool down as a result of reduced processor power

consumption. Bi-directional PROCHOT# can allow VR thermal designs to target

maximum sustained current instead of maximum current. Systems should still provide

proper cooling for the VR and rely on bi-directional PROCHOT# only as a backup in case

of system cooling failure. The system thermal design should allow the power delivery

circuitry to operate within its temper ature specification even while the processor is

operating at its TDP. With a properly designed and characterized thermal solution, it is

anticipated that bi-directional PROCHO T# would only be asserted for very short periods

of time when running the most power intensive applications.

An under-designed thermal solution that is not able to prevent excessiv e assertion of

PROCHOT# in the anticipated ambient environment may cause a noticeable

performance loss.

Package Mechanical Specifications and Ball Information

74 Datasheet

7 Package Mechanical

Specifications and Ball

Information

This chapter provides the package specifications, and ballout assignments.

7.1 Package Mechanical Specifications

The processor is available with 559 pins micro-FCBGA8 package. The package

dimensions are shown in Figure 7-10.

7.1.1 Package Mechanical Drawings

Figure 7-10.Package Mechanical Drawings

Datasheet 75

Package Mechanical Specifications and Ball Information

7.1.2 Package Loading Specifications

P ackage loading is 15lb max static compressive.

7.2 Processor Ballout Assignment

Figure 7-10 to Figure 7-14 are graphic representations of the processor ballout

assignments. Table 7-48 lists the ballout by signal name.

Figure 7-11.Packag e Pinmap (Top View, Upper-Left Quadrant)

1 2 3 4 5 6 7 8 9 10 111213141516

A --- --- RSVD_NC

TF RSVD_NC

TF --- --- XDP_RSV

D_1 --- XDP_RSV

D_8 --- VSS --- GTLREF --- --- VSS

B --- VCCRING_

WEST VCCP VCCP VSS --- XDP_RSV

D_7 XDP_RSV

D_11 VSS XDP_RSV

D_15 XDP_RSV

D_14 XDP_RSV

D_16 VSS TCK --- VSS

CRSVD_NC

TF VCCRING_

WEST VCCRING_

WEST --- XDP_RSVD

_3 XDP_RSV

D_5 XDP_RSV

D_4 XDP_RSV

D_10 --- XDP_RSV

D_12 XDP_RSV

D_17 VSS --- TMS --- TRST#

D --- --- --- VCCP --- XDP_RSV

D_2 --- XDP_RSV

D_6 XDP_RSV

D_9 XDP_RSV

D_13 --- XDP_RSV

D_0 TDO TDI --- ---

ERSVD_NC

TF VCCP --- --- IGNNE# --- SMI# VSS --- VSS PRDY# --- THERMT

RIP# --- BPM_1_1

#---

F --- DMI_RXN_0 DMI_RXP_

0VSS --- --- --- STPCLK# --- LINT0 LINT1 --- BPM_1_3

#--- PREQ# ---

GDMI_TXN

_0 DMI_TXP_0 DMI_RXN_

1--- RSVD DPRSTP# --- INIT# --- DPSLP# BPM_1_0

#--- BPM_1_2

#--- VSS ---

H --- VSS DMI_TXP_

1DMI_RXP

_1 BSEL_1 FERR# A20M# VSS --- BCLKN VSS --- RSVD --- VSS ---

J RSVD DMI_TXN_1 --- VSS --- --- --- --- --- BCLKP VSS --- VSS --- VSS ---

K --- RSVD RSVD VSS BSEL_0 BSEL_2 EXTBGREF VSS RSVD_TP --- VSS --- VSS --- VCC ---

L VSS RSVD RSVD --- PWROK RSVD RSVD EXP_RBIA

SEXP_ICO

MPI EXP_RCO

MPO RSVD --- VSS VCC --- VCC

M --- RSVD VSS RSVD --- --- --- --- --- --- --- --- --- --- --- ---

N VSS RSVD --- VSS VSS EXP_CLKI

NP EXP_CLKI

NN VSS RSVD RSVD RSVD_TP --- VSS VCC --- VCC

P --- RSVD VSS VSS --- --- --- --- --- --- RSVD_TP --- VSS VSS --- VSS

R --- --- --- --- RSVD_TP RSVD_TP VSS VSS RSVD RSVD --- --- --- --- --- ---

Package Mechanical Specifications and Ball Information

76 Datasheet

Figure 7-12.Package Pinmap (Top View, Upper-Right Quadrant)

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

--- --- VSS --- VCC_LG

I---VCC---VCC---VCC---

RSVD_

NCTF RSVD_

NCTF --- A

--- BPM_2_

0#/RSV

DVSS BPM_2_

1#/RSV

BPM_2_

3#/RSV

DVSS VCC VCC VCC VCC VCC --- VSSSEN

SE RSVD_

NCTF RSVD_

NCTF B

--- PROCH

OT# --- BPM_2_

2#/RSV

DVSS VSS --- VCC VSS VCC --- --- VCCSE

NSE

THRMD

A_2/RS

RSVD_

NCTF C

--- RSVD RSVD_T

PRSVD --- VSS VCC VCC --- VCC --- VCC --- THRMD

A_1

THRMD

C_2/RS

VD D

RSVD --- VSS --- VSS VCC --- VCC VSS --- VCC --- VID_6 THRMD

C_1 --- E

VSS --- VSS --- VCC VCC --- VSS VCC --- --- VSS VID_5 --- --- F

VSS --- VCC --- VCC VSS --- VCC --- --- VSS --- VID_4 VID_3 VSS G

VCC --- VCC --- VSS VCC --- VCC VSS LVDD_E

NVSS VID_2 VID_1 VID_0 --- H

VCC --- VCC --- VCC VCC --- --- --- --- --- LVBG --- PM_EXT

TS#_0 VCCRIN

G_EAST J

VCC --- VSS --- VCC --- LDDC_

CLK LDDC_

DATA LCTLB_

DATA VSS VSS VSS

PM_EXT

TS#_1/

DPRSLP

VSS --- K

--- VSS VCC --- VCC VSS LCTLA_

CLK VSS VSS LBKLT_

CTL LBKLT_

EN --- VSS CRT_D

DC_CL

CRT_D

DC_DA

TA L

--- --- --- --- --- --- --- --- --- --- --- VSS CRT_VS

YNC CRT_H

SYNC --- M

--- VSS VCC --- VCC LVREFH LVREFL VSS VSS LA_DAT

AN_1 LA_DAT

AP_1 VSS --- CRT_IR

TN CRT_R

ED N

--- VSS VSS --- VSS --- --- --- --- --- --- DAC_IR

EF CRT_BL

UE CRT_G

REEN --- P

--- --- --- --- --- LIBG LA_DAT

AN_0 LA_DAT

AP_0 VSS LA_DAT

AN_2 LA_DAT

AP_2 --- --- --- --- R

Datasheet 77

Package Mechanical Specifications and Ball Information

Figure 7-13.Packag e Pinmap (Top View, Lower-Left Quadrant)

T VCCA_DMI VCCA_DM

IVCCA_DMI --- --- --- --- --- --- --- VSS --- VCCGFX VCCGFX --- VCCGF

U --- --- --- --- VCCA_DD

RVCCA_D

DR VCCA_D

DR VCCA_

DDR VCCA_

DDR VCCA_D

DR --- --- --- --- --- ---

V---

VCCA_DD

RVCCA_DD

R--- --- --- --- --- --- VCCD_H

MPLL --- VCCGFX VSS --- VSS

WCPUPWRG

OOD VSS --- VSS VSS VSS VSS HPL_CL

KINN HPL_CL

KINP VCCA_D

DR VCCA_DD

R--- VSS VCCGFX --- VCCGF

Y --- VCCA VSS VSS --- --- --- --- --- --- --- --- --- --- --- ---

AA VCCSFR_D

MIHMPLL VSS RSTIN# --- DDR_A_D

Q_12 RSVD_T

PRSVD_TP VSS DDR_A

_DM_1 VCCACK

_DDR VCCACK_

DDR --- VSS VSS --- VSS

AB --- DDR_A_D

Q_4 DDR_A_D

Q_5

DDR3_DR

AM_PWR

DDR_A_D

Q_13 DDR_A_

DQ_8 DDR_A_

DQ_9 DDR_A

_DQS_1 DDR_A

_DQ_14 --- RSVD_TP --- RSVD_T

P--- RSVD ---

AC DDR_A_DQ

_1 VSS --- DDR_A_D

Q_0 --- --- --- --- --- VSS VSS --- DDR_A_

CK#_1 --- DDR_A

_CK_3 ---

AD --- DDR_A_D

QS# _0 DDR_A_D

QS_0 DDR_A_D

M_0 VSS DDR_A_

DQ_15 DDR_A_

DQS#_1 DDR_A

_DQS_2 --- DDR_A_

DQS#_2 DDR_A_D

Q_22 --- DDR_A_

CK_1 --- DDR_A

_CK#_3 ---

AE VSS DDR_A_D

Q_6 DDR_A_D

Q_7 --- DDR_A_D

Q_10 --- --- DDR_A

_DM_2 --- DDR_A_

DQ_23 VSS --- VSS --- VSS ---

AF --- --- DDR_A_D

Q_28 DDR_A_D

Q_2 --- --- DDR_A_

DQ_20 DDR_A

_DQ_21 --- DDR_A_

DQ_18 VSS --- DDR_A_

CK_4 --- DDR_A

_CK#_0 ---

AG --- DDR_A_D

Q_3 VSS --- DDR_A_D

Q_11 --- DDR_A_

DQ_17 DDR_A

_DQ_16 --- VSS DDR_A_D

Q_19 --- DDR_A_

CK# _4 --- DDR_A

_CK_0 ---

AH DDR_A_DQ

_24 DDR_A_D

Q_29 --- VSS --- VSS --- VSS DDR_A

_CKE_1 DDR_A_

CKE_0 --- DDR_A_

MA_11 DDR_A_

MA_8 DDR_A_

MA_5 --- ---

AJ RSVD_NCT

FDDR_A_D

Q_25 DDR_A_D

M_3 --- --- DDR_A_

DQ_31 DDR_A_

DQ_27 DDR_A

_CKE_3 --- DDR_A_

MA_14 DDR_A_

MA_12 DDR_A_

MA_7 --- DDR_A_

MA_4 --- VSS

AK RSVD_NCT

FRSVD_NC

TF DDR_A_D

QS#_3 --- DDR_A_D

QS_3 DDR_A_

DQ_26 VCCCK_

DDR

DDR3_

DRAMR

ST# VCCSM DDR_A_

CKE_2 DDR_A_B

S_2 DDR_A_

MA_9 VCCSM DDR_A_

MA_6 --- DDR_A

_MA_3

AL --- RSVD_NC

TF RSVD_NCT

F--- DDR_A_D

Q_30 --- VCCCK_

DDR --- VSS --- VCCSM --- VSS --- --- VCCSM

1 2 3 4 5 6 7 8910 11 12 13 141516

Package Mechanical Specifications and Ball Information

78 Datasheet

Figure 7-14.Package Pinmap (Top View, Lower-Right Quadrant)

--- VCCGF

XVCCGF

X--- RSVD_T

P--- --- --- --- --- --- --- VSS VCCAC

RTDAC VCC_GI

--- --- --- --- --- VSS VSS VSS LA_CLK

NLA_CLK

PVSS --- --- --- --- U

--- VSS VCCGF

X--- RSVD_T

P--- --- --- --- --- --- VSS VSS VCCALV

DS --- V

--- VCCGF

XVCCGF

X--- RSVD_T

PDDR_A

_DQ_59 VSS DDR_A

_DQ_58 VSS VSS DDR_A

_DQ_63 VSS --- VSS VCCDLV

DS W

--- --- --- --- --- --- --- --- --- --- --- VSS REFCLK

INN REFCLK

INP --- Y

--- VSS VCCD_

AB_DPL --- RSVD_T

PVSS DDR_A

_DQ_62 DDR_A

_DQ_56 VSS VSS DDR_A

_DQS#

_7 --- VSS REFSSC

LKINP REFSSC

LKINN AA

RSVD --- VSS --- VSS --- DDR_A

_DQ_61 DDR_A

_DQ_60 DDR_A

_DQ_57 DDR_A

_DM_7 DDR_A

_DQS_7 VSS VSS VSS --- AB

RSVD --- VSS --- VSS DDR_A

_DQ_44 --- --- --- --- --- VSS --- VSS VCCSF

R_AB_D

PL AC

RSVD --- DDR_A

_DM_4 --- DDR_A

_DQ_39 DDR_A

_DQ_35 --- DDR_A

_DQ_43 DDR_A

_DQ_42 VSS DDR_A

_DQ_46 DDR_A

_DQ_55 DDR_A

_DQ_51 DDR_A

_DQ_50 --- AD

VSS --- DDR_A

_DQ_32 --- DDR_A

_DQ_38 VSS --- DDR_A

_DQ_40 --- DDR_A

_DQS_5 DDR_A

_DQ_47 --- DDR_A

_DQ_54 DDR_A

_DQS_6 VSS AE

VSS --- DDR_A

_DQ_37 --- VSS DDR_A

_DQ_34 --- VSS --- --- --- VSS DDR_A

_DQS#

DDR_A

_DM_6 --- AF

DDR_A

_DQ_36 --- DDR_A

_DQ_33 --- DDR_A

_DQS#

DDR_A

_DQS_4 --- DDR_A

_DQ_45 DDR_A

_DQ_41 --- DDR_A

_DQS#

_5 --- --- DDR_A

_DQ_49 DDR_A

_DQ_48 AG

--- VSS DDR_A

_MA_0 DDR_A

_BS_1 --- DDR_A

_CS#_

0VSS DDR_A

_ODT_2 --- DDR_A

_ODT_1 --- VSS --- --- --- AH

--- DDR_A

_MA_1 --- DDR_A

_BS_0

DDR_A

_CS#_

DDR_A

_CAS# --- DDR_A

_MA_13

DDR_A

_CS#_

DDR_R

PU DDR_A

_DM_5 --- DDR_A

_DQ_53 DDR_A

_DQ_52 RSVD_

NCTF AJ

--- DDR_A

_MA_2 VCCSM DDR_A

_MA_10 DDR_A

_RAS# DDR_A

_WE# VSS DDR_A

_ODT_0

DDR_A

_CS#_

1--- DDR_A

_ODT_3 DDR_R

PD RSVD RSVD_

NCTF RSVD_

NCTF AK

--- --- VSS --- VCCSM --- VSS --- VCCSM --- --- DDR_V

REF RSVD_

NCTF RSVD_

NCTF --- AL

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

Datasheet 79

Package Mechanical Specifications and Ball Information

Table 7-48.Processor Ball List by Ball Name (Sheet 1 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

A20M# H7 CPU legacy I/O RSVD AB17 N/A N/A

BCLKN H10 CPU legacy I DDR_A_CKE_0 AH10 MEM_Cntl_A O

BCLKP J10 CPU legacy I DDR_A_CKE_1 AH9 MEM_Cntl_A O

BPM_1_0# G11 CPU legacy I/O DDR_A_CKE_2 AK10 MEM_Cntl_A O

BPM_1_1# E15 CPU legacy I/O DDR_A_CKE_3 AJ8 MEM_Cntl_A O

BPM_1_2# G13 CPU legacy I/O DDR_A_CS#_0 AH22 MEM_Cntl_A O

BPM_1_3# F13 CPU legacy I/O DDR_A_CS #_1 A K25 MEM_Cntl_A O

BPM_2_0#/

RSVD B18 CPU legacy I/O DDR_A_CS#_2 AJ21 MEM_Cntl_A O

BPM_2_1#/

RSVD B20 CPU legacy I/O DDR_A_CS#_3 AJ25 MEM_Cntl_A O

BPM_2_2#/

RSVD C20 CPU legacy I/O DDR_A_DM_0 AD4 MEM_Ad O

BPM_2_3#/

RSVD B21 CPU legacy I/O DDR_A_DM_1 AA9 MEM_Ad O

BSEL_0 K5 CPU legacy I/O DDR_A_DM_2 AE8 MEM_Ad O

BSEL_1 H5 CPU legacy I/O DDR_A_DM_3 AJ3 MEM_Ad O

BSEL_2 K6 CPU legacy I/O DDR_A_DM_4 AD19 MEM_Ad O

CPUPWRGOOD W1 CPU legacy I DDR_A_DM_5 AJ27 MEM_Ad O

CRT_BLUE P29 CRTDAC O DDR_A_DM_6 AF30 MEM_Ad O

CRT_DDC_CLK L30 CRTDAC I/O DDR_A_DM_7 AB26 MEM_Ad O

CRT_DDC_DAT

AL31 CRTDAC I/O DDR_A_DQ_0 AC4 MEM_Ad I/O

CRT_GREEN P30 CRTDAC O DDR_A_DQ_1 AC1 MEM_Ad I/O

CRT_HSYNC M30 CRTDAC O DDR_A_DQ_10 AE5 MEM_Ad I/O

CRT_IRTN N30 CRTDAC O DDR_A_DQ_11 AG5 MEM_Ad I/O

CRT_RED N31 CRTDAC O DDR_A_DQ_12 AA5 MEM_Ad I/O

CRT_VSYNC M29 CRTDAC O DDR_A_DQ_13 AB5 MEM_Ad I/O

DAC_IREF P28 CRTDAC I/O DDR_A_DQ_14 AB9 MEM_Ad I/O

DDR_A_BS_0 AJ20 MEM_Cntl_A O DDR_A_DQ_15 AD6 MEM_Ad I/O

DDR_A_BS_1 AH20 MEM_Cntl_A O DDR_A_DQ_16 AG8 MEM_Ad I/O

DDR_A_BS_2 AK11 MEM_Cntl_A O DDR_A_DQ_17 AG7 MEM_Ad I/O

DDR_A_CAS# AJ22 MEM_Cntl_A O DDR_A_DQ_18 AF10 MEM_Ad I/O

DDR_A_CK_0 AG15 MEM_Clk_A O DDR_A_DQ_19 AG11 MEM_Ad I/O

DDR_A_CK_1 AD13 MEM_Clk_A O DDR_A_DQ_2 AF4 MEM_Ad I/O

RSVD AD17 N/A N/A DDR_A_DQ_20 AF7 MEM_Ad I/O

DDR_A_CK_3 AC15 MEM_Clk_A O DDR_A_DQ_21 AF8 MEM_Ad I/O

Package Mechanical Specifications and Ball Information

80 Datasheet

DDR_A_CK_4 AF13 MEM_Clk_A O DDR_A_DQ_22 AD11 MEM_Ad I/O

RSVD AB15 N/A N/A DDR_A_DQ_23 AE10 MEM_Ad I/O

DDR_A_CK_0# AF15 MEM_Clk_A O DDR_A_DQ_24 AH1 MEM_Ad I/O

DDR_A_CK_1# AC13 MEM_Clk_A O DDR_A_DQ_25 AJ2 MEM_Ad I/O

RSVD AC17 N/A N/A DDR_A_DQ_26 AK6 MEM_Ad I/O

DDR_A_CK_3# AD15 MEM_Clk_A O DDR_A_DQ_27 AJ7 MEM_Ad I/O

DDR_A_CK_4# AG13 MEM_Clk_A O DDR_A_DQ_28 AF3 MEM_Ad I/O

DDR_A_DQ_29 AH2 MEM_Ad I/O DDR_A_DQ_8 AB6 MEM_Ad I/O

DDR_A_DQ_3 AG2 MEM_Ad I/O DDR_A_DQ_9 AB7 MEM_Ad I/O

DDR_A_DQ_30 AL5 MEM_Ad I/O DDR_A_DQS_0 AD3 MEM_Ad O

DDR_A_DQ_31 AJ6 MEM_Ad I/O DDR_A_DQS_1 AB8 MEM_Ad O

DDR_A_DQ_32 AE19 MEM_Ad I/O DDR_A_DQS_2 AD8 MEM_Ad O

DDR_A_DQ_33 AG19 MEM_Ad I/O DDR_A_DQS_3 AK5 MEM_Ad O

DDR_A_DQ_34 AF22 MEM_Ad I/O DDR_A_DQS_4 AG22 MEM_Ad O

DDR_A_DQ_35 AD22 MEM_Ad I/O DDR_A_DQS_5 AE26 MEM_Ad O

DDR_A_DQ_36 AG17 MEM_Ad I/O DDR_A_DQS_6 AE30 MEM_Ad O

DDR_A_DQ_37 AF19 MEM_Ad I/O DDR_A_DQS_7 AB27 MEM_Ad O

DDR_A_DQ_38 AE21 MEM_Ad I/O DDR_A_DQS#_0 AD2 MEM_Ad O

DDR_A_DQ_39 AD21 MEM_Ad I/O DDR_A_DQS#_1 AD7 MEM_Ad O

DDR_A_DQ_4 AB2 MEM_Ad I/O DDR_A_DQS#_2 AD10 MEM_Ad O

DDR_A_DQ_40 AE24 MEM_Ad I/O DDR_A_DQS#_3 AK3 MEM_Ad O

DDR_A_DQ_41 AG25 MEM_Ad I/O DDR_A_DQS#_4 AG21 MEM_Ad O

DDR_A_DQ_42 AD25 MEM_Ad I/O DDR_A_DQS#_5 AG27 MEM_Ad O

DDR_A_DQ_43 AD24 MEM_Ad I/O DDR_A_DQS#_6 AF29 MEM_Ad O

DDR_A_DQ_44 AC22 MEM_Ad I/O DDR_A_DQS#_7 AA27 MEM_Ad O

DDR_A_DQ_45 AG24 MEM_Ad I/O DDR_A_MA_0 AH19 MEM_Cntl_A O

DDR_A_DQ_46 AD27 MEM_Ad I/O DDR_A_MA_1 AJ18 MEM_Cntl_A O

DDR_A_DQ_47 AE27 MEM_Ad I/O DDR_A_MA_10 AK20 MEM_Cntl_A O

DDR_A_DQ_48 AG31 MEM_Ad I/O DDR_A_MA_11 AH12 MEM_Cntl_A O

DDR_A_DQ_49 AG30 MEM_Ad I/O DDR_A_MA_12 AJ11 MEM_Cntl_A O

DDR_A_DQ_5 AB3 MEM_Ad I/O DDR_A_MA_13 AJ24 MEM_Cntl_A O

DDR_A_DQ_50 AD30 MEM_Ad I/O DDR_A_MA_14 AJ10 MEM_Cntl_A O

DDR_A_DQ_51 AD29 MEM_Ad I/O DDR_A_MA_2 AK18 MEM_Cntl_A O

DDR_A_DQ_52 AJ30 MEM_Ad I/O DDR_A_MA_3 AK16 MEM_Cntl_A O

DDR_A_DQ_53 AJ29 MEM_Ad I/O DDR_A_MA_4 AJ14 MEM_Cntl_A O

DDR_A_DQ_54 AE29 MEM_Ad I/O DDR_A_MA_5 AH14 MEM_Cntl_A O

Table 7-48.Processor Ball List by Ball Name (Sheet 2 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Datasheet 81

Package Mechanical Specifications and Ball Information

DDR_A_DQ_55 AD28 MEM_Ad I/O DDR_A_MA_6 AK14 MEM_Cntl_A O

DDR_A_DQ_56 AA24 MEM_Ad I/O DDR_A_MA_8 AH13 MEM_Cntl_A O

DDR_A_DQ_57 AB25 MEM_Ad I/O DDR_A_MA_9 AK12 MEM_Cntl_A O

DDR_A_DQ_58 W24 MEM_Ad I/O DDR_A_ODT_0 AK24 MEM_Cntl_A O

DDR_A_DQ_59 W22 MEM_Ad I/O DDR_A_ODT_1 AH26 MEM_Cntl_A O

DDR_A_DQ_6 AE2 MEM_Ad I/O DDR_A_ODT_2 AH24 MEM_Cntl_A O

DDR_A_DQ_60 AB24 MEM_Ad I/O DDR_A_ODT_3 AK27 MEM_Cntl_A O

DDR_A_DQ_61 AB23 MEM_Ad I/O DDR_A_RAS# AK21 MEM_Cntl_A O

DDR_A_DQ_62 AA23 MEM_Ad I/O INIT# G8 CPU_sideband I/O

DDR_A_WE# AK22 MEM_Cntl_A O LBKLT_CTL L26 LVDS O

DDR_RPD AK28 MEM_Ana I/O LBKLT_EN L27 LVDS O

DDR_A_DQ_63 W27 MEM_Ad I/O LCTLA_CLK L23 LVDS I/O

DDR_A_DQ_7 AE3 MEM_Ad I/O LCTLB_DATA K25 LVDS I/O

DDR_RPU AJ26 MEM_Ana I/O LDDC_CLK K23 LVDS I/O

RSVD AK29 N/A N/A LDDC_DATA K24 LVDS I/O

DDR_VREF AL28 MEM_Ana I LINT0 F10 CPU_sideband I

DMI_RXN_0 F2 3GIO_CTC_rx I LINT1 F11 CPU_sideband I

DMI_RXN_1 G3 3GIO_CTC_rx I LA_CLKN U25 LVDS O

RSVD J1 N/A N/A LA_CLKP U26 LVDS O

RSVD L3 N/A N/A LA_DATAN_0 R23 LVDS O

DMI_RXP_0 F3 3GIO_CTC_rx I LA_DATAN_1 N26 LVDS O

DMI_RXP_1 H4 3GIO_CTC_rx I LA_DATAN_2 R26 LVDS O

RSVD K2 N/A N/A LA_DATAP_0 R24 LVDS O

RSVD M4 N/A N/A LA_DATAP_1 N27 LVDS O

DMI_TXN_0 G1 3GIO_CTC_tx O LA_DATAP_2 R27 LVDS O

DMI_TXN_1 J2 3GIO_CTC_tx O LIBG R22 LVDS I/O

RSVD L2 N/A N/A LVBG J28 LVDS O

RSVD N2 N/A N/A LVREFH N22 LVDS I

DMI_TXP_0 G2 3GIO_CTC_tx O LVREFL N23 LVDS I

DMI_TXP_1 H3 3GIO_CTC_tx O LVDD_EN H26 LVDS O

RSVD K3 N/A N/A PM_EXTTS#_0 J30 HVCMOS I

RSVD M2 N/A N/A PM_EXTTS#_1/

DPRSLPVR K29 HVCMOS I/O

REFCLKINN Y29 Displ ay PLL I PRDY# E11 CPU_sideband I/O

REFCLKINP Y30 Display PLL I PREQ# F15 CPU_sideband I/O

DPRSTP# G6 CPU_sideband I PROCHOT# C18 CPU_legacy I/O

Table 7-48.Processor Ball List by Ball Name (Sheet 3 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Package Mechanical Specifications and Ball Information

82 Datasheet

DPSLP# G10 CPU_sideband I PWROK L5 HVCMOS I

DDR_A_MA_7 AJ12 MEM_Cntl_A O EXP_CLKINN N7 3GIO_GFX_clk I

EXP_CLKINP N6 3GIO_GFX_clk I RSVD_TP AB11 N/A N/A

EXP_ICOMPI L9 3GIO_GFX_ana I RSVD_TP AB13 N/A N/A

EXP_RBIAS L8 3GIO_GFX_ana I/O DDR3_DRAMRST# AK8 SSTL-1.5 O

EXP_RCOMPO L10 3GIO_GFX_ana I RSVD_TP AA21 N/A N/A

RSVD R10 N/A N/A RSVD_TP W21 N/A N/A

RSVD R9 N/A N/A RSVD_TP T21 N/A N/A

EXTBGREF K7 CPU_legacy I RSVD_TP V21 N/A N/A

FERR# H6 CPU_sideband O REFSSCLKINN AA31 Clock I

GTLREF A13 CPU_legacy I REFSSCLKINP AA30 Clock I

HPL_CLKINN W8 Host PLL I RSVD L11 N/A N/A

HPL_CLKINP W9 Host PLL I RSVD N10 N/A N/A

IGNNE# E5 CPU_sideband I/O RSVD N9 N/A N/A

RSVD_TP N11 N/A N/A VCC D24 PWR

RSVD_TP P11 N/A N/A VCC D26 PWR

RSVD_TP AA6 N/A N/A VCC D28 PWR

RSVD_TP AA7 N/A N/A VCC E22 PWR

RSVD_TP R6 N/A N/A VCC E24 PWR

RSVD_TP R5 N/A N/A VCC E27 PWR

RSVD H13 N/A N/A VCC F21 PWR

RSVD D18 N/A N/A VCC F22 PWR

RSVD L7 N/A N/A VCC F25 PWR

RSVD D20 N/A N/A VCC G19 PWR

RSVD L6 N/A N/A VCC G21 PWR

RSVD E17 N/A N/A VCC G24 PWR

DDR3_DRAM_P

WROK AB4 CMOS-1.5 I VCC H17 PWR

RSVD_TP K9 N/A N/A VCC H19 PWR

RSVD_TP D19 N/A N/A VCC H22 PWR

SMI# E7 CPU_sideband I/O VCC H24 PWR

STPCLK# F8 CPU_sideband I VCC J17 PWR

TCK B14 CPU_legacy I/O VCC J19 PWR

TDI D14 CPU_legacy I/O VCC J21 PWR

TDO D13 CPU_legacy I/O VCC J22 PWR

RSVD G5 N/A N/A VCC K15 PWR

Table 7-48.Processor Ball List by Ball Name (Sheet 4 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Datasheet 83

Package Mechanical Specifications and Ball Information

THERMTRIP# E13 CPU_sideband O VCC K17 PWR

THRMDA_1 D30 CPU_legacy I VCC K21 PWR

RSTIN# AA3 HVCMOS I THRMDA_2/RSVD C30 CPU_legacy I

THRMDC_1 E30 CPU_legacy O VCC L19 PWR

THRMDC_2/

RSVD D31 CPU_legacy O VCC L21 PWR

TMS C14 CPU_legacy I/O VCC N14 PWR

TRST# C16 CPU_legacy I/O VCC N16 PWR

VCC A23 PWR VCC N19 PWR

VCC A25 PWR VCC N21 PWR

VCC A27 PWR VCCP B3 PWR

VCC B23 PWR VCCP B4 PWR

VCC B24 PWR VCCP E2 PWR

VCC B25 PWR VCCP D4 PWR

VCC B26 PWR VCCRING_EAST J31 PWR

VCC B27 PWR VCCRING_WEST B2 PWR

VCC C24 PWR VCCRING_WEST C2 PWR

VCC C26 PWR VCCRING_WEST C3 PWR

VCC D23 PWR VCCGFX W14 PWR

VCCSM AK13 PWR VCCGFX W16 PWR

VCCSM AK19 PWR VCCGFX W18 PWR

VCCSM AK9 PWR VCCGFX W19 PWR

VCCSM AL11 PWR VCCSENSE C29 PWR

VCCSM AL16 PWR VCCSFR_AB_DPL AC31 PWR

VCCSM AL21 PWR VCCSFR_DMIHMP

LL AA1 PWR

VCCSM AL25 PWR VID_0 H30 CPU_legacy O

VCC_GIO T31 PWR VID_1 H29 CPU_legacy O

VCC_LGI A21 PWR VID_2 H28 CPU_legacy O

VCCA Y2 PWR VID_3 G30 CPU_legacy O

VCCA_DDR U10 PWR VID_4 G29 CPU_legacy O

VCCA_DDR U5 PWR VID_5 F29 CPU_legacy O

VCCA_DDR U6 PWR VID_6 E29 CPU_legacy O

VCCA_DDR U7 PWR

VCCA_DDR U8 PWR VSS H27 VSS

VCCA_DDR U9 PWR VSS A11 VSS

Table 7-48.Processor Ball List by Ball Name (Sheet 5 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Package Mechanical Specifications and Ball Information

84 Datasheet

VCCA_DDR V2 PWR VSS A16 VSS

VCCA_DDR V3 PWR VSS A19 VSS

VCCA_DDR V4 PWR RSVD_NCTF A29 VSS

VCC L14 PWR VCCA_DDR W10 PWR

VCC L16 PWR VCCA_DDR W11 PWR

VCCA_DMI T1 PWR RSVD_NCTF A4 VSS

VCCA_DMI T2 PWR VSS AA13 VSS

VCCA_DMI T3 PWR VSS AA14 VSS

VCCALVDS V30 PWR VSS AA16 VSS

VCCACK_DDR AA10 PWR VSS AA18 VSS

VCCACK_DDR AA11 PWR VSS AA2 VSS

VCCACRTDAC T30 PWR VSS AA22 VSS

RSVD P2 N/A N/A VSS AA25 VSS

VCCCK_DDR AK7 PWR VSS AA26 VSS

VCCCK_DDR AL7 PWR VSS AA29 VSS

VCCD_AB_DPL AA19 PWR VSS AA8 VSS

VCCD_HMPLL V11 PWR VSS AB19 VSS

VCCDLVDS W31 PWR VSS AB21 VSS

VCCGFX T13 PWR VSS AB28 VSS

VCCGFX T14 PWR VSS AB29 VSS

VCCGFX T16 PWR VSS AB30 VSS

VCCGFX T18 PWR VSS AC10 VSS

VCCGFX T19 PWR VSS AC11 VSS

VCCGFX V13 PWR VSS AC19 VSS

VCCGFX V19 PWR VSS AC2 VSS

VSS AC21 VSS VSS AL9 VSS

VSS AC28 VSS VSS B13 VSS

VSS AC30 VSS VSS B16 VSS

VSS AD26 VSS VSS B19 VSS

VSS AD5 VSS VSS B22 VSS

VSS AE1 VSS RSVD_NCTF B30 VSS

VSS AE11 VSS RSVD_NCTF B31 VSS

VSS AE13 VSS VSS B5 VSS

VSS AE15 VSS VSS B9 VSS

VSS AE17 VSS RSVD_NCTF C1 VSS

VSS AE22 VSS VSS C12 VSS

Table 7-48.Processor Ball List by Ball Name (Sheet 6 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Datasheet 85

Package Mechanical Specifications and Ball Information

VSS AE31 VSS VSS C21 VSS

VSS AF11 VSS VSS C22 VSS

VSS AF17 VSS VSS C25 VSS

VSS AF21 VSS RSVD_NCTF C31 VSS

RSVD_NCTF A3 VSS VSS AF24 VSS

RSVD_NCTF A30 VSS VSS AF28 VSS

VSS AG10 VSS VSS E10 VSS

VSS AG3 VSS VSS E19 VSS

VSS AH18 VSS VSS E21 VSS

VSS AH23 VSS VSS E25 VSS

VSS AH28 VSS VSS E8 VSS

VSS AH4 VSS VSS F17 VSS

VSS AH6 VSS VSS F19 VSS

VSS AH8 VSS VSS F24 VSS

RSVD_NCTF AJ1 VSS VSS F28 VSS

VSS AJ16 VSS VSS F4 VSS

VSS AJ31 VSS VSS G15 VSS

RSVD_NCTF AK1 VSS VSS G17 VSS

RSVD_NCTF AK2 VSS VSS G22 VSS

VSS AK23 VSS VSS G27 VSS

RSVD_NCTF AK30 VSS VSS G31 VSS

RSVD_NCTF AK31 VSS VSS H11 VSS

VSS AL13 VSS VSS H15 VSS

VSS AL19 VSS VSS H2 VSS

RSVD_NCTF AL2 VSS VSS H21 VSS

VSS AL23 VSS VSS H25 VSS

RSVD_NCTF AL29 VSS VSS H8 VSS

RSVD_NCTF AL3 VSS VSS J11 VSS

RSVD_NCTF AL30 VSS VSS J13 VSS

VSS J15 VSS VSS T11 VSS

VSS J4 VSS VSS U22 VSS

VSS K11 VSS VSS U23 VSS

VSS K13 VSS VSS U24 VSS

VSS K19 VSS VSS U27 VSS

VSS K26 VSS VSS V14 VSS

VSS K27 VSS VSS V28 VSS

Table 7-48.Processor Ball List by Ball Name (Sheet 7 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Package Mechanical Specifications and Ball Information

86 Datasheet

VSS K28 VSS VSS V29 VSS

VSS K30 VSS VSS W13 VSS

VSS K4 VSS VSS W2 VSS

VSS K8 VSS VSS L13 VSS

VSS L1 VSS VSS L18 VSS

VSS D22 VSS VSS W23 VSS

RSVD_NCTF E1 VSS VSS W25 VSS

VSS L22 VSS VSS W26 VSS

VSS L24 VSS VSS W28 VSS

VSS L25 VSS VSS W30 VSS

VSS L29 VSS VSS W4 VSS

VSS M28 VSS VSS W5 VSS

VSS M3 VSS VSS W6 VSS

VSS N1 VSS VSS W7 VSS

VSS N13 VSS VSS Y28 VSS

VSS N18 VSS VSS Y3 VSS

VSS N24 VSS VSS Y4 VSS

VSS N25 VSS VSS T29 VSS

VSS N28 VSS VSSSENSE B29 PWR

VSS N4 VSS XDP_RSVD[0] D12 XDP

VSS N5 VSS XDP_RSVD[1] A7 XDP

VSS N8 VSS XDP_RSVD[2] D6 XDP

VSS P13 VSS XDP_RSVD[3] C5 XDP

VSS P14 VSS XDP_RSVD[4] C7 XDP

VSS P16 VSS XDP_RSVD[5] C6 XDP

VSS P18 VSS XDP_RSVD[6] D8 XDP

VSS P19 VSS XDP_RSVD[7] B7 XDP

VSS P21 VSS XDP_RSVD[8] A9 XDP

VSS P3 VSS XDP_RSVD[9] D9 XDP

VSS P4 VSS XDP_RSVD[10] C8 XDP

VSS R25 VSS XDP_RSVD[11] B8 XDP

VSS R7 VSS XDP_RSVD[12] C10 XDP

VSS R8 VSS XDP_RSVD[13] D10 XDP

VSS V16 VSS XDP_RSVD[14] B11 XDP

VSS V18 VSS XDP_RSVD[15] B10 XDP

Table 7-48.Processor Ball List by Ball Name (Sheet 8 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.

Datasheet 87

Package Mechanical Specifications and Ball Information

XDP_RSVD[16] B12 XDP

XDP_RSVD[17] C11 XDP

Table 7-48.Processor Ball List by Ball Name (Sheet 9 of 9)

Pin Name Pin

Number Type Dir. Pin Name Pin

Number Type Dir.